KR20140051875A - Vapor deposition mask and manufacturing method of vapor deposition mask - Google Patents

Abstract

Provided is a vapor deposition mask to form a layer of a vapor deposition material with high efficiency. The vapor deposition mask comprises a first surface, a second surface opposite to the first surface, and a metal sheet having a through hole which extends a gap between the first surface and the second surface. A line-shaped groove is formed to be extended on the first surface of the metal sheet. A hole is formed on the second surface of the metal sheet. The groove is connected to the hole, thereby forming a through hole penetrating the metal sheet.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vapor deposition mask,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a deposition mask used for deposition in a desired pattern, and more particularly to a deposition mask capable of depositing an evaporation material at a high utilization efficiency.

The present invention also relates to a method of manufacturing a deposition mask used for deposition in a desired pattern, and more particularly, to a method of manufacturing a deposition mask capable of depositing an evaporation material at a high utilization efficiency.

Conventionally, a method of forming a thin film in a desired pattern using an evaporation mask including through holes arranged in a desired pattern is known. In some cases, evaporation may be used when a very expensive material is deposited, for example, when an organic material is deposited on a substrate in the production of an organic EL display device. Further, the deposition mask can be generally manufactured by forming a through hole in a metal plate by etching using a photolithography technique (for example, JP2004-39319A).

However, when the deposition material is deposited on the substrate using the deposition mask, the deposition material adheres to the deposition mask. That is, not all of the used evaporation material is adhered to the substrate. Further, if the hole area ratio of the deposition mask is lowered, the utilization efficiency of the evaporation material is lowered. For example, when an organic luminescent material is deposited on a substrate to produce a color display, the hole rate of the deposition mask for depositing the organic luminescent material capable of emitting one color is usually less than 34% The utilization efficiency of the material becomes a very low value. When an expensive deposition material is used, a low utilization efficiency becomes a big problem. Here, the utilization efficiency refers to the ratio of the deposition material used to the substrate.

In some cases, the evaporation material may be shifted obliquely to the sheet surface of the metal sheet constituting the deposition mask to face the substrate. In order to effectively utilize the evaporation material moving obliquely to improve the utilization efficiency of the evaporation material, it is preferable to form the through hole which is greatly inclined in the wall surface and tapered to the metal sheet. However, in order to form the through hole in the metal sheet by etching, it may be difficult to make the wall surface of the through hole greatly inclined. Specifically, when the spacing distance between adjacent holes is short, the wall surface facing the adjacent hole tends to rise. When a through hole having a rectangular shape in plan view is formed by etching, the wall surface on the longer side of the through hole can be inclined significantly, while the wall surface on the shorter side of the through hole tends to rise.

The present invention has been made in view of this point, and an object of the present invention is to provide a deposition mask capable of depositing an evaporation material at a high utilization efficiency. Another object of the present invention is to provide a method of manufacturing a deposition mask capable of depositing an evaporation material at a high utilization efficiency.

However, if the wall surface of the through hole rises, the use efficiency of the evaporation material deteriorates and another problem arises. The metal sheet constituting the deposition mask has a certain thickness due to limitations in production or use. Therefore, when the wall surface of the through hole rises, part of the evaporation material moves obliquely as described above, so that it is difficult to stably form a film with a predetermined thickness in the edge region of the evaporation deposition region (region to be deposited) . It is considered effective to make the through hole larger than the desired pattern in order to avoid this problem. However, when this method is employed, the through holes of the deposition mask are connected when adjacent evaporated regions are close to each other. Therefore, this method can not be employed, for example, when an organic light emitting material is formed as each pixel of a display device, and adjacent deposition regions (pixels) must be deposited by a separate deposition process. That is, about one half of the film formation region is deposited at one interval in one deposition process, and the remaining film formation region is deposited in the second deposition process, thereby depositing the same material twice. For this reason, when three kinds of organic light emitting materials are deposited to manufacture a color display device, a total of six deposition processes must be provided twice per organic light emitting material. It is more preferable to solve this problem by the present invention and reduce the number of deposition processes.

The deposition mask according to the present invention comprises a metal sheet having a first surface and a second surface opposite to the first surface and having a through hole extending between the first surface and the second surface, Wherein a groove is formed on the first face side of the sheet and a hole is formed in the second face side of the metal sheet to allow the groove and the hole to pass therethrough, And a through hole is formed through the through hole.

In the deposition mask according to the present invention, the grooves may be formed by etching the metal sheet from the side of the first surface.

In the vapor deposition mask according to the present invention, the cross-sectional area of the groove in the cross section along the sheet surface of the metal sheet from the first surface side toward the second surface side may be gradually decreased.

Further, in the deposition mask according to the present invention, the hole may be formed by etching the metal sheet from the side of the second surface.

In the deposition mask according to the present invention, the cross-sectional area of the hole in the cross section along the sheet surface of the metal sheet from the second surface side toward the first surface side may be gradually decreased.

In the vapor deposition mask according to the present invention, the region surrounded by the connecting portion between the wall surface of the groove and the wall surface of the hole has a rectangular shape when observed from the normal direction of the sheet surface of the metal sheet, And the longitudinal direction of the region surrounded by the connecting portion may extend along the longitudinal direction of the linear groove.

In the deposition mask according to the present invention, a plurality of grooves extending in a straight line may be formed parallel to each other.

In the deposition mask according to the present invention, a plurality of holes may be formed at intervals along the longitudinal direction of the groove.

Further, in the deposition mask according to the present invention, a plurality of grooves extending in parallel to each other are formed at regular intervals, a plurality of holes are formed at regular intervals along the longitudinal direction of the grooves, The length between the adjacent two through holes along the longitudinal direction of each groove may be shorter than the length between the two through holes formed in the adjacent grooves.

In the deposition mask according to the present invention, when a plurality of holes are formed at intervals along the longitudinal direction of the grooves, a plurality of holes are formed on the first surface of the groove along a direction orthogonal to the longitudinal direction of the grooves May be narrower in a portion between adjacent two holes in the longitudinal direction than a portion in which the hole is formed in the longitudinal direction.

Further, in the deposition mask according to the present invention, the groove is formed by a plurality of holes formed in the first surface side, and two holes of the plurality of holes, which are adjacent to each other along the longitudinal direction of the groove, And may be connected to the first surface.

Further, in the deposition mask according to the present invention, when a plurality of holes are formed at intervals along the longitudinal direction of the groove, the groove is formed by a plurality of holes formed in the first face side, Wherein two holes of the plurality of holes adjacent to each other along the longitudinal direction of the groove are connected to the first surface and a hole formed on the second surface side is formed on the first surface side, Or may be disposed at a position facing each other.

A method of manufacturing a deposition mask according to the present invention comprises etching a metal sheet having a first surface and a second surface opposite to the first surface to form a groove extending linearly on the first surface side of the metal sheet And a step of etching the metal sheet to form a hole on the second surface side of the metal sheet, wherein a through hole is formed in the metal sheet through the groove and the hole and through the metal sheet by the hole And the groove and the hole are formed.

