KR20160034148A - Handler for testing semiconductor device - Google Patents

Abstract

The present invention relates to a handler for testing a semiconductor device, which is used in testing the fabricated semiconductor device. The handler for testing the semiconductor device according to the present invention includes a first support part for supporting a first test with respect to the semiconductor device and a second support part for supporting a second test with respect to the semiconductor device in which the first test is completed according to the support of the first support part. The second support part supports the second test with respect to the semiconductor devices transmitted from the first support part through an automated process after the first test is completed. According to the present invention, the first test and the second test are continuously performed in the automated process. Accordingly, the human intervention is not required and a time required for entire test processes can be reduced, thereby improving productivity.

Description

[0001] HANDLER FOR TESTING SEMICONDUCTOR DEVICE [0002]

The present invention relates to a handler for testing semiconductor devices used in testing semiconductor devices produced.

A handler for testing a semiconductor device (hereinafter referred to as a " handler ") is a handler for testing semiconductor devices manufactured through a predetermined manufacturing process from a customer tray, electrically connecting the semiconductor devices to a tester, The semiconductor device is classified according to the test result and is introduced into the empty customer tray.

The handler has evolved into various forms depending on the kind of the semiconductor device, the purpose of test, the environment, and the like, as shown in Korean Patent Laid-open No. 10-2009-0012667 or 10-2002-0077596.

Semiconductor devices are generally tested for electrical properties. Secondary tests may be performed on semiconductor devices that have been tested for electrical characteristics as needed.

The secondary test may be a retest for a semiconductor device determined to be defective in a test result for an electrical characteristic, or may be a test for a characteristic other than an electrical characteristic. An example of a boot test is a secondary test of characteristics other than electrical characteristics.

Among the semiconductor devices, there is a type (hereinafter, referred to as 'booting semiconductor device') having a function of booting a smart phone. The bootable semiconductor device must be tested for electrical characteristics and then tested for bootability. Therefore, the test of the semiconductor device for booting is performed in two steps. First, the electrical characteristics are tested as a first step, and as a second step, a booting function is tested for the booting semiconductor devices determined to be good in the first step. Here, a handler necessary for the electrical characteristic test is used in the first step, and a handler necessary for the boot function test is used in the second step.

If the primary test and the secondary test are the same characteristics as described above, the secondary test is performed after the primary test, so that more time is required for the secondary test.

In addition, when the primary test and the secondary test are tests for different characteristics, it is necessary to use two handlers. Therefore, the time and manpower for supplying the boot semiconductor device to the secondary test handler after the primary test need.

It is an object of the present invention to provide a technique in which the primary test and the secondary test can be carried out continuously in one automated process.

According to an aspect of the present invention, there is provided a handler for testing a semiconductor device, comprising: a first support part for supporting a first test on a semiconductor device; And a second support portion for supporting a second test for a semiconductor device for which a first test has been completed according to the support of the first support portion; Wherein the second support portion supports a second test on the semiconductor elements from the first support portion through an automated process after the first test is completed.

The first support portion includes a test shuttle in which the semiconductor elements to be subjected to the first test are seated; A first device mover for moving the semiconductor device from the customer tray to the test shuttle; A connector for electrically connecting the semiconductor device seated in the test shuttle in the test position to the test socket; A second device mover for moving the semiconductor devices from the test shuttle to the required positions while classifying the semiconductor devices subjected to the first test according to the result of the first test; .

The second device mover moves some of the semiconductor devices subjected to the first test in the first support portion to the second support portion and transfers the semiconductor devices completed in the second support portion to the second support portion Classify according to the result.

The first support portion supports testing of the electrical characteristics of the booting semiconductor device and the second support portion supports testing of the booting function of the booting semiconductor device.

The second support portion includes a socket module for enabling a secondary test of the semiconductor device to be made by being electrically connected to the semiconductor element coming from the first support portion; A loading module on which semiconductor elements coming from the first support portion are loaded; And a connection module for electrically connecting the semiconductor device mounted on the stacking module to the socket module to allow a second test to be performed and to load the semiconductor device after the second testing on the stacking module. .

