KR20130130632A - Chip inductor and method of manufacturing the same - Google Patents

Abstract

For minimizing an inductance variation when a lamination alignment error occurs, the present invention provides a chip inductor and a manufacturing method thereof. The chip inductor includes: a laminate which is formed by alternatively laminating a magnetic sheet with a C pattern electrode and a magnetic sheet with an I pattern electrode; a via which passes through the magnetic sheets and connects the C pattern electrode to the I pattern electrode; and external electrode terminals which are formed on both sides of the laminate. able insulation of the motor is secured.

Description

≪ Desc / Clms Page number 1 > CHIP INDUCTOR AND METHOD OF MANUFACTURING THE SAME [

The present invention relates to a chip inductor, and more particularly, to a patterned electrode inside a chip inductor.

In recent years, electronic and communication devices have been developed remarkably, and frequent use of electronic and communication devices has caused frequent problems such as communication failure due to mutual interference. Thus, there is a tendency that the electromagnetic disturbance regulation is strengthened in order to improve the electromagnetic environment derived from the use of the wireless communication device and the multimedia.

In accordance with this trend, development of an electromagnetic interference elimination device has been required in recent years, and with the rapid increase in the demand for the component, the technology has been developed in terms of complexity, high integration and high efficiency. Among them, the multilayered chip inductor is a filter for removing high frequency noise, and is mainly used in personal computers, telephones, and communication devices.

Open No. 2001-0005161, published in Korean Patent Publication No. 2001-0005161, a conventional chip inductor includes a multilayer body in which a plurality of magnetic sheets on which internal electrodes are printed are laminated, Terminal is provided as a basic structure.

Here, the internal electrodes of each layer are generally fabricated in the same pattern in order to facilitate manufacturing. For example, FIG. 11 shows a chip inductor proposed in the prior art, wherein the inner electrodes 1 of each layer except for the uppermost layer and the lower layer use electrodes patterned in the shape of ∩.

However, in such a structure, when stacking alignment errors between magnetic sheets occur in the course of stacking tens or hundreds of magnetic sheets, the cross-sectional area inside the coil largely fluctuates and the inductance capacity is not controlled to a constant value .

For example, when the magnetic sheet of the upper layer or the lower layer is pushed inward as shown in Fig. 12 (a), the gap L1 between the upper and lower internal electrodes is reduced as compared with the case where the layers are stacked normally, . 12 (b), when the magnetic sheet of the upper layer or the lower layer is pushed outward, the gap L2 between the upper and lower inner electrodes is increased as compared with the case where the layers are normally stacked, and the cross- .

In recent years, inductance capacitances are required to be more precisely controlled in accordance with the complexity and high integration of functions and miniaturization trends. When the inductance capacitance varies due to such a stacking alignment error, the reliability of the product is deteriorated. Particularly, The internal electrode and the external electrode terminal may be short-circuited.

Patent Document: Korean Patent Laid-Open Publication No. 2001-0005161

It is an object of the present invention to provide a chip inductor and a chip inductor manufactured by the same, which have no inductance capacity change even if a stacking alignment error occurs.

According to an aspect of the present invention, there is provided a laminated body including a magnetic sheet having a C-patterned electrode and a magnetic sheet having an I-patterned electrode formed thereon; A via penetrating the magnetic sheet and connecting the C-pattern electrode and the I-pattern electrode; And external electrode terminals provided on both sides of the stacked body.

The via is formed in a magnetic sheet on which the C-pattern electrode is formed and has a first via connecting one end of the C-pattern electrode and one end of the I-pattern electrode, and a second via formed on the I- And a second via connecting the other end of the pattern electrode and the C-pattern electrode.

The pattern line of the C-pattern electrode may be a circle, an ellipse, or a square.

The gap distance between both ends of the C-pattern electrode may be 5 탆 to 100 탆.

The length of the I-pattern electrode may be greater than the gap distance between both ends of the C-pattern electrode.

The ratio of the gap distance between both ends of the C-pattern electrode to the length of the I-pattern electrode may be 1.1 to 1.3.

When the magnetic sheet is divided into a virtual quadrant, the gap between both ends of the C-pattern electrode may be disposed on one of the two divided surfaces or on two consecutive divided surfaces.

