KR20150105169A - Lighting apparatus - Google Patents

Abstract

The present invention provides a lighting device capable of restraining the luminance unevenness or the like by effectively spreading a light source of a semiconductor light emitting device even if an optical device of which the front and rear sides are formed in the shape of a plane is used. The present invention comprises: base members (30, 45, 54); a semiconductor light emitting device (62) fixed to the base member; and an optical device (70) formed in the shape of a plane with a surface (70b) facing the semiconductor light emitting device and an opposite surface (70a) of the semiconductor light emitting device. The optical device has: indented parts (71, 72) at least one direction of the surface facing the semiconductor light emitting device and the opposite surface thereof; and a plurality of through holes in at least one direction.

Description

[0001]

The present invention relates to a lighting apparatus using a semiconductor light emitting device (LED).

As a prior art example of a lighting apparatus using a semiconductor light emitting device (LED), there is one disclosed in Patent Document 1.

The lighting apparatus includes a base member, an LED (semiconductor light emitting element) fixed to the base member, and a light distribution lens (optical element) fixed to the base member.

Since the light emitted from the LED has high linearity, unless the shape of the light distribution lens is studied, the illumination light of the LED that has passed through the light distribution lens is hardly diffused and moves toward a specific one direction (and peripheral portion thereof). However, when the light distribution lens has such a light distribution characteristic, the practicality of the lighting apparatus is deteriorated.

Therefore, in Patent Document 1, the shape of the light distribution lens is studied to diffuse the illumination light. The light distribution lens of Patent Document 1 is a rotationally symmetric body centering on an axis orthogonal to the light emitting surface of the LED, and a rotationally symmetrical concave portion around the axis is formed on the surface of the light distribution lens facing the LED (and the base member) .

The light distribution lens is fixed to the base member in a state of covering the LED. And an LED is positioned in a space formed between the recessed portion and the base member.

When the power generating the power is supplied to the LED, the LED emits light.

Then, the illumination light emitted from the LED enters the inside of the light distribution lens from the surface of the concave portion (the inner peripheral surface of the light distribution lens). The illumination light passes through the inside of the light distribution lens and is emitted from the outer peripheral surface of the light distribution lens to the outside of the light distribution lens. Therefore, the illumination light is diffused in various directions by the light distribution lens.

JP 2006-114863 A JP 2012-044016 A JP 2012-004078 A JP 4357508 B JP 4568194 B

In the light distribution lens of Patent Document 1, the opposite side of the LED is entirely curved.

However, when the light distribution lens is configured in this shape, it becomes difficult to mold and process the light distribution lens, and a lot of materials are required to manufacture the light distribution lens. That is, the manufacturing cost of the light distribution lens is increased.

Further, since the thickness of the light distribution lens is increased, the thickness of the entire lighting apparatus is increased.

In order to solve this problem, it is conceivable to construct a light distributing lens by using a planar member having front and rear surfaces (the opposite surface to the LED and the opposite surface to the opposite surface) formed in a plane.

However, a flat light distribution lens has a poor performance for diffusing illumination light. For this reason, the lighting apparatus using the flat light distribution lens easily illuminates only the axial direction and its peripheral portion, and the other portions are easily darkened. That is, luminance unevenness tends to occur in the illumination light emitted from the flat light distribution lens. As a result, the usefulness of the lighting apparatus is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a lighting apparatus capable of minimizing luminance unevenness by effectively diffusing illumination light of a semiconductor light emitting element while using a photon element whose front and rear surfaces are both planar.

The present invention provides a semiconductor light emitting device including a base member, a semiconductor light emitting device fixed to the base member, a light emitting device having a surface opposite to the semiconductor light emitting device and a surface opposite to the semiconductor light emitting device, And at least one of a concave portion and a through hole is formed on at least one side of the surface and the opposite side.

At least one of the recess and the through-hole may be formed on the opposite surface and the opposite surface.

In this case, it is preferable that the concave portion formed on the opposed face and the concave portion formed on the opposite side face are concentric with each other.

At least one of the recessed portion and the through hole may be provided concentrically.

At least one of the concave portion and the through hole may be provided radially.

At least one of the recess and the through hole may be provided in a lattice form.

At least one of the concave portions may be a conical shape.

At least one of the concave portions may be hemispherical.

In addition, at least one of the concave portions may form a part of the spherical surface of the bottom surface, and a portion except the bottom surface may have a circular shape.

It is preferable that at least one of the concave portions has a conical shape in which the bottom surface protrudes toward the opening end side of the concave portion and a portion excluding the bottom surface has a columnar shape.

At least one of the concave portion and the through hole may have a cylindrical shape.

At least one of the concave portion and the through hole may have a shape in which the head of the cone is cut.

The light emitting element of the lighting apparatus of the present invention has a planar shape in which the opposite surface to the semiconductor light emitting element and the opposite surface to the semiconductor light emitting element are flattened to each other. That is, the light emitting device of the present invention has a flat plate shape.

Therefore, the moldability and workability of the light emitting element are good, and the material necessary for manufacturing one light emitting element can be reduced. That is, it is possible to lower the manufacturing cost of the light emitting element.

Further, since the thickness of the light emitting element can be reduced, it is possible to suppress the increase in the thickness of the entire illumination.

And at least one of a concave portion and a light hole is provided in at least one of the opposite surface and the opposite surface of the light emitting element.

The illumination light incident on the inner surface of the concave portion and the through hole is reflected by the inner surface in a direction different from the incident direction.

