KR20160104581A - Insulation Material for Construction and Manufacturing Method Thereof - Google Patents

Abstract

The present invention relates to a heat insulating material for buildings having excellent heat insulating performance and low manufacturing cost, and a method of manufacturing the same. The building heat insulating material according to the present invention comprises a heat insulating member, a first wood member integrally coupled to one side of the heat insulating member, and a second wood member integrally coupled to the other side of the heat insulating member The first panel having the heat insulating member and one or more grooves on the side opposite to the second panel, and a heat insulating material, and at least one groove on the side opposite to the first panel Wherein the first wood member is constituted by a first mixture comprising wood pulverized material and a binder and the second wood member is constituted by a second mixture comprising wood pulverized material and a binder .

Description

Technical Field [0001] The present invention relates to a heat insulating material for construction,

The present invention relates to a heat insulating material used for a building such as a house or an apartment, and more particularly, to a heat insulating material for building having excellent heat insulating performance and low manufacturing cost, and a method for manufacturing the same.

Insulation refers to a material that can inhibit or block the movement of heat energy by conduction, convection, radiation. Currently, insulation is used for residential buildings or walls installed on exterior walls or inner walls of houses or buildings, panels used for interior decoration of sandwich panels, or vehicles, ships. Refrigeration warehouses, household appliances, and so on. Recently, as the national necessity of reducing energy consumption to reduce energy costs and to reduce environmental pollution problems has come to light, legislation related to the use of insulation materials in buildings is gradually strengthened.

Patent Document 10-0750862 (Composite insulation for building), Patent registration 10-1218238 (Building insulation and method for manufacturing the same), Patent document 10-2013-0041459 (Composite insulation for building), Patent document 10-2014-0087637 Phenol foam based building insulation and building insulation including it).

The heat insulating material is largely divided into an inorganic insulating material and an organic insulating material, and a composite material of an inorganic insulating material and an organic insulating material. The inorganic insulator is composed mainly of ceramic, silica, and perlite, which is disadvantageous in that it is excellent in flame retardancy but low in heat insulation. In addition, the organic material insulating material is mainly composed of styrofoam, expanded polystyrene, expanded polyurethane, foamed polyethylene and the like, which is low in manufacturing cost and excellent in heat insulation performance, but weak in heat and low in mechanical strength.

Korean Patent No. 0750862 Korea Patent No. 1218238 Korean Patent Publication No. 2013-0041459 Korea Patent Publication No. 2014-0087637

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat insulating material for a building having good heat insulating performance and a method of manufacturing the same.

Another object of the present invention is to provide a heat insulating material having a low manufacturing cost and excellent mechanical strength and a method of manufacturing the same.

Another object of the present invention is to provide a heat insulating material excellent in flame resistance and a method of manufacturing the same.

Another object of the present invention is to provide a heat insulating material capable of lowering the interlayer noise of a building with excellent heat insulating performance and sound insulating performance, and a manufacturing method thereof.

According to a first aspect of the present invention, there is provided a heat insulating material for use in a building, comprising: a heat insulating member; a first wood member integrally coupled to one side of the heat insulating member; And a second panel member integrally coupled to the other side of the first panel, wherein the heat insulating member is composed of a heat insulating material, a first panel having at least one groove on a side opposite to the second panel, And a second panel having at least one groove on a side opposite to the first panel, wherein the first wood member is composed of a first mixture including wood pulverized material and a binder, And the second wood member is constituted by a second mixture comprising the wood pulverizer and the binder.

Further, the heat insulating member is further provided with at least one coupling hole, and the first and second wood members are mutually coupled through the coupling hole.

And the first or second mixture is set in an amount of 650 g to 1 kg when the size of the woody material is 300 mm x 300 mm x 10 mm.

Further, the binder is a water-soluble binder.

Further, the first or second mixture may further include a porous mineral.

And the flame retardant is further included in the first or second mixture.

And the refractory agent is further included in the first or second mixture.

And the first and second wood members are mutually coupled through the coupling hole.

And a finishing material is further applied to the outside of the heat insulating material.

And the flame retardant or refractory material is contained in the finish material.

