KR20130020093A - Equipped with heat transfer material that improves heat and light-emitting diodes - Google Patents

Equipped with heat transfer material that improves heat and light-emitting diodes Download PDF

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Publication number
KR20130020093A
KR20130020093A KR1020110082493A KR20110082493A KR20130020093A KR 20130020093 A KR20130020093 A KR 20130020093A KR 1020110082493 A KR1020110082493 A KR 1020110082493A KR 20110082493 A KR20110082493 A KR 20110082493A KR 20130020093 A KR20130020093 A KR 20130020093A
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KR
South Korea
Prior art keywords
light emitting
emitting diode
transfer material
heat transfer
heat
Prior art date
Application number
KR1020110082493A
Other languages
Korean (ko)
Inventor
이은숙
김형규
이영주
안재형
김기명
조연지
Original Assignee
(주)씨에스텍
이은숙
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Application filed by (주)씨에스텍, 이은숙 filed Critical (주)씨에스텍
Priority to KR1020110082493A priority Critical patent/KR20130020093A/en
Publication of KR20130020093A publication Critical patent/KR20130020093A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/0075—Fastening of light sources or lamp holders of tubular light sources, e.g. ring-shaped fluorescent light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

PURPOSE: An LED Light source is provided to efficiently dissipate the heat generated from a light emitting diode chip by using a heat radiating plate. CONSTITUTION: A lead frame is installed in a light emitting diode chip. The lead frame is connected to a conductive pattern(104). The conductive pattern is formed in the upper surface of a printed circuit board(103). An insulating layer is formed in the lower part of the printed circuit board. A heat radiating plate(106) is installed in the lower part of the insulating layer.

Description

Equipped with heat transfer material that improves heat and light-emitting diodes

The present invention relates to a light emitting diode light source having a heat transfer material and improved thermal characteristics. More particularly, the light emitting diode chip, which is a light emitting diode light source, has a heat transfer material of a printed circuit board. It transmits the heat generated from the light emitting diode chip of the light emitting diode light source through the heat transfer material layer formed in the lower part of the communication hole to the heat sink through the communication hole, and the light emitting diode light used as the light emitting diode light source if the heat is easily It extends the lifespan of equipment and induces eco-friendly light emitting diode light source products.

Recently, with global warming, energy utilization with low carbon dioxide emission has been spotlighted.

Energy sources such as solar, geothermal, wind and tidal energy, which emit low CO2, are nearing development and commercialization, and energy-efficient devices are being developed and commercialized.

In general lighting and special lighting, light sources using light emitting diodes that meet these requirements are being replaced with low efficiency incandescent or fluorescent lamps.

The advantages of light emitting diodes replacing existing light sources are lower power, smaller size, and lighter weight than conventional light sources, but have disadvantages of high price and external environment.

In particular, there is a serious disadvantage that the life and brightness changes depending on the external temperature.

This may be due to the light emitting mechanism of the light emitting diode.

When an external power source is applied to the light emitting diode, electrons in the conduction band, which are inherent to the solid state semiconductor, transition to the conduction band, and the transition electrons remain unstable.

In order to maintain the thermodynamic equilibrium state, the unstable electrons move back to the conduction band, and at this time, the energy corresponding to the energy difference between the conduction band and the home appliance is emitted as light energy.

However, instead of emitting light energy, electrons that emit energy as thermal energy are also generated, so that the light emitting diode naturally generates heat during operation.

This process of releasing heat is called non-luminescent recombination. Such non-luminescent recombination increases more when the external temperature rises or the flow of current increases, thereby lowering the luminous efficiency of the light emitting diode and shortening the lifespan.

In addition, changes in the energy difference between the conduction band and the consumer electronics affect the emission wavelength.

Figure 2 illustrates that the emission characteristics of LEDs are deteriorating with temperature.

That is, in the normal environment, the light emitting diode emitting a specific wavelength emits light corresponding to the long wavelength side as the energy difference between the conduction band and the provisional conduction band is small, which has a serious effect on the characteristics of the product.

Therefore, a conventional light emitting diode light source is used with a heat sink coupled to facilitate heat dissipation, and a TIM (Thermal Interface Material) is added between the light emitting diode and the heat sink.