In the method of manufacturing a deposition mask according to the present invention, a plurality of grooves extending parallel to each other are formed at regular intervals, a plurality of holes are formed at regular intervals along the longitudinal direction of the grooves, The length between the adjacent two through holes along the longitudinal direction of each groove may be shorter than the length between the two through holes formed in the adjacent grooves when the sheet is observed from the normal direction of the sheet surface of the sheet.

Further, in the method of manufacturing a deposition mask according to the present invention, in the case where an area surrounded by the connecting portion of the wall surface of the groove and the wall surface of the hole is observed from the normal direction of the sheet surface of the metal sheet, And the longitudinal direction of the region surrounded by the connecting portion may extend along the longitudinal direction of the linear groove.

Further, the method of manufacturing a deposition mask according to the present invention may further include the step of supplying the metal sheet, wherein grooves extending along the feeding direction of the metal sheet may be formed in the groove forming step.

Further, in the method of manufacturing a deposition mask according to the present invention, the groove may be formed by etching the metal sheet, and the hole may be formed by etching the metal sheet.

In this method of manufacturing a deposition mask, the first surface and the second surface of the metal sheet may be simultaneously etched to form the hole and the step of forming the groove may be performed in parallel.

Alternatively, in the method of manufacturing such a deposition mask, the first surface and the second surface of the metal sheet are simultaneously etched to form the hole and the step of forming the groove are performed in parallel, And the step of forming the groove may be continuously performed.

Alternatively, the manufacturing method of the deposition mask is a step performed after the hole is formed by etching the metal sheet, and the step of sealing the formed hole with resin, and after the hole is sealed, the metal sheet is etched The grooves communicating from the first surface side to the holes may be formed. In the step of forming the hole in the method of manufacturing a deposition mask, the first surface and the second surface of the metal sheet may be simultaneously etched so that the formation of the groove partially proceeds.

In the method of manufacturing a deposition mask according to the present invention, the step of forming the holes may be performed before the step of forming the grooves.

Further, in the method of manufacturing a deposition mask according to the present invention, the step of forming the groove may be performed before the step of forming the hole.

In the method of manufacturing a deposition mask according to the present invention, in the step of forming the grooves, two adjacent holes may be connected to the first surface, and a plurality of holes may be linearly arranged, So as to form the groove. In this method of manufacturing a deposition mask, a hole formed in the second surface may be formed at a position formed on the first surface side so as to face a hole constituting the groove. Further, in the step of forming the grooves in the method for manufacturing a deposition mask, the plurality of holes constituting the grooves may be formed in a state in which the resist is formed on the first surface by arranging a plurality of through- Wherein the metal sheet is formed on the first surface side of the metal sheet at a position corresponding to the through hole of the resist by etching the first surface of the metal sheet, Two adjacent holes along the longitudinal direction of the resist may be connected below the bridge portion of the resist located between the two through holes of the resist corresponding to the two holes.

According to the present invention, through holes are formed in the metal sheet by linear grooves and holes. Therefore, an evaporation material which advances obliquely with respect to the sheet surface of the metal sheet and proceeds along the longitudinal direction of the groove substantially can be used for deposition with high efficiency. As a result, the utilization efficiency of the evaporation material can be increased.

1 is a perspective view showing an embodiment of a deposition mask according to the present invention;
2 is a partial plan view showing the deposition mask shown in Fig.
3 is a cross-sectional view taken along the line III-III in Fig. 2; Fig.
4 is a cross-sectional view taken along the line IV-IV in FIG. 3;
5 is a view for explaining a method of using a deposition mask;
6 is a view for explaining the action of a deposition mask in a cross section corresponding to Fig. 3; Fig.
Fig. 7 is a view for explaining the action of a deposition mask in a cross section corresponding to Fig. 4; Fig.
8 is a view for explaining an embodiment of a method of manufacturing a deposition mask according to the present invention.
9 is a view for explaining a method of forming a resist pattern on a metal sheet;
10 is a view for explaining a method of etching a metal sheet;
Fig. 11 is a view corresponding to Fig. 8, illustrating one modification of the method for manufacturing a deposition mask. Fig.
FIG. 12 is a view corresponding to FIG. 8, illustrating another modification of the method for manufacturing a deposition mask. FIG.
Fig. 13 is a view corresponding to Fig. 8, illustrating another modification of the method for manufacturing a deposition mask. Fig.
Figs. 14 (a) to 14 (e) are diagrams for explaining the manufacturing method shown in Fig. 13, all showing metal sheets in cross sections along the width direction of grooves to be formed;
Fig. 15 is a partial plan view showing one modification of the deposition mask, corresponding to Fig. 2; Fig.
16 is a cross-sectional view taken along line XVI-XVI of FIG. 15;
17A to 17E are views for explaining an example of a method of manufacturing the deposition mask shown in Fig. 15, and show a metal sheet in a cross section along the longitudinal direction of the groove to be formed, The drawings.
Fig. 18 is a partial plan view showing an example of a resist which can be used in the manufacturing method shown in Fig. 17; Fig.

Hereinafter, one embodiment of a deposition mask and a method of manufacturing a deposition mask according to the present invention will be described with reference to FIGS. 1 to 18. FIG. 1 to 18 are diagrams for explaining an embodiment of the present invention. In the following embodiments, a manufacturing method of a deposition mask (metal mask for vapor deposition) and a deposition mask used for patterning an organic light emitting material on a glass substrate in a desired pattern when manufacturing the organic EL display device is described as an example do. However, the present invention is not limited to such an application, and the present invention can be applied to a deposition mask (metal mask for vapor deposition) used for various applications and a manufacturing method of a deposition mask.

First, an example of a deposition mask that can be manufactured by the method of manufacturing a deposition mask according to the present invention will be described mainly with reference to Figs. 1 to 5. Fig. 2 is a cross-sectional view taken along line III-III in FIG. 2, and FIG. 4 is a cross-sectional view taken along the line III-III in FIG. 2, Sectional view taken along the line IV-IV.

As shown in Figs. 1 to 4, the deposition mask 20 is made of a metal sheet 34 having opposing first and second surfaces 34a and 34b. The metal sheet 34 is formed with a plurality of through holes 25 extending between the first surface 34a and the second surface 34b. The deposition mask apparatus 10 has a deposition mask 20 and a frame 15 fixed to the deposition mask 20 as shown in Fig. In the example shown in Fig. 1, the frame 15 is provided at the edge portion of the deposition mask 20 (the metal sheet 34).

The deposition mask apparatus 10 shown in FIG. 1 is supported in the deposition apparatus 40 so that the deposition mask 20 faces the glass substrate 42 as shown in FIG. Here, FIG. 5 is a view for explaining a method of using the deposition mask apparatus 10. A crucible 44 for accommodating an evaporation material (for example, an organic light emitting material) 48 is provided below the glass substrate 42 having the deposition mask apparatus 10 sandwiched therebetween, a crucible 44, And a heater 46 for heating the heater 46 is disposed. The evaporation material 48 in the crucible 44 is vaporized or sublimated by heating from the heater 46 and attached to the surface of the glass substrate 42. [ A plurality of through holes 25 are formed in the deposition mask 20 and the deposition material 48 is attached to the glass substrate 42 through the through holes 25. As described above, As a result, the evaporation material 48 is deposited on the surface of the glass substrate 42 in a desired pattern corresponding to the position of the through-hole 25 of the deposition mask 20.

