KR20130084206A - Method for breaking brittle material substrate - Google Patents

Method for breaking brittle material substrate Download PDF

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Publication number
KR20130084206A
KR20130084206A KR1020120132161A KR20120132161A KR20130084206A KR 20130084206 A KR20130084206 A KR 20130084206A KR 1020120132161 A KR1020120132161 A KR 1020120132161A KR 20120132161 A KR20120132161 A KR 20120132161A KR 20130084206 A KR20130084206 A KR 20130084206A
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KR
South Korea
Prior art keywords
substrate
method
elastic sheet
formed
brittle material
Prior art date
Application number
KR1020120132161A
Other languages
Korean (ko)
Other versions
KR101416176B1 (en
Inventor
마사카즈 다케다
켄지 무라카미
켄타 다무라
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Priority to JPJP-P-2012-006520 priority Critical
Priority to JP2012006520A priority patent/JP5824365B2/en
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20130084206A publication Critical patent/KR20130084206A/en
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Publication of KR101416176B1 publication Critical patent/KR101416176B1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0095Post-treatments of the devices, e.g. annealing, recrystallisation, short-circuit elimination
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00Severing by means other than cutting; Apparatus therefor
    • B26F3/04Severing by squeezing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

Abstract

PURPOSE: A method for braking a brittle material substrate is provided to simply implement position determination as far as possible, thereby braking the substrate along a scribe groove between adjacent protrusions without damage to the protrusions. CONSTITUTION: A method for braking a brittle material substrate (W) pushes the substrate along a scribe groove (S) between adjacent protrusions (13) on the surface of the substrate. The method includes: a step of covering the protrusions with concave portions (15) using an elastic sheet (16) having the lattice-shaped concave portions corresponding to the position of each protrusion; and a step of putting the substrate on a supporting unit (21) in contact with the sheet, and pushing a brake bar (22) from the rear side of the substrate in order to brake the substrate. The protrusions protrude from the surface of the substrate, and are shaped into a lattice.

Description

[0001] METHOD FOR BRAKING BRITTLE MATERIAL SUBSTRATE [0002]

The present invention relates to a brittle material substrate in which a product unit as a unit area at the time of dividing is formed in a lattice pattern and each product unit is provided with a protrusion protruding from the substrate surface, To a break method for each product unit.

In the process of dividing a brittle material substrate such as a ceramic substrate or a glass substrate, a tool for grooving such as a cutter wheel (also referred to as a scribing wheel) is used, or a laser beam is irradiated, A method of thermally forming a scribe line and thereafter reversing the substrate and applying an external force from the back side along the scribe line by a break bar to bend the substrate to divide the substrate by braking is generally used And is disclosed as an example of a conventional example of Patent Document 1.

Fig. 5 is a diagram showing a sequence of an example of the general division method described above.

First, as shown in Fig. 5 (a), a processed substrate W of a brittle material is placed on a table 40 of a scribing apparatus, and a scribe line S is formed on the surface thereof with a cutter wheel 41 .

Subsequently, as shown in Fig. 5 (b), the processing board W is placed on the table 42 of the brake unit on which the cushion sheet 43 of the elastic body is laid. At this time, the surface (the surface side) on which the scribe line S of the processed substrate W is formed is directed to the cushion sheet 43 side, and the opposite surface (back side) is inverted to be the upper surface.

The plate-like break bar 44 extending downward along the scribe line S is lowered from above the downward scribe line S and is pushed from the back side of the processed substrate W, The processed substrate W is slightly bent in a V-shape on the cushion sheet 43 to break the scribe line S (crack) into the depth direction. Thus, the processed substrate W is divided along the scribe line S.

Japanese Patent No. 3787489

In the case of the processed substrate W divided by the braking method shown in Fig. 5, in many cases, functional devices are patterned on the surface of the substrate. However, Is a thin film which can be regarded as a thin film.

However, depending on the substrate to be processed, the substrate may have to be divided in the state where the projecting portion is formed on the surface.

Fig. 2 is a perspective view (Fig. 2 (a)) showing a processed substrate W in which protrusions are formed in a lattice shape on the substrate surface and a cross-sectional view (Fig. 2 (b)) on a surface transverse to the adjacent protrusions. As such a substrate, there is a mother board for an LED which is divided in a state where, for example, a resin cap serving as a protruding portion is fixed, in addition to the case where the projection itself is formed on the substrate itself.