Therefore, the illuminating light can be effectively diffused even though the overall shape of the balun element is a flat plate shape.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a part of a conductive plate of an embodiment of the present invention; FIG.
Fig. 2 is a perspective view of a primary integral body in which a primary resin molded portion is integrally formed on a conductive plate; Fig.
3 is a bottom perspective view of the primary integral.
4 is a plan view of the primary integral;
Fig. 5 is a plan view of a primary integral piece subjected to primary cutting. Fig.
6 is an exploded perspective view of a primary integral body and a heat sink;
7 is an exploded perspective view of the bottom surface of the primary integral body and the heat sink.
8 is a perspective view of a combined body of a primary integral body and a heat sink;
9 is a bottom perspective view of a combined body of a primary integral body and a heat sink.
10 is a perspective view of a secondary integral body in which a secondary resin molding portion is integrally formed with a combination of a primary integral body and a heat sink;
11 is a bottom perspective view of the secondary integral body.
12 is a plan view of a secondary integral body in which a reflection film is formed on a mounting face;
Fig. 13 is a perspective view of a completed LED holder and an LED by performing a second cutting. Fig.
14 is a sectional view taken along the line XI-V-XIVI in Fig. 13;
15 is a plan view of the LED module.
16 is an exploded perspective view of the LED module and the light distribution lens.
17 is an exploded bottom perspective view of the LED module and the light distribution lens.
18 is a plan view of a light distribution lens;
19 is a bottom view of the light distribution lens shown with the fixed angle omitted.
20 is a cross-sectional view taken along a line X-X in FIG. 18;
FIG. 21 is an enlarged cross-sectional view of the X-X I part of FIG. 20; FIG.
22 is a perspective view of one end portion of the connector portion cable and a vicinity thereof;
23 is a bottom perspective view of one end portion of the connector portion cable and its vicinity.
Fig. 24 is a plan view of a lighting apparatus in which a lower surface of a heat sink of one LED module is fixed on the upper surface of a heat dissipating member, and a light distribution lens connected to a connector of a connector portion cable is omitted.
Fig. 25 is a plan view schematically showing the lighting fixture of Fig. 24 without the illustration of the transparent cover and the chassis. Fig.
26 is an enlarged cross-sectional view corresponding to Fig. 21 as a first modification. Fig.
FIG. 27 is an enlarged cross-sectional view corresponding to FIG. 21 also as a second modification. FIG.
28 is an enlarged cross-sectional view corresponding to FIG. 21 as a third modification.
29 is an enlarged cross-sectional view corresponding to FIG. 21 as a fourth modification.
30 is an enlarged cross-sectional view corresponding to FIG. 21 as a fifth modification.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, the front, back, right and left and up and down directions refer to the direction of the arrow in the drawing.

This embodiment uses the LED module 10 as a light source of the lighting device 66 (see Figs. 24 and 25).

The LED module 10 (semiconductor light emitting module) includes an LED 62, a wire bonding 64 and an encapsulant (also sometimes referred to as a wire bonding 90 ) Are installed and integrated. First, the detailed structure and manufacturing method of the LED holder 15 will be described.

1 shows a conductive plate 17 serving as a basic member of the holder 15 for LED. The conductive plate 17 is formed by stamping a metal flat plate having excellent conductivity, thermal conductivity and rigidity such as brass, beryllium copper, and Colson copper alloy. The overall shape of the conductive plate 17 is a flat plate of a long rectangular shape extending in the front-rear direction (only a part of the conductive plate 17 is shown in Fig. 1). The left and right side portions of the conductive plate 17 are formed by carrier portions 18A and 18B formed in the forward and backward directions and the carrier connecting portions 19 are provided at equal intervals along the front- Thereby connecting the carrier portions 18B. The carrier portion 18A and the carrier portion 18B are provided with a transporting hole 18C at regular intervals. Two first conductive members 20 and two second conductive members 21 are formed at respective portions surrounded by the carriers 18A and 18B and the adjacent two carrier connection portions 19. [ The two first conductive members 20 are each integrated with the carrier portions 18A and 18B and the carrier connection portion 19 by two first cutting bridges 22 respectively, (21) are integrated with the carrier connection portion (19) by a single second cutting bridge (23). The adjacent first conductive member 20 and the second conductive member 21 are connected to each other by a single third cutting bridge 24. An arc-shaped wire connecting portion 20A is formed on the inner periphery of the first conductive member 20. The cable connecting portion 20B formed in the forward and backward directions in a plan view and the cable connecting portions 20B protrude from the other side of the wire connecting portion 20A of the first conductive member 20, And a noncircular coupling hole 20C is formed in the region. On the other hand, a wire connecting portion 21A having an arc shape (same shape as that of the wire connecting portion 20A) is formed on the inner periphery of the second conductive member 21. A cable connecting portion 21B is formed at a position different from the wire connecting portion 21A of the second conductive member 21 so as to protrude from the cable connecting portion 20B and linearly formed in the front- And a coupling hole 21C of a circular shape is perforated.

The conductive plate 17 having such a structure is coupled to a sprocket of a transfer device (not shown) for each of the transfer holes 18C of the conductive plate 17 and is forwardly transferred by the rotation of each sprocket.

When it is transported to a predetermined position, a primary molding die (not shown) composed of a pair of molds positioned above and below the conductive plate 17 is closed and the conductive plate 17 is housed in the primary molding die. When a plurality of support pins (not shown) provided in the primary molding die are coupled to positioning holes (not shown) formed in the conductive plate 17 when being transported to the predetermined position, the conductive plate 17 is inserted into the primary molding die . Injection molding (primary molding or insert molding) using a resin material having high insulation or heat resistance (for example, liquid crystal polymer or the like) is carried out in a primary molding die. When the respective molds of the primary molding die are separated from the conductive plate 17 up and down after the resin material is cured, a plurality of integrally formed primary molded-in-shape portions 30 are integrally formed on the surface of the conductive plate 17 Water (hereinafter referred to as primary integral) appears (only one of Figs. 2 to 4, etc.).

