KR20160051477A - Mirror having display function - Google Patents

Abstract

According to an embodiment, a mirror having a display function comprises: a mirror unit disposed in a vehicle to sense a rear situation of a vehicle; and a light source module disposed on a rear surface of the mirror unit to display information related to operation of the vehicle. The mirror unit comprises: a first area overlapped with the light source module disposed on the rear surface; and a remaining second are except the first area. Reflectivity of the first area of the mirror unit is same with the reflectivity of the second area of the mirror unit.

Description

A mirror having a display function {Mirror having display function}

Embodiments relate to a mirror, and more particularly to a mirror having a display function.

Generally, vehicles are equipped with various audiovisual alarm devices as a means of safe driving, but there are not many alarm devices that notify the dangerous situation of the rear area of the vehicle where the driver's vision is insufficient. So that the driver can directly observe the situation of the rear area of the vehicle.

These mirrors include a side mirror installed on the side of the door to observe the rear side, and a room mirror installed on the front glass of the vehicle to observe the forward and backward regions of the vehicle.

These mirrors can detect a rearward situation up to a certain level but can also cause a blind spot that is not visible due to an insufficient area for recognizing the rearward situation, that is, the mirror, so that when the obstacle is located in such a blind spot, Which can cause safety accidents.

Accordingly, in recent years, there has been provided an apparatus for generating a warning sound when a vehicle is in contact with a vehicle, so that the driver is alerted to the obstacle, thereby notifying the driver of the obstacle, And an alarm device are installed.

On the other hand, in recent years, a rear-view surveillance camera is installed in a vehicle such as a display room mirror, and a monitor for outputting a video signal so as to confirm the captured rear image to the driver is installed in the room mirror. So that it can be grasped accurately.

1 is a view schematically showing a conventional room mirror.

1, a conventional display room mirror includes a mirror unit 1 and a display module 2 installed on the rear surface of the mirror unit 1 and a display room mirror as shown in FIG. 1 (a) And a fixing member 3 for fixing to the front glass.

1 (b), the mirror unit 1 includes a first area overlapping the display module 2 and a second area other than the first area.

At this time, the display module 2 should be positioned inside the mirror 1.

Accordingly, the characteristics of the first region and the characteristics of the second region of the mirror unit 1 are different from each other.

 In other words, the image outputted through the display module 2 is transmitted through the first area of the mirror part 1 and displayed on the front surface of the mirror part 1. At this time, the mirror unit 1 has a reflectance higher than a certain level, and the reflectance of the mirror unit 1 can not transmit the image generated by the display module 2. [

Accordingly, the display room mirror according to the prior art has a separate display space in the mirror unit 1. [

That is, in the conventional room mirror, the reflectance of the first area of the mirror 1 is made lower than that of the second area, or a part of the first area of the mirror 1 is removed, It is necessary to provide a separate space for a separate display, such as making the thickness of the second region thinner than the thickness of the second region.

Embodiments provide a mirror for displaying various information by applying an LED (Light Emitting Diode) having high transmittance.

Also, in the embodiment, a mirror having a display function including a first region overlapping the light source module and a second region having the same reflectance as the second region is provided.

In addition, in the embodiment, a mirror having a display function including a first region overlapping the light source module and a second region having the same thickness except for the second region is provided.

According to an embodiment of the present invention, there is provided a mirror having a display function, the mirror including: a mirror disposed in the vehicle for detecting a rearward state of the vehicle; And a light source module disposed on a rear surface of the mirror portion and displaying information related to the driving of the vehicle, wherein the mirror portion includes a first region overlapping the light source module disposed on the rear surface, And the reflectance of the first region of the mirror portion is the same as the reflectance of the second region of the mirror portion.

The mirror further includes first and second transparent substrates opposed to each other with a predetermined space therebetween, a first transparent electrode and a conductive reflective layer formed on opposing surfaces of the first and second transparent substrates, And an electrochromic layer interposed between the electrode and the electroconductive reflective layer to include an electrochromic material and an electrolyte.

The electrochromic layer may include an electrolyte layer sandwiched between the first transparent electrode and the conductive reflective layer, and an electrochromic coating layer formed on one or both surfaces of the electrolyte layer.

The light source module may include: a flexible circuit board having first and second pads; a plurality of first arrays arranged in a first direction on a first pad of the flexible circuit board; And a connecting member connected to at least one of the light emitting chips of the second array and a second pad of the flexible circuit board, wherein the light emitting chip of the first array includes a plurality of light emitting chips, Wherein at least two of the plurality of light emitting chips are connected to each other by the flexible circuit board and the light emitting chips of the second array are electrically separated from each other and the connecting member extends in the second direction on the flexible circuit board.

Further, the length of the flexible circuit board in the first direction is longer than the length of the second direction, the number of the second arrays is 1.5 times or more than the number of the first arrays, or the light emitting chips arranged in the first array Is 1.5 times or more than the number of light emitting chips arranged in the second array.

In addition, the second pads are respectively disposed between the plurality of light emitting chips arranged in the second array.

Further, the connecting member connects the adjacent light emitting chips arranged in the first array to each other.

The first direction is orthogonal to the second direction.

In addition, the length of the flexible circuit board in the first direction is longer than the length of the second direction, and the stress acting in the second direction is smaller than the stress acting in the first direction.

The light source module may further include a reflective member disposed around the plurality of light emitting chips, and a soft mold member disposed in the reflective member and covering the plurality of light emitting chips.

The light source module may further include a blocking wall disposed between the plurality of light emitting chips.

Further, the upper surface of the blocking wall is lower than the upper surface of the soft mold member.

The light source module may further include a phosphor disposed in the soft mold member.

The soft mold member may include a groove recessed from the upper surface and disposed in a direction of at least one of the first and second directions, wherein a reflective material is formed in the groove, Is less than the thickness.

