KR20100119044A

KR20100119044A - Led lamp

Info

Publication number: KR20100119044A
Application number: KR1020090037960A
Authority: KR
Inventors: 이승헌
Original assignee: 주식회사 아이비피
Priority date: 2009-04-30
Filing date: 2009-04-30
Publication date: 2010-11-09

Abstract

The present invention relates to a lighting lamp using a plurality of LEDs, and more specifically, the singular lighting means 100 having a PCB substrate 20 equipped with LEDs 22 mounted on the bottom of the base plate in the diffusion diffusion cover 30 is combined. Alternatively, a plurality of arrays may be installed, but the heat generated by the lighting means may be solved by a heat dissipation structure, so that the lighting means may be installed intensively, thereby maximizing the load reduction of the device and the reduction of power consumption of the LED lighting. It provides various LED lights by combining various shapes such as square, round, or various shapes or arrangements of lighting means to realize various designs to fit the interior sense of the installation space. It has its features.

Description

LED lighting lamp {LED LAMP}

The present invention relates to a lamp using a plurality of LEDs, and more particularly, the lighting means formed of a PCB substrate on which the LEDs are installed in an array installed on the base plate, because the heat generated from the lighting means by the heat dissipation structure lighting means Can be installed intensively, enabling compact configuration, maximizing power consumption reduction, and realizing various designs to suit the interior sense of the installation space by combining various shapes of base plate, lighting means, and arrangement of lighting means. The present invention relates to an LED lighting lamp that provides excellent merchandise and aesthetics.

In general, there are various types of lightings used for lighting, in addition to fluorescent lamps, incandescent lamps, factory lamps, street lamps, security lamps, and direct lamps.

In addition, recently, due to various advantages such as low power consumption and semi-permanent service life, there is a tendency to replace LED lamps, and many luminaires using LEDs have been disclosed.

As the components of the luminaire using the LED, the four main components of "1. LED substrate, 2. heat radiating means, 3. power supply, 4. diffusion cover" should be properly considered and configured. Problems of the apparatus

first; All LEDs are integrated on one board to match power consumption, so heat is concentrated in one place, causing serious heat dissipation problems.

second; Even if the same type of lighting, the power consumption is changed, all the above four parts must be changed, so it costs a lot of development cost, and also manages many parts in production, so parts loss occurs.

third; When developing lightings with different functions (e.g. fluorescent lights, down lights, street lights, security lamps, factories, etc.), all four items should be developed.In production, many parts modules with the same functions but different shapes and capacities There is a problem such as production costs go up and insoluble materials, so

In addition, the conventional lighting lamp using the LED is mainly to be illuminated by using a conventional fluorescent lamp type or a light guide plate, in the case of the fluorescent lamp type, a plurality of LEDs are arranged in a horizontal column in the exterior of the fluorescent lamp type luminaire In the case of using the light guide plate, when the light of LEDs is irradiated from the side of the light guide plate made of acrylic flat plate, it is reflected to the inside of the light guide plate and is configured to emit light to the outside of the light guide plate. .

However, compared to incandescent lamps and fluorescent lamps, the conventional LED lamps have low power consumption, low heat generation, and long lifespan, while relatively low illuminance increases the intensity of illumination. The problem of not being able to install a large number of LEDs in a limited area and the problem of device load due to heat generated from LEDs when a large number of LEDs are gathered, resulting in a limit in lowering power consumption. Although most of the disclosed inventions can compensate for the shortcomings of LEDs by improving the illuminance by improving the reflectance, these existing methods have structural limitations that can radiate heat in a limited area. In order to increase illuminance by not overcoming There was a defect that can not but enlarge the sphere.

The present invention has been invented to solve the above-mentioned problems of the prior art, the lighting means formed of a plurality of LED mounted PCB substrate arranged in the base plate, the heat dissipation structure according to the height of the heat generated from the lighting means By solving the problem, the lighting means can be installed intensively within a limited area, and the device can be compactly configured, but its purpose is to reduce load and minimize power consumption of LED lighting.

The present invention makes the LED substrate, the heat dissipation means, the power supply, the diffusion cover into one basic module (for example, 3W, 5W, 7W, 10W, 15W, 20W, etc.),

The above-mentioned basic module can be expanded to manufacture various lighting lamps of various power consumptions (e.g., three 20W modules can be manufactured to produce 60W lighting lamps, and five 5W modules to produce 20W lamps). Can and

In addition, various types of lighting lamps having different functions (e.g., 20W fluorescent lamps using four 5W base modules, 40W fluorescent lamps using four 10W base modules, and 120W using six 20W base modules) 60W factory lamp, two 20W base modules, one 10W module, 50W security lamps, six 20W base modules, and 120W street lamps using six 15W base modules). Another purpose is to provide LED lightings of various styles while maximizing the characteristics of LEDs.