According to a second aspect of the present invention, there is provided a method of manufacturing a heat insulating material for building, comprising the steps of preparing a mixture by mixing sawdust or wood with a binder, and forming first and second panels having one or more grooves on one side using a heat insulating material Forming a heat insulating member by bonding the first and second panels such that the grooves are opposite to each other, laminating the mixture to form a first mixture layer for the first woody material, Forming a second mixture layer for the second wood member by laminating the mixture on the upper side of the heat insulating member, and forming a second mixture layer for the second wood member on the upper side of the heat insulating member and the first and second mixture layers And curing the binder while pressurizing the binder.

And the first and second mixture are set in an amount of 650 g to 1 kg when the size of the first or second wood member is 300 mm x 300 mm x 10 mm.

And further comprising the step of adsorbing the flame retardant to the wood pulverized product before the first and second mixture forming steps.

And a step of applying a finishing material to the outside of the heat insulating material.

And further comprising the step of forming at least one bonding hole in the heat insulating member.

Further, the binder is an organic binder, and the foaming agent is further mixed in the binder.

The heat insulating material according to the present invention has the advantages of a very low thermal conductivity and the disadvantage in terms of strength and the combination of the second heat insulating member having a relatively good thermal conductivity and a good mechanical strength, And an excellent heat insulating material can be realized.

Further, since the composite thermal insulation material according to the present invention is manufactured using wood byproducts generated in the process of making wood or wood, the manufacturing cost thereof is low, and a large amount of various pores provided in the heat insulating material provides sound insulation and soundproofing effect It provides an additional effect that can be obtained.

In general, energy loss is 20 ~ 40% through the roof, 20 ~ 30% through the wall, and 10 ~ 15% through the floor. The composite insulation according to the present invention is used as a heat insulating material, a flooring material, and a ceiling material for an inner wall surface and an outer wall surface of a building to reduce energy loss of a building and provide sound insulation effects against various noises including inter- .

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description, serve to further the understanding of the technical idea of the invention, It should not be construed as limited.
1 is a perspective view showing an external shape of a wood board 10 employed in the present invention.
2 is a view for explaining the soundproof effect of the wood board 10 shown in Fig.
3 is a perspective view showing an outer shape of a heat insulating material for construction according to the first embodiment of the present invention.
4 is a cross-sectional view showing a sectional configuration of a heat insulating material for construction shown in Fig.
Fig. 5 is an exploded perspective view of the heat insulating member 30 in Figs. 3 and 4. Fig.
Fig. 6 is a perspective view showing another example of the constitution of the heat insulating member 30 in Fig. 3; Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more readily apparent from the following description of preferred embodiments with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

In this specification, when an element is referred to as being on another element, it may be directly formed on another element, or a third element may be interposed therebetween. Also in the figures, the thickness of the components is exaggerated for an effective description of the technical content.

Embodiments described herein will be described with reference to cross-sectional views and / or plan views that are ideal illustrations of the present invention. In the drawings, the thicknesses of the films and regions are exaggerated for an effective description of the technical content. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. For example, the area shown at right angles may be rounded or may have a shape with a certain curvature. Thus, the regions illustrated in the figures have attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific forms of regions of the elements and are not intended to limit the scope of the invention. Although the terms first, second, etc. have been used in various embodiments of the present disclosure to describe various components, these components should not be limited by these terms. These terms have only been used to distinguish one component from another. The embodiments described and exemplified herein also include their complementary embodiments.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms "comprises" and / or "comprising" used in the specification do not exclude the presence or addition of one or more other elements.

In describing the specific embodiments below, various specific details have been set forth in order to explain the invention in greater detail and to assist in understanding it. However, it will be appreciated by those skilled in the art that the present invention may be understood by those skilled in the art without departing from such specific details. In some instances, it should be noted that portions of the invention that are not commonly known in the description of the invention and are not significantly related to the invention do not describe confusing reasons to explain the present invention.

First, the basic concept of the present invention will be described.

Buildings are constructed using various materials. Examples of the material used for building construction include metal materials such as iron, mortar materials such as concrete / cement, brick and lime, aggregates such as tile, stone, plate, wood, glass and gravel, moistureproof materials such as polyethylene and polypropylene, They are very diverse, such as systems, paper-based wallpaper, and plastic flooring.

