KR20170004826A - 캐리어 부착 동박, 동장 적층판 및 프린트 배선판 - Google Patents

캐리어 부착 동박, 동장 적층판 및 프린트 배선판 Download PDF

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Publication number
KR20170004826A
KR20170004826A KR1020160016978A KR20160016978A KR20170004826A KR 20170004826 A KR20170004826 A KR 20170004826A KR 1020160016978 A KR1020160016978 A KR 1020160016978A KR 20160016978 A KR20160016978 A KR 20160016978A KR 20170004826 A KR20170004826 A KR 20170004826A
Authority
KR
South Korea
Prior art keywords
carrier
copper foil
foil
5cbta
4cbta
Prior art date
Application number
KR1020160016978A
Other languages
English (en)
Korean (ko)
Inventor
아키토시 다카나시
Original Assignee
미쓰이금속광업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이금속광업주식회사 filed Critical 미쓰이금속광업주식회사
Priority to KR1020160177436A priority Critical patent/KR102316978B1/ko
Publication of KR20170004826A publication Critical patent/KR20170004826A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2386/00—Specific polymers obtained by polycondensation or polyaddition not provided for in a single one of index codes B32B2363/00 - B32B2383/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020160016978A 2015-07-01 2016-02-15 캐리어 부착 동박, 동장 적층판 및 프린트 배선판 KR20170004826A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160177436A KR102316978B1 (ko) 2015-07-01 2016-12-23 캐리어 부착 동박, 동장 적층판 및 프린트 배선판

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-133105 2015-07-01
JP2015133105A JP5842077B1 (ja) 2015-07-01 2015-07-01 キャリア付銅箔、銅張積層板及びプリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020160177436A Division KR102316978B1 (ko) 2015-07-01 2016-12-23 캐리어 부착 동박, 동장 적층판 및 프린트 배선판

Publications (1)

Publication Number Publication Date
KR20170004826A true KR20170004826A (ko) 2017-01-11

Family

ID=55073285

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020160016978A KR20170004826A (ko) 2015-07-01 2016-02-15 캐리어 부착 동박, 동장 적층판 및 프린트 배선판
KR1020160177436A KR102316978B1 (ko) 2015-07-01 2016-12-23 캐리어 부착 동박, 동장 적층판 및 프린트 배선판

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020160177436A KR102316978B1 (ko) 2015-07-01 2016-12-23 캐리어 부착 동박, 동장 적층판 및 프린트 배선판

Country Status (7)

Country Link
JP (1) JP5842077B1 (ja)
KR (2) KR20170004826A (ja)
CN (1) CN106332458B (ja)
LU (1) LU93050B1 (ja)
MY (1) MY176516A (ja)
PH (1) PH12016000167B1 (ja)
TW (1) TWI583268B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190111803A (ko) * 2018-03-23 2019-10-02 미쓰이금속광업주식회사 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5842077B1 (ja) * 2015-07-01 2016-01-13 三井金属鉱業株式会社 キャリア付銅箔、銅張積層板及びプリント配線板
JP6471140B2 (ja) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法
KR102480377B1 (ko) * 2018-08-10 2022-12-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
KR20240085453A (ko) 2022-12-08 2024-06-17 롯데에너지머티리얼즈 주식회사 캐리어박 부착 동박 및 이를 이용한 동박 적층판

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317574A (ja) 1998-01-19 1999-11-16 Mitsui Mining & Smelting Co Ltd 複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
JP2003328178A (ja) 2002-05-14 2003-11-19 Mitsui Mining & Smelting Co Ltd 高温耐熱用キャリア箔付電解銅箔の製造方法及びその製造方法で得られる高温耐熱用キャリア箔付電解銅箔

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US6319620B1 (en) * 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
JP3812834B2 (ja) * 2002-08-12 2006-08-23 三井金属鉱業株式会社 キャリア箔付電解銅箔並びにその製造方法及びそのキャリア箔付電解銅箔を用いた銅張積層板
JP2009180796A (ja) * 2008-01-29 2009-08-13 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、及びプリント配線板の製造方法
EP2546387A1 (en) * 2008-03-21 2013-01-16 Enthone, Inc. Adhesion promotion of metal to laminate with a multi-functional compound
JP5379528B2 (ja) 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
EP2240005A1 (en) * 2009-04-09 2010-10-13 ATOTECH Deutschland GmbH A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
CN101892499B (zh) * 2010-07-24 2011-11-09 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法
WO2012118031A1 (ja) * 2011-03-03 2012-09-07 ニチゴー・モートン株式会社 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及び導体パターンの形成方法
JP5842077B1 (ja) * 2015-07-01 2016-01-13 三井金属鉱業株式会社 キャリア付銅箔、銅張積層板及びプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317574A (ja) 1998-01-19 1999-11-16 Mitsui Mining & Smelting Co Ltd 複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
JP2003328178A (ja) 2002-05-14 2003-11-19 Mitsui Mining & Smelting Co Ltd 高温耐熱用キャリア箔付電解銅箔の製造方法及びその製造方法で得られる高温耐熱用キャリア箔付電解銅箔

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190111803A (ko) * 2018-03-23 2019-10-02 미쓰이금속광업주식회사 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판

Also Published As

Publication number Publication date
CN106332458A (zh) 2017-01-11
MY176516A (en) 2020-08-12
JP5842077B1 (ja) 2016-01-13
KR102316978B1 (ko) 2021-10-25
PH12016000167A1 (en) 2017-10-30
JP2017013385A (ja) 2017-01-19
TWI583268B (zh) 2017-05-11
LU93050B1 (en) 2017-06-08
LU93050A1 (en) 2017-01-25
KR20170004924A (ko) 2017-01-11
TW201622495A (zh) 2016-06-16
PH12016000167B1 (en) 2017-10-30
CN106332458B (zh) 2019-03-22

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