KR20160129241A - Printed circuit board, lens driving unit and camera module including the same - Google Patents

Printed circuit board, lens driving unit and camera module including the same Download PDF

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Publication number
KR20160129241A
KR20160129241A KR1020150061040A KR20150061040A KR20160129241A KR 20160129241 A KR20160129241 A KR 20160129241A KR 1020150061040 A KR1020150061040 A KR 1020150061040A KR 20150061040 A KR20150061040 A KR 20150061040A KR 20160129241 A KR20160129241 A KR 20160129241A
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KR
South Korea
Prior art keywords
terminal
circuit board
printed circuit
conductive layer
coating layer
Prior art date
Application number
KR1020150061040A
Other languages
Korean (ko)
Inventor
박상옥
민상준
유경호
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020150061040A priority Critical patent/KR20160129241A/en
Priority claimed from EP16166401.6A external-priority patent/EP3088931A1/en
Publication of KR20160129241A publication Critical patent/KR20160129241A/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Abstract

One embodiment of the printed circuit board is a printed circuit board, comprising: a terminal surface formed on the printed circuit board; A plurality of terminals formed on a surface of the terminal surface; And a coating layer formed on the surface of the terminal and a surface of the terminal to cover the surface of the terminal and a surface of the terminal, wherein a length of a boundary formed between the coating layer and the terminal, May be formed to be longer than the width direction length of the terminal.

