KR20130035548A - Development of spray materials for pool runner by using silicon slurry - Google Patents
Development of spray materials for pool runner by using silicon slurry Download PDFInfo
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- KR20130035548A KR20130035548A KR20110099906A KR20110099906A KR20130035548A KR 20130035548 A KR20130035548 A KR 20130035548A KR 20110099906 A KR20110099906 A KR 20110099906A KR 20110099906 A KR20110099906 A KR 20110099906A KR 20130035548 A KR20130035548 A KR 20130035548A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/40—Compounds of aluminium
- C09C1/407—Aluminium oxides or hydroxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/91—Use of waste materials as fillers for mortars or concrete
Abstract
Description
본 발명은 제철 공정의 대탕도 보수재로 이용할 수 있는 스프레이재 내화물에 관한 것으로, 보다 상세하게는 실리콘 웨이퍼를 만드는 절단공정에서 사용되는 와이어는 평균 입경20㎛의 실리콘 카바이드(SiC) 등을 함유한 절단용 슬러지를 사용하고 있다. 대부분의 국내 실리콘 웨이퍼 제조 공정에서는 많은 양의 SiC와 실리콘 입자, 그리고 절삭유등이 함유되어 있는 슬러지가 발생되 있으며, 이 슬러지는 몇 년 전까지만 해도 폐기물 처리 업체에 의해 전량 매립처리되어 왔다. The present invention relates to a spray material refractory material that can be used as a refining material for steelmaking processes, and more particularly, a wire used in a cutting process for making a silicon wafer includes silicon carbide (SiC) having an average particle diameter of 20 μm or the like. I use the sludge for the dragon. Most domestic silicon wafer manufacturing processes produce sludge containing a large amount of SiC, silicon particles, and cutting oil, which have been completely reclaimed by waste disposal companies until a few years ago.
따라서 이 슬러지를 재활용하여, 처분 또는 폐기에 요하는 비용을 절감과 동시에 자원의 활용성을 높이는 것이다.
Therefore, the sludge is recycled, thereby reducing the cost of disposal or disposal and increasing the utilization of resources.
실리콘 웨이퍼를 만드는 절단공정에서 버려지는 실리콘 슬러지는 가공 슬러리가 차지고 있는 비중이 약68.1%를 차지하고 있어 이러한 실리콘 스러지 중에 함유되어 있는 평균 입경 20㎛정도의 SiC와 절삭유를 분리, 회수하여 실리콘 웨이퍼의 절단공정에서 재이용할 수 있는 기술이 개발되어 현재 적용중에 있다. 그러나 이와 같이 발생되는 슬러지로부터 재이용할 수 있는 성분을 분리 회수하여 재활용 하는 경우에 있어서도 최종적인 잔류물로 남아 배출되는 폐슬러지가 2010년 기준으로 년간 약21,000톤 정도인 것으로 알려져 있으며, 추후 태양광 실리콘 웨이퍼 산업의 급격한 성장과 함께 폐슬러지의 발생량 또한 크게 증가할 것으로 판단된다. 따라서 실리콘 스러지 중에 함유되어 있는 평균 20㎛의 SiC성분은 94.6%로 대탕도에 적용되고 있는 SiC성분 91.5% 대비 높아 대탕도 스프레이재에 내화물용 원재료로 활용이 가능하다.
Silicon sludge, which is discarded in the cutting process for making silicon wafers, accounts for about 68.1% of the processing slurry, and separates and recovers SiC and cutting oil having an average particle diameter of about 20 μm contained in the silicon sludge. A technology that can be reused in the cutting process has been developed and is currently being applied. However, even in the case of recovering and recycling components that can be reused from the sludge generated as such, the waste sludge remaining as a final residue is known to be about 21,000 tons per year as of 2010. Along with the rapid growth of the wafer industry, the amount of waste sludge will also increase significantly. Therefore, the average 20㎛ SiC component contained in the silicon sludge is 94.6%, which is higher than the 91.5% of the SiC component applied to the water bath, and the water bath can also be used as a raw material for refractory materials in spray materials.
본 발명은 상기와 같은 종래 기술의 문제점을 해결하기 위한 것으로 실리콘 웨이퍼를 만드는 절단공정에서 버려지는 실리콘 슬러지를 이용한 대탕도 스프레이재 제조방법을 제공하는데 그 목적이 있다.
The present invention is to solve the problems of the prior art as described above is to provide a method for producing a large water spray material using silicon sludge discarded in the cutting process for making a silicon wafer.
상기의 목적을 달성하기 위하여 본 발명은 실리콘 웨이퍼를 만드는 절단공정에서 버려지는 시리콘 슬러지를 이용한 대탕도 스프페이재 제조 방법을 제공한다.
In order to achieve the above object, the present invention provides a method for producing a large hot water soup material using silicon sludge discarded in a cutting process for making a silicon wafer.
