KR20120113471A - An adhesive film for organic el device, a composition for the same, and an organic el device comprising the same - Google Patents

Abstract

PURPOSE: An adhesive film for organic EL devices, a composition which is included in the same, and an EL device including the same are provided to enhance cure index and adhesive force. CONSTITUTION: An adhesive film for organic EL devices comprises imidazole hardener having the reaction initiative temperature of 60-100 deg. Celsius and the imidazole hardener having the reaction initiative temperature of 100-160 deg. Celsius. The adhesive film for organic EL devices has a hardening ratio of 95% or greater at 100 deg. Celsius for 2 hours. A composition for organic EL devices comprises a low-molecular-weight epoxy resin having the average molecular weight of 50-5,000 g/mol, a high molecular weight epoxy resin having the average molecular weight of 10,000-500,000 g/mol, and the imidazole hardener having the reaction initiative temperature of 60-100 deg. Celsius and the imidazole hardener.

Description

An adhesive film for organic EL device, a composition for the same, and an organic EL device comprising the same}

The present invention relates to an adhesive film for an organic EL device, a composition contained therein and an organic EL device comprising the same. More specifically, the present invention includes an imidazole curing agent having a reaction initiation temperature of 60-100 ° C. and an imidazole curing agent having a reaction initiation temperature of 100-160 ° C., thereby providing a high curing rate at a low temperature, a good coating state, and a dark spot. The present invention relates to an adhesive film for an organic EL device having no adhesive strength and high usability as a film, a composition contained therein, and an organic EL device comprising the same.

The organic EL device is a polycrystalline semiconductor device, and is used as a backlight of liquid crystal for obtaining light emission of a high luminance at a low voltage and is expected as a thin flat display device. However, the organic EL element is extremely weak in moisture, the interface between the metal electric field and the organic EL layer may be peeled off due to the influence of moisture, the metal may be oxidized and become highly resistant, and the organic material itself may be deteriorated by moisture. Therefore, there is a problem that light is not emitted and luminance is lowered.

In order to solve such a problem, a method of encapsulating an organic EL device with a curable composition has been developed. A method of molding an organic EL device with an acrylic resin by a conventional sealing method, a method of adding a moisture absorbing material to an encapsulating resin of an organic EL device to block the organic EL device from moisture, and the like have been proposed.

However, the conventional method of encapsulating the organic EL device has a limitation in suppressing the occurrence and growth of dark spots, it cannot have sufficient adhesive force, and it cannot fully satisfy all the requirements for encapsulation of the organic EL device. There was a limit to use for encapsulation. In particular, the curable composition used for encapsulation of the conventional organic EL device has to be cured at a high temperature of 100 ° C. or higher. In this case, there is a problem in that the curing rate is low and thus post-stability is low.

An object of the present invention is to provide an adhesive film for organic EL devices having a high curing rate even at a low temperature.

Another object of the present invention is to provide an adhesive film for organic EL devices having no dark spots, good adhesion and high usability as a film.

The adhesive film for organic EL devices, which is one aspect of the present invention, may have a curing rate of 95% or more under curing conditions at 100 ° C. for 2 hours.

In one embodiment, the film may include an imidazole curing agent having a reaction initiation temperature of 60-100 ° C. and an imidazole curing agent having a reaction initiation temperature of 100-160 ° C.

In one embodiment, the imidazole curing agent of the reaction initiation temperature 60-100 ° C: the imidazole curing agent of the reaction initiation temperature 100-160 ° C may be included in a weight ratio of 1: 0.1 to 1:10.

In one embodiment, two or more imidazole curing agents of the reaction start temperature 60-100 ℃ can be included.

In one embodiment, two or more kinds of the imidazole curing agent of the reaction start temperature 100-160 ℃.

In one embodiment, the film may further include a low molecular weight epoxy resin having a weight average molecular weight of 50-5,000 g / mol and a high molecular weight epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol.

In one embodiment, the film is 100 parts by weight of the low molecular weight epoxy resin, 10 to 250 parts by weight of the high molecular weight epoxy resin and the reaction start temperature 60-100 ° C based on 100 parts by weight of the low molecular weight epoxy resin And a total amount of 0.05-50 parts by weight of an imidazole curing agent having a reaction start temperature of 100-160 ° C.

