KR20120017732A - Led package comprising cavity formed by etching and manufacturing method of the same - Google Patents

Abstract

PURPOSE: An LED package including a cavity and a manufacturing method thereof are provided to implement a precise pattern by forming the cavity on a ceramic substrate with an etching process. CONSTITUTION: A via hole passes through a ceramic substrate. A cavity is formed by etching the ceramic substrate. A screen mask with an opening corresponding to the via hole is arranged. Conductive ink is coated on the screen mask. An electrode pattern hole(150a,150b) is formed by filling conductive ink in the via hole. An LED chip(160) is mounted in the cavity and is electrically connected to the electrode pattern hole.

Description

LED package including cavity formed by etching, and manufacturing method therefor {LED PACKAGE COMPRISING CAVITY FORMED BY ETCHING AND MANUFACTURING METHOD OF THE SAME}

The present invention is an LED package including a cavity formed by etching and a method of manufacturing the LED package and a method for manufacturing the LED package and a method for manufacturing the same in detail by applying an etching method to a ceramic substrate to form a cavity, and more precisely the process It is about.

Light Emitting Diodes (LEDs) produce a small number of carriers (electrons or holes) injected using the pn junction structure of a semiconductor, and intermetallic compound junctions that emit light by converting electrical energy into light energy by recombination. Refers to a diode. In other words, when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move through the junction of the anode and the cathode and recombine with each other, which is less energy than when the electrons and holes are separated. Release.

Such LEDs are applied to a wide range of applications, such as not only general display devices but also lighting devices or backlight devices of LCD displays. In particular, LED has the advantage of low heat generation and long life due to high energy efficiency while being able to drive at a relatively low voltage, and most of the currently used technologies have been developed to provide high brightness of white light, which was difficult to implement in the past. It is expected to replace the light source device.

1 is a process chart showing a manufacturing process of a conventional ceramic LED package. Referring to the drawings, first, ceramics and other additives are blended to produce a base plate of several tens to hundreds of micrometers in thickness through a casting process. Then, after forming a circuit pattern through various punching on each sheet through various sizes of via hole processing and screen printing, each layer is integrated through a lamination process. Subsequently, the integrated molded body is cut by using a V groove, finally manufactured in a substrate form through a sintering and plating process, and then an LED chip is mounted and molding is performed using epoxy and silicon. Produce it separately.

2A and 2B are conceptual views and exploded perspective views of a conventional ceramic LED package manufactured by the above process. As shown in the drawing, a conventional ceramic type LED package includes a laminated ceramic sheet 10, 20. 30, Although not shown in the drawing, the metal reflector plate 40 and the electrode pattern 50 are configured to conduct electricity through wire bonding to the LED chip and attach heat sinks to the bottom to emit heat. In this case, since the chip bonding area is printed on the ceramic sheet and the ceramic sheet is repeatedly stacked on the top to complete the product, the process is complicated and additional cost is generated compared to a single process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to form a cavity on a ceramic substrate using an etching process to mount an LED chip, thereby simplifying the process compared to the ceramic sheet lamination process and reducing costs. The present invention provides a LED package and a method of manufacturing the same, which implements precise patterns and enhances resistance to external thermal shock.

According to an aspect of the present invention, there is provided a manufacturing method including: (a) forming a via hole through a ceramic substrate and spaced apart from each other; (b) etching the ceramic substrate to form a cavity; (c) filling the via hole with an electrically conductive ink to form an electrode pattern hole; (d) mounting an LED chip in the cavity and electrically connecting the LED chip and an electrode pattern hole to provide a method of manufacturing an LED package including a cavity formed by etching, the process being simplified Precision can be achieved.

In particular, step (b) is preferably a step of forming a cavity in which the inclined surface is formed on the inner surface through etching.

In addition, the step (c) may include (c-1) aligning the screen mask having the opening corresponding to the via hole; (c-2) applying electrically conductive ink on the screen mask; (c-3) pressing the applied electrically conductive ink using a squeeze to fill the electrically conductive ink into the via hole through the opening to form an electrode pattern hole.

In addition, the step (c) may further include forming an electrode pattern layer electrically connected to the electrode pattern hole and spaced apart from each other by applying an electroconductive ink to the lower surface of the ceramic substrate.

After the step (d), (e) forming a molding portion for embedding the LED chip may further protect the LED chip and the wire from the outside.

The configuration of the LED package according to the present invention comprises a ceramic substrate having a cavity formed by etching; An LED chip mounted in the cavity; An electrode pattern hole penetrating the ceramic substrate on the lower surface of the cavity and spaced apart from each other; By providing an LED package including a cavity formed by the etching including a connecting portion for electrically connecting the LED chip and the electrode pattern hole, it is possible to provide a strong LED package with a precise pattern implementation and resistance to thermal shock.