This invention,

The base plate, the lighting means that is built by combining the PCB board with a plurality of LEDs mounted on the bottom of the base plate coupled to the cover, and the upper cover with a heat dissipation hole and a ballast to the heat radiating heat generated from the lighting means on the base plate is combined It is characterized by its finish.

The present invention is configured to assemble at least one or more lighting means combined with a base plate, a PCB substrate equipped with a plurality of LEDs mounted on the bottom of the base plate in the cover, the lighting means to the upper position of the respective lighting means on the base plate It is characterized in that the heat dissipation opening and the top cover to dissipate the generated heat is combined and finished.

At least one locking protrusion having a locking step at the top of the lighting means cover of the present invention is formed, and the base plate has a feature of mutually forming a corresponding locking groove into which the locking protrusion is inserted.

The base plate of the present invention is characterized in that it is formed in a polygonal or circular shape.

The present invention comprises a lighting assembly coupled to a built-in PCB cover with a plurality of LEDs mounted on the bottom of the base plate coupled to the cover, and a heat dissipation opening for radiating heat generated from the lighting means on the top, the lighting assembly is At least one arrangement is arranged at the bottom of the mounting plate protruding from the stepped portion of the ring to the center of the top, and the mounting plate is characterized in that the mounting assembly to surround the lighting assembly with a hemispherical cover having an assembly hole to be assembled so as to protrude through the ring.

The present invention provides a rectangular housing having a width of a fluorescent lamp frame buried in the ceiling, and installs a lighting means combined with a built-in PCB substrate equipped with a plurality of LEDs in the cover of the lower part of the rectangular housing, and each lighting above the rectangular housing The upper cover is characterized in that the heat dissipation opening and the top cover to dissipate heat generated from the lighting means to the combined finish.

The present invention is arranged to install the lighting means formed of a PCB substrate equipped with a plurality of LED on the base plate, the heat generated from the lighting means by the heat dissipation structure, so it is possible to intensively install the lighting means in a limited space While the device can be compactly configured, it has the effect of reducing the power consumption and minimizing the power consumption of the LED lighting. Also, the base plate can be configured in various shapes such as triangular, square, and circular, or the shape or arrangement of the lighting means can be varied. In combination with the various LED lighting, it is possible to realize a variety of designs to suit the interior sense of the installation environment has an excellent effect.

In addition, there is an advantage that the use of common module parts during production does not produce insoluble materials, and heat dissipation structure is easy because the heat is distributed by using a plurality of modules when making a lamp with a large power consumption.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The basic embodiment of the LED lamp of the present invention, as shown in Figure 1 and 2, the base plate 10, the PCB substrate 20 is mounted with LEDs 22 below the base plate diffusion cover 30 The lighting means 100 built-in and coupled to the upper plate 50 is made of a combined heat shield 40 and a top cover 50 having a ballast (not shown) to radiate heat generated from the lighting means.

At this time, the base plate 10 can be produced in various forms of polygonal or circular, such as triangular, square, etc. and various heat dissipable materials such as ferrous metals, non-ferrous metals such as aluminum, iron, stainless, magnesium, etc., limited to any one form It doesn't work.

In addition, the heat dissipation opening 40 may be formed in various shapes, and may be configured in various shapes such as triangular, square, and round, and the heat dissipation opening according to the amount of heat dissipation in proportion to the amount of power consumed according to the quantity of LEDs of the lighting means 100. By varying the height of (2), it is possible to install a large number of LEDs of the lighting means within a limited area, thereby eliminating the problem of heat dissipation, enabling a compact configuration while increasing the illuminance, while minimizing the power consumption and high illuminance A configuration capable of realizing is possible.

In addition, the diffusion cover 30 of the luminaire 100 may be formed in a transparent or translucent in order to allow the LED illumination light to be transmitted brightly or to transmit lightly.

In addition, at least one locking protrusion 32 having a locking step 33 is formed at an upper end of the diffusion cover 30 of the lighting means 100, and the locking protrusion 32 is formed on the base plate 10. It is configured by correspondingly forming the engaging groove 12 is inserted and assembled.

