KR20110026213A - A build-up printed circuit board with via-holes of stack type using bump structure and manufacturing method of the same, detachable carrier using manufacturing method of the same - Google Patents

Abstract

PURPOSE: A build-up printed circuit board with via-holes of a stack type using a bump structure and a manufacturing method of the same and a detachable carrier using manufacturing method of the same are provided to form two stack type printed circuit board at the same time through one process. CONSTITUTION: In a build-up printed circuit board with via-holes of a stack type using a bump structure and a manufacturing method of the same and a detachable carrier using manufacturing method of the same, at least one internal layer is formed in both sides of a decoupling-type carrier. A base layer including a first bump is formed in the decoupling-type carrier. A second bump pad and a second bump are formed on the base layer. The interlayer removes the decoupling-type carrier to be divided into a decoupling-type interlayer. An outer-most base layer including a filling bump is formed in the outside of the decoupling-type interlayer in a via hole filling mode The decoupling-type carrier comprises a Cu layer combined in both sides of the copper foil composite through a joining film.

Description

A build-up printed circuit board with via-holes of stack type using bump structure and manufacturing method of the same, Detachable Carrier using manufacturing method of the same}

The present invention relates to a method for manufacturing a printed circuit board implemented in a multi-layer and a printed circuit board manufactured accordingly.

A printed circuit board (PCB) is a printed circuit board pattern formed of a conductive material such as copper on an electrically insulating substrate, and refers to a board immediately before mounting an electronic component. In other words, in order to mount many kinds of electronic components on a flat plate, it means a circuit board in which a mounting position of each component is determined and a line pattern connecting the components is printed and fixed on the flat surface. Such printed circuit boards generally include a single-layer PCB and a build-up board in which multilayered PCBs are formed, that is, multilayer PCB substrates.

These build-up boards and multilayer PCB boards can manufacture boards and evaluate the quality of the boards one by one, thereby increasing the yield of the entire multilayer PCB board, and precisely connecting the interlayer wirings to produce high-density compact PCBs. To make it possible.

In this build-up process, a connection line of wiring is formed between layers, and the layers are connected through via holes. In order to form such a via hole, a very fine diameter can be realized using a laser rather than a conventional mechanical drill.

Specifically, the method of forming a via hole of the build-up board is implemented by a stack via method in which vias are stacked on vias, and the formation of the stack vias is printed. It is considered to be a very important core technology in the manufacture of multilayer PCB because the circuit design of the circuit board can be facilitated, the wiring length of the circuit can be shortened, the electrical operation ability is improved, and the circuit density can be increased. In order to form a stack via, very precise alignment of via holes is required, and circuit line width and fine design standards of via holes are required for high density, which makes it difficult to process.

In order to form such a stack via, laser holes have been used to process via holes in insulating materials constituting each layer of a printed circuit board, and to fill the via holes with metallic paste. Later, the copper metal foil is laminated on the surface of the insulating material by a hot press method, and a circuit is formed by a patterning method using a photoresist to complete one layer. After forming each layer in this manner, finely aligning their positions, and again by lamination using a hot press to form a build-up board (Build-up Board). 1A and 1B, the via hole 11 is processed in the insulating material 10 using a laser drill (S 1), a plating layer is formed in the via hole, and the metal paste is filled (S 2). ). Thereafter, a copper foil 13 for forming a circuit pattern is formed on the upper surface of the insulating material 10 (S 3), and the copper foil 13 is processed to form a circuit pattern 14, thereby completing one layer (S). 3).

Thereafter, the second dynamic laminated plate 13 and the third dynamic laminated plate are aligned to form a build-up board having a stack via through thermal compression (S 4 to S 5).

However, the processing of the via hole for forming the multilayer stack via is performed by using a fine laser drill. In this case, the via hole must be formed separately in each layer. Problem occurs. In addition, when the conductive metal paste is filled to transmit the electrical signal of the via hole, a high electrical resistance of the metal paste may cause a lot of noise. Therefore, this manufacturing method is difficult to be applied to a product that requires high reliability. .

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to manufacture two stacked printed circuit boards simultaneously in one process using a separate carrier in stacking a multilayer board. It is to provide a manufacturing process that shortens the process and improves the productivity.