In one embodiment, the film may further include a (meth) acrylate-based binder having a glycidyl group.

In one embodiment, the film may further comprise one or more selected from the group consisting of a silane coupling agent and a filler.

Another aspect of the present invention is a composition comprising (A) a low molecular weight epoxy resin having a weight average molecular weight of 50-5,000 g / mol, (B) a high molecular weight epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol and (C) a reaction An imidazole curing agent having an onset temperature of 60-100 ° C. and an imidazole curing agent having a reaction onset temperature of 100-160 ° C. may be included.

The organic EL device which is another aspect of the present invention may include an adhesive layer including the adhesive film for organic EL device or the composition for encapsulating the organic EL device.

A display device which is another aspect of the present invention may include the organic EL element.

The present invention provides an adhesive film for organic EL devices having a high curing rate even at a low temperature. The present invention provides an adhesive film for an organic EL device having no dark spots, good adhesion and high usability as a film.

One aspect of the present invention relates to an adhesive film for an organic EL device. The film of the present invention may have a cure rate of 95% or more under thermosetting conditions at 100 ° C. for 2 hours. Preferably it may have a curing rate of 95-100%.

The curing rate can be measured by comparing the heat of curing (unit: J / g) before and after curing using differential scanning calorimetry (DSC), but is not limited thereto. For example, the curing rate can be expressed by the following formula.

Curing rate (%) = ((Heat of sample before curing)-(Heat of sample after curing)) / (Heat of sample before curing) x 100

In one embodiment, the film of the present invention may include an imidazole curing agent having a reaction initiation temperature of 60-100 ° C. and an imidazole curing agent having a reaction initiation temperature of 100-160 ° C. In the present invention, the term "reaction initiation temperature" means a temperature at which the imidazole curing agent reacts with the epoxy resin to initiate curing. Preferably an imidazole curing agent having a reaction initiation temperature of 70-98 ° C and an imidazole curing agent having a reaction initiation temperature of 105-140 ° C.

In the film of the present invention, two or more kinds of imidazole curing agents having a reaction initiation temperature of 60-100 ° C. may be included. In addition, two or more kinds of the imidazole curing agent of the reaction start temperature 100-160 ° C in the film of the present invention.

The imidazole curing agent having a reaction initiation temperature of 60 to 100 占 폚 and an imidazole curing agent having a reaction initiation temperature of 100 to 160 占 폚 may be a phenyl group, a benzyl group, an alkane having 1 to 20 carbon atoms, An anion or an amine group.

Examples of the imidazole curing agent having a reaction initiation temperature of 60 to 100 占 폚 include 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl- Benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl- Imidazoline, 2-phenylimidazoline, and the like.

Examples of the imidazole curing agent having a reaction initiation temperature of 100 to 160 ° C include 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium-trimellitate, Amino-6 [2'-undecylimidazolyl- (1 ')] - ethyl-s-triazine, 2,4-diamino-6- [ 1 ')] - ethyl-s-triazine, 1-cyanoethyl-2-phenylimidazolium-trimellitate, 2-phenylimidazole isocyanuric acid adduct, ≪ / RTI > imidazole hydrobromide, and the like.

Imidazole curing agent having a reaction initiation temperature of 60-100 ° C .: imidazole curing agent having a reaction initiation temperature of 100-160 ° C. may be included in a weight ratio of 1: 0.1 to 1:10. Within this range, the curing rate can be increased at low temperatures, in particular at 100 ° C., and at the same time there can be an effect of room temperature stability. Preferably it may be included in the weight ratio of 1: 0.2 to 1: 5, more preferably 1: 1.5 to 1: 4.

The sum of the imidazole curing agent having a reaction start temperature of 60-100 ° C. and the imidazole curing agent having a reaction starting temperature of 100-160 ° C. may be included in an amount of 0.05-50 parts by weight based on 100 parts by weight of the low molecular weight epoxy resin described below. In the above range, there may be an appropriate curing effect. Preferably it may be included in 0.1-20 parts by weight, more preferably 0.1-10 parts by weight.

In another embodiment, the film of the present invention further comprises a low molecular weight epoxy resin having a weight average molecular weight of 50-5,000 g / mol and a high molecular weight epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol, in addition to the imidazole curing agent. can do.

