KR20180098527A - Cleaning agent composition for electronic materials, detergent raw solution, and cleaning method for electronic materials - Google Patents

Cleaning agent composition for electronic materials, detergent raw solution, and cleaning method for electronic materials Download PDF

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KR20180098527A
KR20180098527A KR1020187012807A KR20187012807A KR20180098527A KR 20180098527 A KR20180098527 A KR 20180098527A KR 1020187012807 A KR1020187012807 A KR 1020187012807A KR 20187012807 A KR20187012807 A KR 20187012807A KR 20180098527 A KR20180098527 A KR 20180098527A
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South Korea
Prior art keywords
tertiary amine
water
cleaning
electronic materials
ch
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KR1020187012807A
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Korean (ko)
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요스케 이우치
타카시 타나카
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아라까와 가가꾸 고교 가부시끼가이샤
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Priority to JP2015254252 priority Critical
Priority to JPJP-P-2015-254252 priority
Application filed by 아라까와 가가꾸 고교 가부시끼가이샤 filed Critical 아라까와 가가꾸 고교 가부시끼가이샤
Priority to PCT/JP2016/088131 priority patent/WO2017110885A1/en
Publication of KR20180098527A publication Critical patent/KR20180098527A/en

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    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D11/00Special methods for preparing compositions containing mixtures of detergents ; Methods for using cleaning compositions
    • C11D11/0005Special cleaning and washing methods
    • C11D11/0011Special cleaning and washing methods characterised by the objects to be cleaned
    • C11D11/0023"Hard" surfaces
    • C11D11/0047Electronic devices, e.g. PCBs, semiconductors
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3209Amines or imines with one to four nitrogen atoms; Quaternized amines
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

The cleaning composition for an electronic material of the present invention is a detergent composition comprising a tertiary amine (A) and water (B) exhibiting azeotropy with water, wherein the tertiary amine (A) has a boiling point of 130 And the weight ratio (%) of the tertiary amine (A) in the total amount of the tertiary amine (A) and the water (B) in the detergent composition to the tertiary amine (A) B) in the azeotropic mixture is not more than the weight ratio of the tertiary amine (A). The detergent composition can remove particles adhering to the electronic material even if a very small amount (low concentration) is used. Moreover, even if there is no washing process for washing the detergent component, the detergent composition for electronic materials It is possible to provide a cleaning method including a cleaning step of the undiluted solution and the electronic material.

Description

Cleaning agent composition for electronic materials, detergent raw solution, and cleaning method for electronic materials

The present invention relates to a detergent composition for electronic materials, a detergent stock solution, and a cleaning method for electronic materials.

BACKGROUND ART In recent years, in the electronics industry, miniaturization and high performance of electronic components are rapidly progressing along with the transition to informatization, energy saving, and low carbon society. In the background, techniques of polishing and planarization are largely involved.

For example, in the field of semiconductors, silicon oxide (SiO 2 ) formed on a silicon wafer for the purpose of transferring a fine circuit pattern accurately and with high efficiency in a lithography process in manufacturing a digital IC such as CMOS or TTL, Silicon nitride (Si 3 N 4 ), Polishing and planarization of insulating thin films such as phosphorus silicate glass (PSG) are performed. In the field of handling a magnetic disk such as a hard disk drive (HDD), in order to suppress the gap between the disk surface and the magnetic head to a nano order, and to make both the recording density and the reliability compatible, . Furthermore, in the field of handling optical devices such as semiconductor light-emitting diodes (LED), power devices such as diodes and transistors for large power, sapphire (Al 2 O 3 ) The surface of the substrate such as silicon carbide (SiC) and gallium nitride (GaN) is removed to improve the performance and yield of the product.

Examples of the polishing method include chemical mechanical polishing (polishing) using an abrasive (slurry) in which fine particles such as silica (SiO 2 ) , alumina (Al 2 O 3 ), or ceria (CeO 2 ) Polishing, CMP), mechanical polishing with hard particles such as diamond, brush, pad, wheel and the like.

However, in any of the methods, a large amount of abrasive grains, abrasive grains, and the like (hereinafter referred to as particles) adhere to the polished electronic material, resulting in deterioration of performance and yield. Therefore, a cleaning process for removing these components is indispensable, and development of a cleaning composition for removing the particles functionally and efficiently has become a pressing need. As such a detergent composition, for example, the following detergent composition is disclosed.

The detergent composition disclosed in Patent Document 1 contains a fluorine-based anionic surfactant and a quaternary ammonium hydroxide, and includes an alkanolamine as an optional ingredient. According to this document, the detergent composition has a particle Lt; / RTI > However, the detergent composition contains a nonvolatile surfactant and the like, and a washing process for washing the detergent composition after the cleaning process is considered to be essential.

The detergent composition described in Patent Document 2 contains alkylamines, aromatic diamines, ureas, thioureas, azo compounds, nitrogen-nitrogen heterocycle (nitrogen-containing heterocyclic ring) compounds and specific amino acids. According to this document, it is disclosed that this detergent composition is suitable for removal of copper oxide and particles on a semiconductor surface subjected to copper wiring. However, the detergent composition contains a non-fugitive acid (for example, glycine), and it is considered that a washing process for washing them after the cleaning process is essential.