Furthermore, the present invention provides a manufacturing process as described above, to form a bump to form a base layer, to implement the inner layer through the continuous lamination, the outermost layer is shortened the manufacturing process by applying a via hole filling method and At the same time, an object of the present invention is to provide a printed circuit board having a stack via of high reliability by improving interlayer adhesion and minimizing signal transmission resistance.

In addition, the stack via structure of the inner layer substrate may be realized as a bump structure, but the cross section may be implemented in a rectangular structure, so that a fine circuit can be realized more precisely and more in the same area, thereby increasing the efficiency of the product and printing accordingly. It is an object to provide a circuit board.

The present invention introduces an embodiment using a detachable carrier as a means for solving the above problems. Specifically, the first step of forming at least one inner layer on both sides of the removable carrier; Removing the separated carrier to separate the inner layer into a separated inner layer group; Forming an outermost base layer having a filling bump formed in a via hole filling method on an outer surface of the separated inner layer group; It is possible to provide a method for manufacturing a stacked printed circuit board having a bump including a, to manufacture two printed circuit boards in one process as well as to provide a highly reliable product.

Particularly, in the above-described manufacturing process, the specificity of the manufacturing process according to the detachable carrier to be used appears. As an example, the detachable carrier of the first step may use a structure in which a Cu layer is bonded to both surfaces of the copper foil composite by a bonding film. have. In this case, in configuring the first step, 1a) forming a base layer including a primary bump on the split carrier; 1b) forming a secondary bump pad and a secondary bump on the base layer. In addition, in step 1a), the photosensitive material (DFR) may be patterned, and the bump structure may be implemented by plating. In particular, the step 1b), 1c) laminating an insulating layer on the base layer; 1d) forming at least one surface treatment layer on the insulating layer; 1e) patterning the surface treatment layer to form secondary bump pads and forming secondary bumps thereon; It is preferable to form the inner layer forming step including a step of repeating at least one or more times.

In particular, the step 1d) in the above-described manufacturing process according to the present invention, the surface treatment layer may be formed of an alloy deposition layer, Cu deposition layer, Cu plating layer, in particular, the alloy deposition layer, Ni, Cr, It can be formed as a single layer or multilayer structure layer made of a material selected from Au, Ag, Pb, Pd.

In the above-described manufacturing process, step 1e) may implement a bump structure by plating after patterning the photosensitive material (DFR). After plating the bump structure, mechanical or chemical polishing may be performed to remove the photosensitive material. The process can be further formed.

In any case, it is preferable that the manufacturing process according to the present invention as described above can perform simultaneous operation with two separate inner layer groups by removing the detachable carrier so as to enhance the efficiency of the process.

Thereafter, the step 3 after separating the removable carrier may include: 2a) forming a filling bump pad through surface treatment on an outer surface of the removable inner layer group; 2b) forming an outermost base layer formed of an insulating layer and a copper plating layer; 2c) forming via holes in the outermost base layer; 2c) filling the via hole to form a filling bump; 2d) forming a circuit pattern on the copper plating layer in close contact with the filling bumps; It may be formed to include. Furthermore, step 2b) may process via holes using a laser drill.

According to the manufacturing process according to the present invention described above, it is possible to manufacture a printed circuit board having the following structure.

Specifically, the printed circuit board manufactured by the present invention includes at least one inner layer to which each layer is connected by having a bump inside the insulating material layer; An outermost base layer formed on the inner shell and connected to the inner layer, the filling bump pad, and the filling bump; And a circuit pattern formed on the outermost base layer.

In particular, in the structure of the printed circuit board according to the manufacturing process in the above-described embodiment, the inner layer, the base layer having a primary bump in the insulating layer; And at least one secondary inner layer formed on the base layer and having a secondary bump pad and a secondary bump connected to the primary bump in the insulating layer. In this case, in particular, the filling bump pads formed on the two outermost base layers may have a structure in which both filling bump pads are formed.

In addition, the printed circuit board according to the present invention is characterized in that the first bump and the second bump structure has a rectangular or square cross-section, further, the secondary bump pad and the filling bump pad, an alloy deposition layer, Cu It is preferably formed of a laminated structure of a deposition layer and a Cu plating layer, and in particular, the alloy deposition layer is preferably formed of a single layer or a multilayer structure formed of a material selected from Ni, Cr, Au, Ag, Pb, and Pd. In addition, the filling bump in the present invention is characterized in that the cross section is trapezoidal shape.

According to the present invention, in stacking multilayer boards, two stacked printed circuit boards are simultaneously formed in one process using separate carriers to shorten the manufacturing process and improve productivity.

