KR20140140276A - An LED lamp module - Google Patents

An LED lamp module Download PDF

Info

Publication number
KR20140140276A
KR20140140276A KR20130060889A KR20130060889A KR20140140276A KR 20140140276 A KR20140140276 A KR 20140140276A KR 20130060889 A KR20130060889 A KR 20130060889A KR 20130060889 A KR20130060889 A KR 20130060889A KR 20140140276 A KR20140140276 A KR 20140140276A
Authority
KR
South Korea
Prior art keywords
inclined surface
led
led lamp
lamp module
heat
Prior art date
Application number
KR20130060889A
Other languages
Korean (ko)
Inventor
김태민
오재석
신한석
Original Assignee
김태민
오재석
씨에스텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김태민, 오재석, 씨에스텍 주식회사 filed Critical 김태민
Priority to KR20130060889A priority Critical patent/KR20140140276A/en
Publication of KR20140140276A publication Critical patent/KR20140140276A/en

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources

Abstract

A first inclined surface on which a PCB substrate having LEDs is mounted on one side of the upper surface, and a second inclined surface on which a reflector for reflecting light irradiated from the LED to the outside corresponding to the first inclined surface is mounted, And a molding part for covering both side surfaces of the upper part of the heat dissipation part by completely finishing the heat dissipation part fixed to the base substrate of the illumination light body.

Description

An LED lamp module

The present invention relates to an LED lamp module, and more particularly, to an LED lamp module, in which a PCB substrate having LEDs mounted on an illumination lamp, a heat-radiating sheet mounted on a lower end thereof, reflectors disposed at regular intervals, And more particularly, to an LED lamp module having an LED lamp module.

Hitherto, mercury lamps, sodium halides, and metal halides have been mainly used. Since such a conventional lighting lamp operates by a method of emitting a cold light by a high-pressure discharge, there is no generation of heat, so there is no need to worry about heat radiation, and an energy density is high.

1, a conventional halogen lamp, a mercury lamp, a metal halide lamp device 10 and the like are used as a light source. Such a conventional lamp 1 has a built- And the light irradiated from the lamp element 10 through the cap 20 is reflected to the outside.

However, since the conventional illumination lamp 1 does not have a high energy efficiency due to the low efficiency of lighting compared to the power consumption due to the characteristics of the halogen lamp, the mercury lamp and the metal halide lamp 10, the lifetime is relatively short, It is disadvantageous because it uses inconvenience and harmful substances such as mercury, so it is not environmentally friendly because it releases pollutants when manufacturing, handling and disposal.

Regarding these shortcomings of conventional lighting, LED (Light Emitting Diode) lamps have advantages of low power consumption, long life, and environment-friendliness due to high photoelectric efficiency. Therefore, in recent years, it has been actively considered to adopt LED lamps for illumination. However, LED lamps are expensive and have a drawback in that they require heat dissipation due to a lot of heat. In addition, the LED lamp has a low energy density, so it is difficult to obtain a lighting effect that can illuminate a distant place.

Conventional LED lamps for illumination lamps connect several LEDs to each other to form an LED module, and a plurality of LED modules are connected in series or in parallel to constitute an LED lamp set to satisfy the requirements for a large projection area, high brightness, and outdoor illumination I'm getting a lighting effect.

For example, Korean Patent No. 10-0862540 discloses an LED lamp for a lighting lamp, which uses an LED as a light source to significantly reduce power consumption while improving the clarity and brightness of light using a condenser lens, So that the existing lighting facilities can be used as they are.

Generally, a conventional halogen lamp is a type of light spreading in all directions, so it does not affect its function by turning the socket. However, since the LED lamp has unidirectionality, the LED module should be aligned with the ground horizontally .

However, since the conventional LED lamp for a lighting lamp configured as described above is designed to rotate the socket by the same method as a conventional halogen lamp, the LED lamp is not perpendicular to the ground during installation, There is a problem.

According to the installation standards of the current lighting, when the light is installed at a height of 10M from the ground, the side illuminance generated at a point 10m away from the ground on the ground on which the light is installed should be emitted to 20Lux.

However, in the case of a lighting lamp composed of LEDs, since the side lighting and visibility are deteriorated due to the characteristic of having a straight-line in emitting light from the LED, when the LED lighting lamp is formed as a conventional filament type lighting lamp, There is a problem in that it can not satisfy the above-mentioned illumination light installation standard, that is, the side roughness 20Lux.