When the mother substrate for the LED is a processed substrate W, for example, an element (LED) E is formed to be embossed in a tetragonal lattice form on an alumina ceramic substrate 11, and each element E The resin part 14 formed integrally with the sheet surface 12 of the silicone resin and the cap (protruding part) 13 is fixed on the top surface of the resin part 14 and the element E is sealed. The gap L1 between the adjacent caps 13 is about 0.5 mm to 2.5 mm and the thickness L2 of the resin component 14 is about 0.5 mm to 2 mm and the thickness L1 of the ceramic substrate 11 L3) is 0.3 mm to 1 mm.

A groove machining tool such as a cutter wheel 41 (see Fig. 5) or a focal point of the laser beam is positioned at the position of the sheet surface 12 between the adjacent caps 13 and scribed mechanically or thermally The scribe grooves S are formed and then broken along the scribe grooves S to separate each product unit (LED element).

In the following description, the surface having the protruding portion is referred to as the substrate surface side, and the opposite side is referred to as the back surface side.

However, after the scribe groove S is formed, the processed substrate W is reversed to press the brake lever from the back side, so that the processed substrate W is moved from the top of the spherical surface of the cap 13 The pressing force from the brake lever is inevitably concentrated on the center of the spherical surface of the cap 13, because it is brought into contact with the table of the brake apparatus. Therefore, even if the cushion sheet is laid on the table, there is a possibility that the cap 13 is damaged because a concentrated load is applied.

Further, since the position of the scribe groove is not visible from the back side as long as the substrate is not a transparent material, the position of the scribe groove can not be seen, It is not possible to determine the position with reference to the groove itself, and an extra step such as providing markers on the back surface of the substrate or on the substrate side is necessary in advance.

SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a braking method capable of braking a brittle material substrate having protrusions protruding from the surface of a substrate, without breaking the protrusions when braking along a scribe groove formed between adjacent protrusions The purpose is to provide.

Another object of the present invention is to provide a braking method that is as simple as possible positioning.

According to the present invention, there is provided a braking method for braking a brittle material substrate, the brittle material substrate having protrusions protruding from the surface of the substrate in a lattice form, along a scribe groove formed between adjacent protrusions on the substrate surface, Wherein each of the protrusions is placed so as to be embedded in the concave portion, and the elastic sheet is pressed against the support means (for example, , Table), the substrate is placed on the supporting means, and the brake bar is pressed from the back side of the substrate to brake.

According to the present invention, since the protruding portion is embedded in the concave portion of the elastic sheet, only when the protruding portion is pressed by the brake bar from the back side, the protruding portion is not brought into contact with the supporting means (e.g., table) The load is concentrated on only the protruding portion and is not applied. Therefore, breakage can be performed without damaging the projection.

In the above invention, it is preferable that the elastic sheet is made of a transparent material, and when the supporting means is a table, an opening for visualizing the scribe groove is formed immediately below the brake bar.

Alternatively, the elastic sheet is made of a transparent material, and the table is also preferably a transparent material. For example, a glass table.

In this way, since the scribe grooves can be seen from the table side, accurate positioning can be performed simply by using the scribe grooves.

In the case where the elastic sheet is an opaque material, it is possible to use those having openings or the like for observing the scribe grooves. The opening or the like may be any shape as long as an opening portion having a shape and a size capable of observing at least a part of the scribe groove from the table side is formed and the end portion of the elastic sheet is cut- May be observed.

In the case where the supporting means is a table, a plurality of (usually two) rod-like members or a plate-like member (for example, a brake bar) divided into two or more pieces, a plurality of members The scribe groove may be observed from the clearance of the plate member, plate member, etc.).

Fig. 1 is a view for explaining an example of a cutting process including a breaking method according to the present invention.
Fig. 2 is a perspective view and a cross-sectional view showing an example of a mother substrate (LED substrate) having protrusions.
3 is a perspective view showing an example of the elastic sheet.
4 is a perspective view showing a state in which a brake bar is pressed against a substrate.
Fig. 5 is a diagram showing a sequence of an example of a conventional general dividing method.