The socket module is provided below the stack module and the connection module.

The loading module includes: a loading boat on which semiconductor elements can be loaded; A first boat mover for moving the loading boat in a first horizontal direction; A second boat mover for moving the loading boat in a second horizontal direction; And a boat elevator for raising and lowering the loading boat; And the first horizontal direction and the second horizontal direction are orthogonal.

The loading module comprises: a pair of loading boats on which semiconductor elements can be loaded; A first boat mover for moving the pair of loading boats in a first horizontal direction; A second boat mover for narrowing or opening the gap between the pair of loading boats in a second horizontal direction; And a boat elevator for raising and lowering the pair of loading boats; And the first horizontal direction and the second horizontal direction are orthogonal.

The socket module may be arranged side by side on the same plane as the stacking module.

The connecting module includes: a holding device for gripping semiconductor elements; And an elevator for elevating and lowering the gripper to allow the semiconductor device held by the gripper to be electrically connected to the socket module; .

The second support portion includes at least one sorting tray on which semiconductor elements of some of the semiconductor elements classified by the second test can be loaded.

The present invention has the following effects.

First, there is no human intervention between the primary and secondary tests.

Second, the processing time is reduced because the primary and secondary tests are performed continuously within an automated process. Furthermore, the processing time is further reduced since a secondary test for the previous quantity of water can be made while the primary test for the subsequent quantity of water is carried out.

Ultimately, productivity is improved.

In particular, since a small amount of semiconductor devices manufactured in the semiconductor design process can be easily booted before the mass production, the demand for the large-capacity handler for the boot test can be reduced, thereby saving money required for the construction of the test equipment.

In addition, since the first support portion and the second support portion can share the configuration (the second element mobile unit, the tray conveyor, and the like) with each other, the production cost can be reduced.

1 is a conceptual plan view of a handler for testing semiconductor devices according to a first embodiment of the present invention.
Fig. 2 is a schematic layout diagram of a main portion of a second support portion applied to the handler of Fig. 1;
FIG. 3 is an excerpt of a loading module in FIG. 2; FIG.
Fig. 4 is an excerpt of an excerpt of the connection module in Fig.
Figs. 5 to 11 are reference views for explaining the operation of the handler of Fig. 1. Fig.
Fig. 12 is an example in which the sorting tray portion is modified in the handler of Fig.
Fig. 13 is a schematic layout diagram of a main portion of a second support portion of a handler for testing a semiconductor device according to the second embodiment of the present invention. Fig.
Figs. 14 to 16 are reference views for explaining the operation of the main part of the handler of Fig. 13; Fig.

Hereinafter, preferred embodiments according to the present invention will be described with reference to the drawings. For the sake of brevity, redundant descriptions are omitted or compressed.

≪ Embodiment 1 >

1 is a conceptual plan view of a handler 100 according to a first embodiment of the present invention.

1, the handler 100 according to the present invention includes a first support portion 110, a second support portion 120, and a controller 130.

The first support portion 110 supports testing of the electrical characteristics of the semiconductor devices, which are the primary tests. In this specification, the term 'support' refers to a task of electrically connecting semiconductor devices to be tested to a tester, and classifying tested semiconductor devices according to test results.

The first support portion 110 includes a pair of redistriers 111a and 111b, a pair of test shuttles 112a and 112b, a first device mover 113, a coupler 114, a second device mover 115, The tray feeder 116, the feed stacker 117a, the first storage stacker 117b, 117c and 117d, the second storage stacker 117e, the standby stacker 117f, the first tray mover 118a , A second tray mover 118b, 118c, 118d, a third tray mover 118e, and a fourth tray mover 118f.

The booting semiconductor elements can be loaded in the redistriers 111a and 111b. These red plates 111a and 111b may have a heater. Therefore, the loaded semiconductor devices can be heated to a temperature required for an electrical characteristic test (hereinafter referred to as a 'characteristic test'). Of course, at the room temperature test, the operation of the heater is stopped. If necessary, only one red plate may be provided, or three or more red plates may be provided.