In particular, the inner surface of the cavity preferably has a predetermined inclined surface.

The LED package may further include an electrode pattern layer formed on a lower surface of the ceramic substrate to be electrically connected to the electrode pattern hole and spaced apart from each other.

In addition, the LED package may further include a molding part to bury the LED chip and the connection portion to protect the LED chip and the wire from the outside.

In addition, the molding part is preferably made of a transparent silicone resin and a phosphor.

According to the present invention, by forming a cavity on the ceramic substrate through the etching process, the process can be simplified and the pattern can be refined, and the heat resistance characteristics can be improved to enhance the thermal shock resistance and to realize a high output LED package with reduced manufacturing cost. have.

1 is a process chart showing a manufacturing process of a conventional ceramic LED package.
2A and 2B are conceptual and exploded perspective views of a conventional ceramic LED package.
3A to 3C are cross-sectional views of an LED package including a cavity formed by etching according to an embodiment of the present invention, a conceptual diagram for forming electrode pattern holes, and a bottom view of the LED package.
4 is a cross-sectional view of an LED package fabrication process including a cavity formed by etching in accordance with one embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings are exaggerated in order to emphasize a clearer description, and elements denoted by the same symbols in the drawings denote the same elements.

3A to 3C are cross-sectional views of an LED package including a cavity formed by etching according to an embodiment of the present invention, a conceptual diagram for forming electrode pattern holes, and a bottom view of the LED package.

Referring to FIG. 3A, an LED package including a cavity formed by etching according to an exemplary embodiment of the present invention may include a ceramic substrate 110 having a cavity 140 formed by etching, and an LED chip mounted on the cavity 140. The electrode pattern holes 150a and 150b and the LED chip 160 and the electrode pattern holes 150a and 150b formed through the 160 and the ceramic substrate 110 on the lower surface of the cavity 140 are spaced apart from each other. It includes a connection for the electrical connection, which may be connected by a wire 170 as shown in the figure and may be connected in the form of a flip chip (Flip Chip).

At this time, the inner surface of the cavity 140 is preferably provided with a predetermined inclined surface, it is possible to implement a ceramic LED package having a cavity 140, in particular an inclined surface by etching. In general, since the cavity for the mounting area of the LED chip in the ceramic LED package is formed by a punching or cutting process, the incision surface is always vertically formed, making it difficult to form an inclined surface. Therefore, in order to form an inclined surface on the ceramic package, a plurality of ceramic sheets having holes formed by punching with different diameters are repeatedly stacked, and additional costs are incurred. By forming the cavity 140 provided, the process can be simplified and the manufacturing cost can be reduced.

In addition, the electrode pattern holes 150a and 150b may face the lower surface of the ceramic substrate 110 upward as shown in FIG. 3B, and then position the opening of the screen mask 210 to correspond to the via hole 120. After applying the electrically conductive ink 156, a squeeze 220 is used to press the applied electrically conductive ink 156 to fill the electrically conductive ink 156 through the opening into the via hole 120. By forming the electrode pattern holes 150a and 150b, the electrode patterns of the anode 150a and the cathode 150b are formed. In addition, the LED package is electrically connected to the electrode pattern holes (150a, 150b), the electrode pattern layers (155a, 155b) formed by applying an electrically conductive ink on the lower surface of the ceramic substrate 110 to be spaced apart from each other further. It is preferable to include. As such, the electrode pattern holes 150a and 150b and the LED chip 160 are electrically connected to the electrode patterns including the electrode pattern holes 150a and 150b and the electrode pattern layers 155a and 155b and the LED chip 160. In this case, the wire 170 is bonded. In this case, the wire 170 is preferably a gold (Au) wire. As described above, the wire 170 may be electrically connected in a flip chip form as well as by the wire.

In addition, the LED package may further include a molding unit 180 for embedding the LED chip 160 and the wire 170 to protect the LED chip 160 and the wire 170 from the outside, wherein The molding unit 180 may include a phosphor to convert the wavelength of the light emitted from the LED chip 160 together with the transparent silicon resin or the transparent silicon resin.

FIG. 3C is a bottom view of the LED package according to the present invention, and electrode pattern layers 155a and 155b separated from the anode and the cathode are formed below the ceramic substrate 110.

As such, by forming the cavity 140 of the ceramic substrate 110 easily by etching, the process can be simplified and the cost can be reduced. By strengthening, high power LED package can be formed.