The low molecular weight epoxy resin may preferably have a weight average molecular weight of 2,500-5,000 g / mol. The low molecular weight epoxy resin may include, but is not limited to, one or more selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol type epoxy resins, phenol novolac type epoxy resins, and OCA type epoxy resins. It doesn't work.

The high molecular weight epoxy resin may preferably have a weight average molecular weight of 150,000-500,000 g / mol. In addition, the high molecular weight epoxy resin preferably has a low chlorine ion content, for example, the chlorine ion content may be preferably 500 ppm or less. The high molecular weight epoxy resin may include a resin having a bisphenol A type or bisphenol F type epoxy backbone. For example, at least one selected from the group consisting of a solid bisphenol A type epoxy resin, a solid bisphenol F type epoxy resin and a phenoxy resin, but is not limited thereto.

The high molecular weight epoxy resin may be included in an amount of 10 to 250 parts by weight based on 100 parts by weight of the low molecular weight epoxy resin. Within this range, a film having good film coating properties and having a curing rate of 95% or more at 100 ° C can be produced. Preferably 30 to 250 parts by weight may be included.

In one example, the film is 100 parts by weight of the low molecular weight epoxy resin, 30 to 250 parts by weight of the high molecular weight epoxy resin and the reaction start temperature 60-100 ° C with respect to 100 parts by weight of the low molecular weight epoxy resin and It may include 0.05-50 parts by weight of the total imidazole curing agent of the reaction start temperature 100-160 ℃. Within this range, the curing rate is high at low temperatures, particularly at 100 ° C., and the room temperature stability of the coating film can be ensured.

In another embodiment, the film may further include a (meth) acrylate-based binder having a glycidyl group.

The (meth) acrylate-based binder can improve the coating properties, enhance the adhesion and increase the reliability. The (meth) acrylate-based binder may be prepared from an acrylate monomer having various functional groups depending on the glass transition temperature, the coating film properties and other additional properties of the film made of the composition. Among the functional groups, glycidyl group can improve the adhesion and reliability of the film.

The (meth) acrylate-based binder is not particularly limited, but may be a copolymer of (meth) acrylate having an alkyl group and (meth) acrylate having a glycidyl group. The (meth) acrylate having an alkyl group may include a (meth) acrylate having an alkyl group having 1 to 6 carbon atoms, and for example, methyl (meth) acrylate, butyl (meth) acrylate, or the like may be used. . The (meth) acrylate having a glycidyl group may include a (meth) acrylate having an alkyl group having 1 to 6 carbon atoms and a glycidyl group, and for example, glycidyl (meth) acrylate may be used. . The (meth) acrylate having an alkyl group in the (meth) acrylate-based binder: the (meth) acrylate having a glycidyl group may be polymerized in a weight ratio of 1: 1 to 5: 1.

The (meth) acrylate-based binder may have a weight average molecular weight of 10,000-2,000,000 g / mol, preferably 30,000-1,000,000 g / mol.

The (meth) acrylate-based binder may be included in 5-40 parts by weight based on 100 parts by weight of the low molecular weight epoxy resin. Within this range, there may be an effect of improving the film coating film properties and adhesion. Preferably it may be included in 10-40 parts by weight, more preferably 15-30 parts by weight.

In another embodiment, the film may further include one or more selected from the group consisting of a silane coupling agent and a filler. The silane coupling agent and the filler may increase the properties and reliability of the film coating film.

As the silane coupling agent, a conventional coupling agent may be used. For example, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl tri Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) (Meth) acryloxypropyltrimethoxysilane and trimethoxysilane, vinyltrimethoxysilane, N-2- (vinylbenzylamino) ethyl) -3-aminopropyltrimethoxysilane hydrochloride and 3- , But is not limited thereto. The silane coupling agent may be included in an amount of 0.01-50 parts by weight, preferably 0.01-30 parts by weight based on 100 parts by weight of the low molecular weight epoxy resin.

The filler may be a conventional filler. For example, one or more selected from the group consisting of silica, aluminum oxide, aluminum silicate, talc and panic acid silicate may be used, but is not limited thereto. The filler may be included in an amount of 50-200 parts by weight, preferably 50-100 parts by weight, based on 100 parts by weight of the low molecular weight epoxy resin.