One end of the lead electrode formed on the magnetic sheet on the uppermost layer is connected to the external electrode terminal on the left side (or right side), and the other end is connected to the lower layer C Pattern electrodes or I-pattern electrodes. One end of the lead-out electrode formed on the lowermost magnetic sheet may be connected to the right (or left) external electrode terminal, and the other end may be connected to the C pattern electrode or the I-pattern electrode of the upper layer.

The end of the C-pattern electrode connected to the lead electrode is connected to the lead-out electrode connected to the left outer electrode terminal, and the end near the left outer electrode terminal is connected to the lead electrode connected to the left outer electrode terminal. Terminal to be connected to the extraction electrode connected to the terminal.

The end of the I-pattern electrode connected to the lead electrode is connected to the lead-out electrode connected to the right outer electrode terminal, and the end near the outer electrode terminal on the right side is connected to the lead electrode connected to the right outer electrode terminal. Terminal to be connected to the extraction electrode connected to the terminal.

The method for fabricating the chip inductor of the present invention includes: alternately laminating a magnetic sheet on which C-pattern electrodes are formed and a magnetic sheet on which I-pattern electrodes are formed; Pressing and firing the laminated magnetic sheet; And forming external electrode terminals on both sides of the laminate obtained through the pressing and sintering steps.

Forming a C-patterned electrode or I-patterned electrode in each region of the magnetic sheet partitioned into a plurality of regions such that the C-patterned electrode and the I-patterned electrode are alternately arranged; A magnetic sheet of the upper layer or the lower layer is moved and stacked so that a plurality of the magnetic sheets are stacked and the C pattern electrode of the upper layer (or the I pattern electrode of the upper layer) and the I pattern electrode of the lower layer (or the C pattern electrode of the lower layer) step; Individualizing the stacked layers in the respective regions through a cutting process after pressing and sintering the stacked magnetic sheets; And forming external electrode terminals on both sides of the individual laminated body.

Here, before forming the C-pattern electrode or the I-pattern electrode on the magnetic sheet, a via may be formed at a predetermined position of the magnetic sheet.

In the step of forming the C pattern electrode and the I pattern electrode on the magnetic sheet, the C pattern electrode and the I pattern electrode may be alternately arranged in the x axis direction. In this case, the step of laminating the magnetic sheet The magnetic sheet of the upper layer or the lower layer can be stacked by moving one region in the x-axis direction.

In the step of forming the C-pattern electrode and the I-pattern electrode on the magnetic sheet, the C-pattern electrode and the I-pattern electrode may be alternately arranged in the y-axis direction. In this case, It is possible to stack the magnetic sheets of the upper layer or the lower layer by moving one region in the y-axis direction.

In the step of forming the C-pattern electrode and the I-pattern electrode on the magnetic sheet, the C-pattern electrode and the I-pattern electrode may be alternately arranged in the x- and y-axis directions, In the step of laminating the sheets, it is possible to stack the magnetic sheets of the upper layer or the lower layer by moving one region in the x-axis direction and the y-axis direction, respectively.

On the other hand, as another method of manufacturing the chip inductor of the present invention, C pattern electrodes are formed in each region of the first magnetic sheet partitioned into a plurality of regions, and I patterns Forming an electrode; Alternately stacking the first magnetic sheet and the second magnetic sheet; Individualizing the stacked layers in the respective regions through a cutting process after pressing and sintering the stacked magnetic sheets; And forming external electrode terminals on both sides of the individual laminated body.

According to the present invention, even if a stacking alignment error occurs in the process of stacking the magnetic sheets, the cross-sectional area inside the coil hardly changes, thereby minimizing the variation of the inductance capacity and greatly enhancing the product reliability.