(Mode for carrying out the invention)

Hereinafter, the break method of the present invention will be described in detail with reference to the drawings.

Fig. 1 is a view for explaining an example of a cutting processing sequence including the breaking method of the present invention. Here, a case of processing the processed substrate W for LED shown in Fig. 2 will be described.

Fig. 1 (a) is a cross-sectional view of a processed substrate W having protrusions described in Fig. 2 cut out in a cross section across a cap (protrusion) The resin part 14 in which the sheet surface 12 and the cap 13 are integrally formed is fixed on the ceramic substrate 11 on which the element E is formed.

Then, a scribe groove S is formed at an intermediate position of the adjacent protruding portions 13 by a conventional scribing device which is conventionally used before performing the breaking process. The method of forming the scribe groove S is not particularly limited. For example, the scribe groove 41 described in Fig. 5 can be processed by a method of rolling the scribe groove 41. In addition, a scribe groove may be formed using thermal stress by laser irradiation depending on the substrate material. The scribe groove S is at least the depth reaching the ceramic substrate 11 beyond the sheet surface 12 of the resin component 14. [

Before forming the scribe grooves S in the ceramic substrate 11, the scribe grooves S corresponding to the scribe grooves S to be formed on at least the ceramic substrate 11 on the sheet surface 12 of the resin component 14 The scribe groove S may be formed in the ceramic substrate 11 after removing the portion (the portion along the scribe groove S). As a method of removing the resin component, for example, dicing (cutting using a diamond saw or the like), removal by laser light irradiation, or the like can be employed depending on the kind of the resin component 14 or the like.

The cap 13 of the processed substrate W is covered with the concave portion 15 of the elastic sheet 16 by using the elastic sheet 16 having the concave portion formed thereon.

3 is a perspective view showing an example of the elastic sheet. The elastic sheet 16 is made of a transparent material, for example, a highly transparent silicone rubber, and is permeable to the inside so that the opposite side can be seen. The recess 15 may have a shape or a size that can prevent only the portion of the cap 13 from coming into contact with the elastic sheet 16 and may be a through hole as shown in Fig.3, In the case of a hole with a bottom, there is a depth in which a space is formed above the top of the cap 13 when the cap 13 is embedded in view of the effect of preventing the breakage of the cap 13, It is better to use a hole.

Fig. 1 (b) is a cross-sectional view of a processed substrate W showing a state in which all the caps 13 are embedded in the concave portions 15 to cover the elastic sheet 16. Fig. The elastic sheet 16 is brought into contact with the seat surface 12 of the resin component 14 and the cap 13 enters into the recess 15. The position of the scribe groove S can be confirmed through the transparent elastic sheet.

Subsequently, the processed substrate W on which the elastic sheet 16 is placed is pressed from the back side to perform braking. Fig. 1 (c) is a sectional view showing the state of the processed substrate W at the time of braking. 4 is a perspective view showing a state in which the brake bar 22 is pressed against the processed substrate W. In Fig.

The processed substrate W is reversed so that the elastic sheet 16 is brought into contact with the table 21 and placed on the brake device.

In the table 21 of the brake device, an opening 23 for position confirmation is formed at a position immediately below the brake bar 22. As shown in Fig. The elastic sheet 23 can be seen through the opening 23 and the elastic sheet 23 itself is made of a transparent material so that the position of the scribe groove S is set at a position (Not shown) through the elastic sheet 16 and the opening 23. The elastic sheet 16 and the opening 23 are formed in the same manner as in the first embodiment.

The position of the scribe groove S formed on the processed substrate W can be adjusted by a manual or transport robot while confirming the position of the scribe groove S on the processed substrate W by a camera .

The brake bar 22 is lowered in the state of alignment, and brake processing is performed. At this time, when the pressing force of the brake bar 22 is applied, a load is transmitted to the ceramic substrate 11, the seat surface 12 of the resin component 14, and the elastic sheet 16, Is contained in the space of the recessed portion 15 and does not contact the table 21, so that no load is applied.

Therefore, it is possible to break along the scribe groove S without damaging the cap 13.

Although the exemplary embodiments of the present invention have been described above, the present invention is not necessarily limited to the configurations of the above-described embodiments.

