KR20110116894A - Wafer marking system and marking method of wafer - Google Patents

Abstract

The present invention relates to a wafer marking system and a wafer marking method capable of relieving or preventing the wafer to be sag downward in the marking process to enable precise and detailed marking, and to improve the efficiency of the marking process.

Description

Wafer Marking System and Wafer Marking Method {WAFER MARKING SYSTEM AND MARKING METHOD OF WAFER}

The present invention relates to a wafer marking system and a wafer marking method. In more detail, the present invention relates to a wafer marking system and a wafer marking method that can make a precise and fine marking operation by alleviating or preventing the wafer to be sag downward in the marking process, and improve the efficiency of the marking process. .

In general, a semiconductor package includes a thin film deposition process for forming a predetermined thin film to form a circuit pattern on a wafer, a photolithography process for forming a photoresist pattern by applying photoresist to the deposited thin film, and exposing and developing the photoresist. The process of forming a circuit pattern on a silicon wafer and a wafer, including an etching process of patterning a thin film using a resist pattern, an ion implantation process of injecting specific ions into a predetermined region of the substrate, and a cleaning process of removing impurities, It is manufactured through a packaging step of dicing with a semiconductor chip and sealing with an epoxy resin or the like.

In recent years, the weight reduction and miniaturization of electronic products have contributed to the miniaturization and weight reduction of semiconductor packages constituting electronic products.

Therefore, in order to produce a semiconductor package, a semiconductor package is completed by dicing a wafer to package each semiconductor package and marking product information of each semiconductor package, but recently, packaging is performed at a wafer stage. Thereafter, a technique for marking product information corresponding to each semiconductor package is required before dicing the wafer into each semiconductor package .

Conventionally, a wafer having a diameter of about 200 mm is used a lot, but a wafer having a thin thickness and a diameter of 300 mm are used.

In the marking in the wafer state, a wafer marking apparatus for marking the back surface of the wafer using a laser beam is used.

As the size of the wafer increases and the thickness thereof becomes thinner, the center of the wafer farther from the support in contact with the wafer in the wafer support holder sags downward under the influence of gravity.

Due to the deflection of the wafer, there are many difficulties in handling a large and thin wafer in the process of performing the marking operation using the marking apparatus for 300 mm wafer. In addition, due to the deflection of the wafer, a height deviation of the surface to be marked on the wafer occurs, and this height deviation exceeds a range of a predetermined depth of focus of the laser beam, so that the output density of the laser beam on the back surface of the wafer to be marked (beam) density) and the spot size of the laser beam are different. Therefore, there is a problem that the marking quality is not uniform depending on the position of the semiconductor chip formed on the wafer, and the accuracy of the marking is also lowered.

The wafer marking apparatus marks portions corresponding to the respective semiconductor packages while exposing the back surface of the wafer. In this case, as the size of the wafer increases, the back surface of the wafer sags in the direction of gravity. Laser marking device when marking to reflect the change in the focal length of the deflection of the wafer and diminish the marking precision with productivity reduces the deflection of the wafer, sophisticated and marking device capable of precise marking and labeling methods are required .

In order to solve the above problems, the present invention includes a wafer supply unit for supplying a wafer to be marked, a wafer carrying unit to which the marked wafer is carried out, and an upper support member and a lower support member to which the marking target wafer is inserted and supported therebetween. And a wafer marking holder including a wafer support holder and a laser marking device for marking predetermined contents on a back surface of the wafer seated on the wafer support holder, and supplying a wafer to be marked from the wafer supply unit to the wafer marking unit, wherein the wafer marking unit At least one wafer transfer robot for transferring a wafer marked in the wafer to the wafer carrying portion,

The lower support member of the wafer support holder provides a wafer marking system having an opening for exposing a portion of the back surface of the wafer in a semicircular shape.

In this case, the upper support member of the wafer support holder may support the upper edge of the wafer.

In addition, the upper support member of the wafer support holder may have a stepped protrusion to support the upper edge of the wafer.

The upper support member of the wafer support holder may include a plurality of openings for dividing and exposing a predetermined region of the upper surface of the wafer.

Here, two or more openings may be provided, and the shape of the opening may be the same.

In addition, the lower support member of the wafer support holder may include a plurality of suction holes in the support except for a portion where the opening is formed.

In this case, the suction holes may be formed on a plurality of concentric semicircles, and suction holes may be applied to the suction holes formed along the plurality of concentric semicircles having different radii.

In addition, the plurality of concentric semicircular suction channels can be communicated with each other by a radial communication channel.

The lower support member of the wafer support holder may have a semicircular open area in which a center of the back surface of the wafer of the support part is exposed except for an opening portion.

Here, the wafer marking unit may move the wafer while the upper support member and the lower support member constituting the wafer support holder are spaced apart to change the back surface of the wafer exposed to the opening of the lower support member constituting the wafer support. It may further include a wafer displacement device for lifting or rotating.

In addition, the wafer displacement apparatus may raise the wafer by a predetermined height in a state where the upper support member and the lower support member constituting the wafer support holder are spaced apart, rotate the wafer 180 degrees, and then lower it again to the lower support member. Can be seated.