Particularly, bumps are formed to form a base layer, and the inner layer is realized through continuous lamination, and the outermost layer uses a via hole filling method to shorten the manufacturing process, improve interlayer adhesion, and minimize signal transmission resistance. This makes it possible to provide a printed circuit board having a highly reliable stack via.

In particular, the stack via structure of the inner layer substrate may be realized as a bump structure, but the cross-section may be implemented as a rectangular structure, and thus the advantage of improving the efficiency of the product may be realized by enabling more precise and more minute circuits in the same area.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. In the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and duplicate description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

According to the present invention, in manufacturing a stacked printed circuit board having bumps, two printed circuit boards can be simultaneously manufactured using a separate carrier, and in particular, via holes are processed in an inner layer and an outermost part connected to a bump structure therein. The manufacturing method using the method of filling by the above is made into the summary.

2a to 2c schematically show a flowchart and a process diagram of the manufacturing process of the preferred embodiment according to the present invention.

Example

The present invention is largely divided into a first step of forming at least one inner layer on both sides of the separate carrier and the second step of separating the inner layer into a separate inner layer group by removing the separate carrier, and a via hole filling method on the outer shell of the separated inner layer group. It comprises three steps to form the outermost base layer with the filling bump is formed. In this case, the inner layer may implement interlayer connection through bumps, and the outermost layer may implement interlayer connection through filling bumps through plating of via holes.

(1) step 1-separate carrier + inner layer forming step

In the first step, the first bumps 120 are first formed through plating on the detachable carrier C1 (S1 to S2). The detachable carrier C1 has a structure in which the copper foil layer Cu is adhered to the copper foil composite body 110 (the structure in which the copper foil a is coated on both surfaces of the insulator b) through the double-sided bonding film 111. desirable. This serves to facilitate the fairness of the thin product in the future, and at the same time to be able to produce the product on both sides at the same time can realize the effect of improving the productivity of the process. The double-sided bonding film may be formed on the outer portion of the upper and lower surfaces of the copper foil composite, and then form a Cu layer through lamination. Subsequently, in the separation process of the second step, the double-sided adhesive film can be removed and separated. The portions other than the portions on which the double-sided bonding film 111 is formed are preferably formed in a structure in which the space between the upper and lower surfaces of the copper foil composite 110 and the copper foil layer is finely spaced apart or in close contact with each other.

The formation of the first bump may be realized by implementing a pattern by exposure and development using a dry film resist (DFR) and then filling a metal material into the pattern using electroplating. Of course, before the DFR is peeled off after plating, a process of chemical or mechanical polishing may be added to control the height of the appropriate bumps.

Next, after forming the first bump 120, the insulating layer 121 is laminated (S 3). An insulating layer having primary bumps is defined as a 'base layer'.

Specifically, when the primary bump 120 is formed by plating, the DFR is peeled off, the prepreg sheet and the copper thin film layer are laminated, and then pressed by heat and pressure, and then the copper thin film layer is etched and removed. Can be implemented in In this case, the copper thin film layer serves to facilitate the flow and spreadability of the resin during the pressing process due to heat and pressure. Of course, even in this case, after removing the copper thin film layer, it is possible to implement the appropriate bump height by performing mechanical or chemical polishing to make the height of the bump constant.

After step S 3, an inner circuit layer (0.1 to 50 μm), that is, a surface treatment layer is formed on the base layer in order to form the second bump pad in step S 4. The surface treatment layer forms an alloy deposition layer 131, a Cu deposition layer 132, and a Cu plating layer 133 on the base layer. After lamination, the second bump pad 130 is patterned by applying a DFR and forming a pattern. The secondary bump pad forms the secondary bump 140 and at the same time implements an inner layer circuit. The alloy deposition layer 131 may be formed of an alloy of at least two or more metals selected from Ni, Cr, Au, Ag, Pb, and Pd. For example, the alloy deposition layer 131 deposits an alloy of Ni and Cr, thereby improving adhesion between the Cu plating layer 133 and the epoxy layer laminated first. The alloy deposition layer 131 is preferably formed in 0.05 ~ 0.1㎛. In addition, the Cu deposition layer 132 performs a function of improving the bonding strength between the above-described alloy deposition layer 131 and the Cu plating layer 133 in the future. Thereafter, a Cu plating layer 133 which serves as an inner layer circuit is formed on the Cu plating layer 133.