Description

[0001] The present invention relates to a printed circuit board (PCB), a lens driving apparatus including the same, and a camera module
An embodiment relates to a printed circuit board, a lens driving device including the same, and a camera module.
The contents described in this section merely provide background information on the embodiment and do not constitute the prior art.
In recent years, IT products such as mobile phones, smart phones, tablet PCs, and laptops with ultra-small camera modules are actively under development.
The camera module includes a lens driving device, and the lens driving device is provided with a printed circuit board as one component. The printed circuit board may have a terminal for electrical connection with an external device.
In addition, various elements, circuit patterns, and the like, which are electrically connected to the terminals, may be formed on the printed circuit board. If the camera module is subjected to falling or other external impact, stress may be generated in the terminals formed on the printed circuit board.
These stresses can cause cracks in the terminals. In addition, when the camera module repeatedly receives an external impact, the stress is further accumulated, and accordingly, if the number and size of the cracks are increased, a disconnection phenomenon in which the terminals are broken may occur.
Disconnection of such terminals may cause malfunction of the printed circuit board, the lens driving device, and the camera module, and improvement is required.
Therefore, the embodiment relates to a printed circuit board capable of suppressing the occurrence of cracks in the terminals and preventing disconnection of the terminals, a lens driving apparatus including the same, and a camera module.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
One embodiment of the printed circuit board is a printed circuit board, comprising: a terminal surface formed on the printed circuit board; A plurality of terminals formed on a surface of the terminal surface; And a coating layer formed on the surface of the terminal and a surface of the terminal to cover the surface of the terminal and a surface of the terminal, wherein a length of a boundary formed between the coating layer and the terminal, May be formed to be longer than the width direction length of the terminal.
Wherein the terminal surface is protruded at least one side of the printed circuit board, a plurality of the terminals are printed at predetermined intervals on the terminal surface, the coating layer surrounds the respective terminals, and a part of the surface of the terminal May be formed to be exposed.
The boundary line between the coating layer and the terminal may be formed in at least one of a linear shape, a triangular shape, a round shape, an arc shape, a semicircular shape, and a wavy shape having bending points.
The boundary between the coating layer and the terminal may have a width of 0.03 mm to 0.07 mm in the longitudinal direction of the terminal.
The coating layer may be formed of a photosensitive ink (photo solder resist ink) or a polyimide material.
One embodiment of the printed circuit board may have a conductive layer formed on a lower surface of the terminal, the conductive layer being electrically connected to the terminal.
The conductive layer may be formed of copper or copper alloy, and may be formed in the same number as the plurality of terminals.
One embodiment of the printed circuit board includes: a terminal surface; The conductive layer disposed on an upper surface of the terminal surface; The terminal disposed on the top surface of the conductive layer; And a coating layer disposed on an upper surface of the terminal and a part of an upper surface of the terminal exposed, wherein the terminal surface, the conductive layer, and the terminal are electrically connected to each other.
One embodiment of the printed circuit board may include at least one via formed through the conductive layer and the terminal and electrically connecting the conductive layer and the terminal.
One embodiment of a printed circuit board includes: a terminal surface; The conductive layer disposed on an upper surface of the terminal surface; The terminal disposed on the top surface of the conductive layer; And a coating layer disposed on an upper surface of the terminal and a part of the upper surface of the terminal exposed; And the vias formed through the conductive layer and the terminal, wherein the vias electrically connect the terminal surface, the conductive layer, and the terminal.
One embodiment of the lens drive apparatus may include the printed circuit board described above.
One embodiment of the camera module may include the lens driving device described above.
In the embodiment, the printed circuit board can increase the length of the boundary line formed between the coating layer and the terminal, spread the stress generated along the boundary line, and suppress cracking due to concentration of stress.
Also, the printed circuit board has a conductive layer, so that an electrical connection to the printed circuit board and the terminal can be maintained even if the terminal is broken due to stress generated in the boundary line.
In addition, the printed circuit board is provided with vias, so that the electrical connection between the printed circuit board and the terminals can be maintained even if the terminals are broken due to the stress generated at the boundary.
1 is a perspective view showing a part of a lens driving apparatus including a printed circuit board according to an embodiment.
2 and 3 are exploded perspective views showing a part of a lens driving apparatus including a printed circuit board according to an embodiment.
4 is a plan view of a printed circuit board according to an embodiment.
5 is a view showing a portion A in Fig.
6 is a view illustrating a printed circuit board according to another embodiment.
7 is a view illustrating a printed circuit board according to another embodiment.
8 is a side view showing a state in which FIG. 7 is viewed in the direction of arrow B. FIG.
9 is a view illustrating a printed circuit board according to another embodiment.
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The embodiments are to be considered in all aspects as illustrative and not restrictive, and the invention is not limited thereto. It is to be understood, however, that the embodiments are not intended to be limited to the particular forms disclosed, but are to include all modifications, equivalents, and alternatives falling within the spirit and scope of the embodiments. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience.
The terms "first "," second ", and the like can be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In addition, terms specifically defined in consideration of the constitution and operation of the embodiment are only intended to illustrate the embodiments and do not limit the scope of the embodiments.
In the description of the embodiments, when it is described as being formed on the "upper" or "on or under" of each element, the upper or lower (on or under Quot; includes both that the two elements are in direct contact with each other or that one or more other elements are indirectly formed between the two elements. Also, when expressed as "on" or "on or under", it may include not only an upward direction but also a downward direction with respect to one element.
It is also to be understood that the terms "top / top / top" and "bottom / bottom / bottom", as used below, do not necessarily imply nor imply any physical or logical relationship or order between such entities or elements, But may be used only to distinguish one entity or element from another entity or element.
Further, in the drawings, an orthogonal coordinate system (x, y, z) can be used. In the drawing, the x axis and the y axis mean an axis perpendicular to the optical axis. For convenience, the optical axis direction (z axis direction) can be referred to as a first direction, the x axis direction as a second direction, and the y axis direction as a third direction.