Semiconductor devices may be loaded in the test shuttles 112a and 112b. Test shuttle (112a, 112b) can be reciprocated (See a dotted line arrow a _1, a ₂₎ in the right and left horizontal direction past the test position (TP). Similarly, if necessary, one test shuttle may be provided or three or more test shuttles may be provided.

The first element mobile unit 113 draws the semiconductor elements from the customer tray CT at the drawing position WP and loads the semiconductor elements on the red plates 111a and 111b. The first device mover 113 moves the semiconductor devices in the redistribution boards 111a and 111b to the test shuttles 112a and 112b located at the current left side based on the test position TP. Of course, in the room temperature test, since the semiconductor devices may not need to pass through the red plates 111a and 111b, the first device mobile unit 113 may be tested from the customer tray CT at the draw- The semiconductor device may be directly moved to the test shuttle 112a or 112b located at the current left side based on the position TP. In order to perform the above-described operation, the first device mobile device 113 is provided so as to move in the left-right direction and the back-and-forth direction (see the dotted arrows b and c).

The connector 114 electrically connects the semiconductor devices loaded on the test shuttles 112a and 112b in the test position TP to the test socket TS below. Here, the electrical connection between the semiconductor element and the test socket (TS) is achieved by the connector 114 pushing down the semiconductor elements loaded on the test shuttles 112a, 112b. Of course, the semiconductor device is electrically connected to the tester through the test socket (TS).

The second device mover 115 classifies the tested semiconductor devices in the test shuttle 112a and 112b located on the right side of the test position TP according to the test result and outputs the retested position RP, (IP) and into the customer tray (CT) at the fixed position (FP). The retest position RP is a position at which the semiconductor device to be retested is brought into the customer tray CT. The entry position (IP) is the position where the semiconductor device that has passed the test enters the customer tray (CT). The fixed position (FP) is the position at which the semiconductor devices that pass the test or are not to be retested enter the customer tray (CT). The second device mobile device 150 is provided so as to be movable in the left-right direction and the back-and-forth direction (see dotted arrows d and e). Accordingly, the second device mobile device 150 moves in the vertical direction to grasp or release the semiconductor device. For reference, roles and mutual positions of the retest position (RP), the entry position (IP), and the fixed position (FP) can be changed according to the user's needs. The retest position RP and the fixed position FP may be omitted as needed.

The tray feeder 116 feeds the customer tray CT between the pull-out position WP, the stacking position AP, the retest position RP, the pull-in position IP and the standby position SP. For this purpose, the tray feeder 116 is provided so as to be movable in the left and right direction (see a dotted line arrow f).

The structure of the stackers such as the supply stacker 117a, the first storage stacker 117b, 117c and 117d, the second storage stacker 117e and the standby stacker 117f and the structure of the first tray mover 118a, The structure of the tray mover such as the second tray mover 118b, 118c, 118d, the third tray mover 118e and the fourth tray mover 118f is described in the applicant's prior patent applications 10-2013-0052809 and 10-2013 -0055510. Therefore, detailed description of their structure and operation will be omitted in the following description.

The supply stacker 117a accommodates a customer tray (CT) on which semiconductor elements to be tested are loaded. The customer trays (CT) stacked on the supply stacker 117a are sent one by one by the first tray mover 118a to the withdrawal position WP. Of course, two or more supply stacks may be provided.

The first storage stackers 117b, 117c and 117d receive the customer trays CT coming from the retesting position RF or the withdrawal position IP by the operation of the second tray mover 118b, 118c and 118d .

The second storage stacker 117e receives a customer tray CT that passes through the storage position AP after all of the semiconductor elements loaded on the draw-out position WP by the first device mover 113 have been drawn out .

The standby stacker 117f accommodates empty customer trays (CT) to be supplied to a standby position SP in which the customer tray CT to be transported to the retest position RP or the inlet position IP is waiting. That is, the empty customer tray (CT) accommodated in the standby stacker 117f is moved to the standby position SP one sheet at a time by the fourth tray mover 118f. And the customer tray CT at the standby position SP is conveyed to the retest position RP or the retracted position IP or the sorting position CP by the tray conveyor 116. [

The first tray mover 118a sends the customer tray CT accommodated in the supply stacker 117a one by one to the take-out position WP.