In addition, in order to satisfy the lighting fixture standard, a large number of LED elements must be integrated on the PCB of the LED module, which results in a significant amount of heat generated thereby shortening the lifetime of the LED module.

Such conventional LED lamps are used in combination with a plurality of LED lamps to illuminate within a predetermined angle only in a certain direction. Therefore, there may be a problem of overheating due to an adjacent LED lamp. A road from a narrow lane to a wide lane There is a problem that all of the illumination of the light source can not be applied.

In addition, conventional LED lighting lamps have a problem that the brightness of the LED lamps is reduced due to various kinds of insects that catch light in summer.

On the other hand, there is disclosed a technique for adjusting a light source irradiation direction of an illumination lamp. For example, there is an illumination lamp capable of adjusting an irradiation direction according to Japanese Laid-Open Patent Application No. 10-2006-0091034. And is controlled in the form of a ball joint.

However, since the illumination lamps capable of adjusting the irradiation direction according to the conventional technique as described above use a ball joint or a hinge device, a large number of parts are required, and thus the number of assembling holes is increased and the cost of parts of the ball joint and the hinge device is high. There was an increasing problem.

In addition, when the angle is adjusted by a ball joint or a braille device, a separate member supporting the headlight of the auxiliary lamp is required because it is weak in its own ability to support the headlight.

Meanwhile, a technology for inserting and inserting a heat-radiating pad around an LED, which is a light source, from an external high-voltage surge (EMS) is disclosed. For example, a lamp capable of protecting an LED by inserting a LED according to a registered patent No. 10-1062052 This technique is characterized in that a plurality of LEDs are mounted on one plate and the heat radiation pads are fixed to the periphery by fastening means including fixing screws.

As in the conventional literature, since the LEDs can be protected by insulated LEDs, a large number of parts are required because a fixing screw or a heat-radiating pad is used. Therefore, the number of assembling holes is increased and a plurality of LEDs are mounted in one configuration, There is a problem in that it is difficult to maintain and repair due to difficulty in individual repair, that is, partial replacement because a plurality of LEDs are constituted in a single structure when the insulation is difficult and a single LED product is damaged.

Korean Patent No. 10-0862540 Korean Patent Publication No. 10-2006-0091034 Korean Patent No. 10-1062052

In order to solve the above problems, an object of the present invention is to provide a light emitting diode (LED) module in which a molding part is bonded to an upper surface of a heat sink, And to provide an excellent LED lamp module.

Another object of the present invention is to provide an LED lamp module which forms the heat radiating plate around the LED lamp module and finishes the upper surface of the heat radiating plate by the molding part to reduce the reflectance by another medium to improve the light distribution characteristic and the light efficiency.

Another object of the present invention is to provide an LED lamp module that can easily be individually replaced by providing a simple detachable attachment function, thereby enhancing convenience in maintenance.

In order to achieve the above object, the LED lamp module 100 according to the present invention includes a first inclined surface 201 on which a PCB substrate 204 having an LED 203 is mounted, And a second inclined surface 202 on which a reflector 208 for reflecting and illuminating light emitted from the LED 203 in correspondence with the first inclined surface 201 is mounted. A heat dissipating unit 200 fixed to the heat dissipating unit 501, and a molding unit 300 covering the upper surface of the heat dissipating unit 200 with a complete finish.

The first inclined surface 201 and the second inclined surface are formed in a "V" shape, and the first inclined surface 201 is formed on the metal PCB & A mounting groove 206 for inserting and fixing the light guide plate 204 is formed in the second inclined surface 202. A bent surface 209 for dispersing light is formed by changing the angle of inclination of the mounted reflection plate 208 .

The second inclined surface 202 of the LED lamp module 100 according to the present invention is formed such that the LED 203 mounted on the first inclined surface 201 is linearly aligned with the upper end of the molding portion 300 The curved surface is formed as a circular arc having a center point at a half point.

The molding part 300 is made of a transparent poly-carbonate material and further includes a bonding layer 400 between the molding part 300 and the heat dissipating part 200 so that the molding part 300 ) To the first inclined surface (201) and the second inclined surface (202) of the heat dissipating unit (200).

The heat dissipating portion 200 of the LED lamp module 100 according to the present invention includes a base plate 501 having a corner portion 207 protruding from both ends of an L- And is fixed.