1 is a perspective view showing a part of a lens driving apparatus including a printed circuit board according to an embodiment. 2 is an exploded perspective view showing a part of a lens driving apparatus including a printed circuit board according to an embodiment.
An image stabilizer applied to a small-sized camera module of a mobile device such as a smart phone or a tablet PC is a device for preventing the outline of the photographed image from being formed due to the vibration caused by the shaking of the user at the time of shooting the still image Means a configured device. The auto focusing apparatus is a device that automatically focuses an image of an object on an image sensor (not shown).
In this embodiment, the optical module including a plurality of lenses may be moved in a first direction, or may be moved in a direction perpendicular to the first direction. In this case, Operation and / or auto focusing operation.
As shown in FIG. 2, the lens driving apparatus according to the embodiment may include a movable portion. At this time, the movable portion can perform functions of auto focusing of the lens and correction of camera shake. The movable part may include a bobbin 110, a first coil 120, a first magnet 130, a housing 140, an upper elastic member 150, and a lower elastic member 160.
The bobbin 110 has a first coil 120 disposed on an outer circumferential surface of the first magnet 130 and a second coil 120 disposed on an inner side of the first magnet 130. The bobbin 110 has an electromagnetic interaction between the first magnet 130 and the first coil 120 And may be installed in the inner space of the housing 140 to reciprocate in the first direction. The first coil 120 may be installed on the outer circumferential surface of the bobbin 110 to enable electromagnetic interaction with the first magnet 130.
Further, the bobbin 110 is elastically supported by the upper and lower elastic members 150 and 160, and can perform the auto focusing function by moving in the first direction.
The bobbin 110 may include a lens barrel (not shown) in which at least one lens is installed. The lens barrel may be coupled to the inside of the bobbin 110 in various ways.
For example, female threads may be formed on the inner circumferential surface of the bobbin 110, male thread corresponding to the threads may be formed on the outer circumferential surface of the lens barrel, and the lens barrel may be coupled to the bobbin 110 by screwing. However, the present invention is not limited thereto, and the lens barrel may be directly fixed to the inside of the bobbin 110 by a method other than screwing, without forming a thread on the inner circumferential surface of the bobbin 110. Alternatively, the one or more lenses may be formed integrally with the bobbin 110 without a lens barrel.
The lens coupled to the lens barrel may be composed of a single lens, or two or more lenses may be configured to form an optical system.
The auto focusing function is controlled according to the direction of the current, and the auto focusing function may be realized by moving the bobbin 110 in the first direction. For example, when the forward current is applied, the bobbin 110 can move upward from the initial position, and when the reverse current is applied, the bobbin 110 can move downward from the initial position. Alternatively, the amount of unidirectional current may be adjusted to increase or decrease the movement distance from the initial position in one direction.
The upper and lower surfaces of the bobbin 110 may have a plurality of upper support protrusions and lower support protrusions. The upper support protrusion may be provided in a cylindrical shape or a prismatic shape, and the upper elastic member 150 may be engaged and fixed. The lower support protrusions may be cylindrical or prismatic like the upper support protrusions, and the lower elastic members 160 may be engaged and fixed.
At this time, the upper elastic member 150 may have a through hole corresponding to the upper supporting protrusion, and the lower elastic member 160 may have a through hole corresponding to the lower supporting protrusion. The support protrusions and the through holes may be fixedly bonded to each other by an adhesive such as heat seal or epoxy.
The housing 140 has a hollow column shape for supporting the first magnet 130, and may be formed in a substantially rectangular shape. The first magnet 130 and the support member 220 may be coupled to the side surface of the housing 140.
As described above, the bobbin 110, which is guided by the elastic members 150 and 160 and moves in the first direction, may be disposed inside the housing 140. In an embodiment, the first magnet 130 may be disposed at a corner of the housing 140, and the support member 220 may be disposed at a side surface thereof.
The upper elastic member 150 and the lower elastic member 160 can elastically support the bobbin 110 in the first direction in the upward and downward directions. The upper elastic member 150 and the lower elastic member 160 may be formed of leaf springs.
As shown in FIG. 2, the upper elastic member 150 may be provided as two separate members. The divided portions of the upper elastic member 150 can be supplied with different polarity currents or different power sources through the two-divided structure. Further, as a modified embodiment, the lower elastic member 160 may have a two-piece structure, and the upper elastic member 150 may have an integral structure.
Meanwhile, the upper elastic member 150, the lower elastic member 160, the bobbin 110, and the housing 140 may be assembled through heat bonding and / or bonding using an adhesive or the like. At this time, it is possible to finish the fixing work by bonding using, for example, an adhesive after fixing by heat fusion.
The base 210 is disposed at a lower portion of the bobbin 110 and may be formed in a substantially rectangular shape. The printed circuit board 250 may be seated and the lower side of the support member 220 may be fixed. In addition, a support member 220 mounting groove 214 into which the support member 220 can be inserted may be recessed on the upper surface of the base 210. An adhesive may be applied to the seating groove 214 of the supporting member 220 to fix the supporting member 220 so as not to move.
A supporting groove having a corresponding size may be formed on the surface of the base 210 opposite to the portion on which the terminal surface 253 of the printed circuit board 250 is formed. The support groove is recessed to a certain depth from the outer circumferential surface of the base 210 so that the portion where the terminal surface 253 is formed is prevented from protruding outward or can be adjusted.
The support member 220 is disposed on the side surface of the housing 140 and has an upper side coupled to the housing 140 and a lower side coupled to the base 210. The bobbin 110 and the housing 140 Can be movably supported in a second direction and a third direction perpendicular to the first direction, and can be electrically connected to the first coil (120).
Since the support members 220 according to the embodiment are respectively disposed on the outer sides of the quadrangle of the housing 140, a total of four support members 220 may be installed symmetrically. However, the present invention is not limited to this, and it is also possible that the number of each of the two linear surfaces is eight. The support member 220 may be electrically connected to the upper elastic member 150 or may be electrically connected to the linear surface of the upper elastic member 150.
Since the support member 220 is formed separately from the upper elastic member 150, the support member 220 and the upper elastic member 150 can be electrically connected through a conductive adhesive agent, solder, or the like. Accordingly, the upper elastic member 150 can apply an electric current to the first coil 120 through the electrically connected support member 220.
In FIG. 2, the plate-like supporting member 220 is shown as an embodiment, but the present invention is not limited thereto. That is, the support member may be provided in a wire form.