For example, in the above embodiment, the positioning opening 23 is formed in the table, but instead of this, the table 21 itself may be glass-made and made transparent.

In addition, although the above embodiment has been described about the division processing of the mother board for LED, the same breaking method can be applied to the solder balls and the board with bumps.

INDUSTRIAL APPLICABILITY The present invention can be applied to braking of a brittle material substrate on which protrusions are formed.

W: processed substrate (brittle material substrate)
S: scribe home
11: Ceramic substrate
12: Seat face
13: Cap (protrusion)
14: Resin parts
15: concave portion (through hole or hole with bottom)
16: Elastic sheet
21: table (supporting means)
22: Brake bar
23: opening

Claims (3)

  1. Breaking the brittle material substrate having a projection formed from the surface of the substrate in a lattice shape by pushing the brake bar from the back surface side of the substrate along a scribe groove formed between adjacent projections on the surface of the substrate. As a brake method,
    Using the elastic sheet in which the lattice-shaped recessed part corresponding to the position of each said protrusion part was formed, the said protrusion part is covered so that it may be buried in the said recessed part,
    Placing the substrate on the support means with the elastic sheet in contact with the support means,
    The brake method of the brittle material board | substrate which presses and brakes the said brake bar from the back surface side of the said board | substrate.
  2. The method of claim 1,
    Wherein the elastic sheet is made of a transparent material, and the supporting means is a table having an opening for visualizing the scribe groove immediately below the brake bar.
  3. The method of claim 1,
    Wherein said elastic sheet is made of a transparent material, and said supporting means is also a table made of a transparent material.
KR1020120132161A 2012-01-16 2012-11-21 Method for breaking brittle material substrate KR101416176B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-006520 2012-01-16
JP2012006520A JP5824365B2 (en) 2012-01-16 2012-01-16 Breaking method for brittle material substrate

Publications (2)

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KR20130084206A true KR20130084206A (en) 2013-07-24
KR101416176B1 KR101416176B1 (en) 2014-07-08

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KR (1) KR101416176B1 (en)
CN (1) CN103203806B (en)
TW (1) TWI499492B (en)

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JP6154713B2 (en) * 2013-09-30 2017-06-28 三星ダイヤモンド工業株式会社 Method and apparatus for breaking brittle material substrate
JP6185812B2 (en) * 2013-09-30 2017-08-23 三星ダイヤモンド工業株式会社 Method and apparatus for breaking brittle material substrate
JP6213134B2 (en) * 2013-10-16 2017-10-18 三星ダイヤモンド工業株式会社 Elastic support plate, breaking device and dividing method
JP6115438B2 (en) * 2013-10-16 2017-04-19 三星ダイヤモンド工業株式会社 Breaking device and cutting method
JP6268917B2 (en) * 2013-10-25 2018-01-31 三星ダイヤモンド工業株式会社 Break device
JP6243699B2 (en) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 Fragment material substrate cutting device
JP6331656B2 (en) * 2014-04-28 2018-05-30 三星ダイヤモンド工業株式会社 Method and apparatus for conveying brittle material substrate
JP6287547B2 (en) * 2014-04-28 2018-03-07 三星ダイヤモンド工業株式会社 Inverting device for brittle material substrate
JP6561565B2 (en) * 2015-04-30 2019-08-21 三星ダイヤモンド工業株式会社 Method and apparatus for dividing bonded substrate
JP6528581B2 (en) * 2015-07-28 2019-06-12 三星ダイヤモンド工業株式会社 Break device, method of breaking substrate, and member for substrate mounting portion of break device
JP2017001180A (en) * 2016-09-29 2017-01-05 三星ダイヤモンド工業株式会社 Surface layer fracturing apparatus of brittle material substrate
TWI632040B (en) * 2017-07-10 2018-08-11 煜峰投資顧問有限公司 Apparatus and method for breaking brittle substrate
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JP2013144421A (en) 2013-07-25
TW201331009A (en) 2013-08-01
CN103203806B (en) 2015-12-09
TWI499492B (en) 2015-09-11
JP5824365B2 (en) 2015-11-25
KR101416176B1 (en) 2014-07-08
CN103203806A (en) 2013-07-17

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