1 is an external perspective view of a chip inductor according to the present invention.
2 is an exploded perspective view of a chip inductor according to the present invention.
Figs. 3A to 3C show an example of a C-pattern electrode
FIGS. 4A and 4B are plan views for explaining a connection structure of a C-pattern electrode and an I-pattern electrode when a stacking alignment error occurs
Figs. 5A to 5C are plan views illustrating positions where the C-pattern electrodes are formed
6 is a view for explaining a variation of arrangement of lead electrodes included in the present invention
FIGS. 7A to 7C are plan views for explaining the arrangement order of the C-pattern electrode and the I-
8A and 8B are plan views illustrating a state in which a magnetic sheet having a plurality of C-pattern electrodes and I-pattern electrodes on one surface thereof is stacked
9A is a plan view of a first magnetic sheet having C-pattern electrodes formed thereon, and FIG. 9B is a plan view of a second magnetic sheet having I-
10 is a plan view illustrating a state in which the first magnetic sheet and the second magnetic sheet are laminated;
11 is a view showing a chip inductor proposed in the prior art document
12 is an internal plan view of a conventional chip inductor when a stacking alignment error occurs

The advantages and features of the present invention and the techniques for achieving them will be apparent from the following detailed description taken in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The present embodiments are provided so that the disclosure of the present invention is not only limited thereto, but also may enable others skilled in the art to fully understand the scope of the invention.

The terms used herein are intended to illustrate the embodiments and are not intended to limit the invention. In this specification, the singular forms include plural forms unless otherwise specified in the text. Further, elements, steps, operations, and / or elements mentioned in the specification do not preclude the presence or addition of one or more other elements, steps, operations, and / or elements.

Hereinafter, the configuration and operation effects of the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 is an external perspective view of a chip inductor according to the present invention, and FIG. 2 is an exploded perspective view of a chip inductor according to the present invention.

1 and 2, a chip inductor according to the present invention includes a magnetic sheet 140 having a C-patterned electrode 141 formed thereon and a magnetic sheet 150 having I-patterned electrodes 151 formed thereon The stacked body 100, and the external electrode terminals 200 provided on both sides of the stacked body 100. The laminated body 100 is formed by stacking a plurality of magnetic sheets 140 and 150, followed by pressing and sintering, and the adjacent magnetic sheets are integrated so as not to distinguish their boundaries.

The C pattern electrode 141 means an electrode patterned in C shape, and the I pattern electrode 151 means an electrode patterned in I shape. In a broader concept, the C-patterned electrode 141 may include all of the features partially open in the ferrule, and the I-patterned electrode 151 may include any shape connecting the open gap. For example, the C-pattern electrode 141 may be a C-patterned electrode as shown in FIG. 3A, and the pattern line except for the gap opened as shown in FIG. 3B or FIG. 3C may be circular or rectangular have.

When the pattern line of the C-pattern electrode 141 forms a circular or elliptic curve as shown in FIG. 2 or 3B, the flowability of the current is improved and the DC resistance characteristic Rdc can be improved. On the other hand, when the corners are angled as shown in Fig. 3A or Fig. 3C, the internal cross-sectional area can be widened to maximize the inductance capacity.

Since the C-pattern electrode 141 is most advantageously disposed at the edge of the magnetic sheets 140 and 150 for higher inductance capacity, the C-pattern electrode 141 may have an oval shape rather than a circular shape depending on the chip shape of the rectangular parallelepiped, It is preferable to be formed in a rectangular shape rather than a square shape.

2, the C-pattern electrode 141 and the I-pattern electrode 151 may be electrically connected to each other through the vias 142 and 152 passing through the magnetic sheets 140 and 150. [ More specifically, the vias 142 and 152 are formed in the magnetic sheet 140 on which the C-pattern electrode 141 is formed, and one end 141a of the C-pattern electrode 141 and one end 141a of the I- Pattern electrodes 151 are formed on the magnetic sheet 150 on which the I-pattern electrodes 151 are formed and the other ends 151b of the I-pattern electrodes 151 and the C- And a second via 152 connecting the other end 141b.

That is, one end 141a of the C-pattern electrode 141 is connected to one end 151a of the I-pattern electrode 151 below the first via 142 via the first via 142, Pattern electrode 151 is connected to the other end 141b of the lower C-pattern electrode 141 through the second via 152. In this connection structure, a plurality of C-pattern electrodes 141 and I-pattern electrodes 151 are electrically connected to each other to operate as one coil.

When the electrode pattern constituting the coil is composed of the C-pattern electrode 141 and the I-pattern electrode 151, the cross-sectional area inside the coil hardly changes even if a stacking alignment error occurs between the magnetic sheets during the manufacturing process, Thus, the inductance capacity change can be minimized.