According to another aspect of the present invention, there is provided a mirror having a display function, the mirror comprising: a mirror disposed in the vehicle for detecting a rearward state of the vehicle; And a light source module disposed on a rear surface of the mirror portion and displaying information related to the driving of the vehicle, wherein the mirror portion includes a first region overlapping the light source module disposed on the rear surface, The total thickness of the first region of the mirror portion is equal to the total thickness of the second region of the mirror portion, and the light source module includes a first portion and a second portion, A plurality of light emitting chips disposed on the first and second pads of the flexible circuit board; first and second bonding members disposed between the light emitting chip and the first and second pads; A reflective member disposed around the plurality of light emitting chips; and a soft mold member disposed in the reflective member and molding the plurality of light emitting chips, wherein the plurality of light emitting chips are arranged in a first direction And a second array arranged in a second direction different from the first direction, wherein at least two of the light emitting chips of the first array are connected to each other by the flexible circuit board, The light emitting chips of the two arrays are electrically separated from each other, and the length of the flexible circuit board in the first direction is longer than that of the second direction.

Also, the light source module is bent at a predetermined curvature with respect to the first direction, and the light emitting chips of the light source module are separately driven.

According to the embodiments of the present invention, it is possible to provide a display module capable of displaying information on a light emitting chip of a light source module, so that a light source module included in the display module has a high transmittance, It is possible to reduce the manufacturing cost while improving the convenience of the manufacturing process.

In addition, according to the embodiment of the present invention, by applying the display module capable of bending, it is possible to improve the visibility in comparison with the liquid crystal display device applied to the conventional mirror, Can be increased.

1 is a view schematically showing a conventional room mirror.
2 is a side view showing a structure of a mirror having a display function according to an embodiment of the present invention.
3 and 4 are views showing a schematic structure of a mirror unit according to an embodiment of the present invention.
5 is a plan view showing a light source module according to the first embodiment.
6 is a cross-sectional view of the light source module of Fig. 1 on the AA side.
7 is a sectional view of the light source module of Fig. 1 on the BB side.
FIG. 8 is a detailed view of a substrate in the light source module of FIG. 2. FIG.
9 is a view showing an example of a light emitting chip of the light source module of FIG.
10A and 10B are views showing patterns of the first and second wiring layers of the substrate of FIG.
11 is a view for explaining the bending direction of the FPCB according to the first embodiment.
FIG. 12A is a diagram showing an example of information display before bending the light source module according to the embodiment, and FIG. 12B is a view showing an example of information display after bending. FIG.
13 is a view showing a bending state of the light source module according to the embodiment.
14 is a view showing another example of the light source module of FIG.
15 is a plan view showing a light source module according to the second embodiment.
16 is a side sectional view of the light source module of Fig.
17 is a diagram showing a circuit pattern of the first wiring layer of the substrate of the light source module of Fig.
18 is a plan view showing a light source module according to the third embodiment.
19 is a side sectional view of the light source module of Fig.
20 is a plan view showing a light source module according to a fourth embodiment.
21 is a CC side sectional view of the light source module of Fig.
22 is a DD side sectional view of the light source module of Fig.
23 is a view showing a flexible circuit board and a light emitting chip in the light source module of Figs. 217 and 22. Fig.
24 is a plan view showing a light source module according to the fifth embodiment.
25 is a partial side sectional view of the light source module of Fig.
26 is a side sectional view showing another example of the light source module of Fig.
27 is a side sectional view of the light source module according to the sixth embodiment.
28 is a diagram comparing resolutions according to the same size of the embodiment and the comparative example.
Fig. 29 is a diagram comparing the sizes of the light sources of the embodiment and the comparative example by the same number. Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the embodiments described herein and the configurations shown in the drawings are only a preferred embodiment of the present invention, and that various equivalents and modifications may be made thereto at the time of the present application. DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention. The following terms are defined in consideration of the functions of the present invention, and the meaning of each term should be interpreted based on the contents throughout this specification. The same reference numerals are used for portions having similar functions and functions throughout the drawings.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings.

Hereinafter, a mirror having a display function will be described.

2 is a side view showing a structure of a mirror having a display function according to an embodiment of the present invention.

2, a mirror having a display function according to an embodiment of the present invention includes a mirror 200 disposed in a vehicle and sensing a rearward state of the vehicle, a light source 200 disposed on at least a part of a rear surface of the mirror 200, Module 100 may be included.

The mirror unit 200 is a mirror mounted on a vehicle to mount the mirror unit 200 in order to secure a rear view.

Here, the mirror unit 200 may be a side mirror provided outside the vehicle, or may be a room mirror provided inside the vehicle. Hereinafter, it is assumed that the mirror unit 200 is a room located inside the vehicle.

The mirror unit 200 may be a general mirror or a half mirror having both light transmission property and reflection property at the same time, but it can prevent glare that the driver can feel by light reflection by the headlight of the rear vehicle And an electrochromic mirror (ECM) that changes the reflectance of the room mirror 100.

More specifically, the mirror unit 200 uses the redox reaction of the electrochromic device according to the brightness difference of the light measured by the light quantity sensor such as a photodiode, which measures the brightness of the front and the rear of the vehicle, ).

Accordingly, it is possible to suppress the driver's glare caused by the headlight of the rear vehicle, thereby assisting safe driving.

The structure of the mirror unit 200 will be described later in detail with reference to the drawings.

The light source module 100 is disposed on the rear surface of the mirror unit 200 and outputs light to the front surface of the mirror unit 200.

At this time, the light source module 100 is a display device manufactured by directly mounting a plurality of light emitting chips, not the light emitting device package, on the substrate, and displays various information related to the operation of the vehicle with individual control of the plurality of light emitting chips.

That is, the mirror having the conventional display function is implemented by disposing the LCD module on the back of the mirror portion. In this case, since the LCD is located on the rear surface of the mirror reflection layer, the reflection layer of the cell to which the LCD is attached is thinner than the other regions in order to prevent the brightness of the LCD from being reduced by the reflection layer, And the reflectance of the entire reflective layer is reduced. However, in such a case, there is a problem that the manufacturing process of the mirror is complicated and the characteristics of the mirror are deteriorated. However, in disposing the light source module on the back surface of the mirror portion, And a display function that does not require additional additional display space.

The reason for not providing such a display space is that information relating to the vehicle is applied with the light emitting chip provided in the light source module 100.

3 and 4 are views showing a schematic structure of a mirror unit according to an embodiment of the present invention.

Referring to FIG. 3, the mirror portion 200 is an electrochromic mirror (ECM).

