KR20110006156A - The machine vision development of semiconductor bga - Google Patents
The machine vision development of semiconductor bga Download PDFInfo
- Publication number
- KR20110006156A KR20110006156A KR1020090063659A KR20090063659A KR20110006156A KR 20110006156 A KR20110006156 A KR 20110006156A KR 1020090063659 A KR1020090063659 A KR 1020090063659A KR 20090063659 A KR20090063659 A KR 20090063659A KR 20110006156 A KR20110006156 A KR 20110006156A
- Authority
- KR
- South Korea
- Prior art keywords
- inspection
- semiconductor
- image
- frame grabber
- camera
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
As information and communication develops, communication systems must develop accordingly, and the trend toward miniaturization and lightening of the system is increasing. The present invention automatically checks the state of the ball among the semiconductor parts formed by using the ball at the bottom of the semiconductor instead of the lead frame of the semiconductor to miniaturize the system among the semiconductor devices essential for information and communication equipment, and checks whether the defect is in Machine Vision. This invention is an equipment that automatically inspects and classifies defects. The present invention automatically inspects semiconductor BGA device components and inspects the quality in real time in the manufacturing line, contributing to the identification of the cause of defect rate and improvement of quality and improving productivity. The system consists of machine vision system, inspection method, inspection algorithm and system to classify defects.
The system consists of three CCD cameras for primary, secondary and tertiary inspection, frame grabber, computer for image processing, and hardware and software. Firstly, it is a device that captures the image of the object, and the image data is transferred to the computer's memory through the image frame grabber. CCD camera consists of camera body, signal cable and lens. It is a device that receives the image data stored in the CCD camera, and is in charge of driving and interface of the CCD camera. The frame grabber used in this system consists of three parts: camera interface, image memory and PCI bus interface. The instrument part consists of a transport mechanism to smooth the part and transport it onto the correct inspection system, an optical mechanism for the optimal inspection environment, and a housing for light control. And an optical filter. The control panel is a PLC and other electrical and electronic systems that provide outputs to the motion controller, proximity sensor, lighting controller, host computer and peripheral equipment for driving inspection programs, and reports on defective parts. consist of.
The inspection software runs on Windows XP's O / S on the main computer, and plays a key role in controlling peripheral devices, performing inspections, and storing images for BGAs as well as inspection items and parameter settings.
Description
This inspection technology field is a semiconductor component element that is essential for home appliances and communication devices, and cannot be identified by the naked eye at the time of production. Therefore, it is a field that needs image recognition processing technology, precision control technology, precision optical technology, and mechanical design technology as inspection equipment using robot technology.
[Material 1] Matrox Meter Hardware
Image processing, Craig A.Lindly
[Document 3] FARA MVE-02 Hardware
[4] Laser Focus World, A PennWell Publication
[5] The Measurement automation, National Instrument
This inspection technology field is a semiconductor component element that is essential for home appliances and communication devices, and cannot be identified by the naked eye at the time of production. Therefore, it is a field that needs image recognition processing technology, precision control technology, precision optical technology, and mechanical design technology as inspection equipment using robot technology.
The inspection system of the semiconductor component device BGA is started by inspection software, and the user adjusts the inspection object and inspection parameters to set the degree of judgment of the inspection and start the inspection. The transfer mechanism automatically detects and operates the flow of the semiconductor component BGA, and when the semiconductor component BGA reaches the inspection position with the camera and the optics, the lighting and the camera operate to obtain an image of the semiconductor component BGA, which is the main computer. The frame grabber is a plug-n-play board for image acquisition in the machine vision application program.The frame grabber is connected to various trigger, strobe and asynchronous reset options for the camera connected to the frame grabber. It can be easily interfaced with the I / O function for controlling and monitoring external events. Frame Grabber consists of three main parts: Camera Interface, Image Memory and PCI-bus Interface. Connector Pin-Out consists of two 15-pin / 26-pin video connectors and digital I / O ports.
When a defect is detected, the main computer sends a defective output signal to the PLC to send out an output signal to the user so that the user can recognize the defect, and at the same time, sends a signal to the ejecting mechanism to eject the defective product. It is designed to allow the user to monitor the signal from the external outputs and perform additional tasks such as changing parameters or adjusting the test settings as required.
