KR20150055443A - Light emitting diode device - Google Patents

Light emitting diode device Download PDF

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Publication number
KR20150055443A
KR20150055443A KR1020130137827A KR20130137827A KR20150055443A KR 20150055443 A KR20150055443 A KR 20150055443A KR 1020130137827 A KR1020130137827 A KR 1020130137827A KR 20130137827 A KR20130137827 A KR 20130137827A KR 20150055443 A KR20150055443 A KR 20150055443A
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KR
South Korea
Prior art keywords
unit
heat
power
mounted
led lamp
Prior art date
Application number
KR1020130137827A
Other languages
Korean (ko)
Inventor
이우용
Original Assignee
동아하이테크 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동아하이테크 주식회사 filed Critical 동아하이테크 주식회사
Priority to KR1020130137827A priority Critical patent/KR20150055443A/en
Publication of KR20150055443A publication Critical patent/KR20150055443A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15Thermal insulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

Abstract

The present invention relates to a light emitting diode device, and more particularly, to a light emitting diode device which includes a substrate portion of a thermally conductive material to which an LED lamp is mounted, a power generation portion that generates electricity by a temperature difference between the substrate portion and the substrate portion, Electricity can be generated from the substrate portion heated through the LED lamp, including the heat dissipation portion that emits negative heat.

Description

[0001] LIGHT EMITTING DIODE DEVICE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode device, and more particularly, to a light emitting diode device that generates electricity using heat generated from a lamp and uses the generated electricity.

Generally, a light emitting diode (LED) light can generate light of various colors ranging from red, green, blue to white, which are fundamental elements of color using the principle of light emitting diode.

Such a light emitting diode illumination can be remarkably reduced in energy than a conventional lighting apparatus, has a long life span, and is recognized as an environmentally friendly product because no harmful substances such as mercury are used at all, such as a fluorescent lamp.

The light emitting diode package is held in a recess of a socket housing mounted on a support structure of a light fixture, such as a base, a heat sink, or the like.

When the light emitting diode package is held by the socket housing, the socket housing may exert a force on the light emitting diode package.

Background Art [0002] The background art of the present invention is disclosed in Korean Laid-Open Patent Publication No. 2013-0090354 (published on Mar. 23, 201, entitled LED Socket Assembly).

Conventionally, there is a problem that due to the heat generated by the LED lamp generating light, the socket melts or deforms the material including the plastic material.

Therefore, there is a need to improve this.

It is an object of the present invention to provide a light emitting diode device that generates electricity using heat generated from an LED lamp and performs a cooling function by using generated electricity .

According to an aspect of the present invention, there is provided a light emitting diode device comprising: a substrate portion of a thermally conductive material to which an LED lamp is mounted; A power generation unit mounted on the base unit and generating electricity by a temperature deviation from the base unit; And a heat dissipation unit mounted on the substrate unit and emitting heat from the substrate unit.

The light emitting diode device according to an aspect of the present invention may further include a power cable portion connecting the power plant portion and the LED lamp to supply electricity generated from the power plant portion to the LED lamp.

According to an aspect of the present invention, there is provided a light emitting diode device comprising: a power supply part connected to one end of a power plant part to supply electricity generated from the power plant part; And a thermoelectric element mounted on the heat dissipation unit and connected to the power supply unit to receive electricity to cool the heat dissipation unit.

Wherein the thermoelectric element portion comprises: a heat absorbing element mounted on the heat radiating portion and absorbing heat of the heat radiating portion when power is applied; And a heating element which is in contact with the heat absorbing element and generates heat when power is applied.

The heat dissipation unit includes: a heat dissipation unit mounted on the substrate unit and coupled with the heat absorption element; And a support bar protruded from the heat sink and to which the heating element is coupled.

And the support bar includes an insulating material.

According to another aspect of the present invention, there is provided a light emitting diode device comprising: a substrate portion of a thermally conductive material on which an LED lamp is mounted; A power generation unit mounted on the base unit and generating electricity by a temperature deviation from the base unit; A heat dissipation unit mounted on the substrate unit and emitting heat of the substrate unit; A power cable unit connecting the power plant unit and the LED lamp to supply electricity generated in the power plant unit to the LED lamp; A power supply part connected at one end to the power plant part to supply electricity generated at the power plant part; And a thermoelectric conversion element mounted on the heat dissipation unit and connected to the power supply unit to receive electricity to cool the heat dissipation unit.

The light emitting diode device according to the present invention is effective in generating electric power through a substrate portion heated by an LED lamp.

The light emitting diode device according to the present invention has an effect of reducing the electricity consumption required for lighting the LED lamp by supplying electricity generated in the power generation unit to the LED lamp.

The light emitting diode device according to the present invention has the effect of rapidly cooling the heat dissipating unit using electricity generated in the power generating unit.

In the light emitting diode device according to the present invention, since the supporting bar coupled with the heating element protrudes from the heat sink and includes the heat insulating material, the temperature rise of the heat sink due to the heat of the heating element is suppressed.