The second tray mover 118b, 118c or 118d brings the customer tray CT at the retesting position RF or the retracted position IP to the first storage stacker 117b, 117c or 117d.

The third tray mover 118e moves the customer tray CT at the storage position AP to the second storage stacker 117e.

The fourth tray mover 118f sends the empty customer trays CT housed in the waiting stacker 117f one by one to the waiting position SP.

On the other hand, the second support portion 120 supports testing of the boot function of the semiconductor devices, which is a secondary test. To this end, the second support portion 120 includes a socket module 121, a stacking module 122, a pair of connection modules 123a and 123b, five sorting trays 124a to 124e , A third storage stacker 125, and a fifth tray mover 126. [

The socket module 121 is provided for boot testing the semiconductor device from the first support portion 110. [ The socket module 121 has two connection sockets 121a and 121b. The semiconductor device may be electrically connected to the connection sockets 121a and 121b to perform a boot test. Here, the connection socket may be provided only one, or three or more connection sockets may be provided.

The loading module 122 includes a pair of loading boats 122a-1 and 122a-2, a pair of first boat movers 122b-1 and 122b-2, a second boat mover 122c and a boat elevator 122d.

The pair of loading boats 122a-1 and 122a-2 are formed with two seating grooves AS 'and AS, respectively, on which semiconductor elements can be seated. Here, the two seating grooves AS 'and AS formed on one loading boat 122a-1 and 122a-2 are adjacent to each other in the left and right direction (hereinafter referred to as' X-axis direction') which is the first horizontal direction. These pair of loading boats 122a-1 and 122a-2 are coupled to the first boat movers 122b-1 and 122b-2 so as to be movable in the X-axis direction. Of course, one or more of the loading boats may be provided if necessary.

The pair of first boat movers 122b-1 and 122b-2 move the pair of loading boats 122a-1 and 122a-2 in the X-axis direction. The pair of first boat movers 122b-1 and 122b-2 are coupled to the second boat movers 122c so as to be movable in the forward and backward direction (hereinafter referred to as 'Y-axis direction') which is the second horizontal direction.

The second boat mover 122c includes a pair of first boat movers 122b-1 and 122b-2 for narrowing or spreading the gap between the pair of loading boats 122a-1 and 122a-2 in the Y- Narrow or widen the gap between each other. That is, when the second boat movers 122c are operated, the pair of first boat movers 122b-1 and 122b-2 are moved in mutually opposite directions, and the pair of first boat movers 122b- The pair of the loading boats 122a-1 and 122a-2 coupled to the two loading boats 122a-1 and 122b-2 move in opposite directions to each other to narrow the space between the pair of loading boats 122a-1 and 122a-2 It will open.

The boat elevator 122d elevates the second boat mover 122c vertically (hereinafter referred to as "Z-axis direction") to ultimately move the pair of loading boats 122a-1 and 122a-2 in the Z-axis direction Lift.

The pair of connection modules 123a and 123b are provided on the upper side of the socket module 121. [ The pair of connection modules 123a and 123b includes grippers 123a-1 and 123b-1 and elevators 123a-2 and 123b-2, respectively, as shown in FIG.

The grippers 123a-1 and 123b-1 grip or release the semiconductor element. Here, the grippers 123a-1 and 123b-1 are provided with the heater H so that the gripped semiconductor element can be heated to a predetermined temperature. Also, the heater H may be omitted, detachably mounted, or turned on / off according to the test conditions.

The elevators 123a-2 and 123b-2 raise and lower the grippers 123a-1 and 123b-1 in the Z-axis direction.

In this embodiment, the socket module 121 is located below the loading boats 122a-1 and 122a-2 and the pair of connecting modules 123a and 123b for space saving, and the holding devices 123a-1 and 123b -1) can be raised and lowered without horizontal movement. Therefore, the loading boats 122a-1 and 122a-2 must be able to move in the first horizontal direction and the second horizontal direction, and be able to be raised and lowered. This will be explained in detail later.