The base substrate 501 is formed with a plurality of grooves having a size coinciding with the fitting corner 207 of the "L" type base substrate 501 of the heat dissipating unit 200 on the outer side, Is detachably attached to the main body.

As described above, according to the present invention, the LED module is manufactured and aligned in such a manner that the molding part is bonded to form the lamp for the illumination, so that it is self-waterproof and lightweight compared to conventional lamps because the cover and the heat sink are not required separately.

In addition, convenience of maintenance is improved because it is easy to replace and detach individually when the function of single LED is exhausted.

In addition, a heat-radiating sheet and a heat sink are provided around the PCB board on which the LED is mounted, thereby preventing the LED from being overheated, thus excelling in heat radiation.

1 is a perspective view showing a metal halide lamp type light fixture lamp according to a related art.
2 is a detailed view showing an LED lamp module according to a preferred embodiment of the present invention.
3 is a schematic view showing an LED lamp module according to the present invention.
4 is a schematic view showing a bonding structure for bonding the molding portion of the LED lamp module according to the present invention to the heat dissipating portion.
FIG. 5 is an exploded perspective view showing a structure in which the LED lamp module according to the present invention is fixed to a lamp body. FIG.
FIG. 6 is an exploded perspective view showing a structure for fixing the LED lamp module according to the present invention to a lamp body. FIG.
FIG. 7 is a sectional view showing a state in which the LED lamp module according to the present invention is mounted on a lighting lamp body. FIG.
FIG. 8 is a cross-sectional view illustrating a state in which the LED lamp module according to the present invention is mounted on an illuminating lamp body. FIG.
9 is a plan view showing a first inclined surface of the heat dissipation part of the LED lamp module according to the present invention.
10 is an explanatory view showing a state in which light is diffused to the outside using an LED mounted on a first inclined surface and a reflector in an LED lamp module according to the present invention.
11 is a schematic diagram of an LED lamp module according to a preferred embodiment of the present invention.

The present invention will now be described in detail with reference to the accompanying drawings.

2 is a detailed view of an LED lamp module according to a preferred embodiment of the present invention.

The LED lamp module 100 includes a first inclined surface on which a PCB substrate 204 having an LED is mounted on one side of an upper portion thereof and a second inclined surface on which light emitted from the LED is incident on the other side surface of the upper inclined surface 201, A heat dissipation unit 200 fixed to the base substrate 501 of the illumination lamp body 500 and a heat dissipation unit 200 having a second inclined surface 202 on which a reflection plate 208 for reflecting the light is externally mounted, And a molding part 300 covering both side surfaces of the upper part with a complete finish.

2, the heat dissipation unit 200 includes a first inclined surface 201 and a second inclined surface 202. A PCB substrate 204 having LEDs is formed on one side of the heat dissipation unit 200, And a second inclined surface 202 is formed on the other surface of the heat dissipation unit 200 to mount the reflector 208 corresponding to the first inclined surface 201, So that the light irradiated from the LED is reflected to the outside and illuminated.

The reflection plate 208 may be a reflective film, a tape, or any material that adds light-reflecting materials by vapor deposition.

The first and second inclined surfaces 201 and 202 are formed in a "V" shape. The first and second inclined surfaces 201 and 202 are formed of a heat-dissipating material having a low thermal conductivity.

A low-weight heat-radiating material has excellent heat dissipation effect and can be a light-weight material such as aluminum or titanium.

In addition, the LED lamp module 100 according to the present invention includes a heat dissipating plate 210 disposed outside the heat dissipating unit 200 and discharging the heat of the LED, which is a light source, to the outside.

The heat dissipation plate 210 of the LED lamp module 100 according to the present invention is formed by extrusion molding on the outside of the heat dissipation unit 200 and is characterized by heat radiation by convection.

3 is a schematic view showing an LED lamp module according to the present invention.

As shown in Fig. 3, the heat sink 210 described above is shown as a square face below.

The upper surface of the heat dissipating unit 200 is composed of a first inclined surface 201 and a second inclined surface 202 arranged in a pair of "V" The second inclined surface 202 forms a curved surface 209 in the middle so that the inclined angle of the reflection plate 208 So that the light is diffused further outwardly.