As shown in the drawing, the first order wedge shaped portion 30 (base member) is composed of a first conductive member 20, a second conductive member 21, a first cutting bridge 22, a second cutting bridge 23, And a body portion 31 formed integrally with the cutting bridge 24 and having a circular through hole at the center thereof. The body portion 31 and the body portion 31 are integrally formed with the front and rear carrier connecting portions 19, And a plurality of connection arms 43 are provided. The main body portion 31 has a circular (tapered) annular inner wall portion 32 as seen from a plane configuring the outer shape of the through hole, and an annular inner wall portion 32 continuously continuous with four inner peripheral portions of the annular inner wall portion 32. [ 1 conductive member 20 and four inner protrusions 33 filling the space between the end portions of the second conductive member 21. Two bridge exposing holes 35 are formed on the upper surface of the main body 31 to expose the third cutting bridges 24. The four engaging holes 20C are formed on the upper and lower surfaces of the main body 31, And a coupling hole exposing hole 36 for exposing the coupling hole 21C are formed. Two portions of the main body 31 are provided with connector connection projecting portions 37 integrated with the cable connecting portions 20B and the cable connecting portions 21B while exposing the upper surfaces of the front ends of the cable connecting portions 20B and the cable connecting portions 21B A connector connection port 38 formed around each cable connection protrusion 37 and two coupling recesses 39 respectively formed on both side surfaces (right side surface and left side surface) of each connector connection portion 38 have. Further, eight lower side projections 40A, 40B, 40C, 40D protruding downward from the conductive plate 17 are formed on the lower surface of the primary resin molding portion 30. The primary resin molding portion 30 is provided with two outer peripheral walls 41 each having an L-shaped cross section projecting downward from the lower side projections 40A, 40B, 40C and 40D, One engaging projection 42 is formed on the inner surface of the wall 41 (only one of them is shown in Figs. 3 and 7).

Subsequently, each of the first integral pieces (the conductive plate 17 and the first resin molding portion 30) is transported to a predetermined position forward by using the transporting device, and a primary cutting device Cuts the first cutting bridge 22, the second cutting bridge 23 and the third cutting bridge 24 of the conductive plate 17 (performs primary cutting). Specifically, the first cutting bridges 23 and the third cutting bridges 23 are cut in a direction parallel to the outer peripheral surface of the main body portion 31 of each primary resin forming portion 30, and the bridge exposure holes 35 To cut the central portion of each third cutting bridge 24 (see Fig. 5).

Subsequently, the primary integral is moved to a predetermined position forward by the transfer device.

A plurality of heat dissipating plates 45 (base members) (heat transfer members) are embedded in the predetermined positions, and when the primary integral is conveyed to the predetermined position, And the heat sinks 45 are respectively positioned (Figs. 6 and 7).

The heat sink 45 is an integral molded product made of a metal such as aluminum and has a higher thermal conductivity than the primary resin molding portion 30 (and a secondary resin molding portion 54 described later). The outer shape of the heat sink 45 is similar to that of the main body 31. The upper half of the heat radiating plate 45 is constituted by a large water receiving portion 46 having a shape slightly parallel to the lower half portion and the engaging recess portions 47 are formed at two places on the lower surface of the outer peripheral portion of the water receiving portion 46 Only one in Fig. 7 and Fig. 9). The lower surface of the heat sink 45 is constituted by a close contact surface 48 formed in a plane. A cylindrical LED support portion 49 is protruded from the center of the upper surface of the heat sink 45. The upper surface of the LED support portion 49 is constituted by a mounting surface 49a formed in a horizontal plane. In addition, two circular recesses 50 and two non-circular recesses 51 are formed on the upper surface of the heat sink 45.

When each of the first integral pieces (the conductive plate 17 and the first resin molded portion 30) are positioned directly above the respective heat sinks 45, the transfer device directs the respective heat sinks 45 to the respective first integral pieces (See Figs. 8 and 9). As a result, when the object-to-be-filled portion 46 of each heat sink 45 is accommodated in the space surrounded by the two outer peripheral surfaces 41 of the corresponding primary integral, a part (two places) of the outer peripheral surface of the object- And the upper surface of the water receiving portion 46 is in surface contact with the lower surfaces of the lower surface side projections 40A, 40B, 40C, 40D while facing the inner peripheral surface of the outer peripheral wall 41 while forming a micro clearance. At this time, four protrusions (downward projections located around the four engaging hole exposures 36) formed on the lower surface of the primary integral body (main body 31) are divided into two circular recesses 50 and two Circular concave portions 51, respectively. The heat sink 45 is temporarily fixed to the main body 31 because the two engaging projections 42 are downwardly coupled to the two engaging recesses 47 so that the main body 31 and the heat sink 45 . Further, the LED support portion 49 is positioned in the circular hole in the center of the main body portion 31. The outer circumferential surface of the LED support portion 49 is spaced from the inner circumferential side of the wire connecting portion 20A and the inner circumferential surface of the wire connecting portion 21A and each of the inner protruding portions 33 so that an annular space S is formed between them 8).

The integral body of the primary integral (the conductive plate 17 and the secondary-purpose oval-shaped portion 30) and the heat sink 45 is further conveyed to a predetermined position forward by the above conveying device.