The five sorting trays 124a to 124e are loaded with semiconductor elements of grades 2 to 6 among the semiconductor elements that have undergone the boot test. For reference, a class 1 semiconductor device is loaded on a customer tray (CT) at a sorting position (CP), and the product gets better as it goes from grade 6 to grade 1. As a matter of course, it is sufficient to divide the semiconductor devices which have undergone the booting test by two or more grades, and accordingly, the number of sorting trays may be varied. That is, one or more sorting trays may be provided according to the practice.

The third storage stacker 125 is provided to receive a customer tray CT located at the sorting position CP.

The fifth tray mover 126 accommodates the customer tray CT located at the sorting position CP in the third storage stacker 125.

The controller 130 controls only the first support portion 110 to be activated or the first support portion 110 and the second support portion 120 to operate together. Therefore, the handler 100 according to the present invention may be used only for the electrical characteristic test, or may be used for the boot test after the electrical characteristic test.

Subsequently, an operation in which the primary test (electrical characteristic test) and the secondary test (boot test) are continuously performed during the operation of the handler 100 having the above configuration will be described.

First, the first tray mover 118a moves the customer tray (CT) loaded on the supply stacker 117a one by one to the take-out position (WP).

The first element mobile unit 113 draws the semiconductor element to be tested from the customer tray CT at the drawing position WP and loads the semiconductor element on the redistribution boards 111a and 111b. The first device mover 113 moves the semiconductor devices loaded on the redistribution boards 111a and 111b to the test shuttles 112a and 112b located at the current left side with respect to the test position TP.

The test shuttles 112a and 112b loaded with the semiconductor elements to be tested move to the right and are located at the test position TP. The connector 114 presses down the semiconductor elements loaded on the test shuttles 112a and 112b of the test position TP. Thus, the semiconductor device is electrically connected to the test socket TS. Then, the electrical characteristics of the semiconductor device are tested.

When the test is completed, the electrical connection between the semiconductor element and the test socket (TS) is released, and the test shuttles (112a, 112b) move further to the right. The second device mobile device 115 fetches the tested semiconductor devices from the test shuttles 112a and 112b located at the current right side with respect to the test position TP. Then, the second device mover 115 brings the semiconductor devices into the customer tray CT at the retesting position RP, the retracted position IP and the fixed position FP while classifying the semiconductor devices according to the test result. Here, the second device mover 115 also samples some of the semiconductor devices, which are determined to be good ones among the semiconductor devices loaded in the test shuttles 112a and 112b, to move them to the second support part 120.

On the other hand, the customer tray (CT) from which the semiconductor elements loaded in the draw-out position (WP) are all drawn is conveyed to the receiving position (AP) by the tray conveyor (116). And the customer tray CT in the storage position AP is moved to and stored in the second storage stacker 117e by the third tray mover 118e.

Further, when all the semiconductor elements are filled in the customer tray CT at the retest position RP and at the retracted position IP, the customer tray CT at the retest position RP and the retracted position IP, 117c, and 117d by the first and second tray mover 118b, 118c, and 118d. Thus, the customer tray CT is removed from the retest position RP or the retracted position IP. The fourth tray mover 118f sends an empty customer tray CT in advance from the standby stacker 117f to the standby position SP. The empty customer tray (CT) at the standby position SP is then transported to the retest position RP or the retracted position IP by the tray conveyor 116. The empty customer tray CT in the withdrawal position WP may be conveyed to the standby position SP by the tray conveyor 116 and the empty customer tray CT in the withdrawal position WP May be transferred directly to the retest position RP or the retracted position IP. The tray conveyor 116 may also convey the empty customer tray CT at the withdrawal position WP or the standby position SP to the sorting position CP.

Next, a boot test of the semiconductor device sampled from the test shuttles 112a and 112b by the second device mover 150 and moved to the second support portion 120 will be described.

The booting test by the second support portion 120 is performed by the second device mover 115 in such a manner that the two semiconductor elements D sampled from the test shuttles 112a and 112b as shown in FIG. 122a-2 in the left seating groove AS '.

In the state of Fig. 5, the boat elevator 122d is operated to lower the second boat mover 122c as shown in Fig. Accordingly, the first boat mover 122b-1, 122b-2 and the loading boat 122a-1, 122a-2 coupled to the second boat mover 122c descend.