The second coil 230 can perform the camera shake correction by moving the housing 140 in the second and / or third directions through the electromagnetic interaction with the first magnet 130.
Here, the second and third directions may include directions substantially in the x- and y-axis directions as well as the x- and y-axis directions. In other words, as seen from the driving aspect of the embodiment, the housing 140 may move parallel to the x- and y-axes, but may also be slightly inclined to the x- and y-axes when it is supported by the support member 220 have.
Also, the first magnet 130 needs to be installed at a position corresponding to the second coil 230.
The second coil 230 may be disposed to face the first magnet 130 fixed to the housing 140. In an embodiment, the second coil 230 may be disposed outside the first magnet 130. Alternatively, the second coil 230 may be installed at a predetermined distance below the first magnet 130.
According to the embodiment, a total of four second coils 230 may be provided at four corners of the circuit member 231, but the present invention is not limited thereto, and one coil for the second direction and one coil for the third direction Only two can be installed, and more than four may be installed.
A circuit pattern may be formed on the circuit member 231 in the form of a second coil 230 and a separate second coil may be disposed on the circuit member 231. However, Only a separate second coil 230 may be disposed on the circuit member 231 without forming a circuit pattern on the member 231 in the form of the second coil 230. [
Alternatively, the second coil 230 may be formed by winding the wire in a donut shape, or may be electrically connected to the printed circuit board 250 by forming the second coil 230 in the form of an FP coil.
The second coil 230 may be disposed on the upper side of the base 210 and the lower side of the housing 140. At this time, the circuit member 231 including the second coil 230 may be installed on the upper surface of the printed circuit board 250 disposed on the upper side of the base 210.
However, the present invention is not limited thereto. The second coil 230 may be disposed closely to the base 210, may be spaced apart from the base 210, may be separately formed on the substrate, It may also be laminated.
The printed circuit board 250 is coupled to the upper surface of the base 210 and has through holes or grooves at corresponding positions to expose the support grooves 214 of the support member 220, .
The printed circuit board 250 may have a bent terminal surface 253 on which the terminal 251 is mounted. The embodiment shows a printed circuit board 250 on which two bent terminal surfaces 253 are formed. A plurality of terminals 251 are disposed on the terminal surface 253 to supply a current to the first coil 120 and the second coil under external power. The number of terminals formed on the terminal surface 253 may be increased or decreased depending on the type of components that need to be controlled. In addition, the printed circuit board 250 may have one or more terminal surfaces 253.
Various elements, circuit patterns, and the like, which are electrically connected to the terminals 251, may be formed on the printed circuit board 250. In addition, the printed circuit board 250 may have a plurality of layers stacked to form device and circuit patterns, and the layers may be electrically connected to each other.
In each of the layers, elements and circuit patterns may exist independently, or layers may be stacked to form elements and circuit patterns that perform a specific function.
The terminal surface 253 is also a part of the printed circuit board 250. Accordingly, the terminal surface may be formed by stacking a plurality of layers, or may be formed on one layer.
The cover member 300 may be provided in a substantially box shape and may receive the moving part, the second coil 230, a part of the printed circuit board 250, and the like, and may be coupled with the base 210. The cover member 300 protects the movable part, the second coil 230, the printed circuit board 250 and the like received in the first and second magnets 130 and 130, The electromagnetic field generated by the coil 120, the second coil 230, and the like can be prevented from leaking to the outside so that the electromagnetic field can be focused.
3 is an exploded perspective view showing a part of a lens driving apparatus including a printed circuit board according to an embodiment. As shown in FIG. 3, the lens driving apparatus of the embodiment may further include a first holder 600 and a substrate 800. The first holder 600 is disposed under the base 210, and the filter 610 can be mounted.
The filter 610 may block the light of a specific frequency band in the light passing through the lens barrel from entering the image sensor 810, which will be described later. At this time, it is preferable that the filter 610 is provided to be placed on the x-y plane.
In addition, the filter 610 may be coupled to the upper surface of the first holder 600, and the filter 610 may be an infrared cut filter. A hollow may be formed in the first holder 600 where the filter 610 is mounted so that light passing through the filter 610 can be incident on the image sensor 810.
The base 210 and the first holder 600 may be bonded to each other by an adhesive. At this time, the adhesive used is, for example, an epoxy, a thermosetting adhesive, or an ultraviolet ray-curable adhesive.
The substrate 800 is disposed under the first holder 600, and the image sensor 810 can be mounted. The image sensor 810 is a portion where the light passing through the filter 610 is incident and the image included in the light is imaged.
At this time, it is preferable that the image sensor 810 is provided to be placed on the x-y plane. In one embodiment, the image sensor 810 may be mounted on the upper surface of the first holder 600.
The substrate 800 may include various circuits, elements, and a controller for converting an image formed on the image sensor 810 into an electrical signal and transmitting the electrical signal to an external device.
The substrate 800 may be coupled to the first holder 600 and fixed to each other by bonding using an adhesive as in the case of the base 210 and the first holder 600. Meanwhile, the substrate 800 may be formed as a circuit board on which the image sensor 810 is mounted, a circuit pattern is formed, and various devices are coupled.
In addition, the substrate 800 may be electrically connected to the printed circuit board 250. Accordingly, the printed circuit board 250 can receive a current required for driving the lens driving device from the substrate 800, and the printed circuit board 250 and the substrate 800 can exchange electrical signals with each other.
3, the terminal 251 provided on the printed circuit board 250 and the soldering portion 820 provided on the board 800 may be mounted on the printed circuit board 250, And can be disposed at positions corresponding to each other.
Accordingly, the plurality of terminals 251 and the soldering portions 820 can be coupled to each other by soldering or the like, so that the printed circuit board 250 and the substrate 800 are electrically connected to each other Can be connected.
4 is a plan view of a printed circuit board 250 according to an embodiment. 5 is a view showing a portion A in Fig. The printed circuit board 250 may include a terminal surface 253, a terminal 251, and a coating layer 252.
The terminal surface 253 is formed to be bendable on the side surface of the printed circuit board 250 and may be provided for electrical connection with an external device. At this time, the external device may be, for example, a substrate 800.
That is, as described above, the terminal 251 formed on the terminal surface 253 and the soldering portion 820 formed on the substrate 800 may be electrically connected by soldering or the like, The circuit board 250 and the substrate 800 may be electrically connected.
Meanwhile, as shown in FIG. 4, the terminal surface 253 may protrude at least one side of the printed circuit board 250, and may be formed of a flexible material. For this purpose, the entire printed circuit board 250 integrally formed with the terminal surface 253 may be formed of a flexible material.
