KR20130093146A - Target material soldering method - Google Patents

Target material soldering method Download PDF

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Publication number
KR20130093146A
KR20130093146A KR1020137014872A KR20137014872A KR20130093146A KR 20130093146 A KR20130093146 A KR 20130093146A KR 1020137014872 A KR1020137014872 A KR 1020137014872A KR 20137014872 A KR20137014872 A KR 20137014872A KR 20130093146 A KR20130093146 A KR 20130093146A
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KR
South Korea
Prior art keywords
solder
target
back plate
metal wires
plurality
Prior art date
Application number
KR1020137014872A
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Korean (ko)
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KR101474380B1 (en
Inventor
리준 야오
지에 판
쉬에쩨 왕
하이준 위앤
Original Assignee
콘풍 매테리얼스 인터네셔널 컴퍼니 리미티드
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Filing date
Publication date
Priority to CN201010551265.2 priority Critical
Priority to CN 201010551265 priority patent/CN102039459B/en
Application filed by 콘풍 매테리얼스 인터네셔널 컴퍼니 리미티드 filed Critical 콘풍 매테리얼스 인터네셔널 컴퍼니 리미티드
Priority to PCT/CN2011/079652 priority patent/WO2012065471A1/en
Publication of KR20130093146A publication Critical patent/KR20130093146A/en
Application granted granted Critical
Publication of KR101474380B1 publication Critical patent/KR101474380B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom

Abstract

The target material soldering method includes placing an appropriate amount of solder 2 on the soldering surface of the target material 1 and / or the soldering surface of the back plate 3, and heating and melting the solder 2; Placing a plurality of metal wires on the soldering surface of the back plate 3 to support the target material 1; Contacting the soldering surface of the target material 1 with the soldering surface of the back plate 3; And cooling the solder 2 to complete soldering of the target material 1 and the back plate 3. In this method, a plurality of metal wires are disposed between the target material 1 and the back plate 3 such that a gap equal to the diameter of the metal wire is formed between the target material 1 and the back plate 3 to melt It will provide space for accommodating the solder 2. Thus, the flow solder 2 is in contact with the target material 1 and the back plate 3 and does not leak out due to compression during compression, and thus prevents a shortage of the solder 2 on the soldering surface, and thus the solder 2 Waste and reduce production costs.

Description

Target Material Soldering Method {TARGET MATERIAL SOLDERING METHOD}

The present invention claims priority to Chinese Patent Application No. 201010551265.2, filed November 18, 2010, entitled "TARGET MATERIAL WELDING METHOD".

TECHNICAL FIELD The present invention relates to the field of semiconductor manufacturing, and more particularly, to a target welding method.

In a conventional method, the semiconductor target is mainly bonded by a simple and fast solder bonding method. In the bonding process of the solder bonding method, filler metal (hereinafter referred to as 'solder') having a melting point lower than that of the base material (ie, the material to be bonded) is used. At the temperature between the melting point of the solder and the melting point of the base material, the liquid solder and the base material can dissolve and diffuse into each other, whereby the liquid solder wets the base material and diffuses onto the base material, I can fill my gap. After the cooling process, the liquid solder may solidify, thus joining different parts together.

In the joining process, there is no need to apply pressure to the welded parts (ie, the joined material) to prevent deformation of the welded parts caused by gravity. Selecting the appropriate solder according to the properties of the welded parts is important for solder bonding. In addition, because solder is very expensive, the amount of solder must be saved in the joining process and the production cost must be improved by improving the recovery of the solder.

However, solder is wasted a lot in conventional processes, and production costs are high because of poor technology for controlling the amount of solder and recovering solder. Hereinafter, a solder bonding process according to a conventional technique will be described in detail.

1-3 illustrate a bonding process of a solder bonding method in accordance with conventional techniques. In FIG. 1, a target 1 to be bonded is provided, with a moderate solder 2 disposed on the bonding surface of the target 1. In FIG. 2, a back plate 3 is provided, a groove 4 is formed on the joint surface of the back plate 3, and a moderate solder 2 is formed in the groove 4. ) Is placed. The bonding process may be performed as follows: heating the solder 2 on the bonding surface of the target 1 and the back plate 3 to melt it; Scanning the bonding surface with ultrasound; Placing the target (1) in the groove (4) of the back plate (3); Applying pressure to the target 1 to place the target 1 in intimate contact with the back plate 3 (shown in FIG. 3); And cooling the solder to bond the target 1 and the back plate 3 together.