Meanwhile, the LED lamp module 100 according to the present invention includes a molding part 300 extruded with a transparent PC (Poly-Carbonate) material, and a bonding part 300 is formed between the molding part 300 and the heat- Layer 400 to bond the molding part 300 to the first inclined surface 201 and the second inclined surface 202 of the heat dissipation part 200. [

The bonding layer 400 means a layer which is bonded using a material such as silicon.

The molding part 300 is extrusion-molded according to the surface area of the upper surface of the heat dissipating part 200 to perform a function of performing a complete finishing process on the upper surface of the heat dissipating part 200.

Further, the upper surface of the molding part 300 for emitting light to the outside is flat.

Accordingly, the LED lamp module 100 according to the present invention is protected by the molding part 300 to protect the LED lamp module 100 from the outside, and thus the brightness of the illumination lamp is reduced due to various kinds of insects And has a self-waterproof and heat-dissipating function, so that the light emitted from the LED 203 is transmitted to the outside well.

The LED 203 is mounted on the top of the PCB 204 and a lot of heat is generated during the light emitting operation. The heat is generated by the heat radiation sheet 205 mounted on the lower end of the PCB 204, The heat dissipating plate 210 disposed outside the heat dissipation plate 210 is effectively radiated to the outside.

That is, the insulating and heat-radiating sheet 205, which insulates the LED 203, which is a light source, from the external high-voltage surge (EMS) is stuck to the lower end of the PCB board 204 on which the LED 203 for generating heat is mounted, great.

The heat generated by the LED 203 is radiated to the outside through the heat dissipation sheet 205 and the heat dissipation plate 210 so that the heat generated by the LED 203 is superheated .

Meanwhile, the PCB substrate 204 of the LED lamp module 100 according to the present invention is fitted and fixed in a mounting groove formed in the first inclined surface 201 of the heat dissipating unit 200, and the second inclined surface 202 A reflection plate 208 is mounted.

The second inclined surface 202 of the LED lamp module 100 according to the present invention is formed such that when the LED mounted on the first inclined surface 201 is drawn in line with the upper end of the molding part 300 And a curved surface is formed as a circular arc having a center point at a half point.

The second inclined surface 202 of the LED lamp module 100 according to the present invention is preferably applied to the embodiment but it is not limited thereto and the reflector 208 of the second inclined surface 202 may be mounted on the first inclined surface 201 LED 203 may be any structure as long as it can control the angle of light irradiation.

The heat dissipation unit 200 has a heat dissipation plate 210 formed on the opposite side of the first inclined surface 201 and the second inclined surface 202 and is provided at both ends of the heat dissipation unit 200 with an L- 501) fitting corners 207 and is integrally fixed to the base substrate 501 by a fitting method as will be described later.

4 is a schematic view showing a bonding structure for bonding a molding part of an LED lamp module according to the present invention to a heat dissipation part.

The LED lamp module 100 according to the present invention further includes a bonding layer 400 between the molding part 300 and the heat dissipating part 200 so that the molding part 300 can be separated from the heat dissipating part 200. [ To the first inclined surface (201) and the second inclined surface (202) of the body (200).

4, after the silicon is poured between the molding part 300 and the heat radiating part 200, the molding part 300 is inserted into the first inclined surface 201 and the second inclined surface 201 of the heat dissipating part 200, (202). ≪ / RTI >

Therefore, since the LED lamp module 100 according to the present invention joins the molding part 300 and the heat radiating part 200 in a compression manner, an air layer is not formed on the bonding layer 400, , There is no need for fixing screws and flanges used to fix the cover.

In addition, an operation of removing silicon used as a bonding agent that has escaped to a pressure after the bonding operation of the molding part 300 and the heat dissipating part 200 may be added.

FIG. 5 is an exploded assembly view illustrating a structure in which the LED lamp module according to the present invention is fixed to a lamp body. FIG. 6 is an exploded perspective view illustrating a structure of the LED lamp module according to the present invention, to be.

Since the lamp body 500 of the LED lamp module 100 according to the present invention is made of a plastic material, the overall weight of the lamp can be drastically reduced.

In addition, the illumination lamp body 500 may be omitted, if necessary, such as weight and light weight.

A plurality of grooves are formed on the outer side of the base plate 501 of the illuminating body 500 so as to correspond to the base plate fitting corners 207 formed at both ends of the heat dissipating unit 200.

The heat dissipation unit 200 may be disposed symmetrically with respect to the center of the base substrate 501.