4A and 4B are plan views showing a connection structure of the C-pattern electrode 141 and the I-pattern electrode 151 when a stacking alignment error occurs. Referring to FIG. 4A and FIG. 4B, It can be seen that, even if a stacking alignment error occurs, there is almost no change in the cross sectional area inside the coil in the connection structure of the pattern electrode 151. [ That is, when the I-pattern electrode 151 is pushed upward by an alignment error in the y-axis direction as shown in FIG. 4A, the connection positions of the C-pattern electrode 141 and the I- It can be seen that the cross-sectional area of the inside does not change.

In addition, as shown in FIG. 4B, when an alignment error occurs in the x-axis direction and the I pattern electrode 151 is pushed outward, the cross-sectional area inside the fluctuating coil may be a gap between both ends of the C pattern electrode 141. It can be seen that the cross-sectional area inside the coil is hardly changed since it is only the length of the (DELTA) G interval × I pattern electrode 151.

Here, when an alignment error occurs in the x-axis direction, the cross-sectional area of the inside of the coil is proportional to the gap (? G) between the both ends of the C-pattern electrode 141, The narrower the gap (? G) between the ends is, the more advantageous it is. However, if it is too narrow, there is a high possibility that both ends of the C-pattern electrode 141 are short-circuited to each other in the process of forming the C-pattern electrode 141 through screen printing or the like. In addition, since vias connecting the C-pattern electrode 141 and the I-pattern electrode 151 are dense, a step is formed with the periphery, which causes a defect such as cracking or peeling. therefore. It is preferable to select an appropriate value within a range of 5 占 퐉 to 100 占 퐉 in the gap? G between the both ends of the C-pattern electrode 141. [

The length? L of the I-pattern electrode 151 is set to be larger than the gap? G between both ends of the C-pattern electrode 141 in order to secure the connection between the C- ) Spacing. Here, the length (? L) of the I-pattern electrode 151 is a concept including up to the end where the via contacts.

The longer the length (? L) of the I-pattern electrode 151 with respect to the gap G between the both ends of the C-pattern electrode 141 is, the higher the possibility that the C-pattern electrode 141 and the I- If the lamination alignment error occurs, one end of the I-pattern electrode 151 may be short-circuited with the external electrode terminal 200 when a stacking alignment error occurs. Accordingly, it is preferable to select an appropriate value within a range of 1.1 to 1.3, wherein a ratio of a gap (? G) between both ends of the C-pattern electrode 141 and a length? L of the I-pattern electrode 151 is within a range of 1.1 to 1.3.

The gap (? G) between both ends of the C-pattern electrode may be positioned on the major axis or the minor axis of the C-pattern electrode. The magnetic sheet may be divided into virtual quadrants, i.e., a first quadrant, The third and fourth quadrants may be disposed at any one of the quadrants.

For example, as shown in Fig. 5A, the gap? G between both ends can be arranged on the second plane or arranged on the fourth plane as shown in Fig. 5b. Alternatively, it may be arranged so as to span two consecutive quadrants (first quadrant, second quadrant) as shown in Fig. 5C. As described above, in the present invention, the gap? G between both ends of the C-pattern electrode 141 is not particularly limited as far as it is formed.

Referring back to FIG. 2, the chip inductor of the present invention may further include magnetic sheets 160 and 170 having lead electrodes 161 and 171 formed on the uppermost layer and the lowermost layer of the layered body 100.

The lead electrodes 161 and 171 are electrodes for connecting the C pattern electrode 141 or the I pattern electrode 151 to the external electrode terminal 200. For example, One end 161a of the electrode 161 is connected to the external electrode terminal 200 on the left side (or right side) and the other end 161b is connected to the C pattern electrode 16b on the lower layer via the via 162 passing through the magnetic sheet 160. [ Lt; RTI ID = 0.0 > 141 < / RTI >

Similarly, one end 171a of the lead-out electrode 171 formed on the lowermost magnetic sheet 170 is connected to the right (or left) external electrode terminal 200 and the other end 171b is connected to the magnetic sheet Pattern electrode 141 of the upper layer through a via 142 penetrating through the via hole 140. The drawing electrodes 161 and 171 are connected to the C pattern electrodes 141 in accordance with the stacking order of the C pattern electrodes 141 and the I pattern electrodes 151. However, It can be connected to the electrode 151 as well.