Therefore, the terminal surface 253 may be formed on the side surface of the printed circuit board 250 in a direction parallel to the printed circuit board 250. When the lens driving device is assembled, the flexible terminal surface 253 may be folded down to about 90 degrees in the downward direction and bonded to the side surface of the base 210 by bonding or the like.
A plurality of terminals 251 may be formed on the surface of the terminal surface 253. That is, a plurality of the terminals 251 may be formed on the surface of the terminal surface 253 by a printing technique, a nicking technique, or the like at predetermined intervals.
The number of the plurality of terminals 251 may be appropriately selected according to the structure of the printed circuit board 250, the lens driving device and the substrate 800 connected to the printed circuit, and the electrical connection structure therebetween. In addition, when two or more terminal surfaces 253 are provided, the number of terminals 251 formed on each terminal surface 253 need not necessarily match.
The coating layer 252 is formed on the terminal surface 253 and the surface of the terminal 251 to cover a part of the surface of the terminal surface 253 and the terminal 251. The coating layer 252 is formed on the surface of the terminal surface 253 and the surface of the terminal 251 to electrically isolate the terminal surface 253 and the terminal 251 and prevent their wear can do. At this time, the coating layer 252 may be a phto solder resist (PSR) or a coverlay.
In addition, the coating layer 252 can prevent the lead from being attached to unnecessary parts in the soldering process, and various elements, circuit patterns, and the like formed on the printed circuit board 250 can be directly exposed to the air, Oxidation or deterioration of the film.
The coating layer 252 may surround the respective terminals 251 and may expose portions of the surfaces of the terminals 251. Since the terminal 251 is for electrically coupling with the terminal 251 of the substrate 800 or the like, it is preferable to secure a portion such as soldering for electrical coupling. And may be formed on the upper surface of the terminal 251 while leaving exposed portions.
At this time, the coating layer 252 may be formed of, for example, a photo solder resist ink or a polyimide material.
The photosensitive ink may be applied to the terminal surface 253 and the terminal 251 and then cured to form the coating layer 252. At this time, the photosensitive ink is entirely applied to the terminal 251, and an unnecessary portion of the photosensitive ink is removed through exposure and development to form an exposed portion of the terminal 251. In addition, only a necessary portion is coated and cured, so that the exposed portion of the terminal 251 can be formed.
The polyimide can be produced in the form of a film or a tape. The film, tape, or the like is cut into a required shape and coated on the surface of the terminal surface 253 and the terminal 251, The coating layer 252 may be formed.
Alternatively, the photosensitive ink and the polyimide can be used together. Depending on the application method and the structure of the product, the photosensitive ink can be first worked with the polyimide, or conversely, the photosensitive ink after the polyimide work.
On the other hand, polyimide can be used as a material for producing a flexible substrate (FPCB) with a flexible material. Therefore, in the embodiment, the printed circuit board 250 and the coating layer 252 may be formed of polyimide which is the same material.
5, a coating layer 252 is formed on a top surface of the terminal 251 as a hidden line and electrically connected to various elements and circuit patterns provided on the printed circuit board 250 Region.
In FIG. 5, the portion indicated by the solid line of the terminal 251 is an exposed portion in which the coating layer 252 is not formed on the upper surface to be electrically connected to the substrate 800 or the like. Also in Fig. 6, a terminal 251 is shown in the same manner as described above.
5, a boundary line L may be formed between the coating layer 252 and the terminal 251. As shown in FIG. The length of the boundary line L may be longer than the length of the terminal 251 in the width direction.
If the boundary line L 'is formed in the same width as the length of the terminal 251, a crack may easily occur in the boundary line L'. That is, when the assembled camera module including the printed circuit board 250 receives a drop or other impact, a stress may be generated at the boundary line L ', and such a stress may be generated by cracks at the boundary line L' Can be generated.
5 and 6, the portion of the terminal 251, which is indicated by the hatch line, that is, the portion where the coating layer 252 is formed, is formed on the terminal surface 253 due to the coating layer 252, As shown in Fig.
However, the exposed portion, which is indicated by the solid line of the terminal 251, that is, the coating layer 252 is not formed, can be less firmly bonded or fixed as compared with the portion indicated by the silver line. In addition, since the exposed portion can be connected to the device such as the substrate 800 by soldering or the like, an impact force received by the device such as the substrate 800 can be directly transmitted to the exposed portion during an external impact.
Accordingly, when the camera module receives a drop or other external impact, the exposed portion of the terminal 251 may receive a greater impact than the unexposed portion indicated by the hidden line, Stress can be concentrated.
The stress generated in the boundary line L 'can cause a crack in the terminal 251 along the boundary line L', and when stress is accumulated due to repetitive external shock, a crack grows, L '), and can be disconnected. If disconnection of the terminal 251 due to a crack occurs, this may cause malfunction of the camera module.
The length of the boundary line L formed between the coating layer 252 and the terminal 251 formed on the surface of the terminal 251 may be longer than the length of the terminal 251 In the width direction.
For example, as shown in FIG. 5, the boundary line L may be formed in two equilateral shapes of a linear shape having a bending point, that is, an isosceles triangle. In addition, the boundary line L may be formed as a triangle, that is, a triangle having two sides of three sides of a triangle.
When the terminal 251 is formed in this shape, the boundary line L may be formed to be longer than the width direction of the terminal 251. Accordingly, in the extended boundary line L, Can be dispersed relative to the boundary line L '.
When the stress is dispersed due to the shape of the boundary line L, even if the exposed portion of the terminal 251 receives an impact in the longitudinal direction or the width direction of the terminal 251 due to an external impact, The concentration of the stress can be suppressed, and the occurrence of cracks can be suppressed.
6 is a view illustrating a printed circuit board 250 according to another embodiment. As shown in FIG. 6, the boundary line L may be formed in a round shape, an arc shape, or a semicircular shape.
5, the boundary line L may be formed to be longer than the width direction of the terminal 251, and therefore, a long boundary line L may be formed by the impact The stress of the terminal 251 can be dispersed relative to the straight line boundary line L '.
5, the stress generated in the terminal 251 by the external impact due to the dispersion of the stress can be suppressed from concentrating the stress at the specific point of the boundary line L, so that the occurrence of cracks can be suppressed .
When the boundary line L is formed in a round shape or the like, a notch or a sharp edge is not formed on the boundary line L. Therefore, stress is concentrated on the notch or the sharp edge, Can be prevented.
In the meantime, although not shown, if the shape of the boundary line L can be extended, for example, a wavy shape, a linear shape having a bending point repeatedly, a rounded shape repeated, (L) can be formed.