The LED mounted on the first inclined surface 201 formed on the other side of the heat dissipation unit 200 is arranged in the center of the base substrate 501.

Through such a structure, light emitted from the LEDs of the first inclined plane 201 to the reflection plate 208 of the second inclined plane 202 is reflected to the outside. In this process, the light of the LED is further diffused, So that the light distribution characteristic can be maximized.

FIG. 7 is a cross-sectional view illustrating a state in which the LED lamp module according to the present invention is mounted on a lamp body, and FIG. 8 is a cross-sectional view illustrating a state in which the LED lamp module according to the present invention is mounted on a lamp body.

The LED lamp module 100 according to the present invention configured as described above can be easily mounted on the illumination lamp body 500 having a plurality of grooves formed on the base substrate 501 and is configured as a bar type. It is not.

In this case, a plurality of grooves are formed on the outer side of the base plate 501 of the illuminating lamp body 500 so that the LED lamp module 100 can be detachably attached to the LED lamp module 100 by a fitting method.

Therefore, LED lamp module mounting grooves 502 are formed in the base substrate 501, and the fixing screws or the flange portions are formed by the fitting method using the base substrate fitting corners 207 at both ends of the heat dissipating portion 200 And is fastened by a simple coupling method in which the same fastening device is not required.

9 is a plan view showing a first inclined surface of the heat dissipation part of the LED lamp module according to the present invention.

As shown in FIG. 9, the PCB substrate 204 of the heat dissipating unit is connected to the metal substrate PCB 204 through detachable coupling through a connector 212 of a power unit located in an inner space of the lighting body.

The metal substrate PCB 204 is electrically connected to the first inclined surface 201 to receive power from the outside.

 For example, as shown in FIG. 5, the electric wire 211 is connected to a terminal portion 213 of a power source portion disposed in a space built in the illuminated lamp body 500 through a detachable coupling through a connector 212, . Through the detachable connection structure, the LED 203 can be easily turned on by connecting the power source from the outside easily.

10 is an explanatory view showing a state in which light is diffused to the outside using an LED mounted on a first inclined surface and a reflector in an LED lamp module according to the present invention.

The LED mounted on the metal PCB 204 emits light to the outside and the light is reflected to the outside by the reflection plate 208 as shown in FIG.

In the LED lamp module 100 according to the present invention, the molding part 300 has a flat upper surface through which light is emitted to the outside, and is characterized by a uniform light distribution on the road surface.

As shown in FIG. 10, since the molding part 300 has a structure in which the heat dissipation part 200 is completely covered with the transparent material to cover the heat dissipation part 200, the reflectance due to other media To increase the light efficiency.

For example, when a cover is used, when the light is irradiated from the LED, the first reflection between the LED and the inside of the cover, the second reflection between the inside and outside of the cover, and the third reflection between the outside and outside of the cover Resulting in a lower light distribution ratio of the LED.

 Meanwhile, the light emitted from the LED is reflected to the outside through the reflection plate 208 mounted on the second inclined surface 202 through the same structure as the LED lamp module 100 according to the present invention. In this process, The second inclined surface 202 is formed with a bent surface 209 in the middle so that the angle of inclination of the reflector 208 is changed to adjust the angle of light irradiation, .

11 is a schematic diagram of an LED lamp module according to a preferred embodiment of the present invention.

As shown in FIG. 11, the LED lamp module 100 according to the present invention has a structure in which the LED lamp module 100 is detachably attached to the base substrate 501 through the fitting method on the base plate 501 of the illumination lamp body 500, So that it is highly desirable in terms of maintenance and repair.

The PCB substrate 204 including the LED 203 and the LED lamp module 100 manufactured by mounting the reflector 208 are aligned on the base substrate 501 so that light emitted from the LED lamp module 100 It reflects to the outside and illuminates the roadway and the sidewalk.

In addition, in the above-described process, the LED lamp module 100 has a structure in which the arrangement structure can be individually adjusted, so that the light emitted from the LEDs to the reflection plate 208 is reflected to the outside, .

Further, since the LED lamp module 100 according to the present invention enhances the heat radiation effect of heat generated from the LEDs, it can effectively prevent the overheating of the LEDs, thereby improving the durability and maintenance of the lamps of the lamps, It is possible to easily replace the LED which is unnecessary and deteriorated in function, so that the convenience of maintenance is greatly increased.