 The thermal conductivity of the material is approximately 50 to 370 (W / mK) for iron and other metal materials, approximately 1 to 2.5 (W / mK) for concrete / cement, 0.2 to 1 (W / mK) (W / mK), the stone is about 1 to 2.8 (W / mK), the wood is about 0.13 to 0.19 (W / mK) (W / mK), 0.17 ~ 0.27 (W / mK) for wallpaper and 0.19 (W / mK) for flooring, respectively.

Therefore, when building is built, insulation is attached to the inner wall or outer wall of the building in consideration of the cooling and heating of the building. However, as described above, in the case of the conventional heat insulating material, heat insulating materials using an inorganic material having flame retardancy are disadvantageous in thermal conductivity, and in the case of a foamed resin having a high thermal conductivity, flame retardancy is disadvantageous.

The present inventor has studied a method of utilizing wood among the building materials as an insulation material. The wood or wood has a thermal conductivity of 0.13 ~ 0.19 (W / mK), which shows a somewhat higher thermal conductivity for use as an insulating material. However, wood has a relatively good thermal conductivity compared to other materials of the above construction materials. Particularly, the wood is formed of a fiber structure, a water tube is formed inside, and a plurality of pore layers are formed in the fiber structure.

One of the most effective known insulation materials is pores, particularly air layers in a stationary state. Polystyrene, polyurethane, polyethylene resin and the like which are conventionally used as effective insulating materials are not insulated per se. These organic resins must inevitably undergo a foaming process in order to become an insulating material. When the organic resin is foamed, a large amount of pores, that is, a stopped air layer, is produced in the resin. Of course, the foaming gas remains in these pores, and the overall thermal conductivity of the foaming resin changes depending on the thermal conductivity of the gas. Nevertheless, the foamed resin has an effective effect as a heat insulating material due to a large amount of pores provided in the foamed resin, that is, a stopped air layer.

If wood or wood is finely ground and then combined to form a number of pores, a useful thermal insulation material can be constructed using wood pulverized material. In particular, wood or wood produces a large amount of sawdust in the course of work such as sanitizing. Unlike wood or wood, these sawdust are very cheap.

Currently, it is produced by using the by-products of wood and wood, and there are wood board and synthetic wood. Woody boards are made by processing wood to form hair-like woods, which are then joined together using a binder to form a board. Woody boards have been developed as sound absorbing materials. The woolen board provides a soundproof effect by absorbing or reflecting the sound waves using the steps and pores between the woolen wools. The wooly board exhibits a thermal conductivity of about 0.06 to 0.09 (W / mK), which is better than common wood due to the large amount of pores formed in the board. The thermal conductivity of the moped mode still exhibits a somewhat higher thermal conductivity for use as an insulating material. In addition, the production cost of wooden boards, which are formed by processing ordinary wood or wood, is high because the production cost is somewhat high.

Unlike wood board, synthetic wood uses sawdust or finely pulverized wood flour. Synthetic wood is formed by mixing sawdust or wood flour with a binder and compressing it at high pressure. Synthetic wood is heavy and has high strength. It is mainly used as low cost furniture and building materials as a substitute for wood. The thermal conductivity of these synthetic woods is equal to or even higher than that of wood.

As described above, the thermal conductivity of wood is basically somewhat higher than that required for insulating materials in general. In addition, the board made of wood, wool or synthetic wood is very heavy in weight compared with foamed resin, and the price is also high. For this reason, wood has not been utilized as insulation or considered for such use.

The present inventors constructed an effective wood board through a method of forming a large amount of a stopped air layer in a plate material when joining sawdust or wood flour to form a plate material, and using the same appropriately to provide an effective composite insulation material.

1 is a perspective view showing an external shape of a wood board 10 employed in the present invention. The ligneous board 10 is in the form of a square or rectangular plate, and the main material is made of wood pulverized material such as sawdust or wood powder.

In general, when wood or wood is applied, wood chips of various particle sizes, usually called sawdust, are formed, and if necessary, these sawdust or wood or wood are crushed to form wood flour. Also, if necessary, wood or wood may be pulverized to form wood pulverized material of uniform size. Hereinafter, such sawdust or wood flour or by-products of wood or wood are collectively referred to as wood pulverized product.

In the case of using the wood pulverized material to form the wood board 10, the wood pulverized material and the binder are first mixed to form a mixture, that is, a molding material, and then the molding material is rolled or extruded. As the binder, an organic binder of thermosetting or thermoplastic resin type is preferably employed. As the binder, for example, an unsaturated resin such as polyethylene, polypropylene, ABS resin, urethane, or unsaturated polyester can be preferably employed.