In step S5, after applying and patterning the DFR on the Cu plating layer 133, which is the innermost circuit layer of the second bump pad 130, by the same method as the method of forming the first bump, the second bump through plating 140 may be formed, and then mechanical and chemical polishing may be performed before the DFR is peeled off.

Thereafter, an insulating layer 141 is stacked on the secondary bumps 140. Lamination of the insulating layer is the same as the method of step S3. In the present invention, a layer having a structure in which the secondary bump pad 130, the secondary bump 140, and the insulating layer 141 are formed is defined as a 'secondary inner layer'. In the present invention, the secondary inner layer structure may be formed at least one or more.

(2) forming a separate-separable inner layer group of a detachable carrier

Subsequently, as in step S7, the removable carrier C1 is removed to separate the structures formed on the upper and lower surfaces of the removable carrier (each separated structure is defined as a 'separable inner layer group'). Simultaneously work on the PCB manufacturing process. In the figure, the process will be described with only one separate inner layer group.

The above separation process is to cut the use section of the double-sided bonding film of the removable carrier so that the product can be separated through the internal non-bonded portion.

(3) Formation of the outermost base layer with via hole processing and filling bumps

The separate inner layer group has the same structure, one of which will be described later the process. Surface treatment is performed on both sides of the separate inner layer group to form a filling bump pad (S 8). The filling bump pad 150 is formed in the same process as step S3. Similarly, the alloy deposition layer 151, the Cu deposition layer 152, and the Cu plating layer 153 are provided. As shown, the Cu 112 layer of the initial detachable carrier is also formed into a patterned structure while patterning the filling bump pad 150.

In step S 9, an insulating layer 154 and a copper foil layer 155 are formed on the filling bump pad 150. A layer including the filling bump pad 150, the insulating layer 154, and the filling bump formed thereafter is defined as an 'outermost base layer'.

In step S10, via holes H are processed in the outermost base layer. The via hole processing is preferably performed until the filling bump pad 150 is exposed using a laser drill. Thereafter, the via hole H is filled through the via hole to form a filling bump 160 (S 11). Thereafter, the copper foil layer 155 of the outermost base layer is processed to form a circuit pattern 155a. In the above process, the two separate inner layer groups proceed in a simultaneous process, thereby improving productivity.

Referring to Figure 3 will be described the structure of the printed circuit board manufactured by the manufacturing process according to the present invention.

The printed circuit board according to the present invention includes at least one inner layer having bumps inside the insulating material layer and at least one inner layer to which each layer is connected, and an outermost base formed at the outer layer to fill the inner layer and the via hole. The layer may have a structure including a circuit pattern formed on the outermost base layer.

As shown in particular, the printed circuit board manufactured in the manufacturing process according to the embodiment of the present invention includes a bump pad 130 formed on a base layer including a primary bump 120 and an insulating layer 120. At least one secondary inner layer formed of the bump structure 140 and the insulating layer 141 may be formed and stacked. The bump pad 130 may be formed in a triple structure of the alloy deposition layer 131, the Cu deposition layer 132, and the Cu plating layer 133 as described above.

In addition, in the above-described structure, the outermost base layer formed of the filling bump pad 150, the filling bump 160, and the insulating layer may be formed on the outer shell of the laminated structure of the secondary inner layer and the outer shell of the base layer. In particular, a Cu layer may be further formed at an adjacent boundary between the filling bump pad and the primary bump formed on the outer surface of the base layer. The filling bump pad 150 may also be implemented as a triple structure of the alloy deposition layer 151, the Cu deposition layer 152, and the Cu plating layer 153. As the material for forming the alloy deposition layer, an alloy of at least two or more metals selected from Ni, Cr, Au, Ag, Pb, and Pd may be used as described above.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

1A and 1B are conceptual views and process diagrams of a manufacturing process of a printed circuit board according to the prior art.

2A to 2C are conceptual diagrams and process diagrams of a manufacturing process according to an embodiment of the present invention.

3 is a schematic view of the main part of a structure of a printed circuit board according to a manufacturing process of the present invention.