The detergent composition described in Patent Document 3 includes glycine, an acrylic acid-based polymer, a specific nonionic compound and water. According to this document, it is disclosed that this detergent composition is suitable for the removal of particles originating from a slurry for chemical mechanical polishing (CMP). However, the detergent composition contains a nonvolatile acid (e.g., glycine) or a polymer and is considered to be indispensable for a washing process for washing them after the cleaning process.

[Prior Art Literature]

(Patent Document 1) Patent No. 3624809

(Patent Document 2) Patent No. 4821082

(Patent Document 3) JP 2008-147449 A

The present invention has been made in view of the above problems, and it is an object of the present invention to provide a cleaning agent for electronic materials which can remove particles adhering to a cleaning object even if a very small amount (low concentration) is used, And a cleaning method of the composition, the stock solution, and the electronic material.

The present inventors have intensively studied in order to solve the above problems. As a result, the present inventors have found that the above problems can be solved by using tertiary amines (A) and water (B), which exhibit azeotropic properties with water, And completed the present invention. That is, the present invention is the following items 1 to 9.

Item 1: A detergent composition comprising tertiary amine (A) and water (B) exhibiting azeotropic properties with water, wherein the tertiary amine (A) has a boiling point of 130 to 250 ° C under 1 atmospheric pressure, Wherein the weight ratio (%) of the tertiary amine (A) in the total of the tertiary amine (A) and the water (B) in the tertiary amine (A) Wherein the weight ratio of the tertiary amine (A) in the mixture is less than or equal to the weight ratio of the tertiary amine (A) in the mixture.

Section 2. Further, R 1 O- [CH 2 -CH (X) -O] n H (wherein R 1 represents an alkyl group having 1 to 4 carbon atoms) represented by the general formula (1) (C) represented by the following general formula (1), wherein n represents 1 to 3 and X represents hydrogen or a methyl group, wherein the boiling point of the glycol solvent (C) is 120 to 275 deg. (%) Of the glycol-based solvent (C) in the total amount of the glycol-based solvent (C) and the water (B) in the detergent composition is not less than The detergent composition for electronic materials according to the above 1, wherein the weight ratio of the glycol-based solvent (C) in the azeotropic mixture is lower than or equal to the weight ratio of the glycol-based solvent (C) in the azeotropic mixture.

Section 3. Wherein the tertiary amine (A) is a compound represented by the general formula (2): (R 2 ) R 3 N-CH 2 -CH (Y) -OH wherein R 2 and R 3 are the same or different, (R 4 ) R 5 N-C 2 H 4 -Z-C 2 H (wherein R 1 represents an alkyl group having 1 to 3 carbon atoms and Y represents hydrogen or a methyl group) 4- NR 6 (R 7 ) (wherein R 4 , R 5 , R 6 and R 7 are the same or different alkyl groups having 1 to 3 carbon atoms and Z is -CH 2 -, - (CH 2 ) 2 -, -O-, -NH- or -N (CH 3 ) Or a polyamine (A2) represented by the following formula (1) or (2).

Section 4. The electronic material according to any one of items 1 to 3, wherein the weight ratio (A / (A + B)) of the tertiary amine (A) in the total of the tertiary amine (A) ≪ / RTI >

Item 5. (A + C) / ((C)) of the tertiary amine (A) and the glycol solvent (C) in the total of the tertiary amine (A), the water (B) and the glycol solvent A + B + C)) is not less than 1/100000.

Section 6. A detergent stock solution comprising the tertiary amine (A) and the water (B) for preparing the detergent composition for electronic materials according to any one of items 1 to 5 above.

Item 7. A cleaning method of an electronic material characterized by comprising a cleaning step of an electronic material using the cleaning composition for an electronic material according to any one of items 1 to 5.

Section 8. A cleaning method of an electronic material according to the item 7, characterized in that it does not include a washing step.

Section 9. A cleaning method of an electronic material according to the item 7 or 8, characterized by comprising a step of removing particles of an electronic material.

According to the present invention, it is possible to remove particles adhered to an electronic material even by using a very small amount (low concentration), and even if there is no washing step for washing the cleaning agent component, It is possible to provide a detergent composition, a method for cleaning the undiluted solution and an electronic material.

The detergent composition of the present invention comprises a tertiary amine (A) and water (B) exhibiting azeotropy with water, wherein the amount of the tertiary amine (A) and the water (B) in the detergent composition The weight ratio (%) of the tertiary amine (A) is not more than the weight ratio of the tertiary amine (A) in the azeotropic mixture composed of the tertiary amine (A) and water (B) It exhibits an action effect of not leaving any residue of the cleaning agent even at a time of drying for a short time of several minutes to several tens of minutes under the condition of about 150 占 폚 and is therefore excellent in safety and productivity.

Further, the detergent composition of the present invention further, the formula represents the azeotropic water and (1) of the R 1- O- [CH 2- CH ( X) -O] n- H ( formula (1), R 1 (C) represented by the general formula (1) is an alkyl group having 1 to 4 carbon atoms, n is 1 to 3, and X represents hydrogen or a methyl group), the glycol solvent (C) in the azeotropic mixture composed of the glycol-based solvent (C) and the water (B) in the total amount of the glycol-based solvent (C) , It is excellent in safety and productivity because it exhibits an action effect of not leaving any residue of the cleaning agent even when dried in a short time of several minutes to several tens of minutes under the condition of about 50 ° C to 150 ° C, for example.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view showing an example of a method for removing particles of a cleaning agent composition. FIG.