In the state shown in Fig. 6, the second boat mover 122c is actuated to open the space between the pair of loading boats 122a-1 and 122a-2 as shown in Fig. The space between the pair of the loading boats 122a-1 and 122a-2 is opened so that the semiconductor elements D mounted on the pair of loading boats 122a-1 and 122a-2 are connected to the pair of connecting boats 122a-1 and 122a- The semiconductor elements held properly by the modules 123a and 123b or held by the pair of connection modules 123a and 123b are held in the seating grooves AS 'and AS of the pair of loading boats 122a-1 and 122a-2, ). ≪ / RTI >

7, the grippers 123a-1 and 123b-1 of the connection modules 123a and 123b are lowered by a predetermined distance, as shown in FIG. 8, so that two semiconductor elements D, Is loaded on the right seating groove AS of the pair of loading boats 122a-1 and 122a-2, and then ascends by a predetermined distance.

In the state of FIG. 8, the first boat mover 122b-1, 122b-2 is operated to move the loading boat 122a-1, 122a-2 to the right as shown in FIG.

9, the grippers 123a-1 and 123b-1 of the connecting modules 123a and 123b descend a predetermined distance and the load of the loading boats 122a-1 and 122a-2 After holding the semiconductor element D mounted on the left seating groove AS ', the semiconductor element D rises by a predetermined distance.

In the state of FIG. 10, the pair of loading boats 122a-1 and 122a-2 rise as shown in FIG. 11 after narrowing the interval therebetween. At this time, the driving order of the loading boats 122a-1 and 122a-2 can be set in consideration of the interference between the configurations. For example, according to the setting method, the interval between the loading boats 122a-1 and 122a-2 may be narrowed and elevated.

The reason why the loading boats 122a-1 and 122a-2 are elevated in the Z-axis as described above is that the socket module 121 is arranged below the loading boats 122a-1 and 122a-2, To minimize space and save space. 5 to 11, since the socket module 121 is positioned below the loading boats 122a-1 and 122a-2, the loading boats 122a-1 and 122a-2 are moved up and down Since the holding devices 122a-1 and 122a-2 of the holding modules 123a-1 and 123b-1 of the connecting modules 123a and 123b move up and down only in the Z direction, Moving.

Also, since the size of the socket module 121 varies, the connection sockets 121a and 121b must be exchangeable. Since the grippers 123a-1 and 123b-1 of the connection modules 123a and 123b must be positioned above the largest connection socket 121a and 121b, 1, 122a-2) are narrowed or spread in the Y-axis direction. Therefore, the loading boats 122a-1 and 122a-2 can be positioned so that the seating grooves AS 'and AS of the loading boats 122a-1 and 122a-2 can be positioned below the positions where the grippers 123a-1 and 123b- 122a-2 may be widened or narrowed in the Y-axis direction.

The structure and operation of the loading module 122 and the connecting modules 123a and 123b as described above can effectively prevent interference with other structures while efficiently using a narrow space.

After the booting test is completed, the second device mover 115 loads the semiconductor elements D, which have been lifted in the state of being stacked on the pair of loading boats 122a-1 and 122a-2 as shown in FIG. 11, And are transported to the customer tray (CT) or sorting trays (124a to 124e) in the sorting position (CP).

11, the grippers 123a-1 and 123b-1 of the connection modules 123a and 123b are lowered to electrically connect the semiconductor devices D held by the connection modules 123a-1 and 123b-1 to the connection sockets 121a and 121b . Of course, a boot test is performed on the semiconductor device D connected to the connection sockets 121a and 121b. Of course, in the present embodiment, the secondary test is an example of a boot test, but the secondary test may be the same electrical characteristic test as the primary test or another test.

As shown in FIG. 5, the pair of loading boats 122a-1 and 122a-2 are elevated and lowered in a mutually narrowed state, and a pair of grippers 123a-1 and 123b-1 The open connecting modules 123a and 123b can prevent the loading boats 122a-1 and 122a-2 from moving up and down because the spaces between the pair of loading boats 122a-1 and 122a-2 are narrowed down. The loading boats 122a-1 and 122a-2 can not act as obstacles against the descent of the grippers 123a-1 and 123b-1.