This development system is concerned with the construction, inspection method and specification of machine vision system for inspecting the components of semiconductor component BGA, reporting inspection results to users, and separating defects. Optical mechanism and lighting for optimal inspection environment It is composed of a housing for control, and the lighting and the camera are operated to obtain an image of the semiconductor component device BGA, and it is transmitted from the main computer to perform an inspection to determine whether it is defective or normal. Send the output signal to PLC so that the user can recognize the defect. Output signal to the user. The user can monitor the signal of the external output and perform additional work to change the inspection setting parameter or adjust the inspection degree if necessary. Can be. At the same time, it sends out a signal to the ejecting mechanism to eject the defective product. Therefore, the present invention automatically inspects the semiconductor BGA component and inspects the quality in real time in the manufacturing line, contributing to the identification of the cause of the defective rate and improvement of the quality and improving productivity. When a defect is detected, the main computer sends a bad output signal to the PLC to send out an output signal to the user so that the user can recognize the defect, and simultaneously sends a signal to the ejecting mechanism to automatically eject the defective product. have. In addition, the user can change the parameters related to the inspection setting or adjust the inspection degree if necessary, and is designed to be more flexible and convenient than the conventional simple function, and ultimately reduce the defective rate to contribute to the improvement of quality and productivity. It became.
The present invention relates to the construction, inspection method, and specification of a machine vision system for inspecting semiconductor BGA device components, reporting inspection results to users, and isolating defective products. The Vision System consists of hardware and software such as three CCD cameras for the 1st, 2nd and 3rd inspections, a frame grabber, a computer for image processing, and an illumination device. It operates by using a keyboard, and a button menu and a wizard method are adopted for easy and simple operation by the user.
The system was developed with a camera unit, a frame grabber unit, an optics unit, a control panel, and four modules and instrumentation units.
- Digital CCD camera is a device that captures the image of the object, and the image data is transferred to the computer's memory through the Image Frame Grabber. CCD camera consists of camera body, signal cable and lens.
- Frame Grabber is a device that receives image data stored in CCD camera, and is in charge of driving and interface of CCD camera. The frame grabber used in this system consists of three parts: camera interface, image memory and PCI bus interface.
- lighting devices Appropriate lighting is used according to the inspection object and item, and this system is composed of the first inlet inspection lighting device and the second BGA inspection lighting device. First of all, the first inlet inspection lighting device is a top light and consists of a red LED light, a source and a bracket. Secondary BGA inspection lighting consists of side lighting and half mirror lighting. Side light consists of Blue LED Light, Source and Bracket, and Top light consists of Half Mirror, Source, Bracket and Cooling Fan.
The control unit was developed as a PLC and other electrical and electronic systems that provide output to the host computer and peripheral equipment for driving motion control, proximity sensors, lighting controls, inspection programs and reports on defective parts.
The software sector consists of a hardware interface module, such as a frame grabber for obtaining a BGA image of the inspection program, a digital I / O that sends the inspection result signal to the PLC, and a UI module for displaying the interface and inspection status with the user. It is developed as a test setup module for selection and test configuration, and a kernel module for analyzing, processing, and measuring images. The inspection performance and inspection items of this development system are as follows.
1. Inspection Tact time and speed:
-Inspection time: 20 ~ 60 ms
-Inspection accuracy: 0.2 ~ 03Mil
2. Inspection item of inspection subject:
-Ball Presence: Missing Ball, Double ball, Extra ball
-Ball Position: 10um (0.5Mil)
-Ball Pitch: 10um (0.5Mil
-Ball Size: Large Ball, Snall Ball 10um (0.5mil)
-Ball Quality: Circularity
-Package Surface: Reject Mark
-Package Dimension: 12um (0.5Mil)
-Miss Align: 12um (0.5Mil)
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090063659A KR20110006156A (en) | 2009-07-13 | 2009-07-13 | The machine vision development of semiconductor bga |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090063659A KR20110006156A (en) | 2009-07-13 | 2009-07-13 | The machine vision development of semiconductor bga |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20110006156A true KR20110006156A (en) | 2011-01-20 |
Family
ID=43613027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090063659A KR20110006156A (en) | 2009-07-13 | 2009-07-13 | The machine vision development of semiconductor bga |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20110006156A (en) |
-
2009
- 2009-07-13 KR KR1020090063659A patent/KR20110006156A/en not_active Application Discontinuation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application | ||
| E601 | Decision to refuse application | ||
| E601 | Decision to refuse application |