KR20130099470A - Soldering method of camera module - Google Patents

Soldering method of camera module Download PDF

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Publication number
KR20130099470A
KR20130099470A KR1020120021013A KR20120021013A KR20130099470A KR 20130099470 A KR20130099470 A KR 20130099470A KR 1020120021013 A KR1020120021013 A KR 1020120021013A KR 20120021013 A KR20120021013 A KR 20120021013A KR 20130099470 A KR20130099470 A KR 20130099470A
Authority
KR
South Korea
Prior art keywords
soldering
substrate
module
camera module
solder
Prior art date
Application number
KR1020120021013A
Other languages
Korean (ko)
Inventor
고선효
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120021013A priority Critical patent/KR20130099470A/en
Publication of KR20130099470A publication Critical patent/KR20130099470A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • H04N5/2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils

Abstract

PURPOSE: A soldering method for camera module is provided to solder a module substrate onto an actuator substrate at the same time soldering the module substrate onto a main substrate, thereby simplifying the soldering process of the camera module and reducing the process time. CONSTITUTION: A camera module comprises a housing, a module substrate (120), and an actuator substrate (110). Solder (130) is dispensed between a connection terminal (111) of the actuator substrate and a connection pad of the module substrate. The connection pad and the connection terminal are soldered while the module substrate is soldered onto a main substrate of an external electronic component through a hot bar process. The solder is the low-temperature solder of a cream type.