The mirror unit 200 includes a first transparent substrate 210 and a second transparent substrate 220 facing each other with a predetermined gap therebetween and a second transparent substrate 210 formed on each of the opposite surfaces of the first and second transparent substrates 210 and 220 A first transparent electrode 230 and a conductive reflective layer 240 and an electrochromic layer 260 formed between the first transparent electrode 230 and the conductive reflective layer 240.

The mirror unit 200 uses an electrochromic material that can reversibly change the optical characteristics of the material by an electrochemical oxidation-reduction reaction. When the electric signal is not applied from the outside, the mirror unit 200 is not colored, The color of the mirror is adjusted to control the reflectivity of the mirror.

The first and second transparent substrates 210 and 220 are preferably glass substrates. However, the first and second transparent substrates 210 and 220 may be made of a transparent material such as silicon, synthetic resin, airgel or the like.

The first transparent electrode 230 is deposited on the first transparent substrate 210 and is formed of ITO (Indium Tin Oxide), FTO (Fluoropod Tin Oxide), AZO (Aluminum Doped Zinc Oxide), GZO (Galium doped Zinc Oxide) , Antimony doped tin oxide (ATO), indium doped zinc oxide (IZO), niobium doped titanium oxide (NTO), ZnO, and combinations thereof. However, the present invention is not limited thereto It is not.

The conductive reflective layer 240 is formed on the second transparent substrate 220 and serves as a reflective plate for reflecting light incident through the electrochromic layer 260 and serves as a counter electrode of the first transparent electrode 230 And the conductive reflection layer 240 includes at least one kind of metal selected from the group consisting of Cu, Au, Ag, Ni, Al, Cr, Ru, Re, Pb, Sn, However, the present invention is not limited thereto. Also, although not shown in the drawing, the conductive reflection layer 240 may be formed of two layers of a second transparent electrode and a reflective layer.

That is, the second transparent electrode serving as a counter electrode of the first transparent electrode and the reflective layer serving as a reflector reflecting the incident light may be formed.

In this case, the second transparent electrode may be formed of indium tin oxide (ITO), fluoride doped tin oxide (FTO), aluminum doped zinc oxide (AZO), gallium doped zinc oxide (GZO), antimony doped tin oxide (ATO) Zinc Oxide, NTO (Niobium-doped Titanium Oxide), ZnO, and combinations thereof.

The reflective layer may be made of at least one metal selected from the group consisting of Cu, Au, Ag, Ni, Al, Cr, Ru, Re, Pb, Sn, In and Zn, have.

The electrochromic layer 260 is formed of a liquid or solid electrochromic material and an electrolyte and is formed between the first transparent electrode 230 and the conductive reflective layer 240 to form the first transparent electrode 230 and the conductive reflective layer 240 ), And receives coloration or discoloration through an oxidation reaction or a reduction reaction.

The electrochromic layer 260 may be formed by injecting an electrochromic material and an electrolyte between the first transparent electrode 230 and the conductive reflective layer 240 to form a vacuum lacquer. The electrochromic material may be an organic or inorganic electrochromic material. Examples of the organic electrochromic material may include viologen, anthraquinone, polyaniline, or polythiophene. Examples of the inorganic electrochromic material include WO3, MoO3, CeO3, MnO2 , Or Nb2O5.

When the electrochromic material is a solid phase, the electrochromic layer 260 may include an electrolyte layer 262 and an electrochromic coating layer 261 formed on one or both surfaces of the electrolyte layer 262.

3, the electrochromic coating layer 261 may be formed on both sides of the electrolyte layer 262 and may be formed only between the electrolyte layer 262 and the first transparent electrode 230 And may be formed only between the electrolyte layer 262 and the conductive reflection layer 240. If the thickness of the electrochromic coating layer 261 is less than 100 nm, the electrochromic coating layer 261 is difficult to exhibit its inherent function. When the thickness of the electrochromic coating layer 261 is more than 700 nm, a problem of durability such as cracking occurs. Is preferably formed in the range of 100 nm to 700 nm, but is not limited thereto.

When the electrochromic material is in the form of a liquid, the electrochromic coating layer 161 is formed in a solid state as described above although the uniform coloring is not performed and the voltage is continuously applied in order to maintain the discolored state. , The electrochromic material has a memory effect and the voltage is applied only at the time of discoloration and coloring so that the power consumption is reduced and the decoloring reaction speed is fast However, since the electrochromic material to which the coating method is applied is an inorganic or organic polymer, the durability of the device can be improved.

As described above, by using the redox reaction of the electrochromic device according to the brightness of light, the reflectance of the mirror unit 200 is changed, thereby suppressing the driver's glare.

Hereinafter, the light source module 100 disposed on the rear surface of the mirror unit 200 will be described.

FIG. 5 is a plan view showing a light source module according to an embodiment of the present invention, FIG. 6 is a sectional view taken on the A-A side of the light source module of FIG. 5, and FIG. 7 is a sectional view taken on the B-B side of the light source module of FIG.

5 to 7, the light source module 100 includes a flexible circuit board 10; A reflective member (20) disposed around the light emitting region on the flexible circuit board (10); A plurality of light emitting chips (30) arranged in the reflective member (20); And a mold member (40) covering the plurality of light emitting chips (30) in the reflective member (20).

A plurality of light emitting chips 30 are mounted on the flexible circuit board 10. The plurality of light emitting chips 30 may be arranged in a matrix structure. The light emitting chip 30 includes a plurality of first arrays 131 arranged in a first direction X and a plurality of first arrays 131 arranged in a second direction Y different from the first direction X, 2 < / RTI > The first direction X and the second direction Y include directions orthogonal to each other.

A plurality of the first arrays 131 are arranged in a row or a horizontal direction, respectively, and a plurality of the second arrays 133 are arranged in a column or a longitudinal direction. The number of the second arrays 133 may be 1.5 times or more, for example, 2 times or more than the number of the first arrays 131. The light emitting area in which the light emitting chip 30 is arranged may be arranged such that the length X1 of the first direction X is 1.5 times or more of the length Y1 of the second direction Y, for example, 2 times or more. The number of the light emitting chips 30 arranged in the first array 131 is larger than the number of the light emitting chips 30 arranged in the second array 133. For example, the number of the light emitting chips 30 arranged in the first array 131 may be 1.5 times or more, for example, two times or more than the number of the light emitting chips 30 arranged in the second array 133 have. The flexible circuit board 10 can be manufactured by forming the flexible circuit board 10 in the first direction X by making the length X1 in the first direction X of the light emitting area of the flexible circuit board 10 longer than the length Y1 in the second direction Y, It can be bent and used effectively against the direction (X).