The detergent composition of the present invention comprises a tertiary amine (A) (hereinafter referred to as component (A)) and water (B (hereinafter referred to as component (B) (A) in the total amount of the tertiary amine (A) and the water (B) is 130 to 250 DEG C under 1 atmospheric pressure (under a normal pressure and a standard atmospheric pressure) ) Is equal to or less than the weight ratio of the tertiary amine (A) in the azeotrope composed of the tertiary amine (A) and water (B) (the mixing ratio of the tertiary amine is less than the composition ratio of the azeotropic mixture with water). If the boiling point of the tertiary amine (A) is less than 130 캜 under 1 atmospheric pressure, there is a risk of flammability in the undiluted solution of the detergent composition, and handling such as transportation and storage becomes difficult. On the other hand, if the boiling point of the tertiary amine (A) exceeds 250 占 폚 under 1 atm, it is difficult to form an azeotropic mixture with water, and dryability deteriorates. Therefore, it is preferably about 140 to 240 占 폚, and more preferably about 150 to 230 占 폚, from the viewpoint of flammability and drying property.

The detergent composition of the present invention is characterized in that the weight ratio (%) of the tertiary amine (A) to the tertiary amine (A) and the water (B) in the total of the tertiary amine (A) Is not more than the weight ratio of the tertiary amine (A) in the azeotropic mixture. The azeotrope mixture composed of the tertiary amine (A) and water (B) means a composition in which the mixture of the tertiary amine (A) and the water (B) forms an azeotrope (a constant boiling point mixture) do. The weight ratio of (A) in the azeotropic mixture when the mixture of the tertiary amine (A) and water (B) forms an azeotropic mixture can be obtained, for example, at a boiling point of 100 DEG C And the following fractions are analyzed by the gas coloring method and quantified in accordance with the absolute calibration curve method.

As the component (A), various known compounds can be used without particular limitation, provided that they exhibit an azeotropic property with water and are tertiary amines having a boiling point of 130 to 250 ° C at 1 atm. Concretely, from the viewpoint of particle removal power and drying property, a monoamine (A1) (hereinafter referred to as a component (A1)) represented by the following general formula (2) and a polyamine represented by the following general formula (A2) (hereinafter referred to as component (A2)) is particularly preferable. The component (A) may be any one of the components (A1) and (A2) and may contain both components.

(2): (R 2 ) R 3 N-CH 2 - CH (Y) -OH

(In the formula (2), R 2 and R 3 each represent the same or different alkyl group having 1 to 3 carbon atoms, and Y represents hydrogen or a methyl group)

(3): (R 4 ) R 5 N-C 2 H 4 -Z-C 2 H 4 -NR 6 (R 7 )

(In the formula (3), R 4 , R 5 , R 6 , And R 7 represent the same or different alkyl groups having 1 to 3 carbon atoms and Z represents -CH 2 -, - (CH 2 ) 2 -, -O-, -NH-, or -N (CH 3 ) - )

In the general formula (2), the alkyl group of R 2 and R 3 preferably has 2 to 3 carbon atoms, and more preferably 2. Y is preferably hydrogen.

In the general formula (3), R 4 , R 5 , R 6 , And the alkyl group of R < 7 > are preferably 1 to 2 carbon atoms, and more preferably 1. Further, Z is preferably -CH 2 -, - (CH 2 ) 2 -, or -O-, more preferably -CH 2 - or - (CH 2 ) 2 -.

Examples of the above component (A1) include 2- (diethylamino) ethanol, 2- (diisopropylamino) ethanol, 2- Dimethylamino-2-propanol, 1-diethylamino-2-propanol, 1-diisopropylamino-2-propanol and 1-di-n-propylamino-2-propanol. These may be used singly or in combination of two or more. Among these, from the group consisting of 2- (diethylamino) ethanol, 2- (diisopropylamino) ethanol and 1-diethylamino-2-propanol from the viewpoint of low removal power of particles and low risk of ignition At least one selected is preferable.

Examples of the component (A2) include N, N, N ', N'-tetramethylpentamethylenediamine, N, N, N', N'-tetraethylpentamethylenediamine, N, N ', N'-tetramethylhexamethylenediamine, N, N, N', N'-tetrapropylenediamine, N, N ', N'-tetraethylhexamethylenediamine, N, N, N', N'-tetraisopropylhexamethylenediamine, N, (2-diethylaminoethyl) ether, bis (2-diethylaminoethyl) ether, bis , 7-tetramethyldiethylenetriamine, 1,1,7,7-tetraethyldiethylenetriamine, 1,1,7,7-tetraisopropyldiethylenetriamine, 1,1,7,7-tetra -n-propyl diethylene tri , N, N, N ', N' ', N' '-pentamethyldiethylenetriamine, 4-methyl-1,1,7,7-tetraethyldiethylenetriamine, 7,7-tetraisopropyldiethylenetriamine and 4-methyl-1,1,7,7-tetra-n-propyldiethylenetriamine. These may be used singly or in combination of two or more. Among these, N, N, N ', N'-tetramethylhexamethylenediamine, bis (2-dimethylaminoethyl) ether and N, N, N' , N ", N " -pentamethyldiethylenetriamine, and the like.

Examples of the component (B) include ultrapure water, pure water, purified water, distilled water, ion-exchanged water and tap water.

The detergent composition of the present invention preferably has a weight ratio (A / (A + B)) of the tertiary amine (A) in the total of the components (A) and (B) desirable. More preferably, it is 1/80000 or more, more preferably 1/20000 or more, and still more preferably 1/5000 or more.