The lighting of the present invention can be applied to various installation methods, such as to install the upper portion of the housing 50 directly to the ceiling or the wall surface, or to be suspended or suspended by a separate wire or the like.

In the case where the ceiling or wall surface is directly fixed to the ceiling or wall surface, the heat dissipation port 40 and the cover 50 portion of the base plate 10 may be installed in a buried form.

The illumination lamp of the present invention installed as described above is to be illuminated by the illumination light by a plurality of LEDs 22 of the lighting means 100 through a transparent or translucent diffusion cover 30.

In particular, since the luminaire 100 is illuminated by a plurality of LEDs 22, a large amount of heat is generated, which is the primary heat dissipation by the base plate 10 above the luminaire and the secondary by the heat dissipation opening 40. It is solved by thermal radiation.

That is, since heat generated by the lighting means radiates heat by setting the heat dissipation amount according to the height of the base plate 10 and the heat sink 40, the load of the device can be reduced, thereby limiting the LED 22 of the lighting means. It is possible to install a large number in the area range, it is possible to greatly increase the illuminance even in a small area to enable a compact design of the lighting fixtures, it is possible to significantly reduce the power consumption than fluorescent and incandescent lamps compared to the same illuminance.

At this time, it is possible to adjust by setting the top and bottom height of the heat dissipation opening 40 according to the heat dissipation amount according to the number of LEDs of the lighting means 100 to increase the number of LEDs within the limited light emitting area area to increase the illumination It is possible to compose the luminaire compactly by not having to increase the area of the light emitting portion in which the means is installed.

In addition, although not shown in the drawing, by using a conventional wireless sensor operation method, a separate remote control may adjust the brightness of the LED 22 of the luminaire 100 or by rotating the knob KNOB manually. Of course.

In addition, as another embodiment of the present invention LED lighting Figures 3 to 7 is a base plate 10 'as compared to the above-described Figures 1 and 2 is formed of a polygon, such as a triangle, a square, a circle, an ellipse, a free form, etc. However, at least one or more lighting means 100 is assembled by constructing the PCB substrate 20 equipped with LEDs 22 mounted below the base plate in the diffusion cover 30, and combining them.

An upper cover 50 having a heat dissipation hole 40 and a ballast (not shown) that radiate heat generated from the lighting means to the upper position of each lighting means is formed on the base plate.

That is, the present embodiment by assembling a plurality of lighting means 100 in a single base plate 10 'in a variety of arrangements, as well as further maximize the lighting efficiency by the illumination light shining from the plurality of lighting means 100 base plate The aesthetic effect of the shape and the various arrangement of the lighting means to provide the effect of maximizing the display of the interior space in addition to the simple lighting function according to the interior sense.

Of course, in maximizing the lighting efficiency by the plurality of lighting means 100 as described above, the heat generated from the lighting means 100 is radiated by the base plate 10 'and the respective heat dissipation openings 40 above the base plate. This allows for more compact configurations with reduced load on the device, maximizing lighting efficiency.

In addition, as another embodiment of the LED lamp of the present invention Figures 8 to 10 is a diffusion cover the PCB substrate 20, the LED 22 is mounted on the lower base plate 10 as compared to the above-described Figures 1 and 2 Combining the lighting means 100 built-in and coupled to the 30, and the heat dissipation opening 40 for dissipating heat generated from the lighting means on the top to configure the lighting assembly 200,

The lighting assembly 200 is assembled at least one array below the mounting plate 60 protruding stepped from the ring 62 to the center of the top,

The installation plate 60 is made by assembling and installing so as to surround the lighting assembly with a hemispherical cover 70 having an assembly hole 72 is assembled so as to protrude through the ring portion.

At this time, the airtight ring 75 is assembled between the assembly hole 72 of the hemispherical cover 70 and the ring portion 62 of the mounting plate.

This embodiment of the present invention is a hemispherical cover 70 by assembling a plurality of arrays of the light assembly 200 coupled to the heat dissipation opening 40 and the lighting means 100 on the base plate 10 below the installation plate 60. By assembling finish to wrap in, as well as effectively do the illumination in the plurality of lighting assembly 200 is the illumination light is reflected by the hemispherical cover 70 is to intensively illuminate.

In particular, each of the lighting assembly 200 is provided with a base plate 10, the heat dissipation opening 40, respectively, on the upper lighting means 100 to dissipate the heat generated from the lighting means to be more concentrated while reducing the load of the device It can be configured to maximize the lighting efficiency to be used.

Such an embodiment of the present invention can be used to be installed or fixed to the ceiling by a wire or the like using the ring portion 62 of the upper mounting plate 60, of course.