On the other hand, the width D of the boundary line L measured in the longitudinal direction of the terminal 251 can be appropriately adjusted so that stress is not concentrated at a specific point of the boundary line L. [
When the width D of the boundary line L is small, the occurrence of cracks may not be significantly suppressed as compared with the boundary line L 'of the straight line. When the width D of the boundary line L is large, A portion similar to an edge is formed and a stress is concentrated on the portion, so that a crack can be generated.
Therefore, for example, the width D of the boundary line L may be appropriately formed in a range of 0.02 mm to 0.08 mm, more preferably 0.03 mm to 0.07 mm.
7 is a view of a printed circuit board 250 according to another embodiment. 8 is a side view showing a state in which FIG. 7 is viewed in the direction of arrow B. FIG. In FIG. 7, the coating layer 252 formed on the uppermost layer of the printed circuit board 250 is indicated by a silver line. This is shown for the sake of clarity for clarifying the structure of the terminal 251 and the conductive layer 254 formed under the silver line. This also applies to the case of FIG. 9 shown below.
7 and 8, a conductive layer 254 electrically connected to the terminal 251 may be formed on the lower surface of the terminal 251 in the printed circuit board 250 of the embodiment.
The conductive layer 254 is formed in the shape of a plate made of copper or copper alloy and has the same number as the plurality of terminals 251 so that each of the terminals 251 and each conductive layer 254 is electrically connected to another terminal May be electrically connected to each other independently of the conductive layer 251 and the conductive layer 254.
7 illustrates an example in which the boundary line L has a linear shape having a bending point. However, even when the boundary line L is formed in any shape such as a round shape, an arc shape, a semicircular shape, or a wavy shape, (254) may be provided.
The conductive layer 254 may be electrically connected to the terminal 251. The conductive layer 254 and the terminal 251 may be electrically connected by a printing technique and the conductive layer 254 and the terminal 251 may be electrically connected by a conductive adhesive agent, .
The laminated structure of the terminal surface 253 of the printed circuit board 250 may be as shown in Fig. 8, for example. The laminated structure may be laminated in the order of the terminal surface 253, the conductive layer 254, the terminal 251, and the coating layer 252 in the central portion of the terminal 251.
Specifically, the terminal surface 253 is disposed on the lowest layer, and the conductive layer 254 may be disposed on the terminal surface 253. The terminal 251 may be disposed on the upper surface of the conductive layer 254. A portion of the coating layer 252 may be disposed on the terminal surface 253 and the coating layer 252 may be partially exposed on the terminal surface 253.
The exposed surface of the upper surface of the terminal surface 253 may be electrically connected to a device such as the substrate 800 as described above. At this time, the terminal surface 253, the conductive layer 254, and the terminal 251 are electrically connected to each other, and various elements and circuit patterns provided on the printed circuit board 250 or the terminal surface 253, The terminals 251 may be electrically connected to each other.
The terminal 251 is still electrically connected to the terminal surface 253 by the conductive layer 254 even if a crack occurs at the interface between the terminal 251 and the coating layer 252 and the terminal 251 is broken, Lt; / RTI > Therefore, the conductive layer 254 can serve as a counterpart of the disconnection of the terminal 251 at the interface.
9 is a view illustrating a printed circuit board 250 according to another embodiment. As shown in FIG. 9, the printed circuit board 250 of the embodiment may be provided with vias 255 (vias). At least one of the vias 255 may extend through the conductive layer 254 and the terminal 251 to electrically connect the conductive layer 254 and the terminal 251.
The via 255 is formed by plating with a conductive metal such as copper or nickel and the plated metal electrically connects the terminal 251 to the conductive layer 254 disposed on the upper surface of the terminal 251 .
The vias 255 are formed for each of the plurality of terminals 251 and the conductive layer 254 and the overall size of the printed circuit board 250 is set in the one terminal 251 and the corresponding conductive layer 254, The via 255 may be provided in an appropriate number in consideration of the size, the structure, the size of the via 255, and the like.
The laminated structure of the printed circuit board 250 according to the embodiment is stacked in the order of the terminal surface 253, the conductive layer 254, the terminal 251 and the coating layer 252 in the central portion of the terminal 251, 255 may be provided.
Specifically, the terminal surface 253 is disposed on the lowest layer, and the conductive layer 254 may be disposed on the terminal surface 253. The terminal 251 may be disposed on the upper surface of the conductive layer 254. A portion of the coating layer 252 may be disposed on the terminal surface 253 and the coating layer 252 may be partially exposed on the terminal surface 253.
The vias 255 may be formed through the conductive layer 254 and the terminals 251. The vias 255 may be formed on the terminal surfaces 253 and the conductive layers 254, And may electrically connect the terminal 251. [
The terminal surface 253, the conductive layer 254 and the terminal 251 are electrically connected to each other by the vias 255 so that the terminals 253 are electrically connected to the terminal surfaces 253, , The circuit pattern and the terminal 251 may be electrically connected to each other.
The terminal 251 is still electrically connected to the terminal surface 253 and the conductive layer 251 by the via 255 even if a crack is generated in the interface between the terminal 251 and the coating layer 252 and the terminal 251 is broken. It is possible to maintain an electrical connection with the first electrode 254. Therefore, the vias 255 can serve to prepare for breaking of the terminal 251 at the interface.
The printed circuit board 250 may extend the length of the boundary line L formed between the coating layer 252 and the terminal 251 to widely disperse the stress generated along the boundary line L, It is possible to suppress the occurrence of cracks due to concentration.
The printed circuit board 250 includes the conductive layer 254 so that the printed circuit board 250 can be electrically connected to the printed circuit board 250 and the terminal 251 even if the terminal 251 is broken due to the stress generated in the boundary line L. There is a sustainable effect.
The printed circuit board 250 includes a via 255 to maintain an electrical connection with the printed circuit board 250 and the terminal 251 even if the terminal 251 is broken due to stress generated in the boundary line L. [ There is an effect that can be.
On the other hand, the printed circuit board 250 according to the above-described embodiment can be used in a lens driving apparatus as described above. Further, the lens driving apparatus can be used in various fields, for example, a camera module as described above. The camera module can be applied to a mobile device such as a mobile phone.
While only a few have been described above with respect to the embodiments, various other forms of implementation are possible. The technical contents of the embodiments described above may be combined in various forms other than mutually incompatible technologies, and may be implemented in a new embodiment through the same.
210: Base
250: printed circuit board
251: terminal
252: Coating layer
253: terminal face
254: conductive layer
255: Via
800: Second holder
820: soldering portion
D: width of the border
L, L ': Boundary line