In another embodiment, the film may further comprise one or more additives. The additive can improve the leveling on the surface and the film property. The additive may be, for example, at least one selected from the group consisting of a leveling agent, an antifoaming agent, a storage stabilizer, a plasticizer and a talc adjusting agent, but is not limited thereto.

The film may be prepared by drying the composition for encapsulating the organic EL device described below at 1.0 m / s at 25 ° C, and the thickness may be 1-100 μm, more preferably 10-50 μm.

Another aspect of the present invention relates to a resin composition for sealing an organic EL device.

The composition of the present invention is present on a film exhibiting non-fluidity at 25 ° C., and when heated to 50-100 ° C., exhibits fluidity and tackiness and is formed between an organic EL element formed on a glass or film substrate and an encapsulating glass or film substrate. Can be encapsulated.

Form an organic EL device consisting of a transparent electrode, a hole transport layer, an organic EL layer and a back electrode on a glass or film substrate, heat transfer the composition of the present invention thereon, and heat-transfer the non-permeable glass or film to bond and encapsulate it. Can be. Alternatively, the composition of the present invention may be thermally transferred to a water-impermeable glass or film, and bonded and sealed while heating to a glass or film on which an organic EL element is formed.

More specifically, a transparent electrode is formed to a thickness of about 0.1 mu m on a glass or film substrate. The transparent electrode may be formed by vacuum evaporation or sputtering. A hole transport layer and an organic EL layer are sequentially formed on the transparent electrode at a thickness of 0.05 mu m and a rear electrode is formed at a thickness of 0.1 to 0.3 mu m on the organic EL layer. The composition of the present invention is transferred onto a glass or film substrate after the film formation of the device is finished with a laminate or the like. At this time, when the composition of the present invention is transferred onto a release film to form a sheet, it can be easily transferred. Then, a non-permeable glass or film substrate is superimposed on top of the transferred composition. This is heat-compression-bonded using a vacuum laminator apparatus to preliminarily fix the lower glass or film substrate and the upper non-permeable glass or film substrate. Then, the thermosetting resin is completely cured at a curing temperature, for example, a temperature of 100 ° C. or lower. It is also possible to transfer the composition of the present invention to the above impervious glass or film substrate first and to polymerize the element substrate on which the organic EL layer is formed.

The composition of the present invention may have a shelf life of 7 days or more at 25 ℃.

The composition of the present invention comprises (A) a low molecular weight epoxy resin having a weight average molecular weight of 50-5,000 g / mol, (B) a high molecular weight epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol, and (C) a reaction initiation temperature of 60 It may include an imidazole curing agent of -100 ℃ and an imidazole curing agent of the reaction start temperature 100-160 ℃. In addition, the composition of the present invention may further include a (meth) acrylate-based binder having a (D) glycidyl group. In addition, the composition of the present invention may further comprise one or more selected from the group consisting of (E) silane coupling agent and (F) filler. The content of said component (A)-(F) is as above-mentioned.

The film or cured product layer prepared from the composition of the present invention preferably has a thickness of 1-100 μm, more preferably 10-50 μm. It is possible to easily bond between two sheets of glass or film within the above range.

Another aspect of the present invention relates to an organic EL device and a display device including the same. The organic EL device of the present invention may include an adhesive layer containing the adhesive film for organic EL device or the composition for encapsulating the organic EL device. Specifically, in the organic EL device of the present invention, an organic EL device structure is formed on a glass or film substrate, and an adhesive layer and a water impermeable glass or film of the composition are formed thereon.

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Specific specifications of the components used in the following examples and comparative examples are as follows.

(1) YDF-8170 (TOHTO) (equivalent to 159 g / g-eq., Mw. 318 g / mol) was used as the low molecular weight epoxy resin.

(2) E-4275 (JER) (Mw. 74,000 g / mol) was used as the high molecular weight epoxy resin.

(3) Hardening agent 1 (2P4MZ, Shikoku) (2-phenyl-4-methylimidazole) of reaction start temperature 95 degreeC with imidazole hardening | curing agent, hardening agent 2 (2P4MHZ, Shikoku) of reaction start temperature 135 degreeC (2-phenyl 4-methyl-5-hydroxymethylimidazole) and a curing agent 3 (2PHZ, Shikoku) having a reaction start temperature of 165 ° C were used.

(4) A binder polymerized with butyl acrylate: methyl methacrylate: glycidyl methacrylate = 30: 50: 20 (based on parts by weight) was used as the (meth) acrylate binder.

