KR20120017177A - Floor with a heat conductive structure - Google Patents

Floor with a heat conductive structure Download PDF

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Publication number
KR20120017177A
KR20120017177A KR1020100079709A KR20100079709A KR20120017177A KR 20120017177 A KR20120017177 A KR 20120017177A KR 1020100079709 A KR1020100079709 A KR 1020100079709A KR 20100079709 A KR20100079709 A KR 20100079709A KR 20120017177 A KR20120017177 A KR 20120017177A
Authority
KR
South Korea
Prior art keywords
groove
flooring
base panel
protrusion
filling
Prior art date
Application number
KR1020100079709A
Other languages
Korean (ko)
Inventor
박윤
전병완
Original Assignee
동화자연마루 주식회사
동화홀딩스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동화자연마루 주식회사, 동화홀딩스 주식회사 filed Critical 동화자연마루 주식회사
Priority to KR1020100079709A priority Critical patent/KR20120017177A/en
Publication of KR20120017177A publication Critical patent/KR20120017177A/en

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    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/02038—Flooring or floor layers composed of a number of similar elements characterised by tongue and groove connections between neighbouring flooring elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/022—Flooring consisting of parquetry tiles on a non-rollable sub-layer of other material, e.g. board, concrete, cork
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Floor Finish (AREA)

Abstract

PURPOSE: A floor material having a heat conductive structure is provided to improve heat conductivity by filling grooves formed in a base panel with a material having excellent thermal efficiency. CONSTITUTION: A floor material having a heat conductive structure comprises a base panel(100), filling grooves(200), tongue and groove members(300,400), a decoration layer(500), and a decoration protection layer(600). The filling grooves are formed in the bottom of the base panel and are filled with heat conductive materials. The tongue and groove members are formed on both side surfaces of the base panel. The decoration layer is formed on the top surface of the base panel to finish the exterior of the base panel. The decoration protection layer is formed on the top surface of the decoration layer.

Description

Flooring flooring with heat conduction structure {FLOOR WITH A HEAT CONDUCTIVE STRUCTURE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floor covering made of a thermally conductive structure. In particular, a groove for filling a conductive material is formed in a base panel (base panel) constituting a floor covering in contact with a floor, and the floor is filled with a thermal conductive material. The present invention relates to a flooring flooring having a heat conduction structure in which the construction is easily performed by improving the thermal conductivity of the flooring material and processing the tongue / groove part so as to be slidingly coupled to the side surface of the substrate panel.

Generally, wood flooring products such as plywood flooring, solid wood flooring, and reinforced flooring, which are used as flooring flooring, use wood materials such as plywood and fiberboard as base panels (base panels). There is a disadvantage of low thermal conductivity. As a result, the floor heating heat is lowered to the surface compared to the relatively inexpensive floor coverings, and thus, the consumer's satisfaction with the wood flooring is lowered.

Such wood flooring has the advantages of eco-friendly, excellent appearance, high durability, etc. of the wood material, but there are some disadvantages to the unique floor heating in our country.

Therefore, while maintaining the advantages of the wood materials, solving the problem of low thermal conductivity and thermal efficiency, the floor heating heat is easily transferred to the surface, the situation needs a flooring material that can be easily constructed.

Various efforts and attempts have been made to solve the drawbacks of the conventional wood flooring. Currently, products with excellent thermal efficiency are being developed through the National Project of the Ministry of Agriculture and Forestry, and the floor with heat conduction structure is part of the technology development. The flooring was developed.

That is, the present invention is to solve the problems of the prior art as described above, forming a groove structure of a certain form on the base panel (base panel) portion of the PVC, plywood, fiber board, cut sheet, etc. In addition, this part is filled with a material with high thermal efficiency to improve the thermal conductivity and efficiency of the floor, and the side connection part consists of the tongue / groove, so that the floor flooring with heat conduction structure is easily assembled and constructed. The purpose is to provide.