As shown in Figs. 1 and 2, the metal sheet 34 constituting the deposition mask 20 in this embodiment has a substantially rectangular shape in plan view, more precisely a roughly rectangular outline in plan view . A groove 26 extending linearly is formed on the side of the first surface 34a of the metal sheet 34 and a second surface 34b of the metal sheet 34 is formed as shown in Figs. (Concave portion, hole) 27 is formed on the side of the front surface. The through hole 25 is formed through the hole 27 and the groove 26 so that the through hole 25 penetrating the metal sheet 34 is formed by the hole 27 and the groove 26.

The sectional area of the groove 26 in the cross section along the sheet surface of the metal sheet 34 gradually decreases from the first surface 34a side toward the second surface 34b side in the example shown in Fig. Goes. The grooves 26 may be formed by etching the metal sheet 34 from the side of the first surface 34a, for example, as described later. Similarly, in the examples shown in Figs. 3 and 4, the cross-sectional area of the hole 27 in the cross section along the sheet surface of the metal sheet 34 from the second surface 34b side toward the first surface 34a side Gradually diminishes. The hole 27 may be formed by, for example, etching the metal sheet 34 from the side of the second surface 34b as described later.

As shown in Figs. 1 and 2, the groove 26 extends linearly along the sheet surface of the metal sheet 34. As shown in Fig. On the first surface 34a of the metal sheet 34, a plurality of grooves 26 extending parallel to each other are formed. A large number of holes 27 communicating with the respective grooves 26 are formed. The plurality of holes 27 facing the respective grooves 26 are arranged in a straight line at regular intervals along the longitudinal direction of the grooves 26.

In other words, when viewed from the plane of the metal sheet 34, the hole 27 has a rectangular shape, more specifically, a rectangular shape in the plan view of the metal sheet 34, As shown in Fig. The longitudinal direction of the hole 27, that is, the direction along the long side of the rectangular shape contour having the hole 27 is along the longitudinal direction of the groove 26 (the direction in which the groove 26 extends (extension direction)) . As shown in Fig. 2, the hole 27 is formed at a position facing the groove 26. As shown in Fig. More specifically, the hole 27 is disposed at a center in the width direction orthogonal to the longitudinal direction of the groove 26 so that the hole 27 is located in the center of the hole 27 in plan view. The width of the hole 27 is narrower than the width of the groove 26. The rectangular shape or the rectangular shape referred to herein is not a precise rectangular shape or an accurate rectangular shape but a concept including a substantially rectangular shape and a substantially rectangular shape that can be produced when a rectangular or rectangular shape is to be formed by etching.

The hole 27 extends from the second surface 34b of the metal sheet 34 to the bottom of the groove 26. The wall surface 26a of the groove 26 and the wall surface 27a of the hole 27 are connected by the peripheral connecting portion 28. [ As shown in Figs. 3 and 4, the connecting portion 28 is formed of a ridge line of a protruding portion 28a having a minimum opening area (an area of the through-hole 25 in plan view). The region surrounded by the circumferential connecting portion 28 is also viewed from a direction orthogonal to the sheet surface of the metal sheet 34 (as viewed in a plan view) because the shape of the hole 27 is rectangular, , And has a rectangular shape. 2, the longitudinal direction of the region surrounded by the connecting portion 28 extends along the longitudinal direction of the linear groove 26. As shown in Fig. 2, when viewed from a direction orthogonal to the sheet surface of the metal sheet 34 (as viewed in a plan view), two adjacent portions of the metal sheet 34 along the longitudinal direction of the grooves 26 The length La between the through holes 25 (the region surrounded by the connecting portions 28) is equal to the length of the through holes 25 (the region surrounded by the connecting portions 28) formed in the adjacent grooves 26 Of the length Lb.

6 and 7, when the deposition mask apparatus 10 is accommodated in the deposition apparatus 40, the second surface 34b of the deposition mask 20 corresponding to the second surface 34b of the metal sheet 34, The surface 20b faces the glass substrate 42 and the first surface 20a of the deposition mask 20 corresponding to the first surface 34a of the metal sheet 34 is held by the deposition material 48 Facing the crucible 44. 6 and 7, the evaporation material 48 gradually enters the through hole 25 from the side of the tapered groove 26 and then passes through the through hole 25 ).

As described above, the hole 27 is narrowed from the second surface 34b side toward the first surface 34a side. Therefore, the protruding portion 28a having the minimum opening area in the through hole 25 Respectively. When the evaporation is performed using the evaporation mask 20, the film thickness of the evaporation film 49 formed on the region corresponding to the opposite side of the projection 28a in the glass substrate 42 is not stable. The present inventor has found that the deposition mask 20 used for depositing the organic light emitting material when fabricating the organic EL display has a structure in which the wall surface 26a of the groove 26 is connected to the wall surface 27a of the hole 27, When the length Lc along the direction orthogonal to the sheet surface of the metal sheet 34 from the first surface 28 to the second surface 34b (20b) is 10 占 퐉 or less (more preferably 5 占 퐉 or less) A length along the direction orthogonal to the sheet surface of the metal sheet 34 from the connecting portion 28 between the wall surface 26a of the hole 26 and the wall surface 27a of the hole 27 to the first surface 34a (20a) The deposition film 49 can be formed in the film formation region (region to be film-formed) with a stable film thickness if it is not more than one-third of the film thickness Ld.

6 and 7, a part of the evaporation material 48 does not move linearly from the crucible 44 toward the glass substrate 42 but moves obliquely with respect to the surface of the glass substrate 42 There is also. As described above, if the cross-sectional shape of the through hole 25 rises in a direction orthogonal to the sheet surface of the metal sheet 34, the evaporation material 48 that slantingly moves can not be used effectively.

In general, when the spacing distance between the adjacent through holes 25 is short, the wall surface on the adjacent through hole side tends to rise. In the present embodiment, the through holes 25 are arranged at a constant spacing La along one direction as seen in plan view, and spaced apart from the spacing distance La by a distance Lb ). However, according to the present embodiment, since the grooves 26 are extended along one direction in which the spacing distance La becomes shorter, in the cross section across the longitudinal direction of the through holes 25, The wall surface constituting the through hole 25 itself is present only in the portion of the hole 27 where the thickness Lc is adjusted, as shown in Fig.

In general, the wall surface of the through hole 25 tends to rise in a cross section (a cross section across a short side of a rectangular shape) across the longitudinal direction of the through hole 25 having a rectangular shape in plan view have. That is, the wall surface on the shorter side of the through hole 25 having a rectangular shape in plan view tends to rise. However, according to the present embodiment, since the longitudinal direction of the through hole 25 is aligned with the longitudinal direction of the groove 26, the through hole 25 is formed in the cross section across the longitudinal direction of the through hole 25 The wall surface constituting the through hole 25 itself does not exist outside the hole 27 where the thickness Lc is adjusted, as shown in Fig.