In this case, the rising or falling range of the wafer by the wafer displacement device may be smaller than the separation range between the upper support member and the lower support member constituting the wafer support holder.

In addition, the wafer displacement device includes a rotating member for rotating the wafer, a rotating motor for rotating the rotating member, a link member for converting a horizontal reciprocating motion into a vertical reciprocating motion to raise or lower the rotating member and the rotating motor together. It may include.

The apparatus may further include a preliminary alignment unit for aligning the direction of the marking target wafer before the marking target wafer supplied from the wafer supply unit is supplied to the wafer marking unit.

In addition, in order to solve the above problems, the present invention is a wafer supply step of supplying the wafer to be marked, the first marking step to mark the back surface of the wafer exposed in the semicircle form of the wafer to be marked, the marking in the first marking step A wafer rotating step of rotating the wafer at a predetermined angle, a second marking step of marking a back surface of the wafer exposed in a semicircle form of the wafer rotated in the wafer rotating step;

It provides a wafer marking method comprising a; wafer carrying step of carrying out the wafer, the second marking step is completed.

The first marking step and the second marking step may be performed in a state in which an upper surface of the wafer to be marked and an unexposed back surface are supported in a semicircle shape.

In addition, a suction force may be applied to the back surface of the wafer that is not exposed in a semicircle in the first marking step and the second marking step.

The wafer rotation step may rotate the wafer after raising the wafer to a predetermined height.

Here, the wafer rotation step may be performed by releasing the state of pressing and supporting the upper surface of the wafer to be marked.

The method may further include a preliminary alignment step for aligning the direction of the wafer to be marked between the wafer supply step and the first marking step.

The method may further include a marking inspection step of inspecting a marking state of the back surface of the wafer exposed in a semicircle shape after at least one of the first marking step and the second marking step.

According to the wafer marking system and the wafer marking method according to the present invention, the marking target wafer can be alleviated or prevented from being deflected downward in the process of marking the wafer to enable precise and detailed marking.

In addition, according to the wafer marking system and the wafer marking method according to the present invention, since the lower surface of the wafer is exposed in a semicircular shape during the marking process, the process of changing the relative position between the wafer and the wafer support holder to mark the entire lower surface of the wafer is performed . Since it can be minimized, the efficiency of the marking process can be maximized.

In addition, according to the wafer marking system and the wafer marking method according to the present invention, since the upper and lower surfaces of the wafer to be marked are simultaneously supported during the marking of the wafer to be marked, the marking quality can be stably supported to improve the marking quality. have.

1 shows a top view of a wafer marking system according to the invention.
Figure 2 shows a side view of the laser marking device and the alignment inspection device of the wafer marking portion constituting the wafer marking system according to the present invention.
3 and 4 show side views of the wafer support holder and the axis transfer device of the wafer marking system according to the present invention.
5 is a plan view of the upper support member of the wafer support holder constituting the wafer marking system according to the present invention.
6 is a plan view of a lower support member of the wafer support holder constituting the wafer marking system according to the present invention.
Figure 7 shows the operation of the wafer displacement apparatus according to the present invention. Specifically, FIG. 7 (a) shows a side view of a state in which the rotating member of the wafer displacement device is lowered, and FIG. 7 (b) shows a side view of a state in which the rotating member of the wafer displacement device is raised.
8 shows a sequential block diagram of a wafer marking method according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.

1 shows a top view of a wafer marking system 10000 in accordance with the present invention.

The substrate processing apparatus according to the present invention includes a wafer supply unit 1000 for supplying a wafer to be marked, a wafer carrying unit 4000 to which a marked wafer is carried out, an upper plate and a bottom plate to which the marking target wafer is inserted and supported therebetween. Wafer marking unit 3000, including a wafer support holder 3200 and a laser marking device 3500 for marking a predetermined content on the back surface of the wafer seated on the wafer support holder 3200, the wafer to be marked At least one wafer transfer robot 5000 is supplied from the wafer supply unit 1000 to the wafer marking unit 3000 and transfers the marked wafer from the wafer marking unit 3000 to the wafer carrying unit 4000. The lower plate of the wafer support holder 3200 has a wafer marking sheath having an opening for exposing a portion of the back surface of the wafer in a semicircular shape. Provide (000).

The wafer supply unit 1000 refers to a supply unit in which the marking target wafers are stacked and supplied.

The wafer supplied from the wafer supply unit 1000 is preliminarily aligned in the preliminary alignment unit 2000 and then transferred to the wafer marking unit 3000.

The preliminary alignment of the wafers performed by the preliminary alignment unit 2000 is a process of matching roughness according to the type of the wafer and the like, and may be distinguished from the alignment inspection performed by the wafer marking unit 3000 to be described later. .

The wafers aligned in the preliminary alignment unit 2000 are transferred to the wafer marking unit 3000.

The wafer marking unit 3000 may be provided to the wafer support holder 3200 and the wafer support holder 3200 including an upper support member 3210 and a lower support member 3260 on which a wafer to be marked is inserted and supported therebetween. Laser marking apparatus 3500 for marking a predetermined content on the back surface of the seated wafer.