Then, a secondary molding die (not shown) composed of a pair of dies positioned above and below the integral body is closed, and the integral body is housed in the secondary molding die. At this time, a supporting pin (not shown) provided on the secondary molding die is coupled to the positioning hole, and the integral is fixed in the secondary molding die. Injection molding (insert molding, secondary molding) of a resin material (e.g., liquid crystal polymer) having high insulation and heat resistance in the secondary molding die is performed. When the secondary molding die is vertically separated after the resin material is cured, the surface of the integral body of the primary integral body (the conductive plate 17 and the primary structural member 30 and the heat sink 45) An integral body (secondary integral body) in which a base member (base member) 54 is molded (see Figs. 10 and 11). As shown in the drawing, the secondary resin molding die 54 is molded over the primary shoulder 30 and the heat sink 45 (covering the engaging projections 42 and the engaging recesses 47) When the mold 54 is cured, the primary mold 30 and the heat sink 45 are completely fixed. The secondary annular shoulder 54 has a circular tapered surface when viewed in a plane covering the surface of the annular inner wall portion 32 and has an annular wall 55 continuous with the upper surface of each inner projecting portion 33. The annular portion 56 constituting a part of the secondary order oval shaped portion 54 is formed between the inner circumferential surface of the wire contacting portion 20A and the wire contacting portion 21A and between the inner projecting portion 33 and the outer circumferential surface of the LED supporting portion 49 The upper surface of the annular portion 56 is located on the same plane as the mounting surface 49a of the LED support portion 49 and the upper surface of each of the inner projecting portions 33 (see FIG. 10) (The mounting surface 49a of the LED supporting portion 49 and the upper surface of each inner protruding portion 33 are continuous with each other). The second order wedge shaped portion 54 has a gap formed between the lower face of the secondary wedge shaped portion 30 and the upper face of the water filled portion 46 (eight lower face side projected portions 40A, (A gap formed between the first, second, and third protruding portions 40B, 40C, and 40D). The cover protrusions 57 formed on the outer circumferential surface of the secondary resin molding portion 54 are protruded from the end portions of the first cutting bridges 22 and the second cutting bridges 23 exposed before the secondary molding, Respectively.

Subsequently, each of the secondary integrals (the conductive plate 17, the primary osculating die 30, the heat sink 45, and the secondary osseointegrated portion 54) is transported to a predetermined position forward by using a transfer device.

A pad press (not shown) is provided at the predetermined position, and when the secondary integral is conveyed to the predetermined position, each secondary integral is positioned in the pad press. The upper surface of the four inner projecting portions 33, the mounting surface 49a of the LED supporting portion 49, the surface of the annular wall 55, and the upper surface of the annular portion 56 are continuously (integrally) (See Fig. 12 and Fig. 13). The reflective film 58 is a mixture of a polyurethane resin as a main component and titanium oxide (TiO2) as a coloring agent, and has overall insulating properties. Since the reflective film 58 contains a coloring agent, it is white and differs in color (color) from the heat sink 45 made of aluminum. The visible light reflectance of the reflective film 58 is higher than that of the primary ocular shaped portion 30, the heat sink 45, (Specifically, the visible light reflectance is 90% or more, preferably 95% or more). The reflective film 58 formed on the LED support portion 49 is formed in a shape that avoids a part of the mounting surface 49a. In other words, as shown in the drawing, a plurality of (36 in total) planes are formed on the mounting surface 49a in a shape avoiding the spherical area. The spherical region in the plan view constitutes the LED fixing portion 59 (the semiconductor light emitting element fixing portion), and between the upper surface of the reflecting film 58 and the LED fixing portion 59 (mounting surface 49a) A stepped portion of the thick portion of the tapered portion 58 is formed.

Subsequently, the secondary integral is moved to a predetermined position forward by the transfer device, and each connection arm 43 is cut by a secondary cutting device (not shown) installed at the predetermined position (the secondary cutting is performed All). Concretely, the respective connection arms 43 are cut linearly along the end surfaces of the corresponding cover projections 57, and the secondary integrals are separated from the carrier connection portions 19 (and the carrier portions 18A, 18B) (See FIG. 13). As a result, a finished product of a plurality of LED holders 15 that do not expose the carrier portions 18A, 18B and the connecting portion (broken surface, unnecessary metal portion) .

Next, a method of manufacturing the LED module 10 in the LED holder 15 will be described.

A rectangular LED 62 (semiconductor light emitting element) is fixed to each LED support portion 49 of the LED holder 15. As shown in the figure, the planar shape of each LED 62 is similar to the LED fixing portion 59 (slightly smaller than the LED fixing portion 59). When fixing the LED 62 to the LED fixing portion 59, first, an adhesive (not shown) is applied to each of the LED fixing portions 59 (attaching surface 49a), and then an LED transporting device The LED 62 is mounted on the LED fixing portion 59 as shown in Figure 15. As described above, a step difference in thickness of the reflection film 58 is formed between the upper surface of the reflection film 5/8 and the LED fixing portion 59 The LED 62 can be easily and reliably attached (combined) to each of the LED fixing portions 59 since the LED fixing portion 59 is formed as a recessed portion surrounded by the reflective film 58. [ The thickness of the reflective film 58 is varied between the upper surface of the reflective film 58 and the LED fixing portion 59 so that the LED fixing portion 59 (the adhesive applied to the mounting surface 49a) The LED transporting device is provided with a reflection film 58 and an LED fixing portion 59. The LED transporting device includes a reflection film 58 and an LED fixing portion 59. [ (The attachment surface 49a) While the identification of the color difference (border) and mounting the LED (62) with respect to the LED fixing part 59. Therefore, it is possible to securely mounting a LED (62) with respect to the fixing LED (59).

Subsequently, as shown in Fig. 15, the terminals formed on the upper surface of the adjacent LED 62 fixed to the respective LED fixing portions 59 are connected through a wire bonding 64 (solid line shown in Fig. 15) The terminal of the LED 62 located at the position facing the connection section 20A is connected to the wire connection section 20A through the wire bonding 64 and the LED 62 located at the position facing the wire connection section 21A ) And the wire connecting portion 21A are connected to each other through the wire bonding 64 (if necessary, the wire bonding 90 described below is performed).

Finally, an encapsulating material (not shown) formed of an inner hardenable resin material having transparency and insulation and an ultraviolet hardenable resin material or the like (not shown) is formed on the upper surface of the secondary annular shoulder 54 (a circular hole formed on the inner peripheral side of the upper edge of the annular wall 55) ). The LED module 10 with the wire connecting portion 20A, the wire connecting portion 21A, the inner projecting portion 33, the reflecting film 58, the LED 62 and the wire bonding 64 (90) covered by the sealing agent is completed do.