1 is a schematic view of a light emitting diode device according to an embodiment of the present invention.
2 is a schematic view of a thermoelectric element in a light emitting diode device according to an embodiment of the present invention.
3 is a schematic view illustrating a heat dissipation unit in a light emitting diode device according to an embodiment of the present invention.
FIG. 4 is a view schematically showing a state in which a thermoelectric element is mounted in FIG. 3. FIG.

Hereinafter, embodiments of a light emitting diode device according to the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are terms defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

1 is a schematic view of a light emitting diode device according to an embodiment of the present invention.

Referring to FIG. 1, a light emitting diode device 1 according to an embodiment of the present invention includes a substrate unit 10, a power plant unit 20, and a heat dissipation unit 30.

A plurality of LED lamps 11 are mounted on the base unit 10 and are turned on when power is supplied by a power supply unit 100 such as a battery.

The substrate portion 10 is made of a thermally conductive material. For example, an aluminum substrate is used for the substrate portion 10.

The power plant unit 20 is mounted on the base unit 10 and generates electricity by a temperature deviation from the base unit 10. [

That is, the power plant unit 20 uses a device using the Hebeck effect, which is a phenomenon in which an electromotive force is generated due to a temperature difference from the substrate 10.

The heat dissipation unit 30 is mounted on the substrate unit 10, and contacts the air to discharge the heat of the substrate unit 10 to the outside.

The light emitting diode device 1 according to an embodiment of the present invention further includes a power cable portion 40.

The power cable section 40 connects the power plant unit 20 and the LED lamp 11 and supplies electricity generated by the power plant unit 20 to the LED lamp 11. [

For example, the power cable unit 40 is connected to any one of the plurality of LED lamps 11 to supply power, and the power supply unit 100 supplies power to the remaining LED lamps 11.

The light emitting diode device 1 according to an embodiment of the present invention further includes a power supply unit 50 and a thermoelectric element unit 60.

The power supply unit 50 is connected at one end to the power plant unit 20 to guide electricity generated at the power plant unit 20. [ The other end of the power supply 50 is connected to the thermoelectric element 60.

The thermoelectric element portion 60 is mounted on the heat dissipating portion 30 and receives power from the power supply portion 50 to cool the heat dissipating portion 30. [

FIG. 2 is a view schematically showing a thermoelectric element part in a light emitting diode device according to an embodiment of the present invention, FIG. 3 is a view schematically showing a heat dissipation part in a light emitting diode device according to an embodiment of the present invention, 3 is a view schematically showing a state in which a thermoelectric element is mounted.

Referring to FIGS. 1 to 4, a thermoelectric element 60 according to an embodiment of the present invention includes a heat absorbing element 61 and a heat generating element 62.

The heat absorbing element 61 is mounted on the heat dissipating unit 30 and absorbs the heat of the heat dissipating unit 30 when power is applied. The heat generating element 62 is brought into contact with the heat absorbing element 61 and generates heat as power is applied.

That is, the thermoelectric element unit 60 uses a device using a Peltier effect in which heat is absorbed or generated by current.

The heat dissipating unit 30 according to an embodiment of the present invention includes a heat dissipating plate 31 and a support bar 32.

The heat sink 31 is mounted on the base 10 and the heat sink 61 is mounted on the heat sink 31 and remains in contact. The support bar 32 protrudes outwardly from the heat sink 31 and is coupled to the heat generating element 62.

The supporting bar 32 is made of a heat insulating material so that the heat generated from the heat generating element 62 is prevented from being affected by the heat radiating plate 31.

For example, the radiating plate 31 is coupled to the rim of the rectangular substrate portion 10 to maintain the contact state. The heat sink 31 is formed with a quadrangular column, and a heat absorbing element 61 is mounted on one side of the heat sink 31 and kept in contact with the heat sink 31.

A supporting bar 32 of a heat insulating material protrudes from the other side surface of the heat radiating plate 31 and a heat generating element 62 connected to the heat absorbing element 61 is separated from the heat radiating plate 31 by being coupled to the supporting bar 32.

Meanwhile, the light emitting diode device 1 according to an embodiment of the present invention may include a power cable portion 40, a power supply portion 50, and a thermoelectric element portion 60 at the same time. When these are included, electricity produced by using the heat of the substrate unit 10 lights up the LED lamp 11 to cool the heat dissipating unit 30. [

The operation and effect of the light emitting diode device according to an embodiment of the present invention having the above-described structure will be described as follows.

A plurality of LED lamps 11 are arranged on the upper side of the base plate portion 10 and the power plant parts 20 are arranged on the lower side of the base plate portion 10. One end of the power cable section 40 is connected to the power plant unit 20 and the other end of the power cable section 40 is connected to the LED lamp 11. [

A heat radiating plate 31 is in contact with the base plate 10 and a thermoelectric conversion unit 60 is mounted on the heat radiating plate 31. The power supply unit 50 connects the power generation unit 20 and the thermoelectric conversion unit 60 .