The detergent composition of the present invention is preferably a compound represented by the general formula (1): R 1 O- [CH 2 -CH (X) -O] n- , A glycol solvent (C) (hereinafter referred to as a component (C)) represented by the general formula (1), R 1 represents an alkyl group having 1 to 4 carbon atoms, n represents 1 to 3 and X represents hydrogen or a methyl group) (C) in the total amount of the glycol solvent (C) and the water (B) in the detergent composition, and the boiling point of the glycol solvent (C) is 120 to 275 deg. Of the glycol-based solvent (C) in the azeotropic mixture composed of the glycol-based solvent (C) and water (B).

The azeotrope mixture consisting of the glycol-based solvent (C) and water (B) means a composition wherein the mixture of (C) and (B) forms an azeotrope (maintenance point mixture). The weight ratio of (C) in the azeotropic mixture when the mixture of the glycol-based solvent (C) and water (B) forms an azeotropic mixture may be, for example, Is analyzed by the gas coloring method and quantified in accordance with the absolute calibration curve method.

In the general formula (1), the alkyl group of R 1 preferably has 1 to 3 carbon atoms, more preferably 1 to 2 carbon atoms. X is preferably a methyl group. Furthermore, n is preferably 2 to 3, more preferably 3.

Examples of the component (C) include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol monoisopropyl ether, ethylene glycol mono-n- Ethylene glycol mono-sec-butyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol monoisopropyl ether, Butyl ether, propylene glycol mono-n-butyl ether, propylene glycol monoisobutyl ether, propylene glycol mono-sec-butyl ether, propylene glycol mono-tert-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, Diethylene glycol mono-n-propyl ether, diethyl Diethylene glycol mono-n-butyl ether, diethylene glycol monoisobutyl ether, diethylene glycol mono-sec-butyl ether, diethylene glycol mono-tert-butyl ether, dipropylene glycol monomethyl ether Dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol monoisopropyl ether, dipropylene glycol mono-n-butyl ether, dipropylene glycol monoisobutyl ether, dipropylene glycol mono-sec Butyl ether, dipropylene glycol mono-tert-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol mono-n-propyl ether, triethylene glycol monoisopropyl ether, triethylene glycol mono n-butyl ether, triethylene glycol monoisobutyl Ether, triethylene glycol mono-sec-butyl ether, triethylene glycol mono-tert-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, tripropylene glycol mono-n-propyl ether, tripropylene glycol mono Isopropyl ether, tripropylene glycol mono-n-butyl ether, tripropylene glycol monoisobutyl ether, tripropylene glycol mono-sec-butyl ether, tripropylene glycol mono-tert-butyl ether and the like. These may be used singly or in combination of two or more. Of these, at least one species selected from the group consisting of diethylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether and tripropylene glycol monomethyl ether is preferable in view of low particle removing power and low risk of ignition Do.

The component (C) has a boiling point of about 120 to 275 deg. C, preferably about 130 to 260 deg. C, more preferably about 1 to 200 deg. C under one atmospheric pressure because of good drying property and suppression of printing of the cleaning agent solution 140 ~ 250 ℃.

When the component (C) is added, the detergent composition of the present invention has a weight ratio ((A + C) of the component (A) to the component (C) in the total of the component (A), the component ) / (A + B + C)) is preferably 1/100000 or more from the viewpoint of particle removability. More preferably, it is 1/80000 or more, more preferably 1/20000 or more, and still more preferably 1/5000 or more.

The total proportion of the component (A) and the component (B) in the detergent composition of the present invention or the total ratio of the components (A), (B) and (C) is preferably 80% by weight or more, Or more, more preferably 95 wt% or more, further preferably 98 wt% or more, further preferably 100 wt% or more.

The detergent composition of the present invention is prepared by mixing the component (A) and the component (B), and if necessary, the component (C) by various known means.

The detergent composition of the present invention is used as a detergent for electronic materials. Examples of the electronic material include a glass processed product such as a photomask, an optical lens, a vacuum discharge tube, a touch panel, a glass for a display device, a metal processed product such as a metal mask, a pallet, a lead frame, a magnetic disk, a heat sink, (Si), sapphire (Al 2 O 3 ) , silicon carbide (SiC), diamond (C), gallium nitride (GaN), and phosphorous (Such as slicing and dicing), grinding (back grinding, blasting, etc.), fillet (beveling, barrel, etc.), and wafers such as gallium (GaP), gallium arsenide (GaAs), and indium phosphide (Lapping, polishing, buffing, etc.), as well as tools, carriers, and magazines used to machine, mount, weld, clean, and ship these items.

Examples of the electronic material include electronic parts such as a printed circuit board, a flexible circuit board, a ceramic wiring board, a semiconductor element, a semiconductor packaging, a magnetic medium, a power module and a camera module, A mechanism, a carrier, a magazine, and the like used for cleaning and transportation.

The detergent composition of the present invention may be blended with various known additives to the extent that the drying property is not affected. Specific examples of the additives include nonionic surfactants, anionic surfactants, cationic surfactants, amphoteric surfactants , A polymer type surfactant, a chelating agent, an antioxidant, a rust inhibitor, a sealing agent, a pH adjusting agent and a defoaming agent.