At this time, in consideration of the flowability of the electric current, the drawing electrodes 161 and 171 may be disposed such that current flows in the forward direction at the contact point between the drawing electrodes 161 and 171 and the C pattern electrode (or I pattern electrode) have.

For example, when the lead electrodes 161 and 171 are connected to the C-pattern electrode 141, an end of the C-pattern electrode 141 that is close to the external electrode terminal 200 on the right side of both ends 141a and 141b The end 141a near the left external electrode terminal 200 can be connected to the external electrode terminal 200 on the right side and the end 141a near the left external electrode terminal 200 can be connected to the outgoing electrode 161 connected to the left external electrode terminal 200. [ And may be connected to the extraction electrode 171. When the lead electrodes 161 and 171 are connected to the I-pattern electrode 151, an end of the both ends 151a and 151b of the I-pattern electrode 151, which is close to the right external electrode terminal 200, And an end closer to the left external electrode terminal 200 may be connected to the outgoing electrode connected to the left external electrode terminal 200. [

According to this connection structure, a current input through the external electrode terminal 200 flows without changing the direction at the contact point between the lead electrodes 161 and 171 and the C-pattern electrode 141 (or the I-pattern electrode 151) .

Of course, as shown in FIG. 6, on the contrary, the drawing electrodes 161 and 171 may be arranged such that current flows in the opposite direction at the contact point between the drawing electrodes 161 and 171 and the C pattern electrode (or I pattern electrode) in the lower layer or the upper layer.

The chip inductor having the structure of the present invention is obtained by alternately laminating the magnetic sheet 140 on which the C patterned electrode 141 is formed and the magnetic sheet 150 on which the I patterned electrode 151 is formed, The external electrode terminals 200 may be formed on both sides of the laminated body 100 obtained by pressing and firing the external electrodes 140 and 150.

Even if a lamination alignment error occurs between the magnetic sheets in the x-axis direction or the y-axis direction during the above-described manufacturing process, the chip inductor of the present invention minimally changes the inductance capacity because there is almost no change in the sectional area inside the coil as shown in Figs. 4A and 4B can do.

However, the chip inductor of the present invention can be fabricated using a magnetic sheet having a plurality of C-pattern electrodes 141 and I-pattern electrodes 151 printed thereon on one side, It is possible to minimize the change in cross-sectional area of the inside of the coil.

A method of manufacturing a chip inductor of the present invention using a magnetic sheet 110 in which a plurality of C-pattern electrodes 141 and I-pattern electrodes 151 are printed on one surface will be described. First, in each region of the magnetic sheet The pattern electrode 141 or the I-pattern electrode 151 is formed. Vias (142 and 152 in FIG. 2) can be formed by processing via holes at predetermined positions of the magnetic sheet 110 and filling the processed via holes with conductive paste.

The C-pattern electrode 141 and the I-pattern electrode 151 may be formed by using a known technique such as screen printing. At this time, the C-pattern electrode 141 and the I-pattern electrode 151 are alternately arranged . That is, the C-pattern electrode 141 and the I-pattern electrode 151 may be alternately arranged in the x-axis direction as shown in FIG. 7A or alternately in the y-axis direction as shown in FIG. 7B. Alternatively, as shown in FIG. 7C, the C-pattern electrode 141 and the I-pattern electrode 151 may be alternately arranged in the x-axis and y-axis directions.

Then, a step of stacking a plurality of magnetic sheets 110 on which the C-pattern electrode 141 and the I-pattern electrode 151 are printed is performed. At this time, the magnetic sheets of the upper layer or the lower layer are moved by one region to laminate.

8A and 8B are plan views illustrating, for example, a state in which two magnetic sheets are stacked. Here, the shaded magnetic sheet 110a is located on the upper layer, and the magnetic sheet 110b marked in the colorless is located on the lower layer.