Claims (21)

Forming at least one inner layer on both sides of the removable carrier; Removing the separated carrier to separate the inner layer into a separated inner layer group; Forming an outermost base layer having filling bumps formed in a via hole filling method on an outer surface of the separated inner layer group; Method of manufacturing a stack-type printed circuit board having a bump comprising a. The method according to claim 1, The method of manufacturing a stacked printed circuit board having bumps may include a structure in which a Cu layer is bonded to both surfaces of a copper foil composite by using a bonding film. The method according to claim 2, wherein the first step, 1a) forming a base layer including a primary bump on the split carrier; 1b) forming a secondary bump pad and a secondary bump on the base layer; Method of manufacturing a stacked printed circuit board having a bump, characterized in that it comprises a. The method of claim 3, The step 1a), the method of manufacturing a stacked printed circuit board with bumps, characterized in that to pattern the photosensitive material (DFR), and to implement a bump structure by plating. The method of claim 3, Step 1b) is, 1c) stacking an insulating layer on the base layer; 1d) forming at least one surface treatment layer on the insulating layer; 1e) patterning the surface treatment layer to form secondary bump pads and forming secondary bumps thereon; A method of manufacturing a stacked printed circuit board having bumps, the method including: repeating at least one time an inner layer forming step. The method according to claim 5, Step 1d), The method of manufacturing a stacked printed circuit board with bumps, wherein the surface treatment layer is formed of an alloy deposition layer, a Cu deposition layer, and a Cu plating layer. The method according to claim 6, The alloy deposition layer, A method for manufacturing a stacked printed circuit board with bumps, characterized in that it is formed of a single layer or a multilayer structure consisting of a material selected from Ni, Cr, Au, Ag, Pb, and Pd. The method according to claim 5, The step 1e) is a method of manufacturing a stacked printed circuit board with bumps, characterized in that the bump structure is implemented by plating after the photosensitive material (DFR). The method according to claim 8, After the plating of the bump structure, mechanical or chemical polishing and peeling the photosensitive material manufacturing method of a stacked printed circuit board having a bump, characterized in that. The method according to any one of claims 1 to 9, Wherein the step 2 is a step of removing the bonding film constituting the removable carrier to form a separate inner layer group manufacturing method of a stacked printed circuit board having a bump. The method according to claim 10, The third step, 2a) forming a filling bump pad through surface treatment on an outer surface of the separate inner layer group; 2b) forming an outermost base layer formed of an insulating layer and a copper plating layer; 2c) forming via holes in the outermost base layer; 2c) filling the via hole to form a filling bump; 2d) forming a circuit pattern on the copper plating layer in close contact with the filling bumps; Method of manufacturing a stacked printed circuit board having a bump, characterized in that comprises a. The method of claim 11, The step 2b) is a manufacturing method of a printed circuit board having bump vias, wherein the via holes are processed using a laser drill. At least one inner layer having bumps inside the insulating material layer to which each layer is connected; An outermost base layer formed on the outer shell and connected to the filling bump filling the inner layer and the via hole; A circuit pattern formed on the outermost base layer; Stacked printed circuit board having a bump comprising a. 14. The method of claim 13, At least one of the outermost base layer formed on the inner layer outer layer, Stacked printed circuit board with a bump, characterized in that it comprises a filling bump pad for connecting the filling bump and the bump of the inner layer. The method according to claim 14, The inner layer includes a base layer having a primary bump in the insulating layer; And at least one secondary inner layer formed on the base layer and having a secondary bump pad and a secondary bump connected to the primary bump in an insulating layer. Filled bump pads are formed on the outermost base layer, respectively. Stacked printed circuit board having bumps. The method according to claim 15, The first bump and the second bump is a stacked printed circuit board having a bump, characterized in that the cross-section is rectangular or square shape. 18. The method of claim 16, The secondary bump pad and the filling bump pad, Stacked printed circuit board with bumps, characterized in that formed in a laminated structure of an alloy deposition layer, Cu deposition layer, Cu plating layer. The method according to claim 17, The alloy deposition layer, Stacked printed circuit board with bumps, characterized in that it is formed of a single layer or a multilayer structure consisting of a material selected from Ni, Cr, Au, Ag, Pb, Pd. 18. The method of claim 16, The filling bump is a stacked printed circuit board having a bump, characterized in that the cross-section is trapezoidal. A separate carrier in which a Cu layer is bonded by a bonding film on both sides of a copper foil composite (CCL) having Cu layers formed on both sides of an insulator layer. The method of claim 20, The bonding film is a separate carrier, characterized in that formed on the outer portion of the upper and lower surfaces of the copper foil composite.

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