(5) A plate-like filler D-1000 (Nippon talc) was used as the filler.

Example  1-5

The high molecular weight epoxy resin and the (meth) acrylate-based binder were dispersed in methyl ethyl ketone, respectively, and the solids were mixed in the amounts shown in Table 1 below. Then, low molecular weight epoxy resins, imidazole curing agents and fillers were added in the amounts shown in Table 1 below. And dispersed using a planetary mixer and a 3-roll mill. A coating film was formed with an applicator, dried and laminated at 1.0 m / s at 25 ° C. to prepare a film having a thickness of 20 μm.

Comparative example  1-3

Except for changing the low molecular weight epoxy resin, high molecular weight epoxy resin, acrylate-based binder, filler in the above Example 1 to the content shown in Table 1 to prepare a film.

Experimental Example : Physical property evaluation of film

The films prepared in Examples and Comparative Examples were used as samples, and their physical properties were evaluated and shown in Table 1 below.

<Measurement method>

1) Curing rate: The film was thermally cured at 100 ° C. for 2 hours and the curing rate was measured. Curing rate was measured by the method of comparing the heat of hardening before and after hardening using DSC. DSC measurement conditions are the temperature test (30 ~ 250 ℃, heating rate 10 ℃ / min).

2) Coating state: It was confirmed whether tack generation and flow of the produced film at 25 ℃. tack is a tack test of the surface of the film made to a thickness of 20 μm with TOPTAC 2000A of CHEMILAB. When the tack is less than 100gf or no flow at 25 ℃, ○, when the tack exceeds 100gf at 25 ℃ was evaluated as ×.

3) Storage: While keeping the film prepared in a sheet form at 25 ℃, during the DSC heating test (168 ~ 250 ℃, heating rate 10 ℃ / min) before and after 168 hours, the change in the reaction heat and the state of the film. When the crack of the coating film or the change in the heat of reaction was more than 10%, it was evaluated as ○ when there was no visual change of the film and the change in the heat of reaction was less than 10%.

4) DSS (die shear strength) after curing: Laminated (film adhesion conditions 120 ℃ 5kgf, 5 seconds) the 20㎛ thick film prepared on 5mmx5mm glass substrate and cured for 2 hours at 100 ℃ DAGE 4000 (DAGE Co., Ltd.) ) Was measured die shear strength.

5) Reliability Evaluation After DSS: Samples prepared in the same manner as in (4) above were maintained at 85 ° C. and 85% relative humidity for 24 hours, and then die shear strength was measured by DAGE 4000.

6) Dark spot generation: A device was fabricated by sequentially depositing a transparent electrode, a hole transport layer, an organic EL layer, and a back electrode on the glass substrate by sputtering. The produced film was transferred to a laminate, and a glass substrate was superimposed thereon, followed by heat compression. It cured at 100 degreeC for 2 hours. The manufactured device was turned on after maintaining for 24 hours at 85 ℃ and 85% relative humidity. When there was no dark spot, it evaluated as (triangle | delta), and (a) when a large quantity was found.

7) Film usability: When it can be used for organic electroluminescent element sealing use, it evaluated as (circle) and when it was not possible to use.

Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Low molecular weight
Epoxy
(Parts by weight) 100 100 100 100 100 100 100 100 acryl
bookbinder
(Parts by weight) - 15 15 15 15 15 15 - High molecular weight
Epoxy
(Parts by weight) 150 250 30 250 250 250 30 150 Imidazole curing agent 1
(Parts by weight) One One One 2 One 5 - One Imidazole curing agent 2
(Parts by weight) 4 4 4 3 4 - 5 - Imidazole curing agent 3
(Parts by weight) - - - - - - - 4 filler
(Parts by weight) - - - - 80 - - - Coating state ○ ○ ○ ○ ○ ○ ○ ○ Curing rate (%) 100 100 100 100 100 100 65 57 Storage ○ ○ ○ ○ ○ × ○ ○ After curing
(kgf) 86 82 75 72 87 85 52 49 Accelerated Reliability After DSS
(kgf) 53 67 57 59 69 66 36 37 Dark spot
evaluation × × × × × × ○ △ Film availability ○ ○ ○ ○ ○ × × ×

As shown in Table 1, the film containing the imidazole curing agent of the present invention in combination with the film containing the imidazole curing agent alone has a high curing rate at low temperature, no dark spots, good adhesion and usability as a film It can be seen that this is high (see Examples 2 to 5 and Comparative Examples 1 to 2). Moreover, even if it contains the imidazole hardening | curing agent complex, when the reaction start temperature of the imidazole hardening agent is beyond the reaction start temperature of this invention, the effect of this invention was also not acquired (refer Example 1, the comparative example 3).