During the joining process, the target may contact the back plate by pressing, but unfortunately, a portion of the flowable solder may be extruded, resulting in an improper solder for joining, affecting the quality of the joining. Can have In conventional techniques, a large amount of solder is used and the production cost is increased so that a relatively large amount of solder is used to prevent the overflow of the molten solder.

Embodiments of the present invention provide a target bonding method. According to the present invention, the amount of solder and the production cost are reduced without degrading the joining quality.

In one embodiment, the target welding method includes the following steps:

Placing a medium solder on the joint surface of the target and / or back plate and heating and melting the solder;

Placing a plurality of metal wires on the joint surface of the back plate to support the target;

Placing the joining surface of the target in contact with the joining surface of the back plate; And

Cooling the solder to bond the target and the back plate.

Optionally, the plurality of metal wires may have the same diameter.

Optionally, the diameter of the plurality of metal wires may be 0.1 mm to 0.5 mm.

Optionally, the target surface may bear a uniform force when in contact with the plurality of metal wires.

Optionally, a plurality of metal wires may be arranged parallel to each other at a specific distance.

Optionally, the atoms of the plurality of metal wires may have affinity with the atoms of the solder.

Optionally, the solder can be made of indium.

Optionally, the plurality of metal wires may be made of copper.

Optionally, grooves suitable for the size of the target may be formed on the bonding surface of the back plate.

Optionally, the target bonding method may further comprise ultrasonically scanning the bonding surface of the target and the back plate before placing the plurality of metal wires on the bonding surface of the back plate.

Compared with the conventional method, the present invention can have the following advantages.

According to the target joining method of the present invention, a plurality of metal wires are disposed on the joining surface of the back plate. As a result, a gap having a width equal to the diameter of the plurality of metal wires may be formed, and the gap may hold the molten solder. When the target is placed under pressure on the back plate, the target and the back plate can sustain a uniform force because a plurality of metal wires are supported. Thus, a bonding layer having an average thickness can be produced on the entire bonding surface, and solder waste caused by extruding some flowing solder can be prevented. In addition, as a conventional solution, it is not necessary to increase the amount of solder to keep enough solder on the joint surface, and further reduce the amount of solder and the production cost.

The molten solder also wets the metal wires and welded parts well so that the molten solder can be evenly distributed in the gap between the target and the back plate. Therefore, the bonding quality can be secured.

The objects, features and advantages of the present invention may be further understood with reference to the detailed description of the embodiments of the invention shown in the drawings. Like reference numerals are used throughout the drawings to refer to the same component. The drawings are intentionally drawn to scale for the purposes of the present invention without intentionally expanding to actual scale.
1 to 3 schematically illustrate the bonding process of the conventional solder bonding method.
4 schematically shows a flowchart of a target bonding method according to Embodiment 1 of the present invention.
5 and 6 schematically illustrate a method for placing a metal wire according to an embodiment of the invention.
7 schematically shows a flowchart of a target bonding method according to Embodiment 2 of the present invention.
8 to 11 schematically illustrate a target bonding method according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS For the sake of brevity, the objects, features, and advantages of the present invention, embodiments will be described in detail in conjunction with the accompanying drawings.

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced in other embodiments different from the embodiments described below. Accordingly, the described embodiments do not imply a limitation of the present invention.

In addition, embodiments of the present invention will be described in detail with the accompanying drawings. Partial illustration of the component structure may be partially enlarged, and exemplary drawings are not meant to limit the invention. In practice, three-dimensional scale including length, width, and depth must be considered.

As described in the background, in a conventional solder bonding method, when the target contacts the backplate by pressurization, the molten solder can easily be extruded, causing waste of solder. On the other hand, to keep enough solder between the target and the back plate, as much solder is used as possible and the waste of solder also increases. It has been found that the above problems are caused by the following reasons. When the target is in contact with the back plate, the solder between them under pressure will extrude without having space to flow. Therefore, in order to prevent the outflow of the solder, a space for holding the solder must be formed between the target and the back plate.