The binder preferably includes a halogen-based flame retardant such as a bromine-based or chlorine-based flame retardant, a phosphorus-based flame retardant, and a nitrogen-based flame retardant, such as an inorganic hydroxide-based inorganic flame retardant. Further, the binder may include a heat resistant material such as talc or pyrophyllite, a refractory material, a filler such as a pigment or an inorganic material, or a dispersing agent.

The amount of the binder is about 25 to 50% by weight depending on the type of the binder and the type of the wood pulverized product. Further, in the case of forming the plate material, the amount of the molding material is appropriately set corresponding to the size of the plate material. If the amount of the molding material per unit volume is set too high, the density of the sheet material is increased, and the thermal conductivity is significantly lowered. If the amount of the molding material is set too small, the molding can not be performed well. When the size of the plate material is, for example, 300 mm x 300 mm x 10 mm, the amount of the molding material is set to approximately 650 g to 1 Kg. The forming temperature is set to 90 degrees or higher, preferably 90 degrees to 185 degrees, for example.

Further, a water-soluble binder such as water-soluble urethane may be preferably employed as the binder. The water-soluble binder is capable of effectively lowering the thermal conductivity of the wood board 10 by forming a large amount of pores in the sheet material while moisture is discharged to the outside when rolling or compressing the wood pulverized material.

Also, a method of increasing the flame retardancy of the wood board 10 by adsorbing the flame retardant to the wood pulverized material before mixing the wood pulverized material with the binder can be preferably employed.

As a modification of the wood board 10, a mixture of wood pulverized material and a binder, that is, a molding material, may be further mixed with porous materials such as diatomaceous earth, zeolite, and vermiculite. As described above, the heat insulating and sound insulating ability possessed by any medium is effectively determined by the pores of the medium. Particularly, the sound insulation capacity is a very important factor in the pore size as well as the number of pore holes. The smaller the pore size, the more effective it is to remove the low frequency band sound waves.

In order to reduce the size of the pores formed in the heat insulating material, it is necessary to increase the density by increasing the pressing force when molding the wood board. However, when the density of the ligneous board is increased, the amount of pores in the interior of the lumberboard is reduced, thereby significantly reducing the heat insulating efficiency. Therefore, it is very difficult to form minute pores on the wood board, and as a result, there is a limit to enhance the sound insulation effect on the sound wave in the low frequency band.

In the case of a porous material, that is, in the case of porous ceramics, fine pores of several tens to several hundreds of nanometers are formed in ceramic particles. Therefore, when such a porous material is mixed with the molding material, the sound insulation effect by the heat insulating material can be improved.

Particularly, according to the study of the present inventors, when pores having different sizes are formed in a certain material, sound absorption and sound insulation functions are improved. Fig. 2 is a view for explaining such a sound absorption and sound insulation function.

2, reference numeral 20 denotes a medium in which a plurality of pores are formed. The first pore 21 having a relatively large diameter and the second pore 22 having a small diameter are present in the medium. When the sound wave A is drawn from the outside, the sound wave A is separated from the medium 20 And propagated through the first and second pores 21 and 22. However, when the sound wave A having passed through the first pore 21 enters the second pore 22, the sound wave A is reflected or refracted as indicated by a and b. This phenomenon occurs similarly when the sound wave b passing through the second pore 22 enters the first pore 21. This is because the resonance frequency of the pore varies depending on the pore size.

Generally, the sound insulation function of a material is determined by how much of the sound wave applied from the outside passes through it, and the sound absorption function is determined by how much the sound wave applied from the outside is absorbed. As described above, if pores having different sizes are formed in a certain medium, the linearity of the sound waves is remarkably reduced as the sound waves are reflected and refracted in passing through the pores. That is, the sound insulation function is improved. The sound waves are resonated while passing through pores of different sizes. That is, the sound wave energy of various frequency bands is converted into the vibration energy of the pore, thereby improving the sound absorption function.

As another modification of the wood board 10, a method of foaming the organic binder when the wood board 10 is formed by mixing the foaming agent with the organic binder mixed with the wood pulverized product may be preferably employed.

The wood board 10 described above has the following features.