The light emitting chip 30 includes an upper first electrode 301 and a lower second electrode 302, as shown in FIG. The second electrode 302 of each light emitting chip 30 is connected to the first pad 11 of the flexible circuit board 10 by the bonding member 34 as shown in FIGS. At least two of the light emitting chips 30 arranged along the first array 131 may be connected to each other by the first pad 11 of the flexible circuit board 10. The first electrodes 301 are connected to the second pads 12 by connecting members 32, respectively. The light emitting chips 30 arranged along the first array 133 are electrically separated from each other by the second pad 12. The connecting member 32 includes a conductive wire.

The lateral lengths E1 and E2 of the light emitting chips 30 may be the same or different from each other. At least one of the lateral lengths E1 and E2 may be 500 탆 or less, for example, 300 탆 or less.

5 and 6, a wire as the connecting member 32 is disposed in a region R2 between the light emitting chips 30 of the second array 133. [ Therefore, when the flexible circuit board 10 is bent in the second direction Y, the second stress generated is made larger by the light emitting chip 30 and the connecting member 32. That is, the second stress can be increased by the distance D5 between one side of the light emitting chip 30 and the other end of the connecting member 32. [

As shown in FIGS. 5 and 7, since the connection member 32 as shown in FIG. 6 is not disposed in the area R1 between the light emitting chips 30 of the first array 131, ) Is bent with respect to the first direction (X), the first stress generated may be smaller than the second stress. The connection member 32 may extend in the second direction so as to overlap with the light emitting chip 30 so that the second stress may act more largely with respect to the second direction Y. In the first direction X, Can act as one line of stress. Accordingly, the flexible circuit board 10 can be easily bent from the first direction X. The length of the flexible circuit board 10 of the embodiment may be 1.5 times or more, for example, 2 times longer than the length of the second direction, so that the stress at the time of bending in the first direction can be reduced.

6 and 7, the interval D4 and the interval D3 between the light emitting chips 30 in the second array 133 are set so that the interval D2 between the light emitting chips 30 in the first array 131 ) And the period D1. At least one of the intervals D2 and D4 may be formed to be larger than at least one of the horizontal and vertical lengths of the light emitting chip 30, for example, in the range of 0.3 mm to 0.7 mm. The intervals D2 and D4 may vary depending on the size of the light emitting chip 30.

 8, the flexible circuit board 10 includes an insulating film 111, a first wiring layer 112, a second wiring layer 114, a first coverlay 118, and a second coverlay 119 The insulating film 111 may include a polyimide film, or may be a variety of insulating films such as a polyester film and a polyethylene film. The insulating film 111 may be formed to a thickness of 70 탆 or less, for example, 10 탆 to 40 탆, but is not limited thereto. If the thickness of the insulating film 111 exceeds the above range, bending is difficult. If the thickness is less than the above range, there is a problem that the elasticity after bending becomes small.

The first wiring layer 112 is attached to the upper surface of the insulating film 111 and the second wiring layer 114 is attached to the lower surface of the insulating film 111. When the first and second wiring layers 112 and 114 are attached, a desired pattern can be formed through etching. The second wiring layer 114 may be omitted, but the present invention is not limited thereto.

The first and second wiring layers 112 and 114 may be adhered to each other by an adhesive 116. The first and second wiring layers 112 and 114 may be formed by applying a polymer resin to the first and second wiring layers 112 and 114, can do. The first cover layer 118 is bonded to the first wiring layer 112 with an adhesive 116 to protect the first wiring layer 118. The first cover layer 118 has open regions 135 and 137 and the first and second pads 11 and 12 of the first wiring layer 112 may be exposed to the open regions 135 and 137. The first pad 11 may be exposed in an area corresponding to a bottom area of the light emitting chip.

The second cover layer 119 is adhered with an adhesive 117 to protect the second wiring layer 114. The first and second coverlayers 118 and 119 may be formed of a material such as a transparent film or a solder resist, but the present invention is not limited thereto.

Referring to FIG. 10 (A), in the pattern of the first wiring layer 112, the first connection pattern 113 is connected between adjacent first pads 11, 1 via the first via 113A. The second pad 12 may be spaced apart from the first pad 11 and extended by the second connection pattern 115 and may be connected to the second wiring layer 114 through the second via 115A. The first wiring layer 112 may connect the light emitting chips of the first array to each other by the first pad 11 and the first connection pattern 113. That is, at least two light emitting chips of each of the second arrays may be connected to each other by the first connection pattern 113 of the first wiring layer 112. The light emitting chips of each second array may be connected to each other in parallel by the second pad 12 and the second connection pattern 115.

Referring to FIG. 10B, the second wiring layer 114 includes third and fourth connection patterns 114A and 114B, and the third and fourth connection patterns 114A and 114B include a first wiring layer 112 and a third via 114C that is selectively connected to the third via 114C. The first and second wiring layers 112 and 114 of the flexible circuit board 10 can selectively connect the plurality of light emitting chips 30. The control unit (not shown) can selectively turn on and off the individual light emitting chips 30 through the first and second wiring layers 112 and 114 of the flexible circuit board 10.

5 to 7, a reflective member 20 is disposed on the outer circumference of the upper surface of the flexible circuit board 10. The reflective member 20 may be formed as a continuously connected frame. The reflective member 20 may reflect the light emitted from the light emitting chip 30 around the light emitting chip 30. The reflective member 20 may include a material such as silicon or epoxy, or may include a material such as solder resist or a mask material. The reflective member 20 may be white or black, but is not limited thereto.

The reflective member 20 is disposed around the mold member 40. The reflective member 20 may serve as a dam to prevent the mold member 40 from overflowing.