FIG. 12 shows an example in which the sorting trays 124a 'to 124e' are provided in a structure different from that of FIG. In the example of Fig. 12, the sorting trays 124a 'to 124e' are fixed to the rotary table 127 ', and the rotary table 127' is rotatably supported by the rotary 128 '. In this case, there is an advantage that the operation of the second device mover 115 can be simply designed by rotating the rotary table 127 'according to the class of semiconductor devices classified according to the boot test result.

For reference, the size and shape of the sorting tray may vary depending on the number of semiconductor devices subjected to the second test and the number of classes of the sorting. Accordingly, the arrangement in a limited space can be changed as much as possible. That is, in the case of the classification tray, it may be omitted, there may be only one, or two or more may be provided.

≪ Embodiment 2 >

13 is a schematic perspective view of a main portion of a second support portion of a handler according to a second embodiment of the present invention;

13, the main portion of the second support portion includes a socket module 221, a loading module 222, and connection modules 223a and 223b.

The socket module 221 is provided for boot testing a semiconductor device from the first support portion (which is functionally and functionally identical to the first support portion of the first embodiment, and is omitted in Fig. 13). The socket module 221 is the same as in the first embodiment. However, in this embodiment, the socket module 221 is provided on the right side of the loading module 222. That is, in this embodiment, the socket module 221 and the loading module 222 are arranged side by side on the same plane.

Of course, this embodiment also describes the secondary test as a boot test, but the secondary test may be an electrical characteristic test such as a primary test or another test.

The loading module 222 has two fixed loading boats 222a-1, 222a-2. The two loading boats 222a-1 and 222a-2 are formed with two seating grooves AS 'and AS, respectively, on which the semiconductor elements D can be seated.

The pair of connection modules 223a and 223b are provided on the upper side of the socket module 221 and the loading module 222. [ The pair of connection modules 223a and 223b includes grippers 223a-1 and 223b-1, elevators 223a-2 and 223b-2, and horizontal mobile units 223a-3 and 223b-3 .

The grippers 223a-1 and 223b-1 grip or release the semiconductor element. Of course, as in the first embodiment, the holders 223a-1 and 223b-1 may be provided with heaters.

The elevators 223a-2 and 223b-2 elevate the grippers 223a-1 and 223b-1 in the Z-axis direction.

The horizontal shifters 223a-3 and 223b-3 move the grippers 223a-1 and 223b-1 in the X-axis direction.

In addition to the above main portions, the remaining configurations of the second support portion are the same as those in the first embodiment.

Subsequently, the operation of the main part will be described.

13, the semiconductor element D from the first support portion is mounted on the left seating groove AS 'of the loading boat 222a-1, 222a-2, and the connection module 223a, 223b load the semiconductor elements D having completed the secondary test (boot test) into the right seating grooves AS of the loading boats 222a-1, 222a-2.

The grippers 223a-1 and 223b-1 move to the left in the state of Fig. 14 to grip the semiconductor elements D placed on the left seating grooves AS 'of the loading boats 222a-1 and 222a- And then moves to the right as shown in Fig.

15, the grippers 223a-1 and 223b-1 are lowered to electrically connect the semiconductor device D held by the socket module 221 to the socket module 221 as shown in FIG. And a second test is performed.

On the other hand, the semiconductor elements D loaded in the right seating grooves AS of the loading boats 222a-1 and 222a-2 are moved to the customer tray or the sorting tray by the first device moving device according to the result of the secondary test .

In addition to the first and second embodiments, the socket module, the loading module, and the connecting module of the second support portion may be modified in various arrangements and forms.

The above description has described an example in which the primary test is an electrical characteristic test and the secondary test is a boot test. However, depending on the implementation, both the primary test and the secondary test may be implemented as electrical characteristic tests, and the secondary tests may be implemented as tests for other functions than booting.