The wafer to be marked is seated on the lower support member 3260 constituting the wafer support holder 3200 so that the rear side thereof faces downward, and when the wafer to be marked is seated, the upper support member constituting the wafer support holder 3200. 3210 presses and supports the upper surface of the wafer to be marked.

In this case, the lower support member 3260 constituting the wafer support holder 3200 may constitute the wafer support holder 3200 such that the lower support member 3260 can be raised or lowered, or the upper support member constituting the wafer support holder 3200. The wafer support holder 3200 may be configured to raise or lower the 3210.

The upper support member 3210 constituting the wafer support holder 3200 includes a plurality of openings for dividing and exposing a predetermined region of the upper surface of the wafer, and the wafer support holder 3200. The lower support member 3260 has an opening that exposes a portion of the back surface of the wafer in a semicircular shape. Detailed description of the wafer support holder 3200 will be deferred later.

The wafer support holder 3200 is transferable in a predetermined axial direction by the horizontal transfer device 3100.

The horizontal transfer device 3100 may displace the position of the wafer support holder 3200 in which the wafer is accommodated in the wafer marking unit 3000 in the horizontal direction according to each process.

The horizontal feeder 3100 includes a Y-axis feeder (not shown) for reciprocating in the Y-axis direction, and an X-axis feeder (not shown) for feeding the Y-axis feeder in the X-axis direction. It may include.

The wafer marking unit 3000 further includes a laser marking apparatus 3500 for marking a predetermined content on the back surface of the wafer seated on the wafer support holder 3200.

The laser marking apparatus 3500 may include a laser beam projector and a reflector. A reflecting mirror may be provided to lower the height of the marking device itself.

As described above, the lower support member constituting the wafer support holder 3200 has an opening for exposing a portion of the back surface of the wafer in a semicircular shape, and the wafer to be marked is supported by the wafer support holder 3200. When the wafer is transferred to the laser marking device 3500 by the horizontal transfer device 3100, the laser marking device 3500 marks the bottom surface of the wafer through the opening of the lower support member. Detailed description of the marking process will be described later.

The wafer marking unit 3000 may further include an alignment inspection apparatus 3600 having a camera in order to improve the accuracy of marking. The alignment inspection apparatus 3600 is an apparatus for inspecting the alignment state of the wafer and photographing and reading the alignment state in order to mark the correct position.

The alignment inspection apparatus 3600 may also perform imaging for inspection of alignment using a reflecting mirror, similarly to a wafer marking apparatus.

As described above, the upper support member constituting the wafer support holder 3200 includes a plurality of openings for dividing and exposing a predetermined region of the upper surface of the wafer. When the marking target wafer is transferred to the alignment inspecting apparatus 3600, the alignment inspecting apparatus 3600 photographs the position of the index on the wafer exposed to the opening of the upper support member of the front surface of the wafer and based on the photographing information. You can check the alignment.

The alignment inspection apparatus 3600 determines the alignment state of the wafer immediately before marking, and the photographing information on the alignment state is from the front of the wafer, and the marking target is the back side of the wafer, so that the alignment inspection apparatus 3600 and the laser The marking device 3500 is positioned at the top and the bottom in the vertical direction, respectively, and the wafer supported by the wafer support holder 3200 is transferred between the alignment inspection device 3600 and the laser marking device 3500 to perform work. Is performed. A detailed description thereof will be described later.

The wafer marking unit 3000 may further include a marking inspection apparatus for inspecting a marking state of the back surface of the wafer.

The marking inspection apparatus 3400 may also include a camera like the alignment inspection apparatus 3600. The marking state may be inspected based on the information photographed by the camera. The camera provided in the marking inspection apparatus may not photograph the rear surface of the wafer in a vertical direction without a reflecting mirror.

In addition, the wafer marking part 3000 includes an upper part of the wafer support holder 3200 in order to change a back surface of the wafer exposed to the opening of the lower support member 3260 of the wafer support holder 3200. The support member 3210 and the lower support member 3260 may further include a wafer displacement device 3300 for elevating or rotating the wafer while being spaced apart from each other.

As described above, since the lower support member 3260 of the wafer support holder 3200 exposes a partial region of the back surface of the wafer to be marked in a semicircle shape, marking by the laser marking apparatus 3500 is divided into at least two times. Can proceed.

Therefore, in order to change the back region of the wafer exposed through the opening of the lower support member 3260 constituting the wafer support holder 3200, the wafer must be rotated.

At this time, since the upper support member 3210 and the lower support member 3260 constituting the wafer support holder 3200 are in a state of pressing and supporting the upper and lower surfaces of the wafer, the marking target wafer is released after the pressure supporting state is released. It needs to be lifted and rotated.

Accordingly, the wafer displacement device 3300 may lift or rotate the wafer while the upper support member 3210 and the lower support member 3260 constituting the wafer support holder 3200 are spaced apart from each other. The configuration and operation method of the wafer displacement device 3300 will be described later.