Flooring flooring of the present invention for achieving the above object,

A base panel (base panel) in which filling grooves are formed during the process of manufacturing a product for applying a thermally conductive material to a part of the wood material constituting the flooring material;

A thermally conductive filler prepared by extrusion method of a filler or a thermally conductive material in which a thermally conductive material such as graphite powder or carbon fiber filled in the filling groove of the base panel (base panel) is mixed with a resin;

For easy bonding between the substrate panels, the side is processed to have a particular type of tongue / groove member, which is achieved by aligning the tongue member between the groove members, pressing down and then moving horizontally to engage.

Here, the decorative layer and the decorative protective layer for protecting the decorative layer is preferably attached to the upper portion of the base panel laminated.

In addition, the decorative layer may be composed of natural veneer or stone, such as HPM, PVC, marble.

And the filling groove of the thermally conductive material to be processed in the base panel is preferably semi-circular, at least one polygon, such as a triangle, a square is formed, and forming a locking step to increase the bonding force of the thermally conductive filler filled or fitted into the filling groove. Also good.

The flooring material of the present invention is formed by filling the bottom surface of the base panel (base panel) with a good heat transfer soft transfer material or material to improve the thermal conductivity of the flooring flooring material, it is processed into a fitting structure on the side flooring flooring material There is an effect that the connection assembly construction is made easily.

1 is a perspective view showing the components of the present invention separately.
Figure 2 is a perspective view of the component attachment state of the present invention.
3 is a cross-sectional view taken along line IV-IV of FIG. 2.
4 is a perspective view showing a construction state of the present invention.
Figure 5 is a side cross-sectional view of various embodiments of the filling groove formed in the base panel which is a component of the present invention.
6 is a schematic view of a state in which a thermally conductive filling material is filled by a nozzle in a filling groove of a base panel which is a component of the present invention.
7 is a schematic view of a state in which the filling material of the extrudate is bonded by a roller to the filling groove of the base panel which is a component of the present invention.
8 is a process diagram showing the construction process of the present invention.

Hereinafter, the configuration and operation of the present invention for achieving the above object with reference to the accompanying drawings in detail.

In the description of the present invention, the size and shape of the components shown in the drawings may be exaggerated or simplified to help the understanding of the invention.

As shown in Figures 1 to 3, the flooring flooring material (F / P) of the thermal conductive structure of the present invention is for filling to fill the thermal conductive material in the lower portion of the base panel (base panel) 100 The filling groove 200 and the tongue / groove members 300 and 400 opposed to each other so as to be fitted to each other in a mutually fitting manner, and the decorative layer (500) such as veneer, veneer, printing layer on the upper surface The laminated layer is characterized in that it is configured by finishing with a decorative protective layer (Wear layer) 600, such as paint, film, LPM, etc. on top of the decorative layer 500 again.

In addition, the thermally conductive filling material C filled in the filling groove 200 is blended with a resin such as graphite or carbon fiber to the resin, and sprayed through a nozzle as shown in FIG. 6. Filling by a method such as coating, or, as shown in Figure 7, it may be applied by making an extrudate in advance to have the same shape as the filling groove 200, and then inserted into the filling groove 200. have.

In this case, an adhesive may be used for good adhesion between the base panel 100 and the filling material (C) of the extrudate, and a thermally conductive material may be added to the adhesive used therein.

The thermally conductive filling material (C) configured as described above serves to facilitate heat transfer to the surface of the flooring material (F / P). And the thermally conductive filler (C) may be composed of other materials that heat transfer well.

On the other hand, the filling groove 200 is preferably a plurality of semicircular grooves as in the preferred embodiment of the present invention, as shown in Figure 5, may be formed in a triangle, a square, extruded thermally conductive filler (C) When inserting the roller into the filling groove 200, the locking jaw 210 may be formed in the filling groove 200 so that the thermally conductive filling material C is maintained without being pulled out.

Floor flooring material (F / P) of the present invention is a base panel (base panel) 100, the tongue / groove member (300, 400) and the coupling portion to enable mutual fastening with each other by a post-process, and the appearance on the top It is largely composed of a decorative layer 500 such as various veneers and a decorative protective layer 600 for imparting abrasion resistance, chemical resistance, durability, and the like.