A cleaning agent stock solution capable of preparing a detergent composition for electronic materials by diluting with water is one of the present invention. The detergent stock solution of the present invention is concentrated in effective components for cleaning particles, and can be transported and stored with good efficiency. The detergent raw solution exhibits excellent detergency even in a small amount. Therefore, when diluted with water at the time of use, the weight ratio of water can be increased, and the cost and environment burden are also reduced.

A cleaning method including a cleaning process of an electronic material using the cleaning composition of the present invention is also one of the present invention. The cleaning step is a step of bringing the cleaning composition according to the present invention into contact with the electronic material to which the particles are attached to wash the particles. The cleaning method may not include a washing step for rinsing the cleaning agent component from the electronic material with various known rinsing agents. As a result, the cost and time required for the washing process can be reduced. Examples of the particles to be cleaned include, but not limited to, silica (SiO 2 ), alumina (Al 2 O 3 ) , ceria (CeO 2 ), and the like used for mechanical polishing (CMP) (Slicing, dicing, etc.), grinding (back grinding, polishing) of hard particles such as fine particles, diamond, garnet, stainless steel, steel, iron, copper, zinc, aluminum, ceramics, glass, Machining, mounting and welding of the above electronic materials and electronic parts, which are generated during the processing of polishing (lapping, polishing, buffing, etc.), cutting (beveling, barrel etc.) , Organic wastes and inorganic wastes generated when cleaning and transporting wastes.

Examples of the other particles include dust, tigl, and the like adhering to the article in the entire manufacturing process of the electronic material and the electronic component.

The means for cleaning the article by bringing the cleaning composition of the present invention into contact with the particle-attached component is not limited. Examples of the cleaning means include immersion cleaning, shower cleaning, spray cleaning, ultrasonic cleaning, Direct injection cleaning (Direct Path (registered trademark)), and the like. As known cleaning apparatuses, there are, for example, those disclosed in JP-A-7-328565, JP-A-2000-189912, JP-A-2001-932, and JP-A-2005-144441. Further, since the detergent composition and the detergent stock solution of the present invention are non-hazardous substances, they are not burned. Therefore, no explosion-proof equipment is required, and it is also suitable for shower cleaning and spray cleaning.

Since the detergent composition of the present invention can be easily exhibited in the drying process, no residue remains on the article after cleaning. Therefore, the washing process of the article can be omitted. However, if necessary, it is possible to carry out the same cleaning agent or various known rinsing agents as in the present invention. Rinsing agents include water such as pure water and ion exchange water, and alcohols such as methyl alcohol, ethyl alcohol and isopropyl alcohol.

[Example]

Hereinafter, the method of the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited thereto. In the examples, parts or% are based on weight. With respect to various tertiary amines (A) and glycol solvent (C) used in the following detergent stock solution, the composition, the boiling point under 1 atm, and the composition ratio (weight ratio) , Are shown in Table 3.

[Composition ratio of azeotropic mixture]

25 parts by weight of the component (A) and 100 parts by weight of ion-exchanged water were placed in a 200 ml eggplant type flask and thoroughly mixed by a magnetic stirrer to prepare an aqueous solution containing the component (A). Subsequently, a distillation column, a T-shaped tube, a thermometer and a Lvih cooler corresponding to theoretical number of stages N = 10 were connected to the egg-shaped flask. Subsequently, the branched flask was heated in an oil bath under 1 atm, and the mixed solution was boiled to collect only oil fractions having a boiling point of 100 占 폚 or lower.

Next, the above component (A) in the above fraction was quantitatively determined by the gas chromatographic method 6850 Network GC System (manufactured by Agilent Technologies) according to the absolute calibration curve method. The component (C) was also quantified by the same method in place of the component (A).

1. Preparation of detergent stock solution

Preparation Example 1

, 20 parts by weight of 2- (diethylamino) ethanol (DEAE) as the component (A), 80 parts by weight of dipropylene glycol monomethyl ether (DPGMME) as the component (C) And the mixture was sufficiently stirred by a magnetic stirrer to prepare a detergent stock solution.

Preparation example 2

100 parts by weight of ion exchanged water in a beaker, 20 parts by weight of DEAE as the component (A), 80 parts by weight of tripropylene glycol monomethyl ether (TPGMME) as a component (C) and a stirrer piece were charged, To prepare a detergent stock solution.

Preparation Example 3

100 parts by weight of ion exchanged water in a beaker, 20 parts by weight of N, N, N ', N', - tetramethylhexamethylenediamine (TMHMDA) as the component (A), 80 parts by weight of TPGMME as a component (C) And the mixture was thoroughly stirred by a magnetic stirrer to prepare a stock detergent solution.

Preparation Example 4

100 parts by weight of ion-exchanged water in a beaker, 20 parts by weight of TMHMDA as the component (A), 80 parts by weight of diethylene glycol mono-n-butyl ether (DEGMBE) as a component (C) and a stirrer piece were placed, To sufficiently prepare a detergent stock solution.

Preparation Example 5

20 parts by weight of bis (2-dimethylaminoethyl) ether (BDMAEE) as a component (A), 80 parts by weight of DEGMBE as a component (C) and a stirrer piece were placed in a beaker, To sufficiently prepare a detergent stock solution.

Preparation Example 6

100 parts by weight of ion-exchanged water, 100 parts by weight of DEAE as a component (A), and a stirrer piece were placed in a beaker and sufficiently stirred by a magnetic stirrer to prepare a detergent stock solution.