Therefore, the marking target wafer supplied from the wafer marking unit 3000 is transferred to the alignment inspection apparatus 3600 while being supported by the wafer support holder 3200 by the horizontal transfer device 3100. When the alignment is confirmed, the back surface of the wafer exposed in the semi-circular form is marked by the laser marking apparatus 3500, the marking state is inspected by the marking inspection apparatus, and the lower support member (3) is again used by the wafer displacement apparatus 3300. After the area exposed to the opening of the 3260 is changed, the inspection or marking process is repeated again.

The alignment inspection device 3600 and the laser marking device 3500 are disposed up and down, and the marking inspection device and the wafer displacement device 3300 are sequentially disposed with the alignment inspection device 3600 and the laser marking device 3500. .

The means for transferring the marking target wafer to the wafer marking unit 3000 by the preliminary alignment device is by a wafer transfer robot 5000, and the wafer transferred to the wafer marking unit 3000 is transferred within the wafer marking unit 3000. Means for doing this are by the horizontal transfer device 3100 is equipped with a wafer support holder (3200).

The marking-completed wafer in which the marking is completed in the wafer marking unit 3000 may be carried out to the wafer carrying unit 4000 by the wafer transfer robot 5000 and the marking process may be completed.

The wafer transfer robot 5000 may have a plurality of joints, respectively, to transfer wafers in various directions. That is, there is no restriction in the conveying direction. As shown in FIG. 1, the wafer supply unit 1000, the preliminary alignment unit 2000, the wafer marking unit 3000, and the wafer ejection unit 4000 are disposed in all directions around the wafer transfer robot 5000. It is desirable to have a robot arm type configured in the form of a multi-joint.

As illustrated in FIG. 1, two or more wafer transfer robots 5000a and 5000b may be provided to minimize process blanks by the transfer process by each wafer transfer robot 5000a and 5000b.

2 illustrates a side view of the laser marking apparatus 3500 and the alignment inspection apparatus 3600 of the wafer marking unit 3000 constituting the wafer marking system 10000 according to the present invention.

The wafer marking system 10000 according to the present invention exposes the back surface of the wafer to be marked supported by the wafer support holder 3200 downward, thereby marking the back surface of the wafer to be marked. Therefore, the laser marking apparatus 3500 for marking the wafer is disposed under the wafer support holder, and is installed such that the projected laser is vertically upward.

However, as shown in FIG. 2, since the laser reflector 3530 is disposed at an angle of about 45 degrees, the laser marking apparatus 3500 may be installed to project the laser in the horizontal direction.

The laser marking apparatus 3500 marks the bottom surface of the wafer through the opening of the lower support member 3260 constituting the wafer support holder 3200.

As a premise of the marking process, the wafer marking unit 3000 includes an alignment inspection apparatus 3600 in order to ensure that the position and alignment of the wafer to be marked are correct.

The alignment inspection apparatus 3600 photographs an index provided on the front surface of the wafer to be marked through an opening formed in the upper support member 3210 of the wafer support holder 3200 to determine whether the wafer to be marked is placed at the correct position. Can be checked.

Since the alignment inspection apparatus 3600 also needs to photograph the index of the upper surface of the marking target wafer supplied in the horizontal direction, the photographing direction should be vertical, but the alignment inspection apparatus 3600 also includes a photographing reflector 3630. The camera may be installed in the horizontal direction so that the shooting direction of the camera is horizontal.

Therefore, since the alignment inspection apparatus 3600 and the laser marking apparatus 3500 are disposed on the upper and lower portions of the wafer to be marked, respectively, the wafer to be marked is placed on the wafer support holder 3200. 3600 and the laser marking apparatus 3500.

The horizontal transfer device 3100 may have a structure capable of reciprocating the wafer support holder 3200 in a predetermined direction.

The wafer support holder 3200 includes an upper support member 3210 supporting the front surface of the wafer and a lower support member 3260 supporting the back surface of the wafer.

The upper support member 3210 has a plurality of openings for dividing and exposing a predetermined area of the upper surface of the wafer, and the lower support member 3260 constituting the wafer support holder 3200 is formed on the back of the wafer. It has an opening that exposes a partial region in a semicircle. As shown in FIG. 2, the wafer is seated and supported between the upper support member 3210 and the lower support member 3260.

The upper support member 3210 and the lower support member 3260 are selectively separated from each other to supply the wafer and to carry the wafer out, and when marking the wafer, the upper support member 3210 and the lower support member 3260 ) Is driven to support the front and rear surfaces of the marking target wafer. 3 to 5, a wafer support holder 3200 of the wafer marking system 10000 according to the present invention will be described.

3 and 4 show side views of the wafer support holder 3200 and the horizontal transfer device 3100 of the wafer marking system 10000 according to the present invention. More specifically, FIG. 3 illustrates a state in which the upper support member 3210 and the lower support member 3260 of the wafer support holder 3200 of the wafer marking system 10000 according to the present invention are spaced apart from each other, and FIG. The upper support member 3210 and the lower support member 3260 of the wafer support holder 3200 of the wafer marking system 10000 according to the present invention show a state of supporting a wafer interposed therebetween.

The upper support member 3210 constituting the wafer support holder 3200 and the lower support member 3260 are spaced apart in a wafer supply process, a wafer ejection process, and a wafer rotation process to enable supply, release, and rotation of the wafer. do.