In view of the above, it is possible to effectively use the evaporation material 48 which is shifted obliquely to the glass substrate 42 in cross section across the longitudinal direction of the through hole 25 shown in Fig. 7, Film forming efficiency) can be greatly improved. 7, since there is almost no wall surface constituting the through hole 25, even in the region corresponding to the edge region of the through hole 25 in the glass substrate 42, can do. Therefore, it is not necessary to form the through hole 25 with a larger opening area than the film formation area (area to be formed) as in the conventional art. As a result, the through holes 25 are formed at short intervals, and the patterning to the fine pitch can be performed with high precision.

On the other hand, as shown in Fig. 6, in the cross section (the cross section across the long side of the rectangular shape) across the width direction of the through hole 25 having a rectangular shape in plan view, the wall surface of the through hole 25 Groove 26 as shown in FIG. Assuming that the wall surface 26a of the groove 26 has the outline indicated by the dotted line in Fig. 6 on the cross section in the width direction of the through hole 25, the vapor deposition material 48, which moves obliquely, And does not reach the glass substrate 42. That is, in order to increase the utilization efficiency of the evaporation material (the rate of adhering to the glass substrate 42) and save the expensive evaporation material, it is necessary to use the evaporation material which is orthogonal to the longitudinal direction of the groove 26 and which is orthogonal to the sheet surface of the metal sheet 34 The connecting portion 28 of the wall surface 26a of the groove 26 and the wall surface 27a of the hole 27 and the first surface 34a (20a) of the groove 26 are formed in the cross section (the cross- The angle? Formed by the straight line L connecting the ends of the first surface 34a and the second surface 34b 20b is preferably small and the angle? Is preferably 45 degrees or less.

When the angle? Is made smaller, the wall surfaces 26a of the adjacent grooves 26 are connected to each other as shown by the two-dot chain line in Fig. In consideration of the strength of the deposition mask 20, however, it is preferable that the wall surfaces 26a of the adjacent grooves 26 are not connected to each other. In the flat first surface 34a (20a) It is more preferable that a flat surface of 5 mu m or more is formed.

That is, the angle? Formed by the straight line L with respect to the second surface 34b (20b) is such that a flat surface of 5 占 퐉 or more is formed between the grooves 26 on the first surface 34a (20a) Angle, and is preferably 45 DEG or less.

As described above, in the present embodiment, a plurality of through holes 25 are arranged along a groove 26 extending in a straight line with a constant separation distance La. In addition, a plurality of grooves 26 are formed at predetermined intervals. 2, the through holes 25 are arranged not only in the longitudinal direction of the grooves 26 but also at a constant distance Lb along the direction perpendicular to the longitudinal direction of the grooves 26 have. As an example, when the deposition mask 20 (deposition mask apparatus 10) is used for producing a medium-sized display (for example, a 20-inch display), the above-described separation distance La is 20 m or more and 50 m Or less, and the separation distance Lb can be about 84 μm or more and 254 μm or less. The length of one side of the through hole 25 having a rectangular shape (the long side or the short side when the through hole 25 has a rectangular shape) can be about 8 μm or more and 64 μm or less.

The deposition mask 20 (the deposition mask apparatus 10) and the glass substrate 42 are relatively moved relative to each other in the direction orthogonal to the longitudinal direction of the grooves 26 and the organic light emitting material for red, An organic light emitting material, and an organic light emitting material for blue are sequentially deposited on the substrate. Thus, a display for color display can be manufactured. Particularly, according to the present embodiment, since it is not necessary to set the opening area of the through hole 25 larger than the area to be deposited, it is possible to form the pixels spaced apart by a small separation distance La in one deposition process have. Therefore, in the case of depositing the three-color organic light emitting material, three steps can be omitted in comparison with the conventional method in which the deposition of each color is performed twice.

The frame 15 provided on the periphery of the deposition mask 20 is for holding the deposition mask 20 in a pulled state so that the deposition mask 20 is not bent. The deposition mask 20 and the frame 15 are fixed to each other by, for example, spot welding. As described above, the deposition mask apparatus 10 is held inside the deposition apparatus 40 which becomes a high-temperature atmosphere. Therefore, it is preferable that the deposition mask 20 and the frame 15 are made of the same material having a low thermal expansion rate so as to prevent the generation of warpage and thermal stress of the vapor deposition frame. As such a material, for example, 36% Ni can be used.

Next, the method of manufacturing the deposition mask 20 and the deposition mask apparatus 10 will be described mainly with reference to Figs. 8 to 10. Fig. FIG. 9 is a view for explaining a method of forming a resist pattern on a metal sheet, and FIG. 10 is a view for explaining a method of etching a metal sheet. FIG. FIG.

As shown in Fig. 8, the method of manufacturing a deposition mask in this embodiment includes the steps of supplying a metal sheet 34 extending in a strip shape, and etching the metal sheet 34 using a photolithography technique A step of forming a groove 26 extending linearly on the side of the first surface 34a of the metal sheet 34 and a step of etching the metal sheet 34 by using the photolithography technique to form the metal sheet 34, And a step of forming a hole 27 on the second surface 34b side. Each process will be described in more detail below. In the present embodiment, as described below, the first surface 34a and the second surface 34b of the metal sheet 34 are etched at the same time to form the groove 26 and the process of forming the hole 27 Is performed in parallel.

As shown in Fig. 8, in the present embodiment, a core 29 is prepared by winding the metal sheet 34 on the supply core 31. As shown in Fig. Then, the feed core 31 is rotated to rewind the roll 29, whereby the metal sheet 34 extending in a strip shape is fed as shown in Fig. In addition, the metal sheet 34 forms the deposition mask 20 by forming the through-holes 25. Therefore, as described above, the metal sheet 34 is made of, for example, 36% Ni. However, the present invention is not limited to this, and it is also possible to use a sheet made of stainless steel, copper, iron or aluminum as the metal sheet 34.

The supplied metal sheet 34 is subjected to an etching treatment by an etching apparatus (etching means) Specifically, a photosensitive resist material is first applied on the first surface 34a of the metal sheet 34 (on the lower surface in Fig. 9) and the second surface 34b, and the metal sheet 34 The resist films 36a and 36b are formed. Next, glass dry plates 37a and 37b are prepared so that light is not transmitted through the areas to be removed in the resist films 36a and 36b, and the glass dry plates 37a and 37b are disposed on the resist films 36a and 36b .

Thereafter, as shown in Fig. 9, the resist film 36 is exposed over the glass dry plate 37, and the resist film 36 is developed. A resist pattern 35a is formed on the first surface 34a of the metal sheet 34 and a resist 35a is formed on the second surface 34b of the metal sheet 34. The resist pattern Pattern (also simply referred to as resist) 35b is formed.