상술한 바와 같이, 본 발명은 실리콘 웨이퍼를 만드는 절단공정에서 버려지는 실리콘 슬러지를 재활용하여, 처분 또는 폐기에 요하는 비용을 절감과 동시에 자원의 활용성을 높이는 효과가 있다.
As described above, the present invention recycles the silicon sludge discarded in the cutting process for making the silicon wafer, thereby reducing the cost of disposal or disposal and increasing the utilization of resources.
본 발명은 중량%로, 태양광 실리콘 슬러지 10~40%, 알루미나 40~70%, 폴리 프로필렌 파이브 0.5~1% 나머지는 100중량부에 대해 결합재(Sodium Silicate Powder) 1~5%를 포함하는 태양광 실리콘 슬러지을 이용한 대탕도 스프레이재 내화 조성물에 관한 것이다.The present invention is a weight percent, solar silicon sludge 10 to 40%, alumina 40 to 70%, polypropylene pipe 0.5 to 1%, the remainder is 1 to 5% by weight (Sodium Silicate Powder) to 100 parts by weight It relates to a large water spray material refractory composition using photosilicone sludge.
이하, 본 발명의 성분한정 이유부터 살펴본다.Hereinafter, look at from the reasons for the limitation of the present invention.
태양광 실리콘 슬러지: 10~40중량% Solar Silicon Sludge: 10 ~ 40% by weight
태양광 실리콘 스러지는 절단공정에서 버려지는 실리콘 슬러지는 평균 입경 20㎛Photovoltaic Silicon Sludge is discarded in the cutting process.
다.All.
상기 실리콘 슬러지는 현재 대탕도 스프레이재에 적용되고 SiC를 대체하기 위한 것으로 버려지는 실리콘 슬러지을 내화재로 다시 이용한다는 측면에서 본 발명의 핵심이 되는 성분이다, 상기 실리콘 슬러지는 함량이 10중량% 미만이면 본 발명이 목표로 하는 실리콘 슬러지의 재활용 측면에서 효율성이 저하되고, 30중량%를 초과하면 소결성 저하로 내식성이 저하될 뿐만 아니라 입도 구성이 맞지 않게 되어 시공성도 저하는 문제점이 있으므로, 그 함량을 10~40중량%로 제한하였다.The silicon sludge is a key component of the present invention in terms of reusing the silicon sludge, which is currently applied to a large-scale spray material and discarded as a substitute for SiC, as a refractory material. In the aspect of recycling of the silicon sludge aimed at the invention, the efficiency is lowered, and if it exceeds 30% by weight, not only the corrosion resistance is lowered due to the decrease in sintering property, but also the size of the composition is not matched, and the workability is also lowered. Limited to 40% by weight.
알루미나: 40~70중량% Alumina: 40 ~ 70 wt%
상기 알루미나는 기계적 강도가 크고 각종 슬라그에 대한 저항성이 크며 비중이 크다는 특징있어 스프레이재를 공기로 이송할 때 이송 문제가 발생할 가능성이 있으므로 분쇄물의 입도는 3mm이하로 설계하였으며, 40중량% 미만이면 투사성과 내식성이 저하되며 70중량%를 초과하여 첨가되면 단가적인 측면과 리바운드(Rebound)가 발생 되어 부착성 저하가 발생한다. The alumina is characterized by high mechanical strength, high resistance to various slags, and high specific gravity. Therefore, there is a possibility that a transfer problem may occur when the spraying material is transported by air. Its performance and corrosion resistance is lowered, and if it is added in excess of 70% by weight, the unit cost is reduced and rebound occurs, resulting in deterioration of adhesion.
폴리 프로필렌 섬유(Polypropylene fiber) : 0.5~1중량%Polypropylene fiber: 0.5 ~ 1 wt%
상기 폴리 프로필레 섬유는 투사후 시공체에서 수증기가 빠져 나갈수 있도록 안내 역할하여 폭열 방지 효과가 있으며, 0.5중량% 미만시는 첨가 효과가 미미하며, 1중량% 초가하면 저장 호퍼(Hopper)에서 브리지(Bridge) 현상이 발생되어 원료가 이송되는 것을 방해한다.The polypropylene fiber has a thermal protection effect by guiding the water vapor to escape from the projected body after the projection, and when less than 0.5% by weight, the addition effect is insignificant, when the weight of more than 1% by weight bridge (Hopper) bridge ( Bridge) phenomenon occurs, which hinders the transfer of raw materials.
결합재(Sodium Silicate Powder): 1~5중량%Sodium Silicate Powder: 1 ~ 5% by weight
상기 결합재(Sodium Silicate Powder)는 시공시 경화작용을 부여하는 성분으로 1중량% 미만이면 결합강도가 약하고, 5중량% 초과되면 결합강도 증가로 폭열이 발생되므로, 그 함량을 1~5중량%로 제한하는 것이 바람직하다.The binder (Sodium Silicate Powder) is a component that imparts a hardening effect during construction, when less than 1% by weight, the bonding strength is weak, and when more than 5% by weight, the bond strength increases, so that the thermal expansion occurs, the content is 1 to 5% by weight. It is desirable to limit.