Also, in conventional techniques, when the target is in contact with the back plate by pressurization, the pressure may not be evenly distributed on the surface of the target and the back plate, which may cause the solder to leak out. In addition, due to the nonuniform pressure, the solder may be unevenly distributed on the bonding surface, and the bonding layer may have a nonuniform thickness.

Example 1

In this embodiment, a target welding method is provided. 4 shows a flowchart of the method. The method may include the following steps:

Step S101, placing a medium solder on the welding surface of the target and / or back plate and heating and melting the solder;

Step S102, placing a plurality of metal wires on the welding surface of the back plate to support the target;

Various methods exist for placing a plurality of metal wires. The plurality of metal wires must support the target and must maintain a uniform surface after contact with the plurality of metal wires by securing the surface of the target. The method for placing a plurality of metal wires can be adjusted according to the structure and shape of the welded parts. Specifically, when the welded parts are rectangular, a plurality of metal wires may be arranged in parallel and a certain distance may be maintained between the plurality of metal wires, and the welded parts may be triangular. In the case of, a plurality of metal wires may be arranged in parallel with one side of the triangle. In the latter case, if three metal wires are present, a new triangle can be formed by the three metal wires, and each of the plurality of metal wires is on one side of the triangle (ie welded parts). Parallel to the above, the two methods for placing the metal wires are shown in FIGS. 5 and 6, with reference numeral 11 representing welded parts and reference numeral 12 representing metal wires.

For other shaped welded parts, corresponding placement methods may be suitable, depending on the shape, and are not shown in detail herein. In most cases, the plurality of metal wires are arranged parallel to each other at regular intervals, and the plurality of metal wires must form a surface for supporting the target.

Step S103, applying some pressure to the surface of the target 1 to arrange the bonding surface of the target 1 in contact with the bonding surface of the back plate 3; And

Step S104, cooling the solder to bond the target and the back plate.

In this embodiment, it should be noted that a plurality of metal wires are arranged to form a space for holding the solder between the target and the back plate. When the target is in pressure contact with the back plate, a plurality of metal wires may support the target and prevent the solder from being extruded between the target and the back plate.

In general, in this embodiment a plurality of metal wires are only required to support the target. The plurality of metal wires may have different diameters. However, in order to ensure that the surface of the target carries uniform force and that the bonding layer between the target and the back plate has a uniform thickness, the plurality of metal wires in this embodiment have the same diameter, preferably between 0.1 mm and 0.5 mm.

Further, in the above embodiment, the lengths of the plurality of metal wires are not particularly limited, and only those suitable for the shape of the target and the back plate are required. In general, the length of the plurality of metal wires may not exceed the edge of the target. If the target is rectangular, a plurality of metal wires may be arranged in parallel in the longitudinal or width direction of the target, where the plurality of metal wires have an optimal equal length where the same length is longer than the length or width of the target Means not. When a plurality of metal wires are disposed perpendicular to the diagonal direction of the target, the plurality of metal wires may have different lengths, but two ends of one of the plurality of metal wires should not exceed any shaving of the target.

Likewise, the number of the plurality of metal wires in the above embodiment is also not specifically limited. Multiple metal wires are only required for the surface of the target to bear a uniform force. In general, when a plurality of metal wires are arranged in parallel, the number of the plurality of metal wires may be two or three.

In the above embodiment, it should be noted that selecting a plurality of metal wires is also not specifically limited. However, the plurality of metal wires must be well diffused and bonded with the solder, that is, the plurality of metal wires can be smoothly wetted with the solder. Wetting may include the molten solder forming the alloying tool having a good adhesion on the surface of the uniform, smooth, continuous, bonded metal during the wetting process. Conditions for the molten solder to wet the surface of the solid object may include: smooth surfaces of the solder and metal, and liquid solder and bonded metal that dissolve with each other, ie, metals having affinity for atoms of the solder Atom. Thus, in this embodiment, the atoms of the plurality of metal wires have affinity with the atoms of the solder and the surfaces of the plurality of metal wires are smooth.