8A, the C pattern electrode 141 and the I-pattern electrode 151 are alternately arranged in the x-axis and y-axis directions, as shown in FIG. 7C, The magnetic sheets 110a and 110b of the upper or lower layer are moved by one area in the x axis direction or by one area in the y axis direction as shown in Figure 8 (b), as shown in Figure 8 (a) And then laminated. Then, the upper C-pattern electrode 141 (or the upper I-pattern electrode 151) and the lower I-pattern electrode 151 (or the lower C-pattern electrode 141) are aligned with each other and connected do.

Similarly, in the case of using the magnetic sheet in which the C-pattern electrode 141 and the I-pattern electrode 151 are alternately arranged in the x-axis direction as shown in Fig. 7A, the magnetic sheet of the upper layer or the lower layer is arranged in the x- When the magnetic sheet in which the C-pattern electrode 141 and the I-pattern electrode 151 are alternately arranged in the y-axis direction is used as shown in Fig. 7 (b), the upper layer or the magnetic sheet axis direction and by one region in the y-axis direction.

When the magnetic sheet 110 in which a plurality of C-pattern electrodes 141 and I-pattern electrodes 151 are alternately arranged on one surface is used, the magnetic sheet of the upper layer or the lower layer must be moved in the stacking process, There is a high possibility that a stacking alignment error occurs in the process. However, even if such a stacked alignment error occurs, the chip inductor of the present invention can minimize the change in inductance capacity due to little change in cross sectional area inside the coil as shown in FIGS. 4A and 4B.

When a plurality of magnetic sheets are laminated, they are pressurized and fired, individual layers of the respective regions are cut through a cutting process, and finally, external electrode terminals are formed on both sides of the individual laminated body, It can be finally completed.

On the other hand, the chip inductor of the present invention can also be manufactured by using a magnetic sheet having a plurality of pattern electrodes of the same kind on one surface.

9A, C patterned electrodes are formed on respective regions of the first magnetic sheet 120 divided into a plurality of regions as shown in FIG. 9A, and a second magnetic sheet 130 divided into a plurality of regions as shown in FIG. 9B, I-pattern electrodes are formed in the respective regions of the substrate.

Next, as shown in FIG. 10, the first magnetic sheet 120 and the second magnetic sheet 130 are alternately stacked. At this time, unlike FIGS. 8A and 8B, a separate moving operation is not required, and the possibility of occurrence of stacking alignment error is low. However, even if the possibility is low, the chip inductor of the present invention may occur at any time in the lamination process, and even if the alignment error occurs at such a low probability, the change in the inductance capacity is minimized as shown in Figs. 4A and 4B, can do.

When a plurality of the first magnetic sheets 120 and the second magnetic sheets 130 are laminated, the laminated bodies in the respective regions are individually formed through the cutting process after the pressing and firing, and finally, The chip inductor of the present invention can be finally completed.

The foregoing detailed description is illustrative of the present invention. It is also to be understood that the foregoing is illustrative and explanatory of preferred embodiments of the invention only, and that the invention may be used in various other combinations, modifications and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, the disclosure and the equivalents of the disclosure and / or the scope of the art or knowledge of the present invention. The foregoing embodiments are intended to illustrate the best mode contemplated for carrying out the invention and are not intended to limit the scope of the present invention to other modes of operation known in the art for utilizing other inventions such as the present invention, Various changes are possible. Accordingly, the foregoing description of the invention is not intended to limit the invention to the precise embodiments disclosed. It is also to be understood that the appended claims are intended to cover such other embodiments.

100:
110, 120, 130, 140, 150, 160, 170: magnetic sheet
141: C pattern electrode
142, 152: Via
151: I pattern electrode
161, 171:
200: external electrode terminal

Claims (20)