Here, the decoration layer 500 may be composed of natural veneer or stone such as HPM, PVC, marble.

Floor flooring material (F / P) configured in this way by processing the side portion of the base panel 100 into a plank (plank) to form a tongue / groove member (300, 400) on each side, each floor flooring material (F / P) is The flooring flooring (F / P) of the heat conduction structure in which mutual coupling is performed is constructed.

The tongue / groove members 300 and 400 constituting the present invention are not integrally formed on both sides of the substrate panel 100 to which the mutually connected tongues / groove members 300 and 400 are horizontally spaced apart. Dogs are formed. This is because the tongue member 300 is positioned between the groove members 400, and then, to lower the floor flooring material (F / P) vertically and then slide the floor flooring horizontally to connect the floor flooring material (F / P) already installed. To join the tongue member 300 of the flooring flooring (F / P).

Thus, the tongue member 300 of the flooring flooring material (F / P) to be connected is vertically lowered to the groove member 400 of the flooring flooring material (F / P) that is already installed, and then slides horizontally to move the flooring flooring material (F / P). In order to couple each other, first, the groove member 400 is a coupling groove formed by an upward protrusion 420 protruding upward from an end portion extending horizontally to one lower side of the floor flooring material F / P of the thermal conductive structure (F / P). 410 and the protrusion 430 configured to protrude horizontally to be spaced apart from the upper portion of the coupling groove 410, the upper protrusion 420, the coupling groove 410, the protrusion 430, respectively, the side with a constant width Therefore, a plurality of them are formed at intervals.

Similarly, the tongue member 300 has a plurality of coupling protrusions 310 formed on the other upper portion of the floor flooring material F / P of the heat conduction structure corresponding to the number of the groove members 400, and a plurality of tongue members 300 are formed. A horizontal groove 320 is formed on the coupling protrusion 310 to be coupled to the protrusion 430 of the groove member 400 constituting the floor floor material F / P to be connected, and a groove member below the coupling protrusion 310. The vertical groove 330 is formed to be coupled to the upward protrusion 420 of the 400.

The flooring flooring material (F / P) of the thermally conductive structure of the present invention configured as described above is composed of a thermally conductive material is filled (전) so that the heat conduction to the base panel 100 is improved, the transfer of heating heat to the flooring flooring is improved As it is a stable structure during assembly, there is an advantage of less deformation.

And by using the tongue / groove member (300,400) formed on the side of the base panel 100 has the advantage of being easily assembled by lowering the floor flooring of the thermal conductive structure and then sliding the floor.

Looking at the construction of the present invention in more detail with reference to Figure 8,

When the tongue member 300 of the floor flooring material F / P to be connected to the groove member 400 side of the floor flooring material F / P which is already installed is positioned between the groove members 400 and lowered, the groove member 400 Tongue member 300 to be coupled to) is positioned adjacent to the coupling groove 410, the upward protrusion 420 and the protrusion 430 of the groove member 400.

Then, when the floor flooring material F / P to be connected is slid to the groove member 400 side of the floor flooring material F / P pre-installed, the tongue member 300 is moved to the groove member 400 to be coupled.

That is, the engaging projection 310 of the tongue member 300 is to be supported in contact with the coupling groove 410 of the groove member 400, the horizontal groove 320 of the tongue member 300 of the groove member 410 It is combined with the protrusion 430 to be supported, and the vertical floor 330 of the tongue member 300 slides so as to be coupled to the upper protrusion 430 of the groove member 400 is supported by the floor flooring (F / Combination and connection of flooring flooring material (F / P) to be connected to P) is to be connected as shown in FIG.

The flooring flooring material (F / P) of the thermally conductive structure connected and installed in this manner is a structure that has improved thermal conductivity, thereby improving the heat transfer to the flooring material as well as the floor by the tongue / groove members 300 and 400, which are formed on the side. Connection assembly of flooring is done easily.

The present invention may be used as a flooring material that improves thermal conductivity, or may be used as an interior finishing material that purifies a room by filling a material beneficial to the human body instead of the thermal conductive filler.