The region facing the resist films 36a and 36b to be removed from the glass plate 37a or 37b may be made black and visible light may be used as the exposure light. In this case, since visible light is absorbed in the black portion, light is not incident on the region where the resist films 36a and 36b are to be removed, and the resist films 36a and 36b are not fixed on the metal sheet 34. [ On the other hand, light is incident on a region where the resist films 36a and 36b are to be removed, and the resist films 36a and 36b in the region are fixed on the metal sheet 34. [ The unfixed resist films 36a and 36b are removed by, for example, hot water washing.

10, using the resist patterns 35a and 35b formed on the metal sheet 34 as a mask, the metal sheet 34 is etched by an etching liquid (for example, a ferric chloride solution) Are etched from the first surface 34a side and the second surface 34b side. In the present embodiment, the first surface of the metal sheet 34 beyond the resist pattern 35a from the lower nozzle 51a of the etching apparatus 50 disposed below the metal sheet 34 on which the etching liquid 38 is transported 34a. At the same time, the second surface 34b of the metal sheet 34 beyond the resist pattern 35b from the upper nozzle 51b of the etching apparatus 50 disposed on the upper side of the metal sheet 34 to which the etching liquid 38 is transferred Lt; / RTI > At this time, as shown by the dotted line in Fig. 10, erosion by the etching solution starts in the area not covered with the resist patterns 35a and 35b in the metal sheet 34. [ Thereafter, the erosion proceeds not only in the thickness direction of the metal sheet 34 but also in the direction along the sheet surface of the metal sheet 34. As described above, the erosion by the etching liquid proceeds from the first surface 34a of the metal sheet 34 toward the second surface 34b side, so that the groove 26 is formed. In the same manner, The hole 27 is formed by advancing from the second face 34b of the first face 34 toward the first face 34a side. A through hole 25 through which the metal sheet 34 is finally passed by the groove 26 and the hole 27 through the groove 26 and the hole 27 is formed.

Thereafter, the resist patterns 35a and 35b on the metal sheet 34 are removed, and the metal sheet 34 is washed with water. In this manner, the sheet-like member 18 for a vapor-deposition mask comprising the metal sheet 34 on which the plurality of through holes 25 are formed can be obtained.

The thus obtained sheet-like member 18 for a mask is cut by a pair of conveying rollers 52, 52 which are rotated while sandwiching the sheet-like member 18 for a deposition mask, (53). The feeding core 31 is rotated by the tension (tensile force) acting on the sheet-like member 18 and the metal sheet 34 by the rotation of the conveying rollers 52 and 52, 29 are supplied with the metal sheet 34.

The metal sheet 34 on which the plurality of through holes 25 are formed is cut to a predetermined length by a cutting device (cutting means) 53 to obtain a sheet-like deposition mask 20. Then, the deposition mask apparatus 10 is obtained by providing the frame 15 with respect to each of the deposition masks 20. The frame 15 may be provided on one side 20a of the deposition mask 20 or on the other side 20b of the deposition mask 20. [

In the case of forming the grooves 26 that extend in a straight line as described above, the direction in which the grooves 26 extend and the direction in which the metal sheet 34 is fed Direction] is approximately parallel. In this case, it is possible to prevent the metal sheet 34 from being extended or cut off in the portion of the groove 26 having a reduced thickness during the production of the deposition mask 20.

As described above, according to the present embodiment, the through holes 25 are formed in the metal sheet 34 by the linear grooves 26 and the holes 27. Therefore, the evaporation material 48 that proceeds along the longitudinal direction of the groove 26 as the evaporation material 48 that advances obliquely with respect to the sheet surface of the metal sheet 34 can be used for deposition with high efficiency . As a result, the utilization efficiency of the evaporation material 48 can be greatly increased. The deposition mask 20 according to the present embodiment can be used for manufacturing an organic EL display device, for example, a vapor deposition mask used for patterning an expensive organic luminescent material on a substrate 42 in a desired pattern Of the metal mask).

Further, according to the present embodiment, the utilization efficiency of the evaporation material 48 is greatly increased while the thickness of the metal sheet 34 is secured to some extent or more. That is, the thickness of the metal sheet 34 is locally reduced without reducing the thickness of the metal sheet 34 as a whole, and the use efficiency of the evaporation material 48 is greatly increased. Therefore, the rigidity of the metal sheet 34 and the deposition mask 20 can be ensured, and the deposition mask 20 (the metal sheet 34) can be formed at the time of manufacturing the deposition mask 20 or during handling (transportation, use, Can be effectively prevented from being deformed. As a result, when the obtained deposition mask 20 is used, deposition with a very high-precision pattern can be performed with high precision.

According to the present embodiment, in the step of supplying the metal sheet 34, the metal sheet 34 is wound and the metal sheet 34 extending in a strip shape is fed back. Such a body 29 is inexpensively available, and is also highly desirable in terms of handling.

It should be noted that the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the present invention. Hereinafter, an example of a modification will be described with reference to the drawings as appropriate. In FIGS. 13 to 18 referred to hereinafter, the same parts as those of the above-described embodiment are denoted by the same reference numerals, and duplicate detailed descriptions are omitted.

(Modified Example 1)

Although the first and second surfaces 34a and 34b of the metal sheet 34 are simultaneously etched to form the grooves 26 and the holes 27 in parallel in the above embodiment, But it is not limited thereto. For example, as shown in Fig. 11, the step of forming the hole 27 may be performed before the step of forming the groove 26, and the step of forming the groove 26 as shown in Fig. 12 It may be performed before the step of forming the hole 27. [ When the step of forming the hole 27 is performed before the step of forming the groove 26, after the hole 27 is formed by etching from the second surface 34b side of the metal sheet 34, A step of filling with the resin or a step of covering the hole 27 with resin and coating the second surface 34b of the metal sheet 34 with the resin film may be further provided. In this case, the groove 26 can be formed with high precision by etching. In addition, the resin film on the hole 27 and the second surface 34b is removed after forming the groove 26. [ Similarly, when the step of forming the grooves 26 is performed before the step of forming the holes 27, the grooves 26 are formed by etching from the first surface 34a side of the metal sheet 34, Or filling the grooves 26 with a resin and coating the first surface 34a of the metal sheet 34 with a resin film. In this case, the holes 27 can be formed with high precision by etching. In addition, the resin film on the groove 26 and the first surface 34a is removed after forming the hole 27. [

13 or the first surface 34a and the second surface 34b of the metal sheet 34 are simultaneously etched to form the hole 27 and the step of forming the groove 26 Only one of the step of forming the hole 27 and the step of forming the groove 26 may be continuously performed. That is, in this method, etching is performed in two steps, and a step of forming the hole 27 and a step of forming the groove 26 are performed in parallel in the first etching. In the first etching, either the step of forming the hole 27 or the step of forming the groove 26 is completed, and in the second etching, the step of forming the hole 27 And the step of forming the groove 26 are continuously performed. It is preferable that the formation of the hole 27 in which the amount of cutting by the etching is small is completed by the first etching in the case of applying to the production of the deposition mask 20 of the embodiment described above. According to this method, it is possible to efficiently manufacture the groove 26 and the hole 27 having different amounts of cutting by etching.