Claims (12)

  1. In a printed circuit board,
    A terminal surface formed on the printed circuit board;
    A plurality of terminals formed on a surface of the terminal surface; And
    And a coating layer formed on the surface of the terminal surface and the terminal and covering a part of the surface of the terminal surface and the terminal,
    / RTI >
    Wherein a length of a boundary line formed between the coating layer and the terminal formed on a surface of the terminal is longer than a width direction length of the terminal.
  2. The method according to claim 1,
    Wherein the terminal surface is protruded at least one side of the printed circuit board, a plurality of the terminals are printed at a predetermined interval on the terminal surface, the coating layer surrounds the respective terminals, and a part of the surface of the terminal The printed circuit board being formed to be exposed.
  3. The method according to claim 1,
    And a boundary between the coating layer and the terminal,
    Wherein the printed circuit board is formed in at least one of a linear shape, a triangular shape, a round shape, an arc shape, a semicircular shape, and a wavy shape having bending points.
  4. The method of claim 3,
    Wherein the boundary between the coating layer and the terminal has a width of 0.03 mm to 0.07 mm in the longitudinal direction of the terminal.
  5. The method according to claim 1,
    Wherein the coating layer comprises:
    A printed circuit board formed of photo solder resist ink or polyimide material.
  6. The method according to claim 1,
    And a conductive layer electrically connected to the terminal is formed on a lower surface of the terminal.
  7. The method according to claim 6,
    Wherein the conductive layer is formed of a copper or copper alloy material and is formed in the same number as the plurality of terminals.
  8. The method according to claim 6,
    Terminal surface;
    The conductive layer disposed on an upper surface of the terminal surface;
    The terminal disposed on the top surface of the conductive layer; And
    A coating layer disposed on an upper surface of the terminal and having a part of an upper surface of the terminal exposed;
    / RTI >
    And the terminal surface, the conductive layer, and the terminal are electrically connected to each other.
  9. The method according to claim 6,
    And at least one via formed through the conductive layer and the terminal and electrically connecting the conductive layer and the terminal.
  10. 10. The method of claim 9,
    Terminal surface;
    The conductive layer disposed on an upper surface of the terminal surface;
    The terminal disposed on the top surface of the conductive layer; And
    A coating layer partially disposed on the upper surface of the terminal, the coating layer being disposed such that a part of the upper surface of the terminal is exposed;
    And the vias formed through the conductive layer and the terminal,
    The via electrically connecting the terminal surface, the conductive layer, and the terminal.
  11. A lens driving apparatus comprising the printed circuit board according to any one of claims 1 to 10.
  12. A camera module comprising the lens driving device according to claim 11.
KR1020150061040A 2015-04-30 2015-04-30 Printed circuit board, lens driving unit and camera module including the same KR20160129241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150061040A KR20160129241A (en) 2015-04-30 2015-04-30 Printed circuit board, lens driving unit and camera module including the same