An embodiment of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications are within the scope of the present invention as long as they are obvious to those skilled in the art.

1: Conventional light lamp
10: Lamp element
20: Reflective cup
100: LED lamp module
200:
201: first inclined surface
202: second inclined surface
203: LED
204: PCB substrate
205: heat-radiating sheet
206: PCB mounting groove
207: Base board insertion corner
208: Reflector
209: Bending face
210: heat sink
211: Wires
212: Connector
213: terminal portion
300: Molding part
400: bonding layer
500: light body
501: Base substrate
502: Base board insertion corner mounting groove

Claims (6)

A first inclined surface on which a PCB substrate having LEDs is mounted on one side of the upper surface, and a second inclined surface on which a reflector for reflecting light irradiated from the LED to the outside corresponding to the first inclined surface is mounted, A heat dissipating unit fixed to the base substrate of the illuminating lamp body; And
And a molding part covering both side surfaces of the upper part of the heat dissipation part by a complete finishing process.
The method according to claim 1,
The first inclined surface and the second inclined surface are formed in a "V" shape, and the first inclined surface is formed with a mounting groove for inserting and fixing the metal PCB substrate, Wherein the second inclined surface is formed with a bent surface for diffusing light with a different inclination angle of the mounted reflector.
The method according to claim 1,
Wherein the curved surface of the second inclined surface is formed with a circular arc having a center point at a half point when the LED mounted on the first inclined surface is line-aligned with the upper end of the molding portion.
The method according to claim 1,
Wherein the molding part is made of a transparent poly-carbonate (PC) material, and further includes a bonding layer between the molding part and the heat dissipating part to bond the molding part to the first inclined surface and the second inclined surface of the heat- LED lamp module.
The method according to claim 1,
Wherein the heat dissipation part is formed on both sides of the base plate of the illuminating body so that an edge of the "L"
The method according to claim 1,
Wherein the base substrate has a plurality of grooves formed on an outer side thereof and having a size corresponding to an edge of the "L" -shaped base substrate of the heat dissipation unit, and a plurality of the LED lamps are individually detachably fixed
LED lamp module.


KR20130060889A 2013-05-29 2013-05-29 An LED lamp module KR20140140276A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20130060889A KR20140140276A (en) 2013-05-29 2013-05-29 An LED lamp module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130060889A KR20140140276A (en) 2013-05-29 2013-05-29 An LED lamp module

Publications (1)

Publication Number Publication Date
KR20140140276A true KR20140140276A (en) 2014-12-09

Family

ID=52458181

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20130060889A KR20140140276A (en) 2013-05-29 2013-05-29 An LED lamp module

Country Status (1)

Country Link
KR (1) KR20140140276A (en)

Similar Documents

Publication Publication Date Title
KR101062052B1 (en) Lamps for street lighting
US9353927B2 (en) Lighting apparatus
US8480264B2 (en) Lighting apparatus with heat dissipation system
US8287152B2 (en) Lighting apparatus using light emitting diode
JP5625203B2 (en) LED lighting device having block assembly structure
US8888330B2 (en) Omnidirectional LED lighting apparatus
JP3163443U (en) LED lighting device
US8511862B2 (en) Optical unit and lighting apparatus
KR100951781B1 (en) Led floodlight
KR20100007093A (en) Light emitting diode module which can adjust light emitting angle
JP6102864B2 (en) lamp
US9228722B2 (en) Outdoor LED lighting device structure with easy installation features
KR101020326B1 (en) LED fluorescent lamp
KR20140140276A (en) An LED lamp module
KR101582993B1 (en) high-efficiency led lamp with heat pipe and heat-radiation liquid of heat and lamp appliances
KR101049834B1 (en) Led lighting apparatus capable of preventing eye dazzling and easy light distribution and led street light
JP6620892B2 (en) Semiconductor lamp
AU2013205909B2 (en) Lighting Apparatus With Heat Dissipation System
KR20160060877A (en) Flood light and method thereof
KR101083431B1 (en) Lighting apparatus for street lamp
US20140307451A1 (en) Outdoor led lighting device structure with good characteristics of thermal dissipation and waterproof
KR101113715B1 (en) ??? Lamp
KR101278264B1 (en) LED Street Light
CN113566160A (en) Lamp shell and lamp thereof
KR20100040997A (en) Led guard light

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E601 Decision to refuse application