KR20140038305A - Machining method - Google Patents

Machining method Download PDF

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Publication number
KR20140038305A
KR20140038305A KR1020130105964A KR20130105964A KR20140038305A KR 20140038305 A KR20140038305 A KR 20140038305A KR 1020130105964 A KR1020130105964 A KR 1020130105964A KR 20130105964 A KR20130105964 A KR 20130105964A KR 20140038305 A KR20140038305 A KR 20140038305A
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South Korea
Prior art keywords
wafer
adhesive sheet
plate
expanding
protective member
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Application number
KR1020130105964A
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Korean (ko)
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KR101966997B1 (en
Inventor
도루 다카자와
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가부시기가이샤 디스코
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Publication of KR20140038305A publication Critical patent/KR20140038305A/en
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Publication of KR101966997B1 publication Critical patent/KR101966997B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

When a plate-shaped material such as a wafer whose rear side is attached with an adhesive sheet is expanded and divided, the present invention is to provide a processing method capable of completely preventing fracture debris of the adhesive sheet from being attached to the surface of the plate-shaped material. When a wafer (1) is divided into chips (3) by expanding an expanding tape (13) under a state in which the wafer (1) is arranged on the expanding tape (13) by interposing an adhesive sheet (12), a protective member (11) is arranged on the surface (1a) of the wafer (1) so that an excessive part (12a) of the adhesive sheet (12) extruding from the outer peripheral side of the wafer (1) is divided (first expansion step); and then the protective member (11) is removed (protective member removal step); and the chips (3) having a plurality of adhesive sheets (12) are obtained by further expanding the expanding tape (13) and dividing the wafer (1) and the adhesive sheet (12) along a prescribed division line (second expansion step). Fracture debris (12b) of the adhesive sheet (12) generated when the adhesive sheet (12) is separated is attached on the protective member (11), thereby preventing the fracture debris (12b) from being attached to the surface (1a) of the wafer (1).

Description

MACHINING METHOD

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing method for dividing a thin plate-like material such as a semiconductor wafer into a plurality of chips, and more particularly to a method for processing a plate-shaped object to which an adhesive sheet is adhered.

A disk-shaped wafer such as a semiconductor wafer on which a plurality of devices are formed on the surface is divided along a line to be divided between devices and is divided into semiconductor chips. However, in order to form an adhesive layer on the back surface before mounting the chip, there is provided a technique of dividing the wafer with the adhesive sheet for forming an adhesive layer such as DAF (Die Attach Film) adhered to the back surface of the wafer. In this case, the adhesive sheet is formed to have a slightly larger diameter than that of the wafer, and the adhesive sheet adhered to the back surface of the wafer is partially removed from the outer periphery of the wafer.

When the method of dividing the wafer by applying an external force to the wafer by expanding the expanding tape or the like adhered to the wafer having the dividing origin along the line to be divided along the dividing line at the time of dividing the wafer at the time of dividing the wafer is adopted , There is also a problem that the portion which is vacated from the outer periphery of the wafer is also divided and the broken debris of the adhesive sheet formed at that time is adhered to the surface of the wafer.

In order to solve this problem, there has been proposed a technique in which air is blown against the wafer surface by air blowing means during expansion of the expanding tape so that the broken debris of the adhesive sheet is not adhered to the wafer surface (see Patent Document 1 ).

Japanese Patent Application Laid-Open No. 2009-272503

However, even with the technique described in the above document, it is difficult to completely prevent the rupture debris of the adhesive sheet from adhering to the wafer surface.

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above circumstances, and its main technical problem is that when the plate-like material such as a wafer adhered to the back surface of an adhesive sheet is extended and divided, the peeling debris of the adhesive sheet adheres to the surface of the plate- And to provide a machining method capable of preventing the machining process.

A processing method of the present invention is a processing method of a plate-like object having a protective member disposed on a surface thereof and a dividing base point formed along a line to be divided, wherein a plate-like material is placed on an expanding tape via an adhesive sheet having a larger diameter than a plate- A first expanding step of expanding the expanding tape in a state in which the protective member is disposed on the surface of the plate-like object after the adhesion step, and separating the adhesive sheet which has been discharged to the outer periphery side of the plate- A step of removing the protective member disposed on the surface of the plate-shaped object after the first expansion step; and a step of removing the protective member from the division starting point by expanding the expanding tape after the step of removing the protective member, Dividing the adhesive sheet corresponding to the plate-like material along the line to be divided along the line to be divided And a second expansion step.