A laminated body in which a magnetic sheet on which C-pattern electrodes are formed and a magnetic sheet on which I-pattern electrodes are formed are alternately laminated;
A via penetrating the magnetic sheet and connecting the C-pattern electrode and the I-pattern electrode; And
And external electrode terminals provided on both sides of the stacked body.
The method of claim 1,
The VIA includes a first via formed on a magnetic sheet having the C-patterned electrode and connecting one end of the C-patterned electrode to one end of the I-patterned electrode, and a second via formed on the I- And a second via connecting the other end of the C-pattern electrode.
The method of claim 1,
Wherein the pattern line of the C-pattern electrode is a circle, an ellipse, or a square.
The method of claim 1,
And a gap distance between both ends of the C-pattern electrode is 5 占 퐉 to 100 占 퐉.
5. The method of claim 4,
Wherein a length of the I-pattern electrode is larger than a gap distance between both ends of the C-pattern electrode.
The method of claim 5, wherein
Wherein a ratio of a gap distance between both ends of the C-pattern electrode to a length of the I-pattern electrode is 1.1 to 1.3.
The method of claim 1,
Wherein a gap between both ends of the C-pattern electrode is disposed on one of the two divided surfaces or on two consecutive divided surfaces when the magnetic sheet is divided into virtual quadrants.
The method of claim 1,
And a gap between both ends of the C-pattern electrode is located at a long axis of the C-pattern electrode.
The method of claim 1,
One end of the lead electrode formed on the magnetic sheet of the uppermost layer is connected to the external electrode terminal on the left side (or right side), and the other end is connected to the C electrode on the lower layer of the magnetic sheet having the lead electrode formed on the uppermost layer and the lowermost layer of the laminate, (Or left) external electrode terminal, and the other end is connected to a C-pattern electrode or an I-pattern electrode on the upper layer, and the other end of the lead- Inductor.
The method of claim 9,
Wherein the drawing electrode is disposed such that current flows forward at a contact point between the drawing electrode and the C pattern electrode or the I pattern electrode in the lower layer or the upper layer.
A step of alternately laminating a magnetic sheet on which C-pattern electrodes are formed and a magnetic sheet on which I-pattern electrodes are formed;
Pressing and firing the laminated magnetic sheet; And
And forming external electrode terminals on both sides of the laminate obtained through the pressing and firing steps.
Forming a C pattern electrode or I pattern electrode on each region of the magnetic sheet partitioned into a plurality of regions such that the C pattern electrode and the I pattern electrode are alternately arranged;
A magnetic sheet of the upper layer or the lower layer is moved and stacked so that a plurality of the magnetic sheets are stacked and the C pattern electrode of the upper layer (or the I pattern electrode of the upper layer) and the I pattern electrode of the lower layer (or the C pattern electrode of the lower layer) step;
Individualizing the stacked layers in the respective regions through a cutting process after pressing and sintering the stacked magnetic sheets; And
And forming external electrode terminals on both sides of the individual laminated body.
13. The method of claim 12,
Wherein a via is formed at a predetermined position of the magnetic sheet before the C-pattern electrode or the I-pattern electrode is formed on the magnetic sheet.
13. The method of claim 12,
Wherein the C-pattern electrode and the I-pattern electrode are alternately arranged in the x-axis direction in the step of forming the C-pattern electrode and the I-pattern electrode on the magnetic sheet.
15. The method of claim 14,
And the magnetic sheet in the upper layer or the lower layer is moved by one region in the x-axis direction and laminated in the step of laminating the magnetic sheets.
13. The method of claim 12,
Wherein the C pattern electrode and the I pattern electrode are alternately arranged in the y axis direction in the step of forming the C pattern electrode and the I pattern electrode on the magnetic sheet.
17. The method of claim 16,
Wherein the step of laminating the magnetic sheets comprises moving the magnetic sheets of the upper layer or the lower layer by one region in the y-axis direction and stacking them.
13. The method of claim 12,
Wherein the C pattern electrode and the I pattern electrode are alternately arranged in the x axis direction and the y axis direction in the step of forming the C pattern electrode and the I pattern electrode on the magnetic sheet.
The method of claim 18,
And the magnetic sheet in the upper layer or the lower layer is moved by one region in the x-axis direction and the y-axis direction, respectively, and laminated in the step of laminating the magnetic sheets.
Forming a C-patterned electrode in each region of the first magnetic sheet partitioned by the plurality of regions and forming an I-patterned electrode in each region of the second magnetic sheet partitioned by the plurality of regions;
Alternately stacking the first magnetic sheet and the second magnetic sheet;
Individualizing the stacked layers in the respective regions through a cutting process after pressing and sintering the stacked magnetic sheets; And
And forming external electrode terminals on both sides of the individual laminated body.

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