100: substrate panel 200: filling groove
300: tongue member 310: engaging projection
320: horizontal groove 330: vertical groove
400: groove member 410: coupling groove
420: upward protrusion 430: protrusion
500: decorative layer 600: decorative protective layer
C: Thermally Conductive Filler F / P: Flooring Flooring

Claims (5)

A base panel 100 constituting the filling groove 200 at a lower portion thereof;
A thermally conductive filler (C) comprising graphite powder or carbon fiber filled in the filling groove 200 of the base panel 100 mixed with a resin;
A decorative layer 500 laminated on an upper surface of the substrate panel 100 so as to close an upper appearance thereof;
A decorative protective layer 600 stacked on an upper surface of the decorative layer 500; Including,
The base panel 100 is a flooring flooring of the heat conduction structure, characterized in that the tongue / groove member (300,400) is configured on the side by planar processing (plank) for mutual connection.
The method of claim 1,
The groove member 400 extends horizontally to one side lower portion of the base panel 100 and is formed by a coupling groove 410 formed by an upward protrusion 420 protruding upward from an end portion thereof, to an upper portion of the coupling groove 410. It is composed of a protrusion 430 protruding horizontally spaced apart, the coupling groove 410, the upper protrusion 420, the protrusion 430 is a plurality of spaced apart along the side of the base panel 100 in a predetermined width, respectively Formed and configured,
The tongue member 300 has a plurality of coupling protrusions 310 are formed on the other side of the base panel 100 at intervals corresponding to the number of the groove member 400, the image of the coupling protrusion 310, A horizontal groove 420 coupled to the protrusion 430 of the groove member 400 and a vertical groove 330 coupled to the upward protrusion 220 of the groove member 400 are formed at a lower portion of the groove member 400. The floor member of the heat conduction structure, characterized in that configured to be coupled by pressing down and then horizontally aligned the tongue member 300 between).
The method of claim 1,
The decorative layer 500 is a flooring flooring of a thermal conductive structure, characterized in that consisting of natural veneers, such as HPM, PVC, marble.
The method of claim 1,
The thermally conductive filling material (C) filled in the filling groove is filled or sprayed through the nozzle, or the like, or filled by a method of sandwiching by a roller configured floor flooring material, characterized in that configured.
The method according to claim 1 or 2,
Filling groove 200 of the base panel 100 is a flooring flooring of the thermal conductive structure, characterized in that the locking jaw 210 is configured to prevent the thermally conductive filling material (C) to fall out.
KR1020100079709A 2010-08-18 2010-08-18 Floor with a heat conductive structure KR20120017177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100079709A KR20120017177A (en) 2010-08-18 2010-08-18 Floor with a heat conductive structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100079709A KR20120017177A (en) 2010-08-18 2010-08-18 Floor with a heat conductive structure

Publications (1)

Publication Number Publication Date
KR20120017177A true KR20120017177A (en) 2012-02-28

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KR1020100079709A KR20120017177A (en) 2010-08-18 2010-08-18 Floor with a heat conductive structure

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106594849A (en) * 2017-01-12 2017-04-26 李国才 Novel soft heating material
CN109930777A (en) * 2019-04-17 2019-06-25 普洱绿洲木业有限公司 Can fast spreading multi-layer solid-wood composite heated and its processing technology
CN110748118A (en) * 2019-11-18 2020-02-04 安阳师范学院 Environment-friendly heat-conducting wood floor and laying method thereof
KR102315506B1 (en) * 2020-04-21 2021-10-20 정길호 DIY heat sink for easy installation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106594849A (en) * 2017-01-12 2017-04-26 李国才 Novel soft heating material
CN109930777A (en) * 2019-04-17 2019-06-25 普洱绿洲木业有限公司 Can fast spreading multi-layer solid-wood composite heated and its processing technology
CN110748118A (en) * 2019-11-18 2020-02-04 安阳师范学院 Environment-friendly heat-conducting wood floor and laying method thereof
KR102315506B1 (en) * 2020-04-21 2021-10-20 정길호 DIY heat sink for easy installation

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