Claims (15)

The adhesive film for organic electroluminescent elements containing the imidazole hardening | curing agent of reaction start temperature 60-100 degreeC, and the imidazole hardening | curing agent of reaction start temperature 100-160 degreeC, and the hardening rate for 2 hours at 100 degreeC is 95% or more.
The organic EL device according to claim 1, wherein the imidazole curing agent having a reaction initiation temperature of 60-100 ° C .: an imidazole curing agent having a reaction initiation temperature of 100-160 ° C. is included in a weight ratio of 1: 0.1 to 1:10. Adhesive film.
The imidazole curing agent according to claim 1, wherein the imidazole curing agent having a reaction initiation temperature of 60-100 ° C. is 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl-4-methyl Midazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl- An adhesive film for organic EL devices, characterized in that it is selected from the group consisting of 2-undecylimidazole and 2-phenylimidazoline.
The imidazole curing agent according to claim 1, wherein the imidazole curing agent having a reaction initiation temperature of 100-160 ° C is 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecyl imidazolium-trimelitate, 2,4-diamino-6 [2'-undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methyl Imidazolyl- (1 ')]-ethyl-s-triazine, 1-cyanoethyl-2-phenylimidazolium-trimelitate, 2-phenylimidazole isocyanuric acid adduct, 1- An adhesive film for organic EL devices, characterized in that it is selected from the group consisting of benzyl-2-phenylimidazole hydrobromide.
The organic EL of claim 1, wherein the film further comprises a low molecular weight epoxy resin having a weight average molecular weight of 50-5,000 g / mol and a high molecular weight epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol. Adhesive film for elements.
The method of claim 5, wherein the film is 100 parts by weight of the low molecular weight epoxy resin, 10 to 250 parts by weight of the high molecular weight epoxy resin and the reaction start temperature 60-100 ℃ relative to 100 parts by weight of the low molecular weight epoxy resin The adhesive film for organic electroluminescent elements containing 0.05-50 weight part of the sum total of a hardening | curing agent and the imidazole hardening | curing agent of 100-160 degreeC of reaction start temperature.
The adhesive film for organic EL device according to claim 5, wherein the film further comprises a (meth) acrylate binder having a glycidyl group.
The adhesive film for organic EL device according to claim 7, wherein the (meth) acrylate-based binder is contained in an amount of 5-40 parts by weight based on 100 parts by weight of the low molecular weight epoxy resin.
8. The adhesive film for organic EL device according to claim 7, wherein the weight average molecular weight of the (meth) acrylate-based binder is 10,000-2,000,000 g / mol.
The said (meth) acrylate type binder is a copolymer of the (meth) acrylate which has an alkyl group, and the (meth) acrylate which has glycidyl group, The adhesive film for organic electroluminescent elements of Claim 7 characterized by the above-mentioned.
The adhesive film for organic EL device according to claim 1, wherein the film further comprises at least one member selected from the group consisting of a silane coupling agent, a filler, a leveling agent, an antifoaming agent, a storage stabilizer, a plasticizer and a talc adjusting agent. .
(A) a low molecular weight epoxy resin having a weight average molecular weight of 50-5,000 g / mol, (B) a high molecular weight epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol, and (C) a reaction initiation temperature of 60-100 ° C. A composition for encapsulating an organic EL device, comprising a diazole curing agent and an imidazole curing agent having a reaction start temperature of 100-160 ° C.
The composition for encapsulating an organic EL device according to claim 12, wherein the composition further comprises a (meth) acrylate-based binder having a glycidyl group.
The organic electroluminescent element provided with the contact bonding layer containing the adhesive film for organic electroluminescent elements of any one of Claims 1-11, or the composition for sealing the organic electroluminescent element of Claim 12 or 13.
A display apparatus comprising the organic EL element of claim 14.