The LED module 10 having the above-described configuration can be used as a component of the lighting device 66.

The lighting device 66 has a chassis 68 (a heat radiating member) composed of a metal plate. The LED module 10 is fixed to the chassis 68 in a state in which the contact surface 48 of the heat sink 45 is in contact with the upper surface of the chassis 68. [

The lighting device 66 also includes a light distribution lens 70 (optical element) detachable from the LED module 10 and a connector portion cable 75.

The pipe lens 70 is in the form of a disk made of a light-transmissive material (for example, a resin such as glass and a crystal), and can be formed by an injection molding die using a molding die, for example. The surface 70a (reflecting side) and the back side 70b (opposing side) of the light distribution lens 70 are flat when viewed from one another.

A large number (96 in total) of recesses 71 are formed on the surface 70a. Each of the concave portions 71 is arranged in a radial pattern concentrically with respect to the center point of the light distribution lens 70. As shown in Figs. 20 and 21, the recessed portions 71 are in the shape of a cone having an axis extending in the thickness direction of the light distribution lens 70 as a center.

A large number (48 in total) of recesses 72 are abutted on the opposing surface 70b. Each of the concave portions 72 is arranged along four circumferences having different diameters from each other by twelve. Each of the concave portions 72 is arranged concentrically and radially around the center point of the light distribution lens 70. As shown in Figs. 20 and 21, each of the concave portions 72 is in the shape of a cylinder centered on an axis extending in the thickness direction of the light distribution lens 70. [ A total of four fixed angles 73 are protruded from the counter surface 70b.

20 and 21, the recesses 71 and the recesses 72 are coaxial with each other.

The light distribution lens 70 having such a configuration is mounted in a fixed state on the LED module 10 by engaging (press fitting) the four fixing angles 73 with the corresponding engaging holes 20C and the engaging holes 21C (But is removable). When the light distribution lens 70 is installed in the LED module 10, the opposing face 70B of the light distribution lens 70 forms a gap with the LED module 10, Respectively.

The connector portion cable 75 is formed by integrating the two cables 77 and the connector 80 together. The flexible cable 77 has a wire 78 bundled with a plurality of metal wires and a cover tube 79 composed of an insulating material covering the surface of the wire 78. Both ends of each cable 77 And the cover tube 79 is removed to expose the electric wire 78.

The connector 80 has an insulator 18 composed of an insulating material and a first contact 85 and a second contact 87. An engaging protrusion 82 is formed on both sides of the insulator 81 which is a hollow member and formed in the forward and backward directions and a coupling protrusion 83 is protruded from the distal end of the right and left coupling protrusions 82. The lower surface of the front end portion (rear half portion) of the insulator 81 is formed in a thin shape, and two long holes 84 communicating with the inner space of the insulator 81 are formed on the lower surface. The first contact 85 and the second contact 87 are each made of a conductive material (metal or the like) and are inserted in a fixed state in the inner space of the insulator 19. The electric wires 78 at one end (rear end) of the two cables 77 are respectively pressed (connected) to the first ends (front ends) of the first contacts 85 and the second contacts 87, The other end (rear end) of the contact 85 and the second contact 87 is connected to the first contact piece 86 elastically deformable protruded below the insulator 81 through the corresponding long hole 84, And a contact piece 88.

24, the connector portion cable 75 is detachable from the connector connecting protrusion 37 and the connector connecting port 38 (the cable connecting portion 20B and the cable connecting portion 21B) of the LED module 10. That is, the connector 80 is inserted into the connector connection port 38, and the left and right engaging projections 28 are engaged with the left and right sides of the connector connection port 38. Since the left and right engaging projections 83 are engaged with the left and right engaging recesses 39, the connector connecting protrusion 37 and the connector connection port 38 are connected to the connector 80 as long as the connector 80 is not intentionally pulled out The state is maintained.

The first contact piece 86 of the first contact 85 and the second contact piece 86 of the second contact 87 are connected to the connector connection protrusion 37 and the connector connection port 38 88 are elastically deformed and contact the cable connecting portion 20B and the cable connecting portion 21B, respectively.

The lighting device 66 (the LED module 10) of the present embodiment can be implemented in various states, but the lighting device 66 can be configured, for example, in the state shown in Figs. 24 and 25. Fig.

The wire connecting portion 20A and the wire connecting portion 21A on the front side and the wire connecting portion 20A and the wire connecting portion 21A on the rear side of the LED module 10 (LED holder 15) shown in Figs. 24 and 25 And is connected via wire bonding 90. The connector 80 of the connector portion cable 75 is connected to one of the connector projection projections 37 and the connector connection port 38 of the LED module 10 and the two cables (77) are connected to the positive and negative electrodes of the power source, respectively.

The wire connecting portion 20A, the wire connecting portion 21A, the LED 62, the wire bonding 64, and the wire bonding 90 (not shown) via the cable 77 when the switch All the LEDs located on the left side of the center portion of the LED module 10 are indicated by the LED 62A in FIG. 25, and all of the LEDs 62 located on the right side of the center portion 62 are indicated by LED 62B) emits light.

On the other hand, when the switch is switched from ON to OFF, the supply of current to the LED 62 is cut off, and each LED 62 is turned off.

The illumination light (upward) emitted by the LED 62 (the light emitting surface formed on the upper surface of the lighting device 66) of the lighting device 66 has a high linearity. Therefore, most of the illumination light of each LED 62 (The arrow in Fig. 21 indicates the traveling direction of the illumination light). Further, the remaining illumination light advances upward (slightly) obliquely with respect to the vertical direction. Most of the illumination light is directed toward the direct light distribution lens 70 and the remaining illumination light (or a part thereof) is reflected by the reflection film 58 and directed toward the light distribution lens 70 side.