Here, a modified example of the manufacturing method shown in Fig. 14 will be described in detail. Here, Figs. 14A to 14E are diagrams for explaining a modification of the method for manufacturing a deposition mask, all of which are shown in cross section along the width direction of the groove 26, ).

14A, a resist (resist pattern) 35a is formed on the first surface 34a of the metal sheet 34 in the same manner as the above-described method, and a resist A resist (resist pattern) 35b is formed on the second surface 34b. Next, the first etching is performed on the metal sheet 34 beyond the resists 35a and 35b. In the first etching, the first surface 34a and the second surface 34b of the metal sheet 34 are etched at the same time and the groove 26 and the second surface 34b on the first surface 34a side The holes 27 are formed in parallel with each other. However, the amount of cutting by the etching for forming the hole 27 is much smaller than the amount of cutting by etching for forming the groove 26. [ Therefore, as shown in Fig. 14 (b), when the hole 27 having the desired shape is formed on the second surface 34b side of the metal sheet 34, the groove 26 is still formed at the stage have. In the state shown in Fig. 14 (b), the first etching for the metal sheet 34 is terminated.

Next, as shown in Fig. 14C, the hole 27 formed by the resin 39 having resistance to the etching liquid 38 is coated. That is, the hole 27 is sealed by the resin 39 having resistance to the etching liquid 38. In the example shown in Fig. 14C, not only the hole 27 in which the film of the resin 39 is formed, but also the second surface 34b (the resist 35b) is also formed.

Thereafter, the metal sheet 34 is etched for the second time. In the second etching, the formation of the groove 26 proceeds from the side of the first surface 34a which is etched only from the side of the first surface 34a. This is because the metal sheet 34 is coated with the resin 39 having resistance to the etching liquid 38 on the side of the second surface 34b. Therefore, the shape of the hole 27 formed in a desired shape by the first etching is not impaired. 14 (d), when the grooves 26 of the desired shape are formed on the first surface 34a side of the metal sheet 34, the second etching for the metal sheet 34 Lt; / RTI > 14 (d), the groove 26 extends to the position where it reaches the hole 27 along the thickness direction of the metal sheet 34, whereby the groove 26, And the through hole 25 is formed in the metal sheet 34 by the hole 27. [

Next, the resists 35a and 35b and the resin film 39 are removed from the metal sheet 34. Then, Further, the resin film 39 can be removed, for example, by burning. Thus, as shown in Fig. 14 (e), a deposition mask 20 (sheet-like member 18 for a deposition mask) is obtained.

In the above manufacturing method, when the second etching is finished and the through hole 25 is formed by the hole 27 and the groove 26 communicating with each other, the hole 27 is sealed by the resin 39. According to this manufacturing method, the groove 26 and the hole 27 (that is, the through hole 25) can be stably formed with high precision.

The first surface 34a and the second surface 34b of the metal sheet 34 communicate with each other through the through hole 25 when the hole 27 is not sealed with the resin. In this case, a fresh etchant 38 (see FIG. 10) having high erosion capability flows into the groove 27 from the inside of the groove 26 toward the hole 27 side. At this time, the liquid pressure becomes high in the hole 27 where the cross-sectional area (the area of the opening) becomes small or in the vicinity of the projecting portion 28a, and these regions are locally and intensely eroded by the fresh etching solution. Also, the etching liquid flowing from the first surface 34a side to the second surface 34b side may remain around the hole 27 on the second surface 34b. For this reason, it is difficult to stabilize the shape of the connecting portion 28 for defining the contour of the through hole 25, and to make the outline of all the through holes 25 uniform. If the original hole 27 is not sealed with the resin 39, the pressure generated when the groove 26 starts to flow into the side of the second surface 34b through the hole 27 causes the through hole 25 (in particular, the shape of the projecting portion 28a) may be sagged.

On the other hand, according to this modified example in which the hole 27 is sealed by the resin 39 when the hole 27 and the groove 26 are communicated with each other to form the through hole 25, The through holes 25 having a desired shape can be stably formed with high precision. According to this method, since the hole 27 and the groove 26 can be formed in a desired shape with high precision, the metal sheet 34 (34) from the connecting portion 28 to the second surface 34b (20b) (See Fig. 6) along the direction orthogonal to the sheet surface can be stably set to 5 占 퐉 or less (more specifically, 2 to 4 占 퐉). As a result, when the obtained deposition mask 20 is used, deposition with a very high-precision pattern can be performed with high precision. Particularly, it is possible to stabilize the film thickness of the vapor deposition film at the edge portion in the film formation region (region to be film formation).

(Modified example 2)

The grooves 26 are formed by etching the metal sheet 34 from the side of the first surface 34a and the metal sheet 34 is etched from the side of the second surface 34b The hole 27 is formed. However, the present invention is not limited to this. For example, after the metal sheet 34 is etched from the side of the first surface 34a to form the groove 26, a resist pattern (resist) is formed on the first surface 34a of the metal sheet 34, And the hole 27 may be formed by etching the metal sheet 34 from the side of the first surface 34a. In this case, the hole 27 extending from the bottom of the groove 26 to the second surface 34b of the metal sheet 34 can be formed, and the formed hole 27 can be formed in the same manner as the groove 26, Sectional area becomes smaller from the first surface 34a side to the second surface 34b side. That is, according to this method, the cross-sectional area (pore area) of the through hole 25 in the cross section along the sheet surface of the metal sheet 34 from the first surface 34a side toward the second surface 34b gradually decreases It gets smaller. Therefore, according to the deposition mask 20 made of the metal sheet 34 thus manufactured, deposition with high precision can be performed with high accuracy.

(Modification 3)

The configuration of the groove 26 formed on the first surface 34a side of the metal sheet 34 in the above-described embodiment is merely an example. For example, in the above-described embodiment, the groove 26 has a substantially uniform width and a substantially uniform depth along its longitudinal direction, but this is not the case. 15, the width on the first surface 34a of the groove 26 along the direction orthogonal to the longitudinal direction of the groove 26 (i.e., the width direction of the groove) is constant . The width Wa of the portion where the hole 27 is formed in the longitudinal direction of the groove 26 in the deposition mask 20 shown in Fig. Is larger than the width Wb of the portion between the holes 27.

These grooves 26 are formed along the longitudinal direction of the grooves 26 and are formed with a plurality of holes (groove forming holes) 30 formed on the first surface 34a side. Two holes 27 adjacent to each other along the longitudinal direction of the groove 26 among the plurality of holes 30 constituting the groove 26 are connected to the first surface 34a. In other words, the two holes 27 are formed by partially polymerizing on the first surface 34a. That is, on the first surface 34a, the outer contours of the two holes 27 are connected. 15 and 16, the hole 27 formed on the side of the second surface 34b faces the hole 30 formed on the side of the first surface 34a in order to constitute the groove 26 Position. 15 and 16, the central position C27 along the longitudinal direction of the groove 26 of the hole 27 formed on the second surface 34b side is the first In the longitudinal direction of the groove 26 and the center position C30 along the longitudinal direction of the groove 26 of the groove forming hole 30 formed on the side of the surface 34a. 15, the central position along the width direction of the groove 26 of the hole 27 formed on the second surface 34b side is formed on the first surface 34a side And coincide with the central position along the width direction of the groove 26 of the groove forming hole 30 and the width direction of the groove 26. [ 16 shows a cross section along the longitudinal direction of the groove 26. As shown in Fig.