In the processing method of the present invention, the first expansion step is carried out with the protective member disposed on the surface of the plate-shaped article, and at this point, the adhesive sheet evacuated to at least the outer periphery side of the plate-shaped article is broken. The rupture debris of the adhesive sheet formed at the time of breaking is attached on the protective member. After carrying out the first expansion step, the protective member with the ruptured debris is removed on the plate, so that the ruptured debris can be completely prevented from adhering to the surface of the plate.

In the present invention, after the second expansion step is performed, the annular frame is adhered to the expansive tape in a state in which the interval between the individual chips formed by dividing the plate-shaped article is maintained, And an annular frame sticking step of holding a plurality of the chips formed in a divided manner. According to this aspect, the interval between the individual chips after the division is maintained, and handling can be carried out without destroying the chip by handling the annular frame.

According to the present invention, there is provided a processing method capable of completely preventing the adhesive sheet from adhering to the surface of the plate-like material when the plate-shaped object such as a wafer to which the adhesive sheet is adhered is extended and divided.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a protective member sticking step of a working method according to an embodiment of the present invention; FIG.
Fig. 2 is a perspective view showing a back grinding step of the working method of one embodiment. Fig.
3 is a perspective view showing the modified layer forming step of the working method of one embodiment.
4 is a partial cross-sectional view of the wafer showing the details of the reforming layer forming step.
Fig. 5 is a perspective view showing an adhesion step of the processing method of one embodiment. Fig.
6 is a perspective view showing a first expansion step of the processing method of one embodiment.
7 is a sectional view showing the first expansion step.
8 is a perspective view showing a state after the first expansion step.
Fig. 9 is a perspective view showing the protective member removing step of the working method of one embodiment. Fig.
10 is a perspective view showing a second expansion step of the processing method of one embodiment.
11 is a cross-sectional view showing a second expansion step.
Fig. 12 is a cross-sectional view showing (a) an annular frame sticking step and (b) a cross-sectional view showing an expanding tape cut after the annular frame sticking step in the working method of one embodiment.
13 is a perspective view showing a state in which the wafer is taken out from the expending device after the cutting of the expanding tape.
Fig. 14 is a cross-sectional view of an expending apparatus according to another embodiment. Fig. 14 (a) shows a state in which a wafer is set, (b) in a first expansion step, and (c) in a second expansion step.

Hereinafter, a method of processing a wafer according to an embodiment including a processing method of the present invention will be described with reference to the drawings.

(1) Step of sticking protective member

As shown in Fig. 1, the protective member 11 is adhered to the entire surface 1a of a disk-shaped wafer (plate-shaped article) 1 such as a semiconductor wafer. A plurality of lines to be divided are set in a lattice form on the surface (the lower surface side in Fig. 1) 1a of the wafer 1, and a plurality of rectangular device regions, A device 2 having an electronic circuit is formed. The protective member 11 is made of, for example, one having a pressure-sensitive adhesive layer formed on one side of a flexible resin sheet, and is adhered to cover the surface 1a of the wafer 1 via the pressure-sensitive adhesive layer. As the protective member 11, a hard plate such as a silicon wafer, a glass substrate, or a ceramics substrate may be used, and the protective member 11 may be adhered to a wafer by an adhesive or the like.

(2) backside grinding step

Next, as shown in Fig. 2, the wafer 1 is held on the holding table 21 by aligning the protective member 11 side with the holding table 21, and the back surface 1b of the wafer 1 exposed upward Is ground with the grinding means 22 to thin the wafer 1 to a predetermined thickness (e.g., about 50 to 100 mu m).

The holding table 21 is a commonly known negative pressure chuck table for holding and holding a workpiece by a negative pressure action by air suction on a circular horizontal holding surface formed by a porous material, And is rotated about the axis. The grinding means 22 has a grinding wheel 25 fixed to a front end of a spindle 23 extending in the vertical direction and rotationally driven by a motor not shown through a flange 24, In the up-and-down direction. A plurality of grinding wheels 26 are annularly arranged and fixed to the outer peripheral portion of the lower surface of the grinding wheel 25. [ The grindstone 26 is made of a material of the wafer 1, for example, a diamond grindstone formed by hardening diamond abrasive grains with a bonding agent such as a metal bond or a resin bond.

In the grinding step, the wafer 1 is placed on the holding table 21 by aligning the side of the protective member 11 with the holding face, and the wafer 1 is sucked and held by the negative pressure chuck. The grinding means 22 is lowered while the holding table 21 is rotated at a predetermined speed in one direction so that the grinding wheel 26 of the rotating grinding wheel 25 is placed on the back surface 1b of the wafer 1 And the whole surface of the back surface 1b is ground.