Preparation Example 7

100 parts by weight of ion-exchanged water, 100 parts by weight of TMHMDA as the component (A), and a stirrer piece were placed in a beaker and sufficiently stirred by a magnetic stirrer to prepare a detergent stock solution.

Preparation Example 8

100 parts by weight of ion exchanged water, 100 parts by weight of BDMAEE as a component (A) and a stirrer piece were put in a beaker and sufficiently stirred by a magnetic stirrer to prepare a detergent stock solution.

Comparative Preparation Example 1

, 20 parts by weight of N-butyl diethanolamine (BDEA) as the component (A), 80 parts by weight of tetraethylene glycol monomethyl ether (TEGMME) as a component (C) and a stirrer piece , And the mixture was sufficiently stirred by a magnetic stirrer to prepare a stock detergent solution.

Comparative Preparation Example 2

100 parts by weight of ion exchanged water, 100 parts by weight of BDEA as the component (A), and a stirrer piece were put in a beaker and sufficiently stirred by a magnetic stirrer to prepare a detergent stock solution.

Comparative Preparation Example 3

100 parts by weight of ion exchange water, 100 parts by weight of 2- (2-aminoethylamino) ethanol (AEAE) as the component (A) and a stirrer piece were put in a beaker and sufficiently stirred by a magnetic stirrer to prepare a stock solution of a detergent .

Comparative Preparation Example 4

100 parts by weight of ion-exchanged water, 100 parts by weight of polyoxyethylene alkyl ether (POEAE) as component (C), and a stirrer piece were placed in a beaker and sufficiently stirred by a magnetic stirrer to prepare a detergent stock solution.

Comparative Preparation Example 5

100 parts by weight of ion exchanged water as a component (A), 100 parts by weight of diethylamine (DEA) and a stirrer piece were placed in a beaker and sufficiently stirred by a magnetic stirrer to prepare a detergent stock solution.

Comparative Preparation Example 6

Ion exchanged water was used as the cleaning agent stock solution.

2. Flammability of detergent stock solution

[Evaluation method of flammability]

The flash point of each detergent solution was measured in accordance with Cleveland (Cleveland method, JIS K2265-4), and the flammability was evaluated according to the following criteria. Table 1 shows the results.

[Evaluation Criteria for Flammability]

○: No flash point, or a flash point of 100 ° C or higher

X: less than 100 占 폚 of the flash point

Figure pct00001

Figure pct00002

Figure pct00003

3. Particle Removability of Detergent Composition

[Preparation of contaminated liquid]

9.9 g of acetone (manufactured by Wako Pure Chemical Industries, Ltd., purity of 99.5% or more) and 9.9 g of crystalline silica filler (trade name: CLISTLITE VX-S2) were added to a screw tube (capacity 20 mL) (Average particle diameter: 5 μm, manufactured by Ryonsumori Co., Ltd.) was added and 10 g of a contaminated liquid (A) having a concentration of 1% was prepared by shaking well. Subsequently, 1 g of the contaminated liquid (A) and 9 g of acetone were placed in the other screw tube (A ') and shaken well to prepare 10 g of a contaminated liquid (A') having a concentration of 0.1%.

Similarly, 9.9 g of acetone and 0.1 g of spherical silica (trade name "Sciqas", manufactured by Sakai Chemical Industry Co., Ltd., average particle diameter 1 μm) were added to the screw tube B and shaken thoroughly to prepare a contaminated liquid B) was prepared. Then, 1 g of the contaminated liquid (B) and 9 g of acetone were placed in the other screw tube (B ') and shaken well to prepare 10 g of a contaminated liquid (B') having a concentration of 0.1%.

Similarly, 9.9 g of acetone and 0.1 g of alumina particles (trade name "α-alumina for precision polishing", manufactured by Wako Pure Chemical Industries, Ltd., average particle diameter 0.5 μm) were added to the screw tube C and shaken well, 10 g of a contaminated liquid (C) having a concentration of 1% was prepared. Subsequently, 1 g of the polluted liquid (C) and 9 g of acetone were placed in the other screw tube (C ') and shaken well to prepare 10 g of a contaminated liquid (C') having a concentration of 0.1%.

[Preparation of Wafer for Test]

Next, 0.02 g of the contaminated liquid (A) was dropped to the center of a high purity silicon wafer (diameter: 4 inches, manufactured by Asuzon Co., Ltd.) and naturally dried to prepare a test wafer (A). The test wafers (B), (C), and (A ') to (C') were dripped onto the high-purity silicon wafers, (C ').

[Method for Evaluating Particle Removability]

Example 1

1, 40.0 g (2) of the crude detergent solution of Preparation Example 1, 960.0 g (3) of ion-exchanged water, and 9.4 g of a stirrer piece (4) were placed in a beaker 1 (capacity 1000 mL, diameter 110 mm, (A + C) / (A + B + C)] of the component (A), the component (B) and the component (C) is reduced to 1/50 to obtain a detergent composition Was prepared. Subsequently, the test wafer (A) 6 was placed in the solution while the rotational speed of the magnetic stirrer was adjusted to 800 rpm, and the wafer (A) 6 was cleaned for 10 minutes at room temperature while being fixed by a stainless steel clip (7) and a stainless steel bar . Thereafter, the test wafer A was taken out of the solution, and dried in a wind-drier set at a temperature of 80 캜 for 10 minutes. The test wafers (B), (C) and (A ') to (C') were also washed and dried in the same manner.