In order to overcome the above problems, Korean Patent Publication No. 10-2011-0061698 discloses a "heat radiating device of the LED element with improved heat transfer efficiency".

The heat dissipation device includes a lead wire 12 installed on the LED element 10 connected to an upper surface of a printed circuit board (PCB) 20, and a heat dissipation carrier 30 formed on a lower surface of the printed circuit board 20. A plurality of legs 34 are formed below the heat dissipation carrier 30, and the legs 34 are coupled to a plurality of grooves 42 formed on an upper portion of the heat dissipation plate 40. The heat generated from the LED element 10 due to the continuous light emission of the LED element 10 at 10 is configured to radiate heat to the heat dissipation carrier 30 and the heat sink 40.

However, the heat dissipation device does not directly transmit the heat generated by the LED element 10 to the heat dissipation carrier 30, and is transferred to the heat dissipation carrier 30 via the printed circuit board 20. There was a problem that the heat generated in 10) can not be effectively transmitted to the heat dissipation carrier (30).

Therefore, there is a serious problem that the lifespan of the LED device 10 is shortened because the heat generated by the LED device 10 may not be transferred to the heat transfer body 30 and the heat sink 40.

In order to solve the above problems, the present invention is a heat transfer material layer formed on the lower surface of the light emitting diode chip and the lower surface of the printed circuit board in contact with the lower surface of the communication hole having a heat transfer material The heat sink is provided on the bottom surface to continuously transmit heat generated by the temperature rise of the light emitting diode chip to the heat sink through the heat transfer material layer formed under the communication hole through the communication hole having the heat transfer material of the printed circuit board. Efficient heat emission from the light emitting diode chip of the light source, and if heat is easily emitted, a new heat transfer material that can extend the life of the light emitting diode lighting device used as the light emitting diode light source is equipped with improved thermal characteristics The purpose is to provide a diode light source.

In order to achieve the above object, the present invention provides a light emitting diode chip 101 and a lead frame 102 installed on the light emitting diode chip 101 on the conductive pattern 104 formed on the upper surface of the printed circuit board 103. In the light emitting diode light source is connected to, the insulating layer 105 is formed on the lower portion of the printed circuit board 103, the heat sink 106 is provided below the insulating layer 105, the light emitting diode chip A communication hole 201 is formed in the printed circuit board 104 facing the lower surface of the 101, a heat transfer material H is filled in the communication hole 201, and an upper portion of the heat transfer material H is formed. The surface is in contact with the light emitting diode chip 101, the heat transfer material layer 202a formed of a heat transfer material is formed on the bottom surface of the printed circuit board 104 in contact with the bottom surface of the heat transfer material (H) The heat sink 106 is installed on the bottom surface of the heat transfer material layer 202a. .

In addition, the communication hole 201 is first formed on the printed circuit board 104, and then the conductive pattern 104 is formed on the upper surface of the printed circuit board 104.

In addition, the intaglio portion 203 is formed on the lower surface of the light emitting diode chip 101.

In addition, the intaglio 203 is characterized in that the heat transfer material (H) is filled.

In addition, the heat transfer material (H) is characterized in that the phase transition occurs at a temperature of 20 ℃ or more.

Further, characterized in that the heat transfer material (H) consists of any one selected from Al 2 O 3,, AlN, BN, ZnO, ZrO 2 ,, SiO 2 ,,.

The present invention is continuously provided with a heat sink on a lower surface of a heat transfer material layer formed on a lower surface of a printed circuit board formed on a printed circuit board facing a lower surface of a light emitting diode chip and in contact with a lower surface of a communication hole having a heat transfer material. Heat generated by the temperature rise of the light emitting diode chip is transferred to the heat sink through the heat transfer material layer formed under the communication hole through the communication hole having the heat transfer material of the printed circuit board heat generated in the light emitting diode chip of the light emitting diode light source Efficient emission of heat and easy release of heat have the effect of extending the life of the light emitting diode lighting device used as the light emitting diode light source.

1 is a schematic view of a conventional light emitting diode light source.
2 is a schematic view according to the present invention;
3 is a light intensity of the light emitting diode according to the ambient temperature.

For a better understanding of the present invention, a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. The present embodiments are provided to explain the present invention more safely to those having ordinary skill in the art.

Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description.

It should be noted that in the drawings, the same members are denoted by the same reference numerals.

In addition, detailed descriptions of well-known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention are omitted.

2 is a schematic view according to the present invention, Figure 3 is a light intensity of the light emitting diode according to the ambient temperature.

A light emitting diode light source having a heat transfer material according to the present invention having improved thermal characteristics will be described in detail with reference to those shown in FIGS. 2 and 3.

A general light emitting diode light source is configured by connecting a light emitting diode chip 101 and a lead frame 102 installed on the light emitting diode chip 101 to a conductive pattern 104 formed on an upper surface of the printed circuit board 103.

 An insulating layer (not shown) is formed below the printed circuit board 103.

The heat sink 106 is provided below the insulating layer (not shown).

The light emitting diode light source including the heat transfer material according to the present invention having improved thermal characteristics is composed of a communication hole 201, a thermal transfer material (TIM), and a heat transfer material layer 202a.

As shown in FIG. 1, the communication hole 201 is formed in the printed circuit board 104 facing the lower surface of the light emitting diode chip 101.

 The communication hole 201 is first formed on the printed circuit board 104, and then the conductive pattern 104 is preferably formed on the upper surface of the printed circuit board 104.

As described above, after the communication hole 201 is first formed in the printed circuit board 104, the conductive pattern 104 must be formed. The conductive pad 104 is first formed in the printed circuit board 104. This is to prevent the occurrence of a fatal defect by forming an electrical contact between the conductive pattern 104 and the printed circuit board 104 during the processing of the communication hole 201.

The communication hole 201 is filled with a thermal transfer material (TIM).

The thermal transfer material (TIM: thermai interface material (H) is preferably a phase transition at a temperature of 20 ℃ or more.

Further, the heat transfer material (H) consists of Al 2 O 3,, AlN, BN, ZnO, ZrO 2 ,, SiO 2,.

As shown in FIG. 2, the heat transfer material layer 202a is filled in the communication hole 201, and an upper surface of the heat transfer material H is formed on the light emitting diode chip 101. ) Is formed in contact with the lower surface of the heat transfer material (H) is formed of a heat transfer material (H) on the lower surface of the printed circuit board (104).

That is, the heat transfer material layer 202a is formed on the lower surface of the printed circuit board 104.

The thermal transfer material (TIM: thermai interface material (H) is preferably a phase transition at a temperature of 20 ℃ or more.

Further, the heat transfer material (H) consists of Al 2 O 3,, AlN, BN, ZnO, ZrO 2 ,, SiO 2,.

The lower surface of the heat transfer material layer 202a is provided in contact with the upper surface of the heat sink 106.

In the present invention as described above, the light emitting diode light source includes a heat transfer material layer 202a, and the heat dissipation plate 106 is installed on a lower surface of the heat transfer material layer 202a.

In addition, the concave portion 203 is formed on the lower surface of the light emitting diode chip 101.

The engraved portion 203 easily transfers heat generated from the light emitting diode chip 101 to the heat transfer material H of the communication hole 201 so that the heat transfer material contacts the lower surface of the heat transfer material H. This is to transfer the material layer 202a to the heat sink 106 that is in contact with the bottom surface of the heat transfer material layer 202a.

In addition, the intaglio 203 is filled with the heat transfer material (H) to facilitate the transfer to the heat transfer material (H) filled in the communication hole (201).

In the present invention as described above, the heat generated from the light emitting diode light source 101 is transferred to the heat transfer material (H) and the heat transfer material layer (202a) of the communication hole (201), and the heat sink (106). This is for effectively radiating heat generated by the light emitting diode light source 101 to the outside.

As described above, the present invention provides the heat transfer material (H) formed on the printed circuit board 103 and making contact with the lower surface of the light emitting diode chip 101, which is capable of effective heat transfer while changing into a liquid phase at a specific temperature or more. The heat transfer material layer 202a and the bottom surface of the heat transfer material layer 202a which are filled in the communication hole 201 and installed to abut the lower surface of the filled heat transfer material H of the communication hole 201 are installed. The heat generated from the light emitting diode chip 101 may be released to the heat sink 106.