It should also be noted that grooves may not be formed on the joining surface of the back plate in this embodiment. However, in order for the target to be placed in intimate contact with the back plate and to prevent the flow of molten solder, grooves suitable for the size of the target may be formed on the bonding surface of the back plate. The groove can have a small depth that is less than or equal to the sum of the diameters of the plurality of metal wires and the thickness of the target. Generally, the depth is equal to or less than the diameter of the plurality of metal wires.

In this embodiment, the plurality of metal wires is disposed between the target and the back plate. Thus, the gap can be formed to have the same width as the diameter of the plurality of metal wires, and the gap can hold the molten solder. When the target is placed on the back plate by pressurization, the molten solder may not be extruded, and the lack of solder on the joint surface may be prevented. Thus, there is no need to increase the amount of solder to maintain sufficient solder between the target and the back plate, which reduces the amount of solder and the production cost.

In addition, because the plurality of metal wires have the same diameter, the surface of the target and the liquid solder support uniform force. The molten solder also wets the plurality of metal wires and welded parts well, so that the molten solder can be evenly distributed in the gap between the target and the back plate. Therefore, the thickness of the bonding layer of the whole bonding surface is uniform, thereby ensuring the bonding quality.

Example 2

In this embodiment, a flowchart of the target bonding method is shown in FIG. The above embodiment differs from the previous embodiment, prior to placing the metal wire on the joining surface of the back plate, the target joining method may further include:

Step S202, ultrasonically scanning the bonding surfaces of the target and the back plate to ensure a smooth bonding surface.

The target bonding method is described using, for example, a solder made of indium. In the above embodiment, the joint surface of the back plate has a groove. Since copper wires are easy to diffuse and bond with solders made of indium, solders made of indium can wet well on the surfaces of copper wires and welded parts to ensure bonding quality. Thus, the use of copper wires is described later.

Solders made of indium are widely used to bond all kinds of semiconductor targets such as tungsten targets, titanium targets, molybdenum targets, chromium targets, nickel targets, silver targets, or ITO targets. Since indium is very expensive, the amount of indium has to be reduced and used efficiently during bonding to save resources and reduce production costs.

8 to 11, in FIG. 8, a target 1 to be bonded is provided, and a moderate solder 2 is disposed on the bonding surface of the target 1. In FIG. 9, a back plate 3 is provided, a groove 4 is formed on the joining surface of the back plate 3, and a moderate solder 2 is disposed in the groove 4.

The bonding process is carried out as follows. First, a moderate solder 2 is placed on the joint surface of the target 1 and the back plate 3. Thereafter, the welded parts including the target 1 and the back plate 3 are heated until the solder is melted. Ultrasonic scanning of the weld surface of the welded parts. Thereafter, two or three copper wires 5 having a suitable length and the same diameter can be arranged in parallel on the joint surface of the back plate 3 (shown in FIG. 10) to support the target 1. have. Thereafter, the bonding is performed. The joining surface of the target 1 is pressed into contact with the joining surface of the back plate 3, that is, the target 1 is arranged to bring the target 1 into close contact with the back plate 3. 3) disposed in the upper groove (4). Thereafter, the molten solder 2 is cooled and solidified. In this way, the target 1 and the back plate 3 are joined together (shown in FIG. 11).

Based on the bonding process, the thickness of the bonding layer between the target 1 and the back plate 3 is uniform, and since the solder is hardly extruded, it is possible to considerably reduce the amount of solder and reduce the production cost. have.

Although the present invention has been described with reference to the preferred embodiments as described above, it is not limited thereto. Those skilled in the art can modify and change the embodiments without departing from the spirit and scope of the invention. Accordingly, any modifications and equivalent changes that fall within the scope of the present invention without departing from the scope of the present invention shall fall within the protection scope of the present invention.