Further, as shown in Fig. 16, the groove 26 extends linearly, but the depth of the groove 26 is not constant. The depth Da of the portion where the hole 27 is formed in the longitudinal direction of the groove 26 is greater than the depth Db of the portion between the adjacent two holes 27 in the longitudinal direction of the groove 26 It is deep.

The other constitution of the deposition mask 20 shown in Figs. 15 and 16 can be the same as that of the deposition mask described in the above-mentioned embodiment. For example, the cross-sectional shape along the width direction of the groove 26 may be the same as the cross-sectional shape of the groove in the above-described deposition mask (see FIG. 3).

According to such a deposition sheet 20, the same operational effects as those of the deposition sheet in the above-described embodiment can be expected. For example, since the through holes 25 are formed in the metal sheet 34 by the linear grooves 26 and the holes 27, the thickness of the metal sheet 34 can be reduced, The deposition material 48 (see FIG. 5) and advancing generally along the longitudinal direction of the groove 26 can be used for deposition with high efficiency. As a result, the utilization efficiency of the evaporation material 48 can be greatly increased. Particularly, according to this modification, it is possible to secure the rigidity of the metal sheet 34 and the deposition mask 20 more than the deposition masks in the above-described embodiment. This makes it possible to more effectively prevent the deposition mask 20 (the metal sheet 34) from being deformed at the time of manufacturing the deposition mask 20 or at the time of handling (transportation, use, and the like). As a result, when the obtained deposition mask 20 is used, deposition with a very high-precision pattern can be carried out with higher precision.

Here, an example of a method of manufacturing the vapor deposition sheet shown in Figs. 15 and 16 will be described with reference to Figs. 17 and 18. Fig. The deposition sheet 20 shown in Figs. 15 and 16 may be manufactured by any one of the above-described manufacturing methods shown in Figs. 8, 11, 12, and 13. Fig. As an example, the manufacturing method described below is the same as the manufacturing method described with reference to Figs. 13 and 14. Here, FIGS. 17A to 17E are views for explaining a method of manufacturing a deposition mask, all of which show the metal sheet 34 in a section along the longitudinal direction of the groove. FIG. 18 shows an example of a resist (resist pattern) 35a that can be disposed on the first surface 34a of the metal sheet 34. The groove 26 and the outer contour of the through hole 25, And Fig.

First, as shown in FIG. 17A, a resist (resist pattern) 35a is formed on the first surface 34a of the metal sheet 34 and the second surface 34b of the metal sheet 34 A resist (resist pattern) 35b is formed. 18, in the resist 35a formed on the first surface 34a of the metal sheet 34, a groove 26 is formed on the first surface 34a Through holes 35a1 are formed at positions where the holes 30 to be formed are to be formed. As shown in Fig. 18, the plurality of through holes 35a1 are arranged at intervals along the longitudinal direction of the grooves 26 to be formed (vertical direction in the drawing sheet of Fig. 18). Therefore, the resist 35a has a bridge portion 35a2 located between two adjacent through holes 35a1 along the longitudinal direction of the groove 26 to be formed.

Next, the first etching is performed on the metal sheet 34 beyond the resists 35a and 35b. The first surface 34a and the second surface 34b of the metal sheet 34 are etched at the same time to form a hole 30 And the hole 27 on the side of the second surface 34b are formed in parallel. That is, the plurality of holes 30 constituting the grooves 26 are formed in a state in which the resist 35a formed by arranging a plurality of through holes 35a1 in a linear shape at intervals is disposed on the first surface 34a Is formed on the first surface 34a side of the metal sheet 34 at a position corresponding to the through hole 35a1 of the resist 35a by etching the first surface 34a of the metal sheet 34. [ As shown in Fig. 17 (b), holes 27 of a desired shape are formed on the second surface 34b side of the metal sheet 34, and the holes 30 constituting the grooves 26, The first etching with respect to the metal sheet 34 is terminated. Next, as shown in Fig. 17C, the hole 27 and the second surface 34b (the resist 35b), in which the resin film 39 made of a resin resistant to the etching solution 38 is formed, As shown in Fig. That is, the hole 27 is sealed by the resin 39 having resistance to the etching liquid 38.

Thereafter, the metal sheet 34 is etched for the second time. The formation of the hole 30 constituting the groove 26 proceeds from the side of the first surface 34a of the metal sheet 34 only from the side of the first surface 34a in the second etching. At this time, since the hole 27 is sealed by the resin 39 having resistance to the etching liquid 38, the shape of the hole 27 formed by the first etching is not damaged. 17 (d), when the hole 30 having a desired shape is formed on the first surface 34a side of the metal sheet 34, the second etching for the metal sheet 34 Lt; / RTI >

As described above, the erosion of the metal sheet 34 by etching progresses not only in the thickness direction of the metal sheet 34, but also in the direction along the sheet surface of the metal sheet 34. 17 (d), the hole 30 formed in the first surface 34a through the two-step etching step is removed from the metal sheet (not shown) until the hole 27 formed on the second surface 34b side 34 along the sheet surface of the metal sheet 34 so as to be connected to the first surface 34a and the adjacent hole 30 along the longitudinal direction of the groove 26 to be formed . The second etching is performed so that all the two holes 30 adjacent to each other along the longitudinal direction of the groove 26 among the plurality of holes 30 are aligned in the two Is connected to the lower side of the bridge portion 35a2 of the resist 35a located between the through holes 35a1. That is, after the second etching is finished, a gap is formed between the bridge portion 35a2 of the resist 35a and the metal sheet 34. [ In this way, two adjacent holes 30 are finally connected to the first surface 34a by two-step etching, and a plurality of holes (groove forming holes) 30 are arranged in a line And the grooves 26 are finally formed from the plurality of holes 30. [0054] As shown in Fig. It is also possible that the two holes 30 adjacent to each other along the longitudinal direction of the groove 26 start to be polymerized on the first surface 34a during the first etching step, You may be in the middle.

Thereafter, the resists 35a and 35b and the resin film 39 are removed from the metal sheet 34 to form the deposition mask 20 (the sheet member 18 for a deposition mask) as shown in Fig. 17 (e) ] Is obtained.

According to the above-described manufacturing method, the same operational effects as those of the manufacturing method described with reference to Figs. 13 and 14 can be expected. For example, according to the above manufacturing method, the through holes 25 having a desired shape can be stably formed with high precision. According to the above manufacturing method, the length Lc (refer to Fig. 6) along the direction orthogonal to the sheet surface of the metal sheet 34 from the connecting portion 28 to the second surface 34b (20b) And may be stably not more than 5 mu m (more specifically, 2 to 4 mu m). As a result, when the obtained deposition mask 20 is used, deposition with a very high-precision pattern can be performed with high precision. Particularly, it is possible to stabilize the film thickness of the vapor deposition film at the edge portion in the film formation region (region to be film formation).