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR1020150061040A KR20160129241A (en) 2015-04-30 2015-04-30 Printed circuit board, lens driving unit and camera module including the same
EP16166401.6A EP3088931A1 (en) 2015-04-30 2016-04-21 Lens moving apparatus and camera module and optical device including the same
CN201610282618.0A CN106101494B (en) 2015-04-30 2016-04-29 Lens moving device, and camera module and optical apparatus including the same
CN202011156429.1A CN112363292A (en) 2015-04-30 2016-04-29 Lens moving device
US15/144,148 US9921388B2 (en) 2015-04-30 2016-05-02 Lens moving apparatus and camera module and optical device including the same
US15/890,919 US10551587B2 (en) 2015-04-30 2018-02-07 Lens moving apparatus and camera module and optical device including the same
US16/727,107 US20200132962A1 (en) 2015-04-30 2019-12-26 Lens moving apparatus and camera module and optical device including the same

Publications (1)

Publication Number Publication Date
KR20160129241A true KR20160129241A (en) 2016-11-09

Family

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Application Number Title Priority Date Filing Date
KR1020150061040A KR20160129241A (en) 2015-04-30 2015-04-30 Printed circuit board, lens driving unit and camera module including the same

Country Status (1)

Country Link
KR (1) KR20160129241A (en)

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