4 is a cross-sectional view of an LED package fabrication process including a cavity formed by etching in accordance with one embodiment of the present invention.

Referring to FIG. 4, a via hole 120 penetrates the ceramic substrate 110 and is spaced apart from each other by punching in the ceramic substrate 110 (S1), and the resin and the phosphor molding of the ceramic LED package are easily patterned. After the activation of the surface of the ceramic substrate 110 on which the via hole 120 is formed through various chemical treatments to form a photoresist on the ceramic substrate 110 is applied after exposure (S2). After the development process is completed, the photoresist 130 is peeled off from the upper surface of the ceramic substrate 110 by half etching on the surface of the ceramic substrate 110, and then the photoresist 130 is peeled off to allow the LED chip 160 to be mounted. To form 140 (S3), the cavity is preferably formed with an inclined surface on the inner surface.

Next, the via holes 120 are filled with electrically conductive ink to form electrode pattern holes 150a and 150b (S4). Specifically, the screen masks having the openings corresponding to the via holes 120 are aligned. After the electrically conductive ink is applied onto the screen mask, an electrode pattern hole is formed by pressing the applied electrically conductive ink using a squeeze to fill the electrically conductive ink into the via hole through the opening. Since the description thereof has been made with reference to FIG. 3B, it will be omitted. In this case, the method may further include forming electrode pattern layers 155a and 155b which are electrically connected to the electrode pattern holes 150a and 150b and are spaced apart from each other by applying an electroconductive ink to the lower surface of the ceramic substrate 110. can do.

Thereafter, the LED chip 160 is mounted on the cavity 140 (S5), and the LED chip 160 and the electrode pattern holes 150a and 150b are electrically connected through a wire 170 bonding or flip chip form. After (S6), forming the molding unit 180 for embedding the LED chip 160 and the wire 170 (S7) to protect the LED chip 160 and the wire 170 from the outside.

By changing the process of the ceramic LED package, it is possible to simplify the process and to improve the thermal resistance characteristics, thereby to manufacture a high-power LED package that has improved thermal shock resistance and reduced manufacturing costs.

The best embodiments have been disclosed in the drawings and specification above. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

110: ceramic substrate 120: via hole
130: photoresist 140: cavity
150a, 150b: electrode pattern hole 155a, 155b: electrode pattern layer
160: LED chip 170: wire
180: molding portion 210: screen mask
220: squeeze

Claims (10)

(a) forming a via hole through the ceramic substrate and spaced apart from each other;
(b) etching the ceramic substrate to form a cavity;
(c) filling the via hole with an electrically conductive ink to form an electrode pattern hole;
(d) mounting an LED chip in the cavity and electrically connecting the LED chip and an electrode pattern hole;
Method of manufacturing a LED package comprising a cavity formed by the etching comprising a.
The method according to claim 1,
In step (b),
A method of manufacturing an LED package comprising a cavity formed by etching which is a step of forming a cavity in which an inclined surface is formed on an inner side through etching.
The method according to claim 1,
In step (c),
(c-1) aligning the screen masks having the openings corresponding to the via holes;
(c-2) applying electrically conductive ink on the screen mask;
(c-3) pressing the applied electrically conductive ink by using a squeeze to fill the electrically conductive ink into the via hole through the opening to form an electrode pattern hole;
Method of manufacturing a LED package comprising a cavity formed by the etching comprising a.
The method according to claim 1,
In step (c),
And applying a conductive ink to the lower surface of the ceramic substrate to form an electrode pattern layer electrically connected to the electrode pattern hole and spaced apart from each other.
The method according to claim 1,
After the step (d)
(e) a method of manufacturing an LED package including a cavity formed by etching further comprising forming a molding portion to bury the LED chip.
A ceramic substrate having a cavity formed by etching;
An LED chip mounted in the cavity;
An electrode pattern hole penetrating the ceramic substrate on the lower surface of the cavity and spaced apart from each other;
A connection part electrically connecting the LED chip and an electrode pattern hole;
LED package comprising a cavity formed by the etching comprising.
The method of claim 6,
And an inner side surface of the cavity includes a cavity formed by etching having a predetermined inclined surface.
The method of claim 6,
The LED package,
The LED package is electrically connected to the electrode pattern hole, the LED package including a cavity formed by etching further comprising an electrode pattern layer formed on the lower surface of the ceramic substrate.
The method of claim 6,
The LED package,
And a cavity formed by etching further comprising a molding portion filling the LED chip and the connection portion.
The method according to claim 9,
The molding part,
An LED package comprising a cavity formed by etching consisting of transparent silicon resin and phosphor.

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