Next, using the optical microscope (1000 magnification), the contaminated portions of the test wafer (A) after cleaning and drying were observed randomly at five places to obtain the total number of remaining particles. On the other hand, the total number of particles adhering to the surface of the wafer immediately after contamination in the contaminated liquid (A) was determined by the same method as this, and the particle removal rate was calculated by the following equation. This evaluation was carried out five times for each example, and an average value of particle removal ratios was obtained, and the particle removability was evaluated based on the following evaluation criteria. The results are shown in Table 4 (hereafter, the same).

Particle removal rate (%) = (total number of particles immediately after contamination-total number of particles remaining after cleaning) / total number of particles immediately after contamination 100

[Evaluation Criteria of Particle Removability]

⊚: 90% or more of particle removal rate

○: Particle removal rate is 70% or more and less than 90%

?: Particle removal rate is 50% or more and less than 70%

X: Particle removal rate is less than 50%

In addition, the removal performance of the wafers (B), (C) and (A ') to (C') after the cleaning and drying was evaluated in the same manner.

Example 2

1, 20.0 g (2) of the crude detergent solution of Preparation Example 1, 980.0 g (3) of ion-exchanged water and 4 parts of the stirrer piece (4) were added to the beaker 1 (capacity 1000 mL, diameter 110 mm, (A + C) / (A + B + C)] of the component (A), the component (B) and the component (C) is reduced to 1/100 by a magnetic stirrer Was prepared. Subsequently, the test wafer (A) 6 was placed in the solution while the rotational speed of the magnetic stirrer was adjusted to 800 rpm, and the wafer (A) 6 was cleaned for 10 minutes at room temperature while being fixed by a stainless steel clip (7) and a stainless steel bar . Thereafter, the wafer for test A was taken out of the solution, and dried in a circulating air dryer set at a temperature of 80 캜 for 10 minutes. The test wafers (B), (C) and (A ') to (C') were also washed and dried in the same manner.

The removability of the wafers (A) to (C) and (A ') to (C') after cleaning and drying was evaluated on the basis of evaluation criteria equivalent to those in Example 1.

Example 3

As shown in Fig. 1, 1.0 g (2) of the crude detergent solution of Preparation Example 1, 999.0 g of ion-exchanged water (3, and a stirrer piece (4)) was added to the beaker 1 (capacity 1000 mL, diameter 110 mm, (A + C) / (A + B + C)) of the component (A), the component (B) and the component (C) is reduced to 1/2000 to obtain a detergent composition Then, while the rotational speed of the magnetic stirrer was adjusted to 800 rpm, the test wafer (A) 6 was placed in the solution, and the test wafer (A) 6 was fixed by a stainless steel clip (7) and a stainless steel bar (8) The test wafer A was taken out from the solution and dried for 10 minutes in a dry air dryer set at a temperature of 80 DEG C. The test wafers (B), (C) and (A ') - (C '), Followed by washing and drying in this order.

The removability of the wafers (A) to (C) and (A ') to (C') after cleaning and drying was evaluated on the basis of evaluation criteria equivalent to those in Example 1.

Example 4

As shown in Fig. 1, 0.2 g (2) of the crude detergent solution of Preparation Example 1, 999.8 g (3) of ion-exchanged water and 4 g of the stirrer piece (4) were added to the beaker 1 (capacity 1000 mL, diameter 110 mm, (A + C) / (A + B + C)) of the component (A), the component (B) and the component (C) is 1/10000, and the mixture is stirred with the magnetic stirrer Was prepared. Subsequently, the test wafer (A) 6 was placed in the solution while the rotational speed of the magnetic stirrer was adjusted to 800 rpm, and the wafer (A) 6 was cleaned for 10 minutes at room temperature while being fixed by a stainless steel clip (7) and a stainless steel bar . Thereafter, the wafer for test A was taken out of the solution, and dried in a circulating air dryer set at a temperature of 80 캜 for 10 minutes. The test wafers (B), (C) and (A ') to (C') were also washed and dried in the same manner.

The removability of the wafers (A) to (C) and (A ') to (C') after cleaning and drying was evaluated on the basis of evaluation criteria equivalent to those in Example 1.

Examples 5 to 18 and Comparative Examples 1 to 8

(A + C) / (A + B + C)] was diluted to 1/2000 or 1/10000 in the same manner as in Example 1, and each of the cleaning agent solutions was diluted with particles And the removability was evaluated.

Comparative Example 9

The detergent stock solution of Comparative Preparation Example 5 was not evaluated because the flash point was less than 100 캜.

Comparative Example 10

As shown in Fig. 1, 1000 g (3) of ion-exchanged water and a stirrer piece (4) were placed in a beaker 1 (capacity 1000 mL, diameter 110 mm, height 150 mm) and the rotation speed of the magnetic stirrer was adjusted to 800 rpm. Subsequently, the test wafer (A) 6 was placed in the solution, and the wafer (A) 6 was cleaned for 10 minutes at room temperature while being fixed by a stainless steel clip (7) and a stainless steel bar (8). Thereafter, the test wafer A was taken out of the solution, and dried in a wind-drier set at a temperature of 80 캜 for 10 minutes. Also, the test wafers A 'to C' were cleaned and dried in the same manner.

The removability of the wafers (A) to (C) and (A ') to (C') after cleaning and drying was evaluated on the basis of evaluation criteria equivalent to those in Example 1.