The mold member 40 may be formed of a soft mold material, for example, a soft silicone material. The mold member 40 is expanded when the flexible circuit board 10 is bent at a predetermined curvature and can be restored when the flexible circuit board 10 is restored. The mold member 40 is molded on the connection member 32 together with the light emitting chip 30 to further increase the second stress in the second array 133. Accordingly, bending and restoration of the array direction of the first array 131 can be facilitated.

The mold member 40 includes a light-transmitting material. The light-transmitting material emits light emitted from the light-emitting chip 30. The mold member 40 may include a phosphor. The phosphor converts a part of light emitted from the light emitting chip 30. The light emitting chip 30 may emit at least one of ultraviolet light, blue light, red light, green light, and white light. The phosphor may include at least one of red, yellow, green, and blue phosphors. As another example, an individual phosphor layer may be disposed on each light emitting chip 30 to convert the wavelength of the light emitted from the light emitting chip 30. In this case, the mold member 40 may not be formed, Can be provided with no clean molding material.

9 is a view showing an example of the light emitting chip 30 according to the embodiment.

Referring to FIG. 9, the light emitting chip 30 includes a first electrode 301, a light emitting structure 310; A second electrode 302 under the light emitting structure 310 and a protective layer 323 around the bottom surface of the light emitting structure 310.

The light emitting structure 310 includes a first conductive semiconductor layer 313, an active layer 314, and a second conductive semiconductor layer 315. The first conductivity type semiconductor layer 313 is formed of a Group III-V compound semiconductor doped with a first conductivity type dopant, and the first conductivity type semiconductor layer 313 is formed of In _x Al _y Ga _1-xy N (0? X? 1, 0? Y? 1, 0? X + y? 1). The first conductive semiconductor layer 313 may be a stacked structure of layers including at least one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, . ≪ / RTI > The first conductive type semiconductor layer 313 is an n-type semiconductor layer, and the first conductive type dopant is an n-type dopant including Si, Ge, Sn, Se, or Te.

The active layer 314 may be disposed under the first conductive semiconductor layer 313 and may selectively include a single quantum well, a MQW, a quantum wire structure, or a quantum dot structure. . The active layer 314 includes a well layer and a barrier layer period. The well layer comprises a composition formula of _{In x Al y Ga 1-xy} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1), and wherein the barrier layer is In _x Al _y Ga _{1 -xy} N (0? x? 1, 0? y? 1, 0? x + y? 1). The period of the well layer / barrier layer may be one or more cycles using a lamination structure of, for example, InGaN / GaN, GaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, and InAlGaN / InAlGaN.

The second conductive semiconductor layer 315 is disposed under the active layer 314. The second conductive semiconductor layer 315 may be formed of a semiconductor doped with a second conductive dopant such as In _x Al _y Ga _1-xy N (0? X? 1, 0? Y? 1, 0? 1). The second conductive semiconductor layer 315 may be formed of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP and AlGaInP. The second conductivity type semiconductor layer 315 may be a p-type semiconductor layer, and the second conductivity type dopant may include Mg, Zn, Ca, Sr, and Ba as a p-type dopant.

The second conductive semiconductor layer 315 may include a superlattice structure, and the superlattice structure may include an InGaN / GaN superlattice structure or an AlGaN / GaN superlattice structure. The superlattice structure of the second conductivity type semiconductor layer 315 may protect the active layer 314 by diffusing a current contained in the voltage abnormally.

The protective layer 323 is disposed around the lower surface of the light emitting structure 310. The protective layer 323 may block some of the metal of the second electrode 302 from being adjacent to the layers of the light emitting structure 310. The passivation layer 323 may be formed of a metal, a metal oxide, or an insulating material. The passivation layer 323 may be formed of a metal such as ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide) , IGZO (indium gallium zinc oxide) , IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), SiO 2, SiO x, SiO x N y, Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ .

A second electrode 302 is disposed under the second conductive type semiconductor layer 315 and the second electrode 302 is formed of a contact layer 321, a reflective layer 324, a bonding layer 325, 327). The contact layer 321 is in contact with the second conductive type semiconductor layer 315, and the material thereof may be selected from a conductive material such as a metal, a metal oxide, or a metal nitride. The contact layer 321 may be formed of a metal such as ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO tin oxide (AZO), antimony tin oxide (ATO), gallium zinc oxide (GZO), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, ≪ / RTI > or combinations thereof.

The reflective layer 324 may be disposed under the contact layer 321 and the protective layer 323. The reflective layer 324 may be formed of a material selected from the group consisting of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf and combinations thereof. The reflective layer 324 may be formed to be wider than the width of the light emitting structure 310, which may improve the light reflection efficiency.

The bonding layer 325 is bonded between the support member 327 and the reflective layer 324. [

The support member 327 may be made of a metal such as copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu- Si, Ge, GaAs, ZnO, SiC).

The second electrode 302 may be connected to the second pad 12 of the flexible circuit board 10 by a bonding member 34 as shown in FIGS. The first electrode 301 is disposed in the light emitting structure 310 and is connected to the first conductive semiconductor layer 313. The first electrode 301 is connected to the connecting member 32 as shown in FIGS.

Referring to FIG. 11, the light source module 100 may be bent in the first direction X direction. After bending in the direction of the first array 131, the bending radius of the flexible circuit board 10 may be 150 mm or less, for example, 100 mm or less. Further, the light source module 100 may display information by the light emitting chip before bending and may display information by the light emitting chip after (B) bending, as shown in FIG. 12 (A). Further, bending can be performed in a state in which information is displayed by the light emitting chip. Referring to FIG. 13, when bending the light source module 100 to the maximum, the bending radius r1 may be in the range of 5 mm to 10 mm. The bending shape may include a circular shape, an elliptical shape, for example, a ring shape or a ring shape. The bendable light source module 100 can be provided as a display module by controlling the point light source to selectively turn on and off the light emitting chip.

14 is an example in which the lateral length E1 and the longitudinal length E2 of the light emitting chip 30 are different from each other in the light source module of Fig. For example, since the lateral length E1 of the light emitting chip 30 is smaller than the longitudinal length E2, the distance D2 between the light emitting chips 30 can be widened. Accordingly, the stress due to bending of the flexible circuit board 10 can be smaller than that of the first embodiment.