In the above embodiment, the second test is performed only on the sampled semiconductor devices after the first test, but it may be implemented to conduct the second test on all the semiconductor devices tested first have.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And the scope of the present invention should be understood as the scope of the following claims and their equivalents.

100: Handler for semiconductor device test
110: first support portion
112a, 112b: test shuttle 113: first device mobile station
114: connector 115: second device mobile unit
120: second support portion
121: Socket module
122: Stacking module
122a-1, 122a-2: Loading boat
122b-1, 122b-2: a first boat mover
122c: second boat mover
122d: boat lift
123a, 123b: connection module
124a to 124e, 124a 'to 124e': sorting tray
127 ': Rotary table 128': Rotor

Claims (11)

A first support portion for supporting a first test for a semiconductor device; And
A second support portion for supporting a secondary test for a semiconductor device for which a first test has been completed according to the support of the first support portion; / RTI >
Wherein the second support portion supports a secondary test on the semiconductor elements from the first support portion via an automated process after the first test is completed
Handler for testing semiconductor devices. The method according to claim 1,
Wherein the first support portion comprises:
A test shuttle which reciprocates past the test location and on which the semiconductor elements to be subjected to the primary test are seated;
A first device mover for moving the semiconductor device from the customer tray to the test shuttle;
A connector for electrically connecting the semiconductor device seated in the test shuttle in the test position to the test socket;
A second device mover for moving the semiconductor devices from the test shuttle to the required positions while classifying the semiconductor devices subjected to the first test according to the result of the first test; ≪ RTI ID = 0.0 >
Handler for testing semiconductor devices. 3. The method of claim 2,
The second device mover moves some of the semiconductor devices subjected to the first test in the first support portion to the second support portion and transfers the semiconductor devices completed in the second support portion to the second support portion Characterized in that it is classified according to the result
Handler for testing semiconductor devices. The method according to claim 1,
The first support portion supports testing of the electrical characteristics of the booting semiconductor device,
Characterized in that the second support portion supports testing of the boot function of the booting semiconductor component
Handler for testing semiconductor devices. The method according to claim 1,
The second support portion comprises:
A socket module that is electrically connected to the semiconductor device from the first support portion so that a secondary test of the semiconductor device can be performed;
A loading module on which semiconductor elements coming from the first support portion are loaded; And
A connection module for electrically connecting the semiconductor device loaded on the stacking module to the socket module to allow a secondary test to be performed and to load the semiconductor device after the secondary testing on the stacking module; ≪ RTI ID = 0.0 >
Handler for testing semiconductor devices. 6. The method of claim 5,
Wherein the socket module is provided below the loading module and the connecting module
Handler for testing semiconductor devices. The method according to claim 6,
Wherein the loading module comprises:
A loading boat on which semiconductor elements can be loaded;
A first boat mover for moving the loading boat in a first horizontal direction;
A second boat mover for moving the loading boat in a second horizontal direction; And
A boat elevator for raising and lowering the loading boat; Lt; / RTI >
Wherein the first horizontal direction and the second horizontal direction are orthogonal to each other
Handler for testing semiconductor devices. The method according to claim 6,
Wherein the loading module comprises:
A pair of loading boats on which semiconductor elements can be loaded;
A first boat mover for moving the pair of loading boats in a first horizontal direction;
A second boat mover for narrowing or opening the gap between the pair of loading boats in a second horizontal direction; And
A boat elevator for raising and lowering the pair of loading boats; Lt; / RTI >
Wherein the first horizontal direction and the second horizontal direction are orthogonal to each other
Handler for testing semiconductor devices. 6. The method of claim 5,
Characterized in that the socket module is arranged side by side on the same plane as the stacking module
Handler for testing semiconductor devices. 6. The method of claim 5,
The connection module includes:
A gripper for gripping semiconductor elements; And
An elevator for elevating and lowering the gripper to allow the semiconductor device held by the gripper to be electrically connected to the socket module; ≪ RTI ID = 0.0 >
Handler for testing semiconductor devices. 6. The method of claim 5,
Characterized in that the second support portion comprises at least one sorting tray on which semiconductor elements of some of the semiconductor elements classified by grade by the secondary test can be loaded
Handler for testing semiconductor devices.

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