Claims (10)

  1. Placing a medium solder on the joint surface of the target and / or back plate and heating and melting the solder;
    Placing a plurality of metal wires on the bonding surface of the back plate to support the target;
    Placing the joining surface of the target in contact with the joining surface of the back plate; And
    Cooling the solder to bond the target and the back plate.
  2. The method of claim 1,
    And a plurality of metal wires have the same diameter.
  3. The method of claim 2,
    The target joining method of the plurality of metal wires has a diameter of 0.1mm to 0.5mm.
  4. The method of claim 2,
    And a target surface bears a uniform force when in contact with the plurality of metal wires.
  5. 5. The method of claim 4,
    And the plurality of metal wires are arranged parallel to each other at a specific distance.
  6. The method of claim 1,
    And the atoms of the plurality of metal wires have affinity with the atoms of the solder.
  7. The method according to claim 6,
    And the solder is made of indium.
  8. 8. The method of claim 7, wherein the plurality of metal wires are made of copper.
  9. 9. The method according to any one of claims 1 to 8,
    A method of joining targets, wherein grooves suitable for the size of the target are formed on the joining surface of the back plate.
  10. 10. The method of claim 9,
    And ultrasonically scanning the target and the bonding surface of the back plate before placing a plurality of metal wires on the bonding surface of the back plate.
KR1020137014872A 2010-11-18 2011-09-15 Target material soldering method KR101474380B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201010551265.2 2010-11-18
CN 201010551265 CN102039459B (en) 2010-11-18 2010-11-18 Target material welding method
PCT/CN2011/079652 WO2012065471A1 (en) 2010-11-18 2011-09-15 Target material soldering method

Publications (2)

Publication Number Publication Date
KR20130093146A true KR20130093146A (en) 2013-08-21
KR101474380B1 KR101474380B1 (en) 2014-12-18

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CN (1) CN102039459B (en)
WO (1) WO2012065471A1 (en)

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CN102039459B (en) * 2010-11-18 2012-09-19 宁波江丰电子材料有限公司 Target material welding method
CN102554447A (en) * 2011-12-26 2012-07-11 昆山全亚冠环保科技有限公司 Method for welding high-purity Al target material welding
CN103506725B (en) * 2012-06-18 2016-03-09 宁波江丰电子材料股份有限公司 The preparation method of target material assembly
CN103658898B (en) * 2012-09-20 2016-03-16 宁波江丰电子材料股份有限公司 Welding method of target assembly
CN103692041A (en) * 2012-09-28 2014-04-02 宁波江丰电子材料有限公司 Brazing method for silicon target component
JP6567048B2 (en) 2014-06-27 2019-08-28 プランゼー コンポジット マテリアルズ ゲーエムベーハー Sputtering target
CN104195513A (en) * 2014-08-11 2014-12-10 昆山海普电子材料有限公司 Nickel-platinum alloy target with copper alloy backing plate and preparation method of nickel-platinum alloy target
CN106624235A (en) * 2015-10-30 2017-05-10 宁波江丰电子材料股份有限公司 Target material assembly and manufacturing method thereof
CN106695145A (en) * 2015-11-17 2017-05-24 宁波江丰电子材料股份有限公司 Welding method for target material
CN107511599A (en) * 2016-06-15 2017-12-26 宁波江丰电子材料股份有限公司 The welding method of tantalum target component
CN107617825A (en) * 2016-07-14 2018-01-23 宁波江丰电子材料股份有限公司 The manufacture method of nickel target material assembly
CN107755837A (en) * 2016-08-18 2018-03-06 宁波江丰电子材料股份有限公司 The manufacture method of target material assembly
CN108070834A (en) * 2016-11-18 2018-05-25 宁波江丰电子材料股份有限公司 Backboard and forming method thereof
CN108149203A (en) * 2016-12-05 2018-06-12 宁波江丰电子材料股份有限公司 The manufacturing method of target material assembly
CN109093218B (en) * 2017-06-20 2019-12-27 宁波江丰电子材料股份有限公司 Manufacturing method of target assembly
CN108544045A (en) * 2018-04-20 2018-09-18 宁波江丰电子材料股份有限公司 A kind of tungsten target material welding method and tungsten target material component
CN108790365A (en) * 2018-06-07 2018-11-13 苏州精美科光电材料有限公司 A kind of device and method ensureing indium layer thickness evenness

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KR101474380B1 (en) 2014-12-18
WO2012065471A1 (en) 2012-05-24
CN102039459A (en) 2011-05-04
CN102039459B (en) 2012-09-19

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