FIG. 15 is a plan view of a light source module according to a second embodiment, and FIG. 16 is a side sectional view of the light source module of FIG. In describing the second embodiment, the same configuration as that of the first embodiment will be described with reference to the description of the first embodiment.

15 and 16, the light source module includes a flexible circuit board 10; A reflective member (20) disposed around the light emitting region on the flexible circuit board (10); A plurality of light emitting chips (30) arranged in the reflective member (20); And a mold member (40) covering the plurality of light emitting chips (30).

A plurality of light emitting chips 30 are mounted on the flexible circuit board 10. The plurality of light emitting chips 30 may be arranged in a matrix structure and may include a first array 131 arranged in a first direction X and a second array 131 arranged in a second direction Y different from the first direction X, And a second array 133 arranged thereon.

The first electrodes 301 of the light emitting chip 30 in the second array 133 are connected to each other by the first connecting member 32A and the last light emitting chip is connected to the flexible circuit board 10 to the second pad 12. The first connecting member 32A connects the chips to each other, thereby eliminating a short circuit problem due to a height difference between both ends of the wire. The second pad 12 may be connected to the second wiring layer via the via 115B, as shown in FIG.

The second electrode 302 of the light emitting chip 30 is bonded to the first pad 11 of the flexible circuit board 10 by the bonding member 34. [ In the second array 133, the first electrodes 301 of the light emitting chip 30 are connected to each other, and the second electrodes 302 are separated from each other.

The light emitting chips 30 in the first array 131 may be connected to each other by the first connection pattern 113A of the first wiring layer 112 as shown in FIG. That is, the second electrodes 302 of the respective light emitting chips 30 in the first array 131 are connected to each other through the first pad 11.

17 is a view showing a first wiring layer of the flexible circuit board 10 of the light source module of Fig. Referring to FIG. 17, a plurality of first pads 11 arranged in a first direction of the first wiring layer 112 are connected to each other by a first connection pattern 113A. The second pads 12 may be spaced apart from each other and connected to the second wiring layer via the via 115B. Accordingly, the second electrodes of each light emitting chip 30 in the first array 131 are connected to each other, and the first electrodes are separated from each other.

Since the light emitting chip 30 and the wires as the first and second connection members 32A and 32B are disposed in the second direction of the second array 133, when the flexible circuit board 10 is bent , The second stress acting in the second direction (Y) is greater than the first stress in the first direction.

Also, the second stress is increased by the first and second connecting members 32A and 32B, and the first stress may be the same as in the first embodiment.

FIG. 18 is a plan view showing a light source module according to a third embodiment, and FIG. 19 is a side sectional view of the light source module of FIG. In describing the third embodiment, the same configurations as those of the first and second embodiments will be described with reference to the description of the first and second embodiments.

18 and 19, the light source module includes a flexible circuit board 10; A reflective member (20) disposed around the light emitting region on the flexible circuit board (10); A plurality of light emitting chips (30) arranged in the reflective member (20); And a mold member (40) covering the plurality of light emitting chips (30); And a blocking wall 50 between the light emitting chips 30.

The blocking wall 50 may block the interference of the light generated from the adjacent light emitting chip 30. The upper surface of the blocking wall 50 may be disposed lower than the upper surface of the reflective member 20. The blocking wall 50 may be disposed lower than the peak of the first and second connecting members 32A and 32B. The mold member 40 molds the blocking wall 50 and the light emitting chip 30. The blocking wall 50 may be formed of a light reflecting material such as a solder resist or a coverlay, but is not limited thereto.

The blocking wall 50 may be disposed in at least one of a first direction and a second direction, but the present invention is not limited thereto.

A second pad 12 is disposed on a part of the blocking wall 50 and the second pad 12 and the light emitting chip 30 are connected to a second connecting member 32B. By disposing the second pad 12 on the blocking wall 50, the tensile force due to the difference in height between the opposite ends of the second connecting member 32B can be improved. In other words, it is possible to prevent the second connection member 32A from boiling. The blocking wall 50 may be formed to have a wide lower portion and a narrow upper portion, or the outer wall may be formed as a sloped surface. The structure of the blocking wall 50 can improve the reflection efficiency of light.

20 is a plan view showing a light source module according to a fourth embodiment, FIG. 21 is a cross-sectional view taken along the line C-C of FIG. 20, and FIG. 22 is a sectional view taken along the line D-D of FIG. In describing the fourth embodiment, the same parts as the above-described embodiments will be described with reference to the description of the embodiments disclosed above.

20 to 22, in the light source module, a plurality of light emitting chips 30A are mounted on the flexible circuit board 10 in a flip manner. Each of the light emitting chips 30A is connected to the flexible circuit board 10 by first and second bonding members 361 and 362. For example, the light emitting chip 30A is connected to the first pad 11 of the flexible circuit board 10 by the first bonding member 361 and the second pad 12 and the first bonding member 362 . By mounting the light emitting chip 30A in a flip manner, the light extraction efficiency can be improved.

23 is a view showing the light emitting chip 30A of Fig. Referring to FIG. 23, the light emitting chip 30A is bonded to the first and second pads 11 and 12 of the flexible circuit board 10 by first and second bonding members 361 and 362, respectively. The first and second bonding members 361 and 362 may be, for example, a part of a solder, a solder ball, a bump, or a solder paste.

The light emitting chip 30A includes a substrate 311, a first semiconductor layer 312, a light emitting structure 310, an electrode layer 331, an insulating layer 333, a first electrode 335 and a second electrode 337, .

The substrate 311 may use a light-transmitting, insulating or conductive substrate, e.g., sapphire (Al ₂ O _3), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP, Ge, Ga ₂ O ₃ of At least one can be used. A plurality of convex portions (not shown) may be formed on the top surface of the substrate 311 to improve light extraction efficiency. Here, the substrate 311 may be removed in the light emitting chip 30A. In this case, the first semiconductor layer 312 or the first conductivity type semiconductor layer 313 may be disposed as a top layer. The light extraction efficiency can be improved by extracting light through the front surface of the substrate 311 by the light emitting chip 30.