The heat absorbing element 61 is in contact with the heat radiating plate 31 and the heat generating element 62 is coupled to the support bar 32 protruding from the heat radiating plate 31 to be spaced apart from the heat radiating plate 31.

When the LED lamp 11 is turned on by the power supply of the power supply unit 100 in the above-described state, the temperature of the substrate unit 10 rises. When the substrate portion 10 is heated, the power generation unit 20 generates electricity due to the temperature difference.

When the power plant unit 20 generates electricity, the power cable unit 40 supplies the generated electricity to the LED lamp 11.

In addition, when the power plant unit 20 generates electricity, the power supply unit 50 supplies the generated electricity to the thermoelectric element unit 60. [

When electricity is supplied to the thermoelectric element portion 60, the heat absorbing element 61 absorbs the heat of the heat sink 31 according to the current direction, and the heat generating element 62 generates heat.

At this time, the heat generating element 62 may be additionally provided with a heat dissipating blade 63 for increasing the contact with the air to quickly discharge the heat.

The light emitting diode device 1 according to an embodiment of the present invention can generate electricity through the substrate unit 10 heated by the LED lamp 11 by the power generator unit 20. [

The light emitting diode device 1 according to an embodiment of the present invention can supply electricity generated in the power plant unit 20 to the LED lamp 11 to reduce electricity consumption required for lighting the LED lamp 11. [

The light emitting diode device 1 according to an embodiment of the present invention can quickly cool the heat dissipating unit 30 using electricity generated in the power plant unit 20. [

The light emitting diode device 1 according to the embodiment of the present invention includes the support bar 32 which is coupled to the heat generating element 62 and protrudes from the heat sink 31 and includes a heat insulating material. The temperature rise of the heat sink 61 due to heat can be suppressed.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. I will understand.

Accordingly, the true scope of protection of the present invention should be defined by the following claims.

10: substrate part 11: LED lamp
20: power plant part 30:
31: heat sink 32: support bar
40: power cable part 50: power supply part
60: thermoelectric element part 61:
62: heating element 100: power source part

Claims (7)

  1. A substrate portion of a thermally conductive material on which the LED lamp is mounted;
    A power generation unit mounted on the base unit and generating electricity by a temperature deviation from the base unit; And
    And a heat dissipation unit mounted on the substrate unit to emit heat of the substrate unit.
  2. The method according to claim 1,
    Further comprising a power cable unit connecting the power plant unit and the LED lamp to supply electricity generated in the power plant unit to the LED lamp.
  3. The method according to claim 1,
    A power supply part connected at one end to the power plant part to supply electricity generated at the power plant part; And
    Further comprising a thermoelectric element mounted on the heat dissipation unit and connected to the power supply unit to receive electricity to cool the heat dissipation unit.
  4. 4. The apparatus of claim 3, wherein the thermoelectric element portion
    A heat absorbing element mounted on the heat dissipating unit and absorbing heat of the heat dissipating unit when power is applied; And
    And a heating element which is in contact with the heat absorbing element and generates heat when power is applied.
  5. 5. The plasma display panel of claim 4,
    A heat sink mounted on the substrate portion and coupled with the heat absorbing element; And
    And a support bar protruded from the heat sink and to which the heating element is coupled.
  6. 6. The method of claim 5,
    Wherein the supporting bar comprises a heat insulating material.
  7. A substrate portion of a thermally conductive material on which the LED lamp is mounted;
    A power generation unit mounted on the base unit and generating electricity by a temperature deviation from the base unit;
    A heat dissipation unit mounted on the substrate unit and emitting heat of the substrate unit;
    A power cable unit connecting the power plant unit and the LED lamp to supply electricity generated in the power plant unit to the LED lamp;
    A power supply part connected at one end to the power plant part to supply electricity generated at the power plant part; And
    And a thermoelectric conversion element mounted on the heat dissipation unit and connected to the power supply unit to receive electricity to cool the heat dissipation unit.
KR1020130137827A 2013-11-13 2013-11-13 Light emitting diode device KR20150055443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130137827A KR20150055443A (en) 2013-11-13 2013-11-13 Light emitting diode device

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Application Number Priority Date Filing Date Title
KR1020130137827A KR20150055443A (en) 2013-11-13 2013-11-13 Light emitting diode device

Publications (1)

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KR20150055443A true KR20150055443A (en) 2015-05-21

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KR1020130137827A KR20150055443A (en) 2013-11-13 2013-11-13 Light emitting diode device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9829188B2 (en) 2016-03-16 2017-11-28 Samsung Electronics Co., Ltd. Light-emitting diode driving apparatus and lighting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9829188B2 (en) 2016-03-16 2017-11-28 Samsung Electronics Co., Ltd. Light-emitting diode driving apparatus and lighting device

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