The upper support member 3210 and the lower support member 3260 constituting the wafer support holder 3200 may include at least one guide 3290 and a driving device 3280 for guiding a separation operation or an approach operation. Can be.

The guide 3290 and the driving device 3290 constitute the horizontal transfer device 3100 and may be mounted on a side of the support arm 3110 on which the wafer support holder 3200 is mounted. In addition, since the upper support member 3210 may be mounted on the lower surface of the support arm 3110, the driving device 3280 may lift and lower the lower support member 3260 by a driving force by hydraulic pressure.

The guide 3290 guides the lifting process of the lower support member 3260 by the driving device.

The driving device 3280 and the guide 3290 may be provided in plural numbers to achieve stability of the lifting process of the lower support member 3260.

In the embodiment shown in FIG. 3, the support member driven by the driving device 3280 fixes the lower support member 3260 or the lower support member 3260 constituting the wafer support holder 3200 and supports the upper support. The member 3210 may be configured to be elevated.

The upper support member 3210 has a plurality of openings for dividing and exposing a predetermined area of the upper surface of the wafer, and the lower support member 3260 constituting the wafer support holder 3200 is formed on the back of the wafer. It has an opening that exposes a partial region in a semicircle. The reason why the lower support member 3260 exposes a portion of the back surface of the wafer in a semicircle is to divide the marking process twice.

The upper support member 3210 and the lower support member 3260 constituting the wafer support holder 3200 specify a seating position of the wafer, and in order to reinforce the seating state of the wafer, the edges of the front and rear surfaces of the wafer are fixed. It can have a step.

The stepped portion may be formed on both sides of the upper support member 3210 and the lower support member 3260, or may be formed on only one side thereof.

In the embodiment illustrated in FIG. 3, stepped portions 3111 and 3261 are formed on both the upper support member 3210 and the lower support member 3260.

3, the step formed in the upper support member 3210 and the step formed in the lower support member 3260 may have different intentions.

The upper step 3321 provided in the upper support member 3210 is provided to support the edge area of the upper surface of the wafer, and the lower step 3326 provided in the lower support member 3260 is mounted on the wafer. It performs the function of forming a groove.

The front surface of the wafer is a portion of the circuit of each semiconductor package is etched, it is not preferable to contact with other objects.

In addition, according to the shape of a semiconductor package having a generally rectangular shape, the edge region of the wafer may include a portion (for example, a portion cut in a triangle shape) that cannot be used as a semiconductor package even after cutting.

Therefore, the portion supported by the upper support member 3210 of the wafer support holder 3200 is preferably limited to an edge area which cannot be used among the front surfaces of the wafer.

On the other hand, the lower surface of the wafer is a marking target surface and is exposed in a semicircle through an opening formed in the lower support member 3260. At the same time, since the downward deflection of the wafer should be prevented as much as possible, a suction hole and a suction flow path are formed in an area excluding the semi-circular opening of the lower support member 3260 to apply suction force to an area not exposed through the opening. can do. When a suction force is applied to the back surface of the wafer, even if some regions of the back surface of the wafer are exposed in a semicircle shape, deflection of the wafer due to the load on the exposed portion can be eliminated. A detailed description thereof will be described later.

Therefore, the lower surface of the wafer may be configured to be interviewed with the lower support member 3260 while not being exposed to the opening while being seated on the lower support member 3260.

The lower step 3326 may serve as a boundary portion of a recess in which the lower surface of the wafer is seated, and may provide a positioning function when the wafer is seated.

As shown in FIG. 4, the back surface of the wafer is disposed to contact the upper surface of the lower support member 3260, and suction force is applied by a suction hole, which will be described later, to prevent sag of the wafer during marking. have.

A lower surface of the upper step 3321 of the upper support member 3210 is a portion of an upper edge of a wafer seated on the lower support member 3260 and a part of an upper surface of the lower step 3326 provided on the lower support member 3260. It can have a structure that supports at the same time.

Therefore, such a supporting structure can stably support the wafer while preventing sagging of the wafer during the marking process.

5 is a plan view of the upper support member 3210 of the wafer support holder 3200 constituting the wafer marking system 10000 according to the present invention. Specifically, FIG. 5 (a) illustrates a case in which three openings formed in the upper support member 3210 are provided in total, and FIG. 5 (b) illustrates the openings formed in the upper support member 3210 in a quadrant shape. The case with four is shown.

As described above, the alignment inspection index provided on the upper surface of the wafer may be checked by the alignment inspection apparatus 3600 such that the alignment state of the wafer is marked. Here, if it is determined that the position of the wafer is slightly misaligned with the reference position by checking the alignment state, the position of the wafer is reflected to the marking position of the laser marking apparatus 3500, even if the position of the wafer does not exactly match the predetermined position. The accuracy of the marking process can be guaranteed.

As illustrated in FIGS. 5A and 5B, the upper support member 3210 constituting the wafer support holder 3200 may include a plurality of openings. The number and area of the openings may be determined according to the position of the index according to the type of wafer or the type of wafer. Here, two or more openings may be provided, and the shape of the opening may be the same.