4. Drying of the detergent composition

[Evaluation method of drying property]

Example 1

4.0 g of the cleaning agent solution of Preparation Example 1 and 96.0 g of ion-exchanged water were added to a screw tube (capacity 100 mL), and the mixture was shaken well and the mixing ratio of (A + C ) / (A + B + C)] was 1/50. Next, 0.05 g of the detergent composition was dropped onto the center of a high-purity silicon wafer (diameter: 4 inches, manufactured by Asuzon Co., Ltd.) and allowed to stand in a circulating air dryer adjusted to 80 캜 for 20 minutes. Then, the surface of the dried wafer was visually observed, and the dryness of the cleaning composition was evaluated based on the following evaluation criteria.

[Evaluation Criteria of Dryness]

○: No residue of detergent composition

X: Residue of detergent composition

Example 2

2.0 g of the detergent solution of Preparation Example 1 and 98.0 g of ion-exchanged water were added to a screw tube (capacity 100 mL), and the mixture was shaken well and the mixing ratio of (A + C ) / (A + B + C)] was 1/100. Hereinafter, the drying properties of the detergent composition were evaluated in the same manner as in Example 1. [

Example 3

0.1 g of the crude detergent solution of Preparation Example 1 and 99.9 g of ion-exchanged water were added to a screw tube (capacity: 100 mL) and the mixture was shaken well and the mixing ratio [(A + C) ) / (A + B + C)] was 1/2000. Hereinafter, the drying properties of the detergent composition were evaluated in the same manner as in Example 1. [

Example 4

0.02 g of the cleaning agent solution of Preparation Example 1 and 99.98 g of ion-exchanged water were added to a screw tube (capacity: 100 mL) and thoroughly shaken to prepare a blend ratio of (A + C ) / (A + B + C)] was 1/10000. Hereinafter, the drying properties of the detergent composition were evaluated in the same manner as in Example 1. [

Examples 5 to 18 and Comparative Examples 1 to 8

(A + C) / (A + B + C)] was diluted to 1/2000 or 1/10000 in the same manner as in Example 1, and each of the detergent compositions was diluted with each detergent composition The composition was evaluated.

Comparative Example 10

Drying was evaluated by the same procedure as in Example 1 using ion-exchanged water.

Figure pct00004

1: Beaker
2: Detergent solution
3: Ion exchange water
4: stirrer piece
5: Magnetic stirrer
6: Test wafer
7: Stainless steel clip
8: Stainless steel rods

Claims (9)

  1. A detergent composition comprising a tertiary amine (A) and water (B) exhibiting water and azeotropic properties,
    The tertiary amine (A) has a boiling point of 130 to 250 캜 under 1 atm,
    The weight ratio (%) of the tertiary amine (A) in the total of the tertiary amine (A) and the water (B) Wherein the weight ratio of the tertiary amine (A) in the mixture is lower than that of the tertiary amine
    Cleaner composition for electronic materials.
  2. The method according to claim 1,
    General formula (1) showing water and azeotropy:
    R 1 -O- [CH 2 -CH (X) -O] n H
    (C) a glycol-based solvent represented by the formula (1) wherein R 1 represents an alkyl group having 1 to 4 carbon atoms, n represents 1 to 3, and X represents hydrogen or a methyl group,
    The glycol-based solvent (C) has a boiling point of 120 to 275 ° C under 1 atm,
    Wherein the weight ratio (%) of the glycol solvent (C) in the total of the glycol solvent (C) and the water (B) in the detergent composition is in the range of Based solvent (C) in the mixture is less than or equal to the weight ratio of the glycol-
    Cleaner composition for electronic materials.
  3. 3. The method according to claim 1 or 2,
    Wherein the tertiary amine (A) is a compound represented by the general formula (2):
    (R 2 ) R 3 N-CH 2 - CH (Y) -OH
    (In the formula (2), R 2 and R 3 each represent the same or different alkyl group having 1 to 3 carbon atoms and Y represents hydrogen or a methyl group), and
    The general formula (3)
    (R 4 ) R 5 N-C 2 H 4 -Z-C 2 H 4 -NR 6 (R 7 )
    (In the formula (3), R 4 , R 5 , R 6 and R 7 are the same or different and each represents an alkyl group having 1 to 3 carbon atoms; Z represents -CH 2 -, - (CH 2 ) 2- , -O-, -NH- or -N (CH 3 ) And a polyamine (A2) represented by the following general formula
    Cleaner composition for electronic materials.
  4. 4. The method according to any one of claims 1 to 3,
    (A / (A + B)) of the tertiary amine (A) in the total amount of the tertiary amine (A) and the water (B)
    Cleaner composition for electronic materials.
  5. 5. The method according to any one of claims 2 to 4,
    (A + C) / ((C)) of the tertiary amine (A) and the glycol solvent (C) in the total of the tertiary amine (A), the water (B) and the glycol solvent A + B + C)) is 1/100000 or more.
  6. A cleaning agent composition for electronic materials according to any one of claims 1 to 5, which comprises the tertiary amine (A) and the water (B)
    Detergent solution.
  7. A cleaning method for an electronic material, comprising the step of cleaning an electronic material using the cleaning composition for an electronic material according to any one of claims 1 to 5,
    Method of cleaning electronic materials.
  8. 8. The method of claim 7,
    Characterized in that it does not include a washing step,
    Method of cleaning electronic materials.
  9. The method of claim 7 or 8, further comprising a step of removing particles of the electronic material.
    Method of cleaning electronic materials.
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