The resist 35a formed on the first surface 34a of the metal sheet 34 has a bridge portion 35a2 between the through holes 35a1. Therefore, compared with the case where the elongated through holes extending linearly in correspondence with the grooves 26 to be formed are arranged side by side, the resist 35a has high rigidity, and the adhesion to the metal sheet 34 . That is, it is possible to effectively prevent the resist 35a from being deformed on the first surface 34a of the metal sheet 34 during the etching, or the resist 35a from being peeled off from the first surface 34a of the metal sheet 34 can do. Thereby, the through hole 25 having a desired shape can be formed more precisely and more stably.

(Variation 4)

The configuration of the hole 27 formed on the first surface 34a side of the metal sheet 34 in the above-described embodiment is merely an example. For example, although the holes 27 are rectangular in plan view in the above-described embodiment, the present invention is not limited to this. For example, the holes 27 may have various shapes such as a square.

(Modified Example 5)

In the above embodiment, the metal sheet 34 extending in a strip shape is supplied. However, the present invention is not limited to this. It is also possible to form a vapor deposition mask 20 by supplying a sheet-like metal sheet 34 and etching the metal sheet 34.

(Modified Example 6)

In the above-described embodiment, the frame 15 is provided for the deposition mask 20 cut to a predetermined length. However, the present invention is not limited to this. For example, a frame 15 is provided for the sheet-like member 18 for a deposition mask before cutting, and then the sheet-like member 18 for a deposition mask to which the frame 15 is fixed is cut to a predetermined length .

(Modification 7)

In addition, although a few modifications of the embodiment described above have been described above, it is of course possible to apply a plurality of modified examples suitably in combination.

10: Deposition mask device
15: frame
20: Deposition mask
25: Through hole
34: metal sheet
40: Deposition device

Claims (18)

And a metal sheet having a first surface and a second surface opposite to the first surface and having a through hole extending between the first surface and the second surface,
A groove extending linearly is formed on the first surface side of the metal sheet,
A hole is formed in the second surface side of the metal sheet,
A through hole penetrating the metal sheet is formed by the groove and the hole,
Wherein the groove is formed by a plurality of holes formed in the first surface side and two holes adjacent to each other along the longitudinal direction of the groove among the plurality of holes are connected to the first surface Mask. And a metal sheet having a first surface and a second surface opposite to the first surface and having a through hole extending between the first surface and the second surface,
A plurality of grooves extending linearly on the first surface side of the metal sheet are formed at intervals,
A hole is formed in the second surface side of the metal sheet,
And the through hole is formed through the groove and the hole and through the metal sheet by the hole and the hole. 3. The deposition mask according to claim 1 or 2, wherein the cross-sectional area of the groove in the cross section along the sheet surface of the metal sheet from the first surface side toward the second surface side gradually decreases. 3. The deposition mask according to claim 1 or 2, wherein the cross-sectional area of the hole in the cross section along the sheet surface of the metal sheet from the second surface side toward the first surface side gradually decreases. The deposition mask according to claim 1 or 2, wherein a plurality of grooves extending in a linear shape are formed in parallel with each other. The deposition mask according to claim 1 or 2, wherein a plurality of the holes are formed at intervals along the longitudinal direction of the groove. 3. The semiconductor device according to claim 1 or 2, wherein a plurality of grooves extending in parallel to each other are formed at regular intervals,
A plurality of holes are formed at equal intervals along the longitudinal direction of each groove,
The length between two through holes adjacent to each other along the longitudinal direction of the groove is shorter than the length between two through holes formed in the adjacent grooves, when observed from the normal direction of the sheet surface of the metal sheet Lt; / RTI > 3. The semiconductor device according to claim 2, wherein the groove is formed by a plurality of holes formed in the first surface side, and two holes of the plurality of holes, which are adjacent to each other along the longitudinal direction of the groove, Wherein the mask is a mask. 7. The semiconductor device according to claim 6, wherein the groove is formed by a plurality of holes formed in the first surface side, and two holes of the plurality of holes, which are adjacent to each other along the longitudinal direction of the groove, And,
And the hole formed in the second surface side is disposed at a position facing the hole constituting the groove and formed on the first surface side. Etching a metal sheet having a first surface and a second surface opposite to the first surface to form a groove extending linearly on the first surface side of the metal sheet;
And etching the metal sheet to form a hole on the second surface side of the metal sheet,
The groove and the hole are formed such that the groove and the hole allow the groove and the hole to form a through hole penetrating the metal sheet,
Characterized in that the groove is formed by arranging a plurality of holes linearly from the first surface side so that two adjacent holes are connected to the first surface in the step of forming the groove Wherein the deposition mask is formed on the substrate. Etching a metal sheet having a first side and a second side opposite to the first side to form a plurality of grooves extending linearly on the first side of the metal sheet at intervals;
And etching the metal sheet to form a hole on the second surface side of the metal sheet,
Wherein the groove and the hole are formed through the groove and the hole to form a through hole penetrating the metal sheet by the groove and the hole. 12. The semiconductor device according to claim 10 or 11, wherein a plurality of grooves extending in parallel to each other are formed at regular intervals,
A plurality of holes are formed at equal intervals along the longitudinal direction of each groove,
The length between the two through holes adjacent to each other along the longitudinal direction of the groove is shorter than the length between the two through holes formed in the adjacent grooves when observed from the normal direction of the sheet surface of the metal sheet Wherein the deposition mask is formed on the substrate. The method according to claim 10 or 11, further comprising the step of supplying the metal sheet,
Wherein a groove is formed in the groove forming step in a feeding direction of the metal sheet. The method of manufacturing a deposition mask according to claim 10 or 11, wherein the step of forming the hole is performed before the step of forming the groove. The method of manufacturing a deposition mask according to claim 10 or 11, wherein the step of forming the grooves is performed before the step of forming the holes. The method according to claim 11, wherein in the step of forming the grooves, two adjacent holes are connected to the first surface, and the plurality of holes are linearly arranged from the first surface side, Is formed on the substrate. The deposition mask manufacturing method according to claim 10 or 16, wherein the hole formed on the second surface side is formed at a position formed on the first surface side so as to face the hole constituting the groove . The method according to claim 10 or 16, wherein in the step of forming the groove,
The plurality of holes constituting the grooves are formed by etching the first surface of the metal sheet in a state in which a resist is formed on the first surface with a plurality of through holes arranged at intervals, Is formed on the first surface side of the metal sheet,
The etching for forming the groove comprising the plurality of holes is performed such that the two holes adjacent to each other along the longitudinal direction of the groove are formed by the bridge of the resist located between the two through holes of the resist respectively corresponding to the two holes And the lower electrode is connected to the lower portion of the substrate.

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