A first semiconductor layer 312 may be formed under the substrate 311. The first semiconductor layer 312 may be formed using a compound semiconductor of group II to V elements. The first semiconductor layer 312 may include at least one of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP and GaP. The first semiconductor layer 312 may be formed of at least one of a buffer layer and an undoped semiconductor layer. The buffer layer may reduce a difference in lattice constant between the substrate and the nitride semiconductor layer, Layer can improve the crystal quality of the semiconductor. Here, the first semiconductor layer 312 may not be formed.

A light emitting structure 310 may be formed on the first semiconductor layer 312. The light emitting structure 310 is selectively formed from a compound semiconductor of group II to V elements and a group III-V element, and can emit a predetermined peak wavelength within a wavelength range from the ultraviolet band to the visible light band.

The light emitting structure 310 includes a first conductive semiconductor layer 313, a second conductive semiconductor layer 315, and a second conductive semiconductor layer 315 between the first conductive semiconductor layer 313 and the second conductive semiconductor layer 315. And an active layer 314 formed thereon.

An electrode layer 331 is formed under the second conductive type semiconductor layer 315. The electrode layer 331 may include a reflective layer, and the reflective layer may further include an ohmic layer in contact with the light emitting structure 310. The reflective layer may be selected from a material having a reflectance of 70% or more, for example, a metal of Al, Ag, Ru, Pd, Rh, Pt or Ir, and an alloy of two or more of the above metals. The electrode layer 331 may also include a laminate structure of a light-transmitting electrode layer / a reflective layer. A light extracting structure such as a roughness may be formed on the surface of at least one of the second conductive type semiconductor layer 315 and the electrode layer 331. Such a light extracting structure may change the critical angle of incident light, The light extraction efficiency can be improved.

A first electrode 335 may be disposed below a portion of the first conductive semiconductor layer 313 and a second electrode 337 may be disposed under a portion of the electrode layer 331.

The first electrode 335 is electrically connected to the first conductive type semiconductor layer 315 and the first bonding member 361 and the second electrode 337 is electrically connected to the first electrode 331 through the electrode layer 331. [ Type semiconductor layer 315 may be electrically connected to the second bonding member 362. The first electrode 335 and the second electrode 337 may be formed of at least one of Cr, Ti, Co, Ni, V, Hf, Ag, Al, Ru, Rh, Pt, Pd, Ta, . The first electrode 335 and the second electrode 337 may have the same or different lamination structures.

The insulating layer 333 is disposed under the electrode layer 331 and the side surfaces of the second conductive type semiconductor layer 315 and the active layer 314, And may be disposed in a part of the region of the first conductivity type semiconductor layer 313. The insulating layer 333 is formed in a region of the light emitting structure 310 excluding the electrode layer 331, the first electrode 335 and the second electrode 337, So that the lower part is electrically protected. The insulating layer 333 includes an insulating material or an insulating resin formed of at least one of oxide, nitride, fluoride, and sulfide having at least one of Al, Cr, Si, Ti, Zn, and Zr. The insulating layer 333 may be selectively formed of, for example, SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , or TiO ₂ . The insulating layer 333 is formed to prevent an interlayer short circuit of the light emitting structure 310 when the metal structure for flip bonding is formed below the light emitting structure 310.

The light emitted from the light emitting chip 30A may be reflected by the electrode layer 331 and may be emitted through the substrate 311. [

FIG. 24 is a view of a light source module according to a fifth embodiment, and FIG. 25 is a side sectional view of the light source module of FIG. 24. FIG. In describing the fifth embodiment, the same portions as the above-described embodiments will be described with reference to the description of the embodiments disclosed above.

24 and 25, the light source module includes a flexible circuit board 10; A reflective member (20) disposed around the light emitting region on the flexible circuit board (10); A plurality of light emitting chips (30) arranged in the reflective member (20); And a mold member (40) covering the plurality of light emitting chips (30) and having grooves (46) therein.

A groove 46 is formed in a region between the second array 133 and the second array 133 in the mold member 40. The groove 46 may be formed in a polygonal shape in cross section, And includes a triangular shape or a rectangular shape. The grooves 46 are concave from the upper surface of the mold member 40 and may be disposed in at least one of the first and second directions.

The depth T2 of the groove 46 may be smaller than the thickness T1 of the mold member 40. [

The grooves 46 may be disposed between the light emitting chips 30 of the first array 131 to reflect the light generated from the light emitting chip 30. Also, the stress can be reduced when the flexible circuit board 10 is bent in the first direction (X) direction. A portion 40A of the mold member 40 is present between the groove 46 and the FPCB 10 so that the portion 40A of the FPCB 10 is positioned along the depth T2 of the groove 46, Resilience can vary.

As another example, the grooves 46 may be arranged so as to intersect with each other in the mold member 40, but the present invention is not limited thereto.

26 shows a state in which a polygonal groove 47 is arranged in the mold member 40 and the reflective material 48 is filled in the groove 47. [ The reflective material 48 may reflect light generated from the light emitting chip 30. The depth T3 of the groove 47 may be less than the thickness T1 of the mold member 40. The reflective material 40 may be doped with a reflective material such as soft silicon, and the reflective material may include TIO ₂ , or SiO ₂ .

27 is a side sectional view of the light source module according to the sixth embodiment.

27, the light source module includes a plurality of light emitting chips 30 arranged on a flexible circuit board 10, a blocking wall 62 disposed between the plurality of light emitting chips 30, A translucent film 60 is disposed on the substrate 62. The light transmitting film 60 is bonded on the plurality of light emitting chips 30 and the reflecting member 20 to protect the plurality of light emitting chips 30. The light transmitting film 60 may include a light transmitting material such as polyimide.

The blocking wall 62 may function as a member that reflects light and prevents the light transmitting film 60 from striking. The blocking wall 62 may be formed in a columnar shape or a bar shape, but is not limited thereto.

Here, the area 70 between the flexible circuit board 10 and the light transmitting film 60 may be filled with air rather than a mold member, but the present invention is not limited thereto.

 FIG. 28 is a view for comparing resolutions according to the same size of the embodiment and the comparative example, and FIG. 29 is a diagram comparing the sizes by the same numbers of the embodiment and the comparative example.