Description

Soldering Method of Camera Module
The present invention relates to a soldering method of a camera module, and more particularly, to a soldering method of a camera module that can simplify the soldering process of the camera module and improve the solder paste, that is, the coating stability and electrical connectivity of the solder.
In general, the camera module is small and is applied to portable mobile communication devices such as camera phones, PDAs, and smart phones, and various IT devices. Recently, as these devices become smaller and slimmer, the size of the camera module itself becomes smaller and smaller. to be.
Such a camera module is manufactured by using an image sensor such as a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) as a main component, and condenses an image of an object through the image sensor on the memory of the device. Data is stored, and the stored data is output as an image through a display medium such as an LCD or a PC monitor in the device.
In addition, although the camera module may be assembled and completed so that the focus of the lens module mounted therein is fixed, in recent years, a camera module for performing an auto-focusing or zooming function has been developed. to be.
The camera module performing the auto focusing or zooming function is provided with an actuator to move the lens barrel containing the lens module along the optical axis direction.
That is, the camera module includes a lens barrel accommodating a lens module and an actuator provided to move the lens barrel, and the housing is attached to the module substrate while the housing is accommodated therein.
An image sensor is bonded and electrically connected to the module substrate, and the actuator and the module substrate are connected to each other by a predetermined member, that is, a flexible printed circuit board, so as to be in electrical communication with each other.
At this time, the bonding method for the electrical connection between the flexible printed circuit board and the module substrate is largely a soldering method using a laser and a soldering method using a conductive bond, that is, silver paste.
However, the soldering method using a laser is expensive and there is a problem of increasing the manufacturing cost, the soldering method using a silver paste has a relatively weak problem in reliability.
In more detail, as shown in FIG. 1, the conventional soldering method using silver paste includes connecting the connection terminal 11 of the flexible printed circuit board 10 and the connection pad 21 of the module substrate 20 (see FIG. 4). After the alignment, the silver paste 30 (see FIG. 2A) is disposed on the connection terminal 11 and the connection pad 21 and then cured to electrically connect the flexible printed circuit board 10 and the module substrate 20. This is how you connect.
In this case, however, the bonding strength of the silver paste was reduced, and thus, a bonding process for reinforcing was additionally performed, and as shown in FIGS. 2A and 2B, dispensing the reinforcing bonding agent for the bonding process was performed. When the silver paste is touched in the process, an open phenomenon occurs in which electrical connection of the silver paste 30 is disconnected.
In addition, as shown in FIG. 3, when the application position of the silver paste 30 is misaligned, since the silver paste is cured as it is, there is a problem that the stability of the application is lowered and the bonding property is lowered.
In addition, as shown in FIG. 4, it is difficult to accurately control the coating amount of the silver paste 30, and thus, when soldering using the silver paste, the silver paste 30 is stretched toward the side of the module substrate 20 to have a tail shape. Accordingly, there is a problem in that a short phenomenon may occur by contacting the soldering part 50 for electrical connection between the module substrate 20 and the main board 40 of an external electronic product.
Meanwhile, in the soldering method using the silver paste of the conventional camera module, the manufacturing process is performed because the electrical connection process between the module substrate and the main substrate is performed separately after the electrical connection process of the flexible printed circuit board and the module substrate is performed. There was also a problem of increased complexity and manufacturing time.
[Prior Art]
Republic of Korea Patent Publication No. 10-1008447
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a soldering method of a camera module that can simplify the soldering process of the camera module.
Another object of the present invention is to provide a soldering method of a camera module that can improve the electrical connection between the actuator and the module substrate and the external electrical connectivity.
Another object of the present invention is to provide a soldering method of a camera module that can improve the coating stability of the solder used in the electrical connection by soldering, and can prevent or minimize the electrical short caused by poor soldering.
In order to achieve the above object, the present invention comprises: a housing housing a lens module and an actuator for transporting the lens module, a module substrate coupled to a lower portion of the housing, and electrically connecting the actuator and the module substrate. A soldering method of a camera module including an actuator substrate, comprising: a solder coating step of dispensing solder between a connection terminal of the actuator substrate and a connection pad of the module substrate; And simultaneously soldering the module substrate to a main substrate of an external electronic component and simultaneously soldering the connection terminal and the connection pad to the soldering method of the camera module.
The simultaneous soldering step may be performed through a hot bar process.
Here, the solder may include a low temperature solder in the form of a cream.
In this case, it is preferable that the low temperature solder has a gold affinity.
The connection pad of the module substrate may be formed on an upper surface of the module substrate so as to correspond to the connection terminal of the actuator substrate.
Meanwhile, a connection terminal for soldering and a connection terminal formed on the main substrate of the external electronic component may be formed on the lower surface of the module substrate.
As described above, according to the soldering method of the camera module according to the present invention, there is an advantage that the productivity can be improved by simplifying the soldering process of the camera module and reducing the process time.
In addition, according to the soldering method of the camera module according to the present invention, the electrical connection between the actuator and the module substrate of the camera module and when mounting the camera module to an external electronic component has the advantage of improving the reliability by increasing the electrical connectivity. .
In addition, according to the soldering method of the camera module according to the present invention, there is an advantage to improve the coating stability of the solder used in the electrical connection by the soldering, and to prevent or minimize the electrical short due to poor soldering.
1 is a perspective view schematically showing a general camera module.
Figure 2a is a front side main portion photograph showing a state in which the reinforcement bonding in addition to the silver paste used when soldering the conventional camera module.
2B is an enlarged view of portion A of FIG. 4A.
Figure 3 is a front side main picture showing a problem in the soldering of the conventional camera module.
FIG. 4 is a side view main portion photograph corresponding to the photograph of FIG. 3.
5 is a block diagram schematically illustrating a soldering method of a camera module according to the present invention.
Figure 6 is a front side photograph showing the main portion of the camera module to which the soldering method of the camera module according to the present invention is applied.
FIG. 7 is a lateral side main part photograph corresponding to the photograph of FIG. 6.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention, in which the object of the present invention can be specifically realized, are described with reference to the accompanying drawings. In describing the present embodiment, the same name and the same reference numerals are used for the same configuration and additional description thereof will be omitted below.
Hereinafter, an embodiment of the soldering method of the camera module according to the present invention will be described in more detail with reference to FIGS. 5 to 7 as follows.
Figure 5 is a block diagram schematically showing a soldering method of the camera module according to the present invention, Figure 6 is a front side photograph showing the main portion of the camera module to which the soldering method of the camera module according to the present invention is applied, Figure 7 is Figure 6 A picture of the lateral side corresponding to the picture of.
Prior to the description of the present embodiment, the camera module applied to the present embodiment may have a configuration of a conventional general camera module. That is, the camera module of the present embodiment includes a housing in which a lens module and an actuator for transferring the lens module is accommodated, a module substrate coupled to a lower portion of the housing, and an actuator substrate electrically connecting the actuator and the module substrate. This configuration is the same as the configuration of a general camera module having an autofocus function or a zoom function, and thus a detailed description thereof will be omitted.
As shown in FIG. 5, an embodiment of the soldering method of the camera module according to the present invention may be configured to include a solder coating step S10 and a simultaneous soldering step S20.
Here, the solder coating step S10 may include a connection terminal 111 (see FIG. 6) of the actuator substrate 110 (see FIG. 6) of the camera module and a connection pad 121 of the module substrate 120 (see FIG. 6). And dispensing the solder 130 (see FIG. 6).
In the simultaneous soldering step (S20), the module substrate 120 is soldered to the main board 140 (see FIG. 7) of an external electronic component or an electronic product such as a mobile phone, and at the same time, the connection terminal 111 and the connection pad. It is a step of performing soldering between the 121.
At this time, the simultaneous soldering step (S20) may be performed through a hot bar process.
That is, the soldering method of the present embodiment may include soldering the module substrate 120 to the main substrate 140 in order to mount the module substrate 120 of the camera module on the main substrate 140 such as an external electronic component. Together, the module substrate 120 may be soldered simultaneously with the actuator substrate 110.
Accordingly, according to the soldering method of the present embodiment, there is an advantage that productivity can be improved and product cost can be reduced by reducing the manufacturing cost and manufacturing time according to the simplification of the manufacturing process.
Here, the solder 130 may include a low temperature solder in the form of a cream, wherein the low temperature solder preferably has a gold affinity.
Therefore, according to the soldering method of the camera module of the present embodiment, as shown in Figure 6, by using a low-temperature solder having a cream-like gold affinity, even if the application position of the solder is misaligned by self-aligned by the gold affinity This can increase the coating stability of the solder and improve the bonding.
In addition, as shown in Figure 7, according to the soldering method of the camera module of the present embodiment by using a low-temperature solder having a gold affinity in the form of a cream, the solder 130 through the self-aligned action by the gold affinity of the solder The 130 may prevent the tail from sagging toward the side of the module substrate 120, thereby preventing electrical shorts due to poor soldering, thereby increasing reliability.
Meanwhile, in the present exemplary embodiment, the connection pad 121 of the module substrate 120 is formed on the upper surface of the module substrate 120 to correspond to the connection terminal 111 of the actuator substrate 110. It is not limited to this.
In addition, a connection terminal 141 formed on the main board 140 of the external electronic component and a connection pad 122 for soldering may be formed on the bottom surface of the module substrate 120, but is not limited thereto. The connection pad 122 may be formed on the side surface of the module substrate 120.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, and that various changes, substitutions and alterations can be made therein without departing from the spirit and scope of the invention. However, it should be understood that such substitutions, changes, and the like fall within the scope of the following claims.
110: actuator substrate 111: connection terminal
120: module substrate 121: connection pad
130: solder