A part of the illumination light (including the light reflected by the reflection film 58) toward the light distribution lens 70 is directed to the opposing face 70b. A part of the illumination light directed toward the opposing surface 70b passes through the inner surface 70a of the light distribution lens 70 while avoiding the concave portion 71 and the concave portion 72 to move upwardly of the light distribution lens 70. [

On the other hand, the illumination light entering the concave portion 72 in the opposing face 70b inclining with respect to the up-and-down direction is advanced by the interior of the light distribution lens 70 while being reflected by the surface of the concave portion 72 Passes through the surface 70a, and advances obliquely upwardly of the light distribution lens 70.

A part of the illumination light (both inclined in plan view with respect to the up and down direction) entering the inside of the light distribution lens 70 from the opposing face 70b is directed to the concave portion 71. The illumination light passes through the concave portion 71 And passes through the surface 70a so as to be inclined with respect to the vertical direction, and moves upwardly of the light distribution lens 70. [

As described above, the light distribution lens 70 can effectively diffuse the illumination light of each LED 62 while being a flat lens having a planar shape when the surface 70a and the opposing surface 70b are viewed from the plane. Therefore, luminance unevenness is unlikely to occur in the illumination light emitted from the surface 70a of the light distribution lens 70.

Therefore, the lighting device 66 is not only usable as a lighting device for illuminating an interior of a room, but is also usable for various other uses (for example, a backlight for a liquid crystal display).

Further, since the light distribution lens 70 is a flat lens, the moldability and workability are good, and the material required for manufacturing a single light distribution lens 70 can be minimized. That is, the light distribution lens 70 can be manufactured at a low cost.

Further, since the thickness of the light distribution lens 70 can be minimized, the thickness of the entire lighting device 66 can be suppressed.

The lighting device 66 also has a resin part with a low visible light reflectance inside the LED module 10 (LED holder 15) in a circular pocket (a part located on the inner peripheral side of the upper edge of the annular wall 55) (Without exposing the resin portion and the attaching surface 49a) on the upper surface of the inner protruding portion 33, the surface of the annular wall 55, and the upper surface of the annular portion 56) and the attaching surface 49a, Reflection film 58 having a higher visible light reflectance than that of the LED 30, the LED support 49 and the secondary-order oval-shaped portion 54 is formed. Therefore, the light intensity of the LED 62 provided on each of the LED fixing portions 59 (mounting surface 49a) can be reflected without a substantial loss of light intensity.

The LED holder 15 is provided with the component elements (the conductive plate 17), the primary-gear wedge-shaped portion 30, the heat sink 45, and the secondary-wedge-shaped portion 54 constituting the LED holder 15 (Insert molding) the primary shoulder 30 and the secondary resin molding portion 54, instead of assembling these components together and fixing them with screws or the like after separately molding them, .

The upper surface of each inner projecting portion 33, the mounting surface 49a of the LED support portion 49 and the upper surface of the annular portion 56 are located on the same plane (continuous) The upper surface of the inner projecting portion 33 and the upper surface of the LED supporting portion 49 are formed so as to be continuous with each other with the surface 49a and the annular wall 55 continuing between the upper surface of the annular portion 56 and the upper surface of each inner projecting portion 33. [ The reflective film 58 can be easily and cleanly formed on the mounting surface 49a, the surface of the annular wall 55, and the upper surface of the annular portion 56. [ Therefore, it is possible to reliably raise the reflection efficiency of the illumination light emitted by the LED 62 by the reflection film 58.

The heat generated from each LED 62 is radiated from the lower half portion (exposed portion) of the heat sink 45 transmitted to the heat sink 45 through the reflective film 58 composed of a thin film and at the same time the heat sink 45 48) is transferred to the chassis 68 and then radiated from the chassis 68, the heat of the LED 62 can be effectively dissipated to the outside. Therefore, it is possible to prevent degradation of the foot and efficiency of the LED 62 due to high temperature. Further, since the LED 62 can use a large LED element having a large heat radiation amount, the amount of light can be increased.

The LED module 10 has the annular wall 55 (the portion formed in the annular wall 55 of the reflective film 58) of the LED 62 (the light distribution lens 70) It is possible to control the directivity and radiation angle of the generated illumination light. Further, since the reflective film 58 and the LED fixing portion 59 can be formed in various shapes in the LED holder 15 (the arrangement of the LEDs 62 on the mounting surface 49a is flexible) It is possible to obtain a large LED module 10 in which luminance unevenness of the LED 62 is suppressed, dimming (adjustment of brightness) and coloring (adjustment of warmth / color of blue) is easy.

Although the present invention has been described based on the above embodiments, the present invention is not limited to the above embodiments, and various modifications may be made.

For example, in the form of a modification of Figs. 26 to 30.

In the modification shown in Fig. 26, the concave portion 71 formed on the surface 70a is partially or wholly replaced with the hemispherical concave portion 71a.

The modification shown in Figs. 27 to 29 is a modification of the shape of the concave portion 72.

Fig. 27 shows an example in which a recess 72a and a recess 72b are formed in a part or all of the recess 72 formed on the opposing face 70b. The recessed portion 72a is in the shape of an inclined column and has a shape in cross section when the light distribution lens 70 is cut in the thickness direction (sectional shape in FIG. 27) is a parallelogram (the shape when cut in the direction orthogonal to the thickness direction is Circle). The concave portion 72b has a shape obtained by cutting the head of the cone around the axis formed in the thickness direction of the light distribution lens 70 (the shape of the cut when the light distribution lens 70 is cut in the thickness direction, A symmetrical shape about the axis line).

Fig. 28 shows an example in which a recess 72c is formed by partially or entirely forming a recess 72 in the surface 70b. The recessed portion 72c has a shape in which the upper end portion forms a part of a sphere (the sectional shape when cut in the thickness direction is an arc shape as shown in Fig. 28), and the remaining portion (the axial line formed in the thickness direction of the light distribution lens 70 Centered).