In addition, even in the same light emitting diode chip 101, a chip installed in a module designed for easy heat dissipation and a chip not provided at the same current value show a difference in luminous efficiency as shown in FIG. 3.

These differences show different characteristics for each manufacturer of the light emitting diode chip 101, but typically show a difference of about 100 mcd / ° C.

Expressed in luminous efficiency, a difference of about 10% occurs. Therefore, in a lighting device using a light emitting diode (LED), which is a light emitting diode light source, if the heat emission is improved, the number of light emitting diode packages can be reduced by the improved efficiency to achieve the same brightness, thereby reducing the cost of the light emitting diode (LED) lighting device. Can be saved.

It contributes significantly to cost reduction, which is one of the biggest obstacles to the expansion of the LED lighting device, which is a light emitting diode light source, and is easy to dissipate heat, thereby improving reliability.

As the temperature of the light emitting diode chip 101 continuously increases in the light emitting diode of the light emitting diode, the light emitting efficiency is further reduced with time. When heat is easily released as in the present invention, a light emitting diode (LED) lighting device is a light emitting diode light source. It can be said to be more environmentally friendly product because it can extend the life of the product.

It will be apparent to those skilled in the art that various modifications and equivalent arrangements may be made therein without departing from the scope of the present invention. . Therefore, it is to be understood that the present invention is not limited to the above-described embodiments.

Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims. It is also to be understood that the present invention includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims.

Reference Numerals 101: light emitting diode chip 102: lead frame 103: printed circuit board 104: conductive pattern 106: heat sink 201: communication hole 202a: heat transfer material layer 203: engraved portion H: heat transfer material

Claims (6)

The light emitting diode chip 101 and the lead frame 102 installed on the light emitting diode chip 101 are connected to a conductive pattern 104 formed on the upper surface of the printed circuit board 103, and the printed circuit board 103 In the light emitting diode light source comprising an insulating layer formed on the lower portion, the heat sink 106 is provided below the insulating layer,
A communication hole 201 is formed in the printed circuit board 104 facing the lower surface of the light emitting diode chip 101, a heat transfer material H is filled in the communication hole 201, and the heat transfer material ( The upper surface of the H) is in contact with the light emitting diode chip 101, the heat transfer material formed of the heat transfer material (H) on the lower surface of the printed circuit board 104 in contact with the lower surface of the heat transfer material (H) The layer 202a is formed, and the heat dissipation plate 106 is provided on the lower surface of the heat transfer material layer 202a. The method of claim 1,
The communication hole 201 is formed on the printed circuit board 104 first, and then the conductive pattern 104 is formed on the upper surface of the printed circuit board 104, the thermal characteristics with a heat transfer material Light emitting diode light source. The method of claim 1,
A light emitting diode light source provided with a heat transfer material characterized in that the intaglio portion 203 is formed on the lower surface of the light emitting diode chip 101 to improve thermal characteristics. The method of claim 3, wherein
The intaglio portion 203 is provided with a heat transfer material (H) is filled with a light emitting diode light source having improved thermal characteristics. The method according to any one of claims 1 to 4,
The heat transfer material (H) is a light emitting diode light source provided with a heat transfer material, characterized in that the phase transition occurs at a temperature of 20 ℃ or more improved heat characteristics 6. The method according to any one of claims 1 to 5,
The heat transfer material (H) is Al 2 O 3,, AlN, BN, ZnO, ZrO 2 ,, SiO 2 ,, in which the thermal properties of the hyangsyang by having a heat-conducting material characterized in that the selected configuration of any one light emitting diode light source




KR1020110082493A 2011-08-18 2011-08-18 Equipped with heat transfer material that improves heat and light-emitting diodes KR20130020093A (en)

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KR1020110082493A KR20130020093A (en) 2011-08-18 2011-08-18 Equipped with heat transfer material that improves heat and light-emitting diodes

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Application Number Priority Date Filing Date Title
KR1020110082493A KR20130020093A (en) 2011-08-18 2011-08-18 Equipped with heat transfer material that improves heat and light-emitting diodes

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104654247A (en) * 2013-11-25 2015-05-27 海洋王（东莞）照明科技有限公司 Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104654247A (en) * 2013-11-25 2015-05-27 海洋王（东莞）照明科技有限公司 Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp

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