1. Low thermal conductivity.

The wood board 10 has a relatively low thermal conductivity because a large amount of stable air layer is formed between the wood chips.

2. It has higher mechanical strength than foamed organic material.

Typical foam organics have the disadvantage of being broken or broken by small physical impact from the outside. On the other hand, the wood board 10 described above exhibits high mechanical strength against an external impact.

3. Because it contains many pores, it is very light in weight.

The wood board 10 described above is characterized in that it is very light compared to conventional synthetic wood because a large amount of stable air layer is formed between the wood pulverized products.

4. Has flame retardancy.

The wood board 10 described above can improve the flame retardancy through a method of mixing a flame-retardant substance with a binder or adsorbing a flame-retardant substance on wood pulverized material.

5. The manufacturing cost is low.

Normally, wood chips such as sawdust are by-products that are produced during the processing of wood or wood, so the price is very low.

6. Provide sound proofing effect.

Wood crushed water has the original pores of wood. When the wood pulverized product is compression molded, a large number of pores are formed according to the compressive strength. These pores not only lower the thermal conductivity of the insulation but also reflect and refract the sound waves passing through the insulation to enhance the sound insulation effect of the insulation.

FIG. 3 is a perspective view showing an external shape of a heat insulating material according to the present invention, and FIG. 4 is a sectional view taken along the line A-A 'in FIG.

The heat insulating material according to the present invention is integrally formed in the form of a sandwich panel by integrally connecting the first and second wood members 10 and 40 on both sides of the heat insulating member 30. [ In this embodiment, the first and second wood members 10, 40 are substantially the same as the wood board 10 of Fig.

4 is an exploded perspective view of the heat insulating member 30. FIG. The heat insulating member (30) comprises first and second panels (31, 32). Each of the first and second panels 31 and 32 is formed by mixing a foaming agent with organic substances such as PVC, nylon, polyester and water-based acrylic, ethylvinyl acetate (EVA) and polyvinyl alcohol (PVA) . Preferable examples of the first and second panels are polystyrene foam foam, polyurethane foam foam, polyurea foam foam, polyvinyl chloride foam foam, polypropylene foam foam, polyethylene foam foam, polystyrene foam foam, polyvinyl acetate foam foam, melamine Resin foam foam, phenol resin foam foam, and the like. The heat insulating material for the first and second panels 31, 32 is not limited to a specific one.

 A plurality of hemispherical grooves 31a are provided on one side of the first panel 31. [ Here, the shape and size of the groove 31a are not limited to a specific one. A groove 32a having a size and shape corresponding to the position corresponding to the groove 31a is provided on one side of the second panel 32, that is, the side opposite to the first panel 31. [

In the case of manufacturing the heat insulating material according to the present embodiment, a first layer for forming the first wood member 10 is laminated by laminating a mixture of the wood pulverized material and the binder, and the heat insulating member 30 is formed on the first layer, A second layer of the mixture for the second wood member 40 is laminated on the upper side of the heat insulating member 30 and then the whole is pressed to form the laminate.

In this embodiment, the first and second wood members 10 and 40 are formed, and then the first and second wood members 10 and 40 and the heat insulating member 30 are bonded to each other Can also be suitably applied.

In this embodiment, the heat insulating member 30 is provided between the first and second wood boards 10 and 40. In addition, pores formed by the grooves 31a and 32a are provided inside the heat insulating member 30. For example, in the case of the foamed polyethylene foam or the foamed polyurethane foam constituting the heat insulating member 30, the thermal conductivity is as low as about 0.016 to 0.030 W / mK. Particularly, in the case of pores filled in the space member 30, 0.025 W / mK. Therefore, in this embodiment, the heat insulating member 30 exhibits a very low heat conduction characteristic.

Further, the first and second wood boards 10 and 40 have flame retardancy and very high mechanical strength characteristics. Therefore, the heat insulating material according to the present invention has excellent mechanical strength as a building material and excellent flame retardancy.

In addition, a large amount of pore layer is formed on the first and second wood boards 10 and 40, and in particular, since the heat insulating member 30 also has a large amount of pores, the heat insulating material of the present embodiment has a very excellent sound insulating function.