28 and 29, the comparative example (B) is a configuration in which a light emitting device package is arranged as a light source on a flexible circuit board, and in the embodiment (A), a light emitting chip is arranged as a light source on a flexible circuit board to be. Therefore, the distance between the light emitting device packages of the comparative example can be wider than the distance between the light emitting chips of the embodiment. Therefore, it can be seen that the resolution of the embodiment is further improved by comparing the resolutions at the same display size in the comparative example and the embodiment. This makes it possible to arrange more light sources in the same size, and the resolution is improved as compared with the comparative example.

Fig. 29 shows a comparison of the sizes of the light sources of the same number in a matrix. In the comparative example (B), even when the same number of packages are arranged by the light emitting device package, Size. Thus, the embodiment in which the light emitting chip is arranged can provide a smaller size as well as an improved resolution as compared with the comparative example. Further, since the size of the light emitting chip is smaller and the interval between the light emitting chips can be arranged narrower, the stress acting on the light source module becomes smaller, which is effective for bending.

The light source module according to the embodiment can display desired information by individually controlling the plurality of light emitting chips and turning them on / off. Further, the light source module can be used by bending the light source module in the first direction, and can be used as a display module having a light source module. It can also be used as an accessory for watches, rings, and mobile terminals with light source modules. In the embodiment, lenses may be arranged on the light emitting chip, but the present invention is not limited thereto.

The light source module according to the embodiment can be applied not only to a backlight unit such as a portable terminal and a computer, but also to an illumination device such as an illumination light, a traffic light, a vehicle headlight, an electric signboard, a streetlight, and the like.

The present invention is not limited to the above-described embodiment and the attached drawings, but is defined by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims, As will be described below.

100: Light source module
200: mirror part

Claims (16)

A mirror disposed in the vehicle for detecting a rearward state of the vehicle; And
And a light source module disposed on a rear surface of the mirror portion and displaying information related to the driving of the vehicle,
The mirror section may include:
A first region overlapping with the light source module disposed on the back surface,
And a second region other than the first region,
The reflectance of the first region of the mirror portion is,
Is equal to the reflectance of the second region of the mirror portion
Mirror with display function. The method according to claim 1,
The mirror may further comprise:
First and second transparent substrates facing each other at a predetermined interval,
A first transparent electrode and a conductive reflective layer formed on opposite surfaces of the first and second transparent substrates,
And an electrochromic layer interposed between the first transparent electrode and the conductive reflection layer to include an electrochromic material and an electrolyte,
Mirror with display function. 3. The method of claim 2,
Wherein the electrochromic layer comprises:
An electrolyte layer interposed between the first transparent electrode and the conductive reflection layer;
And an electrochromic coating layer formed on one or both sides of the electrolyte layer
Mirror with display function. The method according to claim 1,
The light source module includes:
A flexible circuit board having first and second pads,
A plurality of light emitting chips including a plurality of first arrays arranged in a first direction on a first pad of the flexible circuit board and a second array arranged in a second direction different from the first direction;
And a connection member connected to at least one of the light emitting chips of the second array and a second pad of the flexible circuit board,
At least two of the light emitting chips of the first array are connected to each other by the flexible circuit board, the light emitting chips of the second array are electrically separated from each other,
The connecting member extends on the flexible circuit board in a second direction
Mirror with display function. 5. The method of claim 4,
The length of the flexible circuit board in the first direction is longer than the length of the flexible circuit board in the second direction,
Wherein the number of the second arrays is at least 1.5 times the number of the first arrays,
Wherein the light emitting chips arranged in the first array are 1.5 times or more times the number of light emitting chips arranged in the second array
Mirror with display function. The method according to claim 4 or 5,
The second pad
And a plurality of light emitting chips arranged in the second array
Mirror with display function. The method according to claim 6,
The connecting member includes:
A plurality of light emitting chips arranged in the first array,
Mirror with display function. The method according to claim 6,
The first direction is a direction
And a second direction orthogonal to the second direction
Mirror with display function. The method according to claim 6,
The flexible circuit board includes:
The length of the first direction is longer than the length of the second direction,
The stress acting in the second direction is smaller than the stress acting in the first direction
Mirror with display function. The method according to claim 4 or 5,
The light source module includes:
A reflective member disposed around the plurality of light emitting chips,
And a soft mold member disposed in the reflective member and covering the plurality of light emitting chips
Mirror with display function. 11. The method of claim 10,
The light source module includes:
Further comprising a blocking wall disposed between the plurality of light emitting chips
Mirror with display function. 12. The method of claim 11,
Wherein the upper surface of the blocking wall
A lower surface of the soft mold member
Mirror with display function. 11. The method of claim 10,
The light source module includes:
And a phosphor disposed within the soft mold member
Mirror with display function. 14. The method of claim 13,
The soft mold member
And a groove recessed from an upper surface and arranged in a direction of at least one of the first and second directions,
A reflective material is formed in the groove,
Wherein the depth of the groove is smaller than the thickness of the soft mold member
Mirror with display function. A mirror disposed in the vehicle for detecting a rearward state of the vehicle; And
And a light source module disposed on a rear surface of the mirror portion and displaying information related to the driving of the vehicle,
The mirror section may include:
A first region overlapping with the light source module disposed on the back surface,
And a second region other than the first region,
The total thickness of the first region of the mirror portion,
Is equal to the total thickness of the second region of the mirror portion,
The light source module includes:
A flexible circuit board including a first pad and a second pad;
A plurality of light emitting chips arranged on the first and second pads of the flexible circuit board,
First and second bonding members disposed between the light emitting chip and the first and second pads,
A reflective member disposed around the plurality of light emitting chips,
And a soft mold member disposed in the reflective member and molding the plurality of light emitting chips,
The plurality of light emitting chips
A plurality of first arrays arranged in a first direction,
And a second array arranged in a second direction different from the first direction,
At least two of the light emitting chips of the first array are connected to each other by the flexible circuit board,
The light emitting chips of the second array are electrically separated from each other,
The length of the flexible circuit board in the first direction is longer than the length of the flexible circuit board in the second direction
Mirror with display function. 16. The method of claim 15,
Wherein the light source module is bent at a predetermined curvature with respect to the first direction,
The light emitting chip of the light source module is individually driven
Mirror with display function.

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