Fig. 29 shows an example in which the recessed portion 72d formed on the opposing face 70b is partially or wholly replaced with the recessed portion 72d. The concave portion 72d has a conical shape whose upper end protrudes toward the opposite surface 70b and the remaining portion is a circumferential portion (centered on the axial line formed in the thickness direction of the light distribution lens 70).

30, the light distribution lens 70 is provided with a light distribution lens 70 in the thickness direction instead of the concave portions 71, 71a, 72, 72a, 72b, 72c, The through holes 74a, 74b, 74c, 74d, 74e and 74f are formed (the arrangement of the through holes in the light distribution lens 70 is the same as that of the recessed portions) .

The through hole 74a is a through hole having a columnar shape (centered on the axis formed in the thickness direction of the light distribution lens 70). The through-hole 74b is in the form of an inclined column, and the cross-sectional shape when the light distribution lens 70 is cut in the thickness direction (cross-sectional shape shown in Fig. 30) is a parallelogram (when cut in the direction perpendicular to the thickness direction) The shape is circular). The through hole 74c has a shape obtained by cutting a head of a cone around the axis formed in the thickness direction of the light distribution lens 70 (the cut shape when the light distribution lens 70 is cut in the thickness direction, A symmetrical shape around the axis). The through hole 74d is a through hole that is vertically symmetrical with the through hole 74c. The through hole 74e has a shape in which the sectional shape (sectional shape in FIG. 30) when the light distribution lens 70 is cut in the thickness direction (asymmetric about the axis extending in the thickness direction of the light distribution lens 70) (The shape when cut in the direction perpendicular to the thickness direction is circular). The through hole 74f is a through hole that is vertically symmetrical with the through hole 74e.

The through holes 74a, 74b, 74c, 74d, 74e, and 74f can be changed in position and size according to the distance in the front, rear, left, And the combination of the types of the through holes may be appropriately changed to be formed in the light distribution lens 70. [

Also in the case of FIGS. 26 to 30, the same operational effects as those of the above-described embodiment can be obtained.

The through holes 74c and 74d which are easy to reduce the directivity of the reflected illumination light (which easily distribute the light evenly in the direction perpendicular to the thickness direction of the light distribution lens 70) (A region on the center side of the light distribution lens 70). On the other hand, the through holes 74b, 74e, 74f, and the like, which tend to increase the directivity of the reflected illumination light (easy to reflect upward the light incident in a direction orthogonal to the thickness of the light distribution lens 70) It is preferable that the lens 70 is provided at a position distant from the LED 62 (a region on the outer peripheral side of the light distribution lens 70) so that the illumination light can be distributed in a specific direction.

72a, 72b, 72c, 72d are formed on the surface 70a side of the light distribution lens 70 and a plurality of recessed portions 71 are formed on the side of the opposing surface 70b, (Concave portion 71a may be formed).

A plurality of recessed portions 71 (recessed portions 71a, 72, 72a, 72b, 72c, 72d) may be formed only on one surface of the surface 70a and the opposing surface 70b.

All the concave portions provided on the surface 70a and all of the concave portions provided on the opposing surface 70b may be arranged concentrically (coaxially) with each other. Alternatively, all the concave portions provided on the surface 70a and the concave portions provided on the opposing surface 70b side And all of the recessed portions may be arranged so as not to be concentric (coaxial) with each other.

It is also possible to arrange the concave portions provided on the surface 70a and the concave portions provided on the opposing face 70b differently from the above-described shapes. For example, each of the concave portions may be arranged so as to form a concentric circle, but not radially. At least one of the recessed portion provided on the surface 70a and the recessed portion provided on the opposing surface 70b may be irregularly arranged randomly.

The through holes 74a, 74b, 74c, 74d, 74e, and 74f are formed in the light distribution lens 70, and the concave portions 74a, 74b, 74c, 74d, 74e, and 74f are formed on at least one of the surface 70a and the opposing surface 70b. .

The plurality of recessed portions 71, 71a, 72, 72a, 72b, 72c, 72d, and / or 74a formed in the light distribution lens 70 74b, 74c, 74d, 74e and 74f may be arranged in a lattice form.

The through holes 74a, 74b, 74c, 74d, 74e, 72e, 72b, 72c, 72d and the through holes 74a, And 74f may be a polygonal shape other than a circular shape in cross section orthogonal to the up and down direction (thickness direction of the light distribution lens 70).

Further, the planar shape of the light distribution lens 70 may be a shape other than a circular shape (for example, a polygonal shape). In this case, however, the surface 70a and the opposing surface 70b of the surface 70a of the light distribution lens 70 are planarly viewed from each other.

The light diffusing function (function of diffusing the illumination light upward) may be diffusion-coated on the surface 70a of the light distribution lens 70 rather than the surface 70a. Instead of applying a diffusion coating to the light distribution lens 70, a rough surface (rough surface as compared with other portions of the surface 70a) is formed on the surface 70a of the light distribution lens 70, and illumination light It may be diffused.

The surfaces of the concave portions 71, 71a, 72, 72a, 72b, 72c, 72d and the through holes 74a, 74b, 74c, 74d, 74e and 74f may be formed of a glossy surface and a rough surface to change (adjust) the diffusion function of the light distribution lens 70. [ For example, the concave portions 71, 71a, 72, 72a, 72b, 72c, 72d and through holes 74a, 74b, 74c, 71a, 72, 72a, 72b, 72c, 72c, and 72d can be formed by forming the light distribution lens 70 having the lenses 74a, 74e, 74d, 74e, and 74f, and the surfaces of the through holes 74a, 74b, 74c, 74d, 74e, and 74f may be formed of glossy surfaces. 72b, 72c, 72d and the through holes 74a, 74b of the light distribution lens 70 (for example, the concave portions 71, 71a, 72, 72a, 71a, 72, 72a (72a), 72a (72a), and 72a (72a) are formed by shaving after the molds 74b, 74c, 74d, 74e, and 74f to form recesses (the surfaces of which are made of rough surfaces), and the through holes 74a, 74b, 74c, The through holes 74a, 74b, 74c, and 74d, which are made of the rough surfaces, and the surfaces 71a, 71, 71a, 72, 72a, 72b, 72c, , (74e), and (74f).