Fig. 6 is a perspective view showing another example of the construction of the heat insulating member 30. Fig. In this embodiment, the space member 30 is constituted by a plurality of coupling holes 301. This coupling hole 301 is for effectively bonding the insulating member 30 to the first and second wood boards 10 and 40 when the insulating material is manufactured.

That is, the heat insulating member 30 according to the present embodiment is formed by laminating a mixture of wood pulverized material and a binder on the lower side and the upper side of the heat insulating member 30, So that the heat insulating member 30 is firmly coupled to the first and second wood members 10, 40. Since the other portions are substantially the same as those of the above-described embodiment, a detailed description thereof will be omitted.

The embodiments according to the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the present invention.

For example, the shapes of the grooves 31a and 32a provided in the first and second panels 31 and 32 are not limited to the hemispherical shape, but may be various shapes. In addition, the grooves 31a and 32a provided in the first and second panels 31 and 32 may be formed at different positions instead of facing each other.

In addition, the first wood member 10 and the second wood member 40 may be different from each other in constituting other components such as wood byproducts, kinds of special binders, molding density, additives such as flame retardants and fillers .

Further, in the above embodiment, for example, an unsaturated resin or the like may be applied to the outer side of the heat insulating material as a finishing material, and a flame retardant, a refractory agent, a pigment or the like may further be added to the unsaturated resin.

It should be noted that the above-described apparatus and method are not limited to the configurations and methods of the embodiments described above, but the embodiments may be modified so that all or some of the embodiments are selectively combined .

10, 40: wood member 20: medium
21, 22: pores 30: insulating member
31, 32: first and second panels 31a, 32a:
301: Combination ball

Claims (16)

In the insulation used in buildings,
A heat insulating member,
A first wood member integrally coupled to one side of the heat insulating member,
And a second wood member integrally coupled to the other side surface of the heat insulating member,
Wherein the heat insulating member is made of a heat insulating material, a first panel having at least one groove on a side opposite to the second panel, and a heat insulating material, and at least one groove is provided on a side opposite to the first panel And a second panel,
Wherein the first wood member is composed of a first mixture comprising a wood pulverizer and a binder,
Wherein said second wood member is comprised of a second mixture comprising wood pulverized material and a binder. The method according to claim 1,
Wherein the heat insulating member is further provided with at least one coupling hole,
Wherein the first and second wood members are coupled to each other through the coupling hole. 3. The method according to claim 1 or 2,
Wherein the first or second mixture is set in an amount of 650 g to 1 kg when the size of the woody material is 300 mm x 300 mm x 10 mm. The method according to claim 1,
Wherein the binder is a water-soluble binder. 3. The method according to claim 1 or 2,
Characterized in that the first or second mixture further comprises a porous mineral. 3. The method according to claim 1 or 2,
Characterized in that the first or second mixture further comprises a flame retardant. 3. The method according to claim 1 or 2,
Characterized in that the first or second mixture further comprises a refractory agent. 3. The method of claim 2,
Wherein the first and second wood members are coupled to each other through the coupling hole. The method according to claim 1,
And a finishing material is additionally applied to the outside of the heat insulating material. 10. The method of claim 9,
Characterized in that the finishing material contains a flame retardant or a refractory material. A method of manufacturing a heat insulating material for building,
Mixing the sawdust or wood with a binder to prepare a mixture,
Forming first and second panels having one or more grooves on one side by using a heat insulating material,
Connecting the first and second panels such that the grooves are opposed to each other to form a heat insulating member,
Laminating the mixture to form a first mixture layer for the first wood member,
Disposing the heat insulating member on the upper side of the first mixture layer,
Laminating the mixture on the upper side of the heat insulating member to form a second mixture layer for the second wood member,
And curing the binder while pressurizing the heat insulating member and the first and second mixture layers. 12. The method of claim 11,
Wherein the first and second mixture are set in an amount of 650 g to 1 kg when the size of the first or second wood member is 300 mm x 300 mm x 10 mm. 12. The method of claim 11,
Further comprising the step of adsorbing the flame retardant to the wood pulverized product before the first and second mixture forming steps. 12. The method of claim 11,
Further comprising the step of applying a finishing material to the outside of the heat insulating material. 12. The method of claim 11,
Further comprising the step of forming at least one bonding hole in the heat insulating member. 12. The method of claim 11,
Wherein the binder is an organic binder and the foaming agent is further mixed with the binder.

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