6 shows a top view of the lower support member 3260 of the wafer support holder 3200 constituting the wafer marking system 10000 according to the present invention.

If there is no deflection of the wafer, performing the marking process by exposing most of the back surface of the wafer may increase the efficiency of the marking process. However, since the area of the wafer becomes larger and the thickness becomes thinner, it is inevitable to expose only a portion of the wafer. The marking process may be performed to alleviate the deflection of the wafer.

Accordingly, the lower support member 3260 may expose only a partial region of the lower surface of the wafer, and as shown in FIG. 6, the exposed partial region may have a semicircular shape. The opening of the lower support member 3260 having a semicircular shape may have a larger area than the circular circle, rather than the circular circle.

That is, the reason for configuring the lower support member 3260 in a semicircle is to divide the marking process of the entire back surface of the wafer into two. That is, after the first marking step of marking the exposed semi-circle is performed, the second semi-circle is exposed to the opening of the lower support member 3260 and then the second marking step is performed.

However, the boundary area of each semicircle is a boundary area of the opening of the lower support member 3260, and is an area which is easily exposed to the opening even by the rotation of the wafer or is hard to reach the laser projected by the laser marking device 3500. to be.

Therefore, if the opening of the lower support member 3260 has a semi-circle shape accurately, there may exist an area that is impossible to mark by rotating the wafer once. Accordingly, the opening of the lower support member 3260, which exposes the back surface of the wafer, may be semicircular, including the longest diameter, not the semicircle, to expose the semicircular shape and to expose the region corresponding to the longest diameter of the wafer.

In addition, a region other than the opening 3260h (hereinafter referred to as “support portion 3260s”) of the upper surface of the lower support member 3260 is a region in which the back surface of the wafer to be marked is supported. The hole 3221h may be provided. A negative pressure is applied to each of the suction holes 3331h, and a suction force is applied to support an area not exposed to the opening.

The suction hole may be applied with a suction force through a suction flow path 3301 provided inside the support member.

As illustrated in FIG. 6, the suction flow path 3301 may be configured in the form of a plurality of concentric semicircular arcs having different sizes. The suction flow path 3221 may be applied with suction power as an independent suction pump or the like, respectively, but may include a communication flow path 3221c communicating with each other in a radial direction so as to communicate with each other, and may share a suction pump and the like.

In addition, the lower support member 3260 may further include a semicircular opening region 3260h at the center of the support 3260s.

The opening area 3260h is an area through which an upper surface of the rotating member 3310 of the wafer displacement device 3300 (see FIG. 7) may pass through.

In the embodiment illustrated in FIG. 6, the upper surface of the rotating member 3310 of the wafer displacement device 3300 is a portion indicated by a dotted line, and the rear surface of the wafer exposed to the opening 3260h of the lower support member 3260 is shown. In order to change or rotate the wafer, the wafer may be rotated while the upper support member 3210 and the lower support member 3260 constituting the wafer support holder 3200 are spaced apart from each other. An operation of the wafer displacement device 3300 will be described with reference to FIG. 7.

7 shows the operation of the wafer displacement device 3300 according to the present invention. Specifically, FIG. 7 (a) shows a side view of the rotating member 3310 of the wafer displacement apparatus 3300 in a lowered state, and FIG. 7 (b) shows that the rotating member 3310 of the wafer displacement apparatus 3300 is raised. A side view of the state is shown.

The wafer displacement device 3000 raises the wafer by a predetermined height in a state where the upper support member and the lower support member constituting the wafer support holder are spaced apart, rotates the wafer 180 degrees, and then lowers the lower support member. It is configured to be seated on.

The wafer displacement device 3300 may optionally include a wafer in which the upper support member 3210 and the lower support member 3260 constituting the wafer support holder 3200 are spaced apart from each other, that is, the pressing support state of the wafer is released. Rotating member for rotating in a state supporting the lower surface may be provided.

The rising or falling range of the wafer by the wafer displacement device 3300 may be smaller than the separation distance between the upper support member and the lower support member constituting the wafer support holder.

The upper surface of the rotating member may rotate to approach the wafer seated on the lower support member 3260 through the opening region 3260h described above.

Therefore, the rotating member 3310 is configured to be rotatable, and at the same time configured to be able to lift. Accordingly, the wafer displacement device 3300 includes a rotation motor 3320 for rotating the rotating member, and includes a driving belt 3325 to slow down the speed of the rotation motor 3320 and reduce vibration. Can be.

The rotary motor 3320 and the driving belt 3325 are related to the rotation of the rotating member 3310, but a separate driving unit is required for lifting the rotating member 3310.

The elevating drive of the rotating member 3310 is by the elevating driving unit 3360 and the link member 3330 provided separately.

The lifting driving unit 3360 may reciprocally drive the propulsion arm 3365 by a cylinder type or a motor type. The other end of the propulsion arm 3365, one end of which is driven by the elevating driving unit 3360, is connected to the propulsion block 3350 to which the lower end of the inclined link member 3330 is fastened.