(3) Modification layer formation step

Next, a laser beam of a wavelength having a transmittance to the wafer 1 is irradiated along a line to be divided, thereby forming a modified layer along the line to be divided in the wafer 1. The modified layer is formed by aligning the side of the protective backing material 11 on the holding surface of a rotatable negative pressure holding table 31 such as the holding table 21 and holding the wafer 1 on the holding table (31), and the wafer (1) is sucked and held by a negative pressure chuck. 4, a laser beam L having a wavelength that is transmissive to the wafer 1 is grinded from the irradiating portion 33 of the laser irradiating means 32 disposed above the holding table 31, The light-converging point is irradiated along the line to be divided with the light-converging point positioned inside the wafer 1 from the back surface 1b side to form the modified layer 1c.

The holding table 31 can be moved in the X and Y directions shown in Fig. 3 and the scanning of the laser beam L on the wafer 1 can be performed by, for example, moving the holding table 31 in the X direction . In this case, the scheduled line to be irradiated with the laser beam L is selected by the indexing feed for moving the holding table 31 in the Y direction. Further, in order to bring the line to be divided along the X direction, the holding table 31 is rotated. The modified layer 1c is formed to have a constant layer thickness at a predetermined depth from the surface to be irradiated (the back surface 1b of the wafer 1) of the laser beam L. [ The modified layer 1c has a characteristic in which the strength of the modified layer 1c is lower than the other portions in the wafer 1 and serves as a dividing point of the wafer 1 in the subsequent second expansion step.

(4) Adhesion step

5, the back surface 1b side of the wafer 1 is placed on the expanding tape 13 with the adhesive sheet 12 having a larger diameter than the wafer 1 interposed therebetween. The expanding tape 13 is formed of an adhesive layer on one surface of a stretchable synthetic resin sheet such as polyvinyl chloride or polyolefin. In this case, the expanding tape 13 may have a rectangular shape larger than the wafer 1, Is used.

The adhesive step is carried out in such a manner that an adhesive sheet 12 made of DAF or the like is arranged in a circular shape on the adhesive layer side of the expansive tape 13 and then the back surface 1b of the wafer 1 ) Side. Further, the wafer 1 may be adhered to the expanding tape 13 on which the circular adhesive sheet 12 is disposed in advance. Alternatively, the adhesive sheet 12 may be adhered to the back surface 1b of the wafer 1, and the adhesive sheet 12 may be adhered to the adhesive layer of the expansive tape 13. The adhesive sheet 12 is formed in a circular shape larger in diameter than the wafer 1 and the excess portion 12a of the adhesive sheet 12 is exposed on the outer peripheral side of the wafer 1. [

(5) First Expansion Phase

Next, the expanding tape 13 is extended in a state in which the protective member 11 is disposed on the front surface 1a of the wafer 1, and the excess of the adhesive sheet 12, which has been released to the outer circumferential side of the wafer 1, And divides the portion 12a.

In the first expansion step, the expender 40 shown in Figs. 6 and 7 is used. The expanding device 40 has a clamping member 41 which grips the edges of the four sides of the expanding tape 13 and pulls outward at right angles to the edge. The clamp member 41 has a configuration in which L-shaped cross-section frames 42 are combined in a vertically symmetrical state. A plurality of rollers 43 are arranged close to each other on the inner side of each frame 42. These rollers 43 are supported on the frame 42 so as to be rotatable about a rotational axis orthogonal to the longitudinal direction of the frame 42. The expanding tape 13 is sandwiched between the upper and lower rollers 43. When the expanding tape 13 is stretched in the direction along the edge in the sandwiching state, the roller 43 rolls in accordance therewith.

Expansion of the expansion tape 13 is carried out by first passing the edges of the four sides of the expanding tape 13 between the upper and lower frames 42 of the clamp members 41 of the expender 40, (42) are brought close to each other and the upper and lower rollers (43) hold the expansive tape (13). Subsequently, the clamping member 41 is moved outward (the direction of the arrows in Figs. 6 and 7) to expand the expanding tape 13. Fig. The roller 43 of the clamp member 41 pivots and the deformation is released even if the deformation displaced by the expansion occurs on the expanding tape 13. The deformation of the roller 43 is released, Lt; / RTI >

By expanding the expanding tape 13 in this way, only the excess portion 12a of the adhesive sheet 12, which has been evacuated to the outer peripheral side of the wafer 1, is divided as shown in Fig. Here, the expanding tape 13 is extended until the excess portion 12a is divided, without dividing the wafer 1 yet.