이하, 실시예를 통하여 본 발명을 보다 상세하게 설명한다.Hereinafter, the present invention will be described in more detail with reference to Examples.
하기의 표1과 같은 조성의 스프레이재를 혼련한 다음, 시편성형, 양생, 건조하여 강도, 내식성, 부착율 등의 물성을 측정하여 하기 표1에 나타내었다.After spraying the spray material of the composition as shown in Table 1, and then specimen molding, curing, and drying to measure the physical properties such as strength, corrosion resistance, adhesion rate, and the like are shown in Table 1.
상기의 강도 시험에 사용한 시편의 크기는 40x40x160mm 시편으로 1500℃에서 3시간 소성한 다음, 자연 냉각 후 강도를 측정 하였다.The size of the test specimen used in the strength test was 40x40x160mm specimens calcined at 1500 ℃ for 3 hours, and then measured the strength after natural cooling.
상기의 내식성 평가는 회전 침식기를 사용하여 종래 제품과 실시예(1-4)에서 제조된 부정형 내화물의 내식성을 시험하였다. 시험시 평균온도(Average Temperature)는 1550℃이며, 사용된 국내 제철 업체의 고로 Slag를 사용하였다. The above corrosion resistance evaluation tested the corrosion resistance of the conventional refractory product manufactured in the conventional product and Example (1-4) using the rotary erosion machine. Average temperature (Average Temperature) at the time of test is 1550 ℃ Respectively.
상기의 부착성은 40kg의 시료를 제조한 후 스프레이기 선단에서 적정량의 수분을 첨가하면서 벽면에 스프레이할 때 부착되지 않고 리바운드(Rebound)되어 떨어지는 스프레이재를 수거하여 무게를 측정하여 부착율을 측정하였다.The adhesion was measured by measuring the weight by collecting a spray material falling off the rebound (rebound) instead of being adhered when spraying on the wall while adding the appropriate amount of water at the tip of the sprayer after preparing a sample of 40kg.
상기의 투사 시간 측정은 시험용 투사기(자체 제작)를 이용하여 이루어졌으며, 물을 13.5%첨가한 혼련물을 이용하여 시험하였다. 처짐 정도는 육안으로 관찰하였고 이때 투사 높이는 70mm를 기준으로 하였다. 투사성은 다음과 같은 계산식 1로 계산되었다. The projection time was measured using a test projector (self-made), and was tested using a kneaded product in which 13.5% of water was added. The degree of deflection was visually observed and the projection height was based on 70 mm. Projectivity was calculated by the following equation.
계산식 1:(종래의 투사시간-실시예 투사시간)/종래의 투사시간*100 Calculation 1: (Original Projection Time-Example Projection Time) / Conventional Projection Time * 100
배합비
(%)
Mixing ratio
(%)
하기표2에서 알 수 있듯이, 본 발명의 범위를 만족하는 실시예(1~3)은 투사시간, 강도 및 부착성이 기준품에 비하여 동등하였다.As can be seen from Table 2, Examples (1 to 3) satisfying the scope of the present invention were equal in projection time, intensity and adhesion compared to the reference product.
실시예(4)는 실리콘 슬러지를 과도하게 첨가한 것으로, 스프레이재의 입도 구성이 맞지 않아 부착성과 강도가 발현되지 않았다. 또한 실리콘 슬러지의 첨가량이 높아짐에 따라 소결력 저하가 발생하였다. In Example (4), the silicon sludge was excessively added, and the particle size constitution of the spraying material did not match, and adhesion and strength were not expressed. In addition, as the amount of silicon sludge added increased, the sintering force lowered.
본 발명은 상기의 실험 결과에 상술한 바와 같이, 실리콘 웨이퍼를 만드는 절단공정에서 버려지는 실리콘 슬러지를 재활용하여, 중량%로, 태양광 실리콘 슬러지 10~40%, 알루미나 40~70%, 폴리 프로필렌 섬유(Polypropylene fiber)0.5~1% 나머지는 100중량부에 대해 결합재(Sodium Silicate Powder) 1~5%를 포함하는 태양광 실리콘 슬러지을 이용한 고로용 대탕도 및 각종 탕도 스프레이재르 발명한 결과, 실리콘 슬러지를 처분 또는 폐기에 요하는 비용 절감과 동시에 자원의 활용성을 높이는 효과가 있다.
The present invention, as described above in the above experimental results, by recycling the silicon sludge discarded in the cutting process for making a silicon wafer, by weight%, 10 to 40% solar silicon sludge, 40 to 70% alumina, polypropylene fiber (Polypropylene fiber) 0.5 ~ 1% The remainder is 100% by weight of the blast furnace for a blast furnace using a silicon silicon sludge containing 1 ~ 5% of sodium silicate powder and various types of spray spray material as a result of the invention, silicon sludge It can reduce the cost of disposal or disposal and increase the utilization of resources.
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