The link member 3330 has a lower end connected to the propulsion block 3350, and an upper end thereof is connected to a lower part of the mounting member 3370 on which the rotating member and the rotating motor are mounted, and thus are inclined from the lower end to the upper direction. As shown in FIG. 7B, when the propulsion block 3350 is propelled in the right direction, the link member 3330 is displaced to have a steeper slope than that shown in FIG. 7A.

In response to the displacement of the link member 3330, the height of the mounting member 3370 may be changed, and the rotating member 3310 mounted to the mounting member 3370 may also be raised.

The rotating member 3310 may rise to approach the rear surface of the wafer interposed between the upper support member 3210 and the lower support member 3260 and then raise the wafer by a predetermined height.

Here, since the back surface of the wafer is opened in a semicircle through the opening of the lower support member 3260, in order to perform the second marking step after the first marking step is finished, it must be rotated 180 degrees.

Therefore, as shown in FIG. 7B, the rotating motor may rotate while the rotating member supports the lower surface of the wafer to rotate the wafer.

In this manner, the lower surface area of the wafer exposed through the opening 3260h of the lower support member 3260 may be changed, and the marking process may be expanded while minimizing the deflection of the wafer.

In the case of dividing the back region of the exposed wafer further, and dividing the multi-circuit marking process, the efficiency of the marking process may be deteriorated. The efficiency and marking quality can be improved.

8 shows a block diagram of a wafer marking method according to the present invention.

In the wafer marking method according to the present invention, in order to perform a more efficient marking process and improve the marking quality, the wafer supply step (S100) of supplying the wafer to be marked is marked, and the back surface of the wafer exposed in a semicircle form of the wafer to be marked is marked. In the first marking step (S320), the wafer rotation step (S340) for rotating the wafer marked in the first marking step (S320) at a predetermined angle in the form of a semi-circle of the wafer rotated in the wafer rotation step (S340) It provides a wafer marking method comprising a second marking step (S360) for marking the back surface of the exposed wafer, and a wafer carrying out step (S400) for carrying out the wafer is completed, the second marking step (S320).

Wafer supply step (S100) is carried out in a way that the wafer is carried out by the wafer transfer robot in the wafer supply unit (1000).

As described above, the first marking step S320 may be performed by exposing a portion of the back surface of the wafer to be marked in a semicircular shape, and the wafer rotating step S340 may not be marked on the back surface of the wafer to be marked. The process of exposing other class members. The predetermined angle of the wafer rotation step S340 may be 180 degrees.

After the first marking step S320 and the second marking step S360 are completed, the marking wafer is carried out to the wafer carrying part 4000 to finish the marking process.

As described above, the first marking step S320 and the second marking step S360 may be performed in a state where the edge of the top surface of the wafer to be marked and the back surface not exposed in the semicircle form are supported. This is to prevent damage to the front surface of the wafer on which the circuit is etched and to prevent sagging of the lower surface of the wafer.

In addition, in order to strengthen the supporting force on the back surface not exposed in the semicircle of the wafer to be marked, negative pressure is applied to the back surface of the wafer not exposed in the semicircle in the first marking step S320 and the second marking step S360. Suction force can be applied.

The wafer rotation step may raise and rotate the wafer to a predetermined height, thereby preventing damage to the wafer surface due to friction between the upper support member and the lower support member constituting the wafer support holder 3200.

The first marking step (S320) and the second marking step (S360) are performed in a state where the edge of the top surface of the wafer to be marked and the back surface which are not exposed in a semicircle are supported, but in the wafer rotating step (S340) Since it is preferable to lift slightly to rotate, the wafer rotation step (S340) may be performed by releasing a state in which the upper surface of the wafer to be marked is pressed and supported.

Then, in order to correct the orientation and position of the wafer before the marking target wafer is supplied to the wafer marking unit, the direction of the marking wafer is aligned between the wafer supply step S100 and the first marking step S320. As described above, it may further include a preliminary alignment step (S200).

The method may further include a checking step of checking a marking state of the back surface of the wafer after at least one marking step of the first marking step S320 and the second marking step S360. The marking inspection step is performed by the marking inspection apparatus disposed adjacent to the laser marking apparatus 3500.

In addition, the marking inspection step may be subdivided into a first marking inspection step S330 and a second marking inspection step S370 for inspecting marking states of semi-circles marked respectively after the first marking step and the second marking step.

Of course, after the first marking step S320 and the second marking step S360 are both completed, the marking state may be checked at once. However, since the positions of the laser marking device 3500 and the marking inspection device 3400 are adjacent to each other, the quality of each marking operation after each marking step is minimized in order to minimize the number of rotations of the wafer by the wafer displacement device 3300. It can be efficient to check. In addition, since the rotation of the wafer is caused by the wafer displacement device, it is not preferable that the reciprocating feed path is long.

And, as described above, before each of the first marking step (S320) and the second marking step (S360) is further supplied to the laser marking device 3500, the alignment inspection step for checking the alignment state of the wafer to be marked further It may include.

As shown in FIG. 8, the first alignment inspection step (S310) and the second alignment for inspecting the alignment state of the wafer to be marked before the first marking step and the second marking step to correct the laser marking are performed. It may further include an inspection step (S350).