Also, the light distribution lens 70 may be fixed to a member different from the LED module 10. For example, when the lighting device 66 is used as a backlight for a liquid crystal display device, the light distribution lens 70 may be fixed to the case of the liquid crystal display device.

The heat sink 45 is fixed to the integral body after the portions corresponding to the primary and secondary oedomens 30 and 54 are integrated with the first conductive member 20 and the second conductive member 21 in advance The LED holder 15 may be manufactured. In this case, a portion corresponding to the primary-order wedge-shaped portion 30 and the secondary-resin molded portion 54 is injection-molded (insert molded) and integrated with the first conductive member 20 and the second conductive member 21 Or the molded article may be assembled to the first conductive member 20 and the second conductive member 21 after the portion corresponding to the primary shoulder 30 and the secondary shoulder 54 is molded.

The heat sink 45 may be made of a material different from aluminum (however, a material having a thermal conductivity higher than that of the primary annular shaped portion 30 and the secondary secondary molded portion 54).

Further, a heat-conductive sheet and a heat-conductive adhesive may be interposed between the contact surface 48 of the heat sink 45 and the chassis 68.

Further, the molding of the reflective film 58 may be omitted in the inner projecting portion 33 and / or the annular portion 56.

The light distribution lens 70 may be fixed to the LED holder 15 by means other than the fixing angle 73. [ The light distribution lens 70 may be attached to the LED 62 on an object other than the LED holder 15 (for example, the chassis 68) by means other than the fixed angle 73 or the fixed angle 73. [ And the opposing face 70b may face each other.

10 ... LED module (semiconductor light emitting device module)
15 ... LED holder (semiconductor light emitting element holder)
17 ... conduction plates 18A, 18B ... carrier portion
18C ... transferring hole 19 ... carrier connection portion
20 ... first conductive member 20A ... wire connection
20B ... cable connection portion 20C ... engagement hole
21 ... second conductive member 21A ... wire connecting portion
21B ... cable connection portion 21C ... engagement hole
22 ... first cutting bridge 23 ... second cutting bridge
24 ... third cutting bridge
30 ... first order oilless mold (base member) (resin molding section)
31 ... body portion 32 ... annular inner wall
33 ... Inner protrusion 35 ... Bridge exposed ball
36 ... joint hole exposure hole 37 ... connector connection protrusion
38 ... connector connection hole 39 ... engagement recess
40A, 40B, 40C, 40D ... side surface protruding portions 41 ... outer peripheral walls
42 ... engagement projection 43 ... connection arm
45 ... heat sink (base member) (heat transfer member)
46 ... the water supply part 47 ... the coupling recess
48 ... tight contact surface 49 ... LED supporting portion
49a ... mounting surface 50 ... circular recess
51 ... non-circular recess
54 ... Second order oilless mold (base member) (resin molding section)
55 ... annular wall 56 ... annular portion
57 ... Cloth projection 58 ... Reflective film
59 ... LED fixing portion (semiconductor light emitting element fixing portion)
62, 62A, 62B ... LED (semiconductor light emitting element)
64 ... wire bonding 66 ... lighting fixture
68 ... chassis (radiation member) 70 ... distribution lens (light-emitting element)
70a ... surface (reflecting surface) 70b ... opposing surface (facing surface)
71, 71a ... recesses 72, 72a, 72b, 72c, 72d ... recess
73 ... fixed angles 74a, 74b, 74c, 74d, 74f ... through holes
75 ... Connector cable 77 ... Cable
78 ... Wire 79 ... Cloth tube
80 ... connector 81 ... insulator
82 ... engaging projection 83 ... engaging projection
84 ... elongated hole 85 ... first contact
86 ... first contact piece 87 ... second contact
88 ... second contact piece 90 ... wire bonding
S ... annular gap

Claims (12)

The base member
A semiconductor light emitting element fixed to the base member,
And a light emitting device having a surface opposite to the semiconductor light emitting device and a surface opposite to the semiconductor light emitting device in plan view,
Wherein at least one of a concave portion and a through hole is formed in at least one of the facing surface and the opposite surface of the light emitting element. The method according to claim 1,
And at least one of the recessed portion and the through hole is formed on the opposite surface and the opposite surface. 3. The method of claim 2,
Wherein the concave portion formed on the opposed surface and the concave portion formed on the opposed side are concentric with each other. 4. The method according to any one of claims 1 to 3,
Wherein at least one of the recess and the through hole is formed concentrically. 4. The method according to any one of claims 1 to 3,
Wherein at least one of the recessed portion and the through hole is provided radially. 4. The method according to any one of claims 1 to 3,
Wherein at least one of the recess and the through hole is provided in a lattice form. 4. The method according to any one of claims 1 to 3,
At least one of said recesses being a conical shape. 4. The method according to any one of claims 1 to 3,
Wherein at least one of the recesses is hemispherical. 9. The method according to any one of claims 1 to 8,
Wherein at least one of the concave portions forms a part of a spherical surface at a bottom surface and a portion except a bottom surface thereof forms a columnar shape. 4. The method according to any one of claims 1 to 3,
Wherein at least one of the concave portions has a conical shape with a bottom surface protruding toward the opening end side of the concave portion and a portion excluding the bottom surface has a cylindrical shape. 4. The method according to any one of claims 1 to 3,
Wherein at least one of the concave portion and the through hole is in the shape of a cylinder. 4. The method according to any one of claims 1 to 3,
Wherein at least one of the recess and the through-hole has a shape in which a head of the cone is cut.

Images