Claims (6)

  1. A soldering method of a camera module including a lens module and a housing accommodating an actuator for transferring the lens module, a module substrate coupled to a lower portion of the housing, and an actuator substrate electrically connecting the actuator and the module substrate.
    A solder coating step of dispensing solder between a connection terminal of the actuator substrate and a connection pad of the module substrate; And
    Simultaneously soldering the module substrate to a main substrate of an external electronic component and simultaneously soldering between the connection terminal and the connection pad;
    Soldering method of the camera module comprising a.
  2. The method of claim 1,
    The simultaneous soldering step is a soldering method of the camera module is performed through a hot bar process.
  3. The method of claim 1,
    The soldering method of the camera module including a low-temperature solder in the form of a cream (cream).
  4. The method of claim 3,
    The low temperature solder has a gold affinity (gold) has a soldering method of the camera module.
  5. The method of claim 1,
    The connection pad of the module substrate is soldering method of the camera module is formed on the upper surface of the module substrate so as to correspond to the connection terminal of the actuator substrate.
  6. 6. The method according to claim 1 or 5,
    A soldering method of a camera module, wherein a connection pad for soldering a connection terminal formed on a main substrate of the external electronic component is formed on a lower surface of the module substrate.
KR1020120021013A 2012-02-29 2012-02-29 Soldering method of camera module KR20130099470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120021013A KR20130099470A (en) 2012-02-29 2012-02-29 Soldering method of camera module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120021013A KR20130099470A (en) 2012-02-29 2012-02-29 Soldering method of camera module

Publications (1)

Publication Number Publication Date
KR20130099470A true KR20130099470A (en) 2013-09-06

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Application Number Title Priority Date Filing Date
KR1020120021013A KR20130099470A (en) 2012-02-29 2012-02-29 Soldering method of camera module

Country Status (1)

Country Link
KR (1) KR20130099470A (en)

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