As described above, the wafer marking system 10000 and the wafer marking method according to the present invention expose a portion of the wafer to prevent sagging of the wafer while maximizing the sagging of the wafer during the marking of the wafer being enlarged and thinned. In order to mark the back surface of the wafer, in order to mark the back surface of one wafer, the efficiency of the process of changing the position of the wafer can be maximized, thereby improving the efficiency and quality of the marking process.

Although the present specification has been described with reference to preferred embodiments of the invention, those skilled in the art may variously modify and change the invention without departing from the spirit and scope of the invention as set forth in the claims set forth below. Could be done. Therefore, it should be seen that all modifications included in the technical scope of the present invention are basically included in the scope of the claims of the present invention.

1000: wafer supply part 2000: preliminary alignment part
3000: Wafer marking part 3100: Horizontal transfer device
3200: wafer support holder 3210: upper support member
3260: lower support member 3300: wafer displacement device
3500: Laser Marking Device 3600: Alignment Inspection Device
4000: wafer carrying part 5000: wafer transfer robot
10000: Wafer Marking System

Claims (19)

A wafer supply unit supplying a marking target wafer;
A wafer carrying part to which the marked wafers are carried out;
A wafer including a wafer support holder including an upper support member and a lower support member to which the wafer to be marked is inserted and supported therebetween, and a laser marking device for marking predetermined contents on a back surface of the wafer seated on the wafer support holder Marking part;
And at least one wafer transfer robot for supplying a wafer to be marked from the wafer supply unit to a wafer marking unit, and transferring the wafer marked at the wafer marking unit to a wafer carrying unit.
The lower support member of the wafer support holder has an opening for exposing a portion of the back surface of the wafer in a semi-circular shape. The method of claim 1,
The upper support member of the wafer support holder is a wafer marking system, characterized in that for supporting the upper edge of the wafer. The method of claim 2,
And an upper support member of the wafer support holder has a protruding step to support the upper edge of the wafer. The method of claim 1,
And the upper support member of the wafer support holder has a plurality of openings for dividing and exposing a predetermined area of the upper surface of the wafer. The method of claim 4, wherein
The opening is provided with two or more, the shape of the opening is a wafer marking system, characterized in that the same. The method of claim 1,
The lower support member of the wafer support holder is provided with a plurality of suction holes in the support except for the portion where the opening is formed. The method of claim 6,
The suction hole is formed on a plurality of concentric semi-circles, each of the suction holes formed on the concentric semi-circle is a wafer marking system, characterized in that the suction force is applied through the suction flow path formed along the plurality of concentric semi-circles of different radius sizes . The method of claim 7, wherein
A plurality of concentric semicircular suction flow paths are communicated with each other by a radial flow path. The method of claim 6,
The lower support member of the wafer support holder is a wafer marking system, characterized in that the semicircular open area is formed to expose the center of the back surface of the wafer, except for the opening portion. The method of claim 1,
The wafer marking unit lifts or lowers the wafer while the upper support member and the lower support member constituting the wafer support holder are spaced apart to change the back surface of the wafer exposed to the opening of the lower support member constituting the wafer support. A wafer marking system, further comprising a rotating wafer displacement device. The method of claim 10,
The wafer displacement device may raise the wafer by a predetermined height in a state where the upper support member and the lower support member constituting the wafer support holder are spaced apart, rotate the wafer 180 degrees, and then lower it again to seat the lower support member. Wafer marking system, characterized in that. The method of claim 11,
Wafer marking system, characterized in that the rising or falling range of the wafer by the wafer displacement device is less than the separation distance between the upper support member and the lower support member constituting the wafer support holder. The method of claim 11,
The wafer displacement device includes a rotating member for rotating the wafer, a rotating motor for rotating the rotating member, and a link member for converting a horizontal reciprocating motion into a vertical reciprocating motion to raise or lower the rotating member and the rotating motor together. Wafer marking system, characterized in that. A wafer supplying step of supplying a marking target wafer;
A first marking step of marking the back surface of the exposed wafer in the semi-circular form of the wafer to be marked;
A wafer rotating step of rotating the wafer marked in the first marking step at a predetermined angle;
A second marking step of marking a back surface of the wafer exposed in a semicircle form of the wafer rotated in the wafer rotation step; And,
Wafer marking method comprising a; wafer carrying step of carrying out the wafer is completed, the second marking step. The method of claim 14,
The first marking step and the second marking step is a wafer marking method, characterized in that is performed in the state that the back surface of the top surface of the wafer to be marked and the unexposed back surface in a semicircle shape are supported. The method of claim 14,
Wafer marking method characterized in that the suction force is applied to the back surface of the wafer that is not exposed in the semicircle form in the first marking step and the second marking step. The method of claim 14,
The wafer marking step is a wafer marking method, characterized in that for rotating the wafer after raising the predetermined height. The method of claim 17,
The wafer marking step is performed by releasing a state in which the upper surface of the marking target wafer is pressed and supported. 16. The method of claim 15,
And a marking inspection step of inspecting a marking state of a rear surface of the wafer exposed in a semicircle shape after at least one marking step of the first marking step and the second marking step.

Images