When separating the excess portion 12a, it is preferable that at least the excess portion 12a is cooled down, so that it is easy to separate. In order to cool the excess portion 12a, it is possible to eject the cooling fluid such as air cooled in the excess portion 12a directly from the surface side or via the expansion tape 13 on the back side. The entire expansing device 40 may be accommodated in the cooling chamber, and the atmosphere temperature in the cooling chamber may be set at, for example, about 0 캜 to -30 캜 to expand the entire cooling device.

8, breakage debris 12b of the adhesive sheet 12 is generated from the excess portion 12a as shown in Fig. 8, but these breakage debris 12b is scattered on the wafer 1 The protective member 11 is adhered to the surface 1a of the wafer 1. In this case,

(6) Step of removing the protective member

Next, as shown in Fig. 9, the protective member 11 disposed on the surface 1a of the wafer 1 is removed. The surface of the removed protective member 11 is provided with a broken debris 12b of the adhesive sheet 12 scattered at the time of the division of the adhesive sheet 12, Is in a clean state.

(7) Second Expansion Phase

Next, as shown in Fig. 10, the expanding tape 13 is extended by the expending device 40 again. Thus, the wafer 1 is divided along the line to be divided from the modified layer 1c, which is the starting point of division, and the adhesive sheet 12 corresponding to the device 2 is broken along the line to be divided, The chip 3 is separated into the chips 3 with the adhesive sheet 12 having the device 2 on its surface.

(8) Annular frame adhesion step

Next, as shown in Fig. 12 (a), in a state in which the gap between the individual chips 3 formed by dividing the wafer 1 is maintained, the adhesive layer of the expanding tape 13 is formed The annular frame 14 is adhered to the front side. The annular frame 14 has a size larger than the outer periphery of the adhesive sheet 12 and capable of being disposed inside the clamp member 41 and is formed of a metal plate having rigidity such as stainless steel. The annular frame 14 is adhered to the expanding tape 13 so as to be concentric with the wafer 1 so that the plurality of chips 3 formed by dividing the wafer 1 are separated from the opening 1 of the annular frame 14 14a.

12 (b), the adhesive portion of the expanding tape 13 on the back side of the annular frame 14 is cut by the cutter 50. Thereafter, as shown in Fig. 13, the plurality of chips 3 having the adhesive sheet 12 adhered to the center of the expanding tape 13 to which the annular frame 14 is adhered is attached to the spreading device 40 . The chip 3 is handled by using the annular frame 14 and transferred to the next process (for example, a pick-up process of picking up the chip 3 having the adhesive sheet 12 from the expanding tape 13).

(9) Effects of the embodiment

In the above-described processing method of the embodiment, the first expansion step is carried out while the protective member 11 is disposed on the surface 1a of the wafer 1, and at this point in time, The excess portion 12a of the adhesive sheet 12 is divided. And the broken debris 12b of the adhesive sheet 12 formed at the time of division is attached on the protective member 11. [ The protective member 11 to which the fracture debris 12b is attached is removed from the wafer 1 after the first expansion step so that the fracture debris 12b is adhered to the surface 1a of the wafer 1 It can be completely prevented.

In this embodiment, after the wafer 1 is divided into a plurality of chips 3 by performing the second expansion step, the expansions of the expanding tape 13 in the state of keeping the spacing between the individual chips 3 after the division, To which the annular frame 14 is attached. As a result, the expanding tape 13 is held in the extended state in the annular frame 14, so that the interval between the individual chips 3 after the division is maintained. Therefore, by handling the annular frame 14, it is possible to carry out transportation without damaging the chip 3. [

The protection member 11 prevents the adhesion of the breakage debris 12b of the adhesive sheet 12 to the wafer surface but since the protective member 11 adheres to the wafer surface before the grinding step of the first process, The holding table 21 or 31 does not come into direct contact with the surface 1a by the protective member 11 in the processing to be performed until the protective member 11 is removed, There is an advantage that it can be used as a thing.

(10) Another embodiment

Fig. 14 shows an embodiment in which the expanding tape 13 is expanded by using the expending device 60 different from the above. That is, the expansive device 60 can perform the first expansion step or the second expansion step.

The expansing device 60 in this case has a configuration in which a lifting table 63 capable of being lifted and lowered by a cylinder device 62 is disposed around a cylindrical table 61, The annular frame 14 is set in a state in which the annular frame 14 is preliminarily adhered to the expansive tape 13 to which the wafer 1 is adhered via the intermediary of the adhesive layer 12. Inside the table 61, a nozzle 64 for ejecting a cooling fluid toward the expansive tape 13 is disposed.

14 (a), the elevation position of the elevation table 63 is set to be the same as that of the table 61, The wafer 1 on the wafer table 13 is placed, and the annular frame 14 is placed on the elevation table 63. Subsequently, the annular frame 14 is fixed to the elevating table 63 by the clamp 65 provided on the elevating table 63.

14 (b), the cylinder apparatus 62 is shrunk in a state in which the adhesive sheet 12 is cooled by ejecting the cooling fluid from the nozzle 64, so that the excess portion of the adhesive sheet 12 A first expansion step for dividing the first expansion section 12a is performed. When the lifting table 63 descends, the expanding tape 13 expands outward, and the excess portion 12a of the adhesive sheet 12 is divided.

14 (c), the lifting table 63 is further lowered to expand the expanding tape 13, and the wafer 11 is removed from the surface of the wafer 1, (1) is divided into chips (3).

As described above, the expanding device 60 can also perform the first expansion step and the second expansion step. The protruding debris 12b of the excess portion 12a of the adhesive sheet 12 generated in the first expansion step is removed from the surface of the wafer 1 in the first expansion step, Is not adhered to the surface 1a of the wafer 1.

In the above embodiment, the division originating points formed along the line along which the wafer is divided on the wafer 1 are made of the modified layer 1c by laser beam irradiation. However, the division origin point may be, for example, The groove may be a cutting groove formed by a cutting blade or a laser machining groove formed by irradiating the wafer 1 with a laser beam of a wavelength having absorbency.

The back grinding of the wafer 1 and the formation of the dividing origin may be performed in any order. In contrast to the above embodiment, the back grinding of the wafer 1 may be performed after the division origin is formed.

1: wafer (plate) 1a: surface of wafer
1c: reforming layer (division starting point) 3: chip
11: protective member 12: adhesive sheet
12a: excess portion of the adhesive sheet 13: expansive tape
14: annular frame 14a: opening of annular frame

Claims (2)

A method of processing a plate-like object having a protective member disposed on a surface thereof and having a dividing base point along a line to be divided,
Comprising the steps of: placing a plate-shaped article on an expanding tape via an adhesive sheet having a larger diameter than a plate-shaped article;
A first expanding step of expanding the expanding tape in a state in which the protective member is disposed on the surface of the plate-like object after the adhesion step, thereby separating the adhesive sheet that has been discharged to the outer periphery side of the plate-
A protective member removing step of removing the protective member disposed on the surface of the plate-like object after the first expansion step;
Dividing the plate-shaped object from the dividing base point along the dividing line, expanding the expanding tape after performing the protecting member removing step, and cutting the adhesive sheet corresponding to the plate- Expansion phase
And a machining method. The method according to claim 1, further comprising: after the second expansion step, adhering the annular frame to the expansive tape while maintaining the interval between individual chips formed by dividing the plate-shaped object, And an annular frame adhering step of holding a plurality of chips formed by dividing the water.
KR1020130105964A 2012-09-20 2013-09-04 Machining method KR101966997B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012206913A JP5977633B2 (en) 2012-09-20 2012-09-20 Processing method
JPJP-P-2012-206913 2012-09-20

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JP6494360B2 (en) * 2015-03-25 2019-04-03 株式会社ディスコ Expansion unit
JP6671794B2 (en) * 2016-05-11 2020-03-25 株式会社ディスコ Wafer processing method
JP6710457B2 (en) * 2016-06-01 2020-06-17 株式会社ディスコ Expanded sheet, method for manufacturing expanded sheet, and method for expanding expanded sheet
JP7216504B2 (en) * 2018-09-03 2023-02-01 株式会社ディスコ Expanding method
JP7345328B2 (en) 2019-09-13 2023-09-15 株式会社ディスコ Processing method of workpiece

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KR20090089340A (en) * 2007-02-27 2009-08-21 인터내셔널 비지네스 머신즈 코포레이션 Rectifying element for a crosspoint based memory array architecture
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CN103681492B (en) 2018-02-16
CN103681492A (en) 2014-03-26
JP5977633B2 (en) 2016-08-24
KR101966997B1 (en) 2019-04-08
JP2014063812A (en) 2014-04-10

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