In addition, as another embodiment of the LED lamp of the present invention, FIGS. 11 to 13 provide a rectangular housing 10-1 having a width of a fluorescent lamp frame embedded in a ceiling or the like.

In the lower part of the rectangular housing (10-1) is installed a lighting means 100, which is built by combining the PCB substrate 20, the LED 22 is mounted in the diffusion cover 30, and each lighting means on the upper rectangular housing The upper cover 50, which is built-in heat dissipation hole 40 and a ballast (not shown) for radiating heat generated from the lighting means to the upper position of the coupling is made and finished.

At this time, the lighting means 100 is arranged in a singular or plural rows.

In addition, the rectangular housing 10-1 may be made of various iron and nonferrous metal materials having good thermal conductivity such as aluminum, iron, stainless steel, magnesium, and the like.

The present invention utilizes the existing lighting fixtures square enclosure 10-1 as it is without the need to install a separate lighting fixtures in the ceiling position where the existing fluorescent lamps are installed, the base plate equipped with the lighting means of the present invention rectangular box By covering and covering the area (10-1), it is possible to easily replace the conventional fluorescent lamp.

In addition, the rectangular housing (10-1) can be further maximized by the intensive configuration of the lighting means by assembling a plurality of continuous arrangement of the lighting means 100 in a single or multiple rows.

In this case, since the heat dissipation opening 40 is provided at a position where each lighting means of the rectangular housing 10-1 is installed to radiate heat generated by each lighting means, it can be configured to be more concentrated while reducing the load of the apparatus. Therefore, the lighting efficiency can be maximized and used.

1 is an exploded perspective view showing an embodiment of the present invention.

2 is an assembled cross-sectional view of FIG.

3 is a front view showing another embodiment of the present invention.

4 is a bottom view of FIG. 3.

5 is a bottom view showing another example of FIG. 4.

6 is a bottom view showing another example of FIG. 4.

7 is a bottom view showing another example of FIG. 4.

8 is a bottom view showing another example of FIG. 4.

9 is a bottom view illustrating another example of FIG. 4.

10 is a perspective view showing another embodiment of the present invention.

11 is a cross-sectional view of FIG. 10.

12 is a bottom view of FIG. 10.

13 is a cross-sectional view showing another embodiment of the present invention.

14 is a plan view of FIG.

15 is a plan view illustrating another example of FIG. 13.

** Description of the symbols for the main parts of the drawings **

10,10 ': base plate 20: PCB board

22: LED 30: Cover

40: heat sink 50: cover

100: lighting means 32: locking projection

12: hanging groove 20: lighting assembly

60: mounting plate 70: hemispherical cover

10-1: square enclosure

Claims

In the lamp using the LED,

The base plate 10, the lighting means 100 is built in the diffusion cover 30 and coupled to the PCB substrate 20, the LED 22 is mounted on the lower base plate, and generated in the lighting means on the base plate LED lighting, characterized in that the heat is configured to combine the heat sink 40 and the upper cover 50 is set to a height proportional to the amount of heat dissipation.

In the lamp using the LED,

At least one base unit 10 'and at least one lighting means 100 having a PCB substrate 20 equipped with LEDs 22 mounted below the base plate in the diffusion cover 30 are combined and assembled.

LED lighting lamp, characterized in that the upper end of the heat sink 40 and the upper cover 50 for heat dissipating heat generated from the lighting means to the upper position of each lighting means on the base plate.

The method according to claim 1 or 2,

At least one locking protrusion 32 having a locking jaw 33 is formed at an upper end of the diffusion cover 30 of the lighting means 100, and the locking protrusion 32 is inserted into the base plate 10. LED lighting lamp, characterized in that the engaging groove 12 is formed correspondingly coupled.

The method according to claim 1 or 2,

LED lamp, characterized in that the base plate is formed in a polygonal shape.

The method according to claim 1 or 2,

LED base lamp, characterized in that the base plate is formed in a circular shape.

In the lamp using the LED,

A lighting means 100 having a PCB substrate 20 equipped with LEDs 22 mounted below the base plate 10 in the diffusion cover 30 and coupled thereto, and a heat dissipation hole for radiating heat generated from the lighting means at the top thereof. Combining 40 to configure the lighting assembly 200,

LED mounting lamp, characterized in that the mounting plate 60 is installed to surround the lighting assembly as a hemispherical cover 70 having an assembly hole 72 is assembled to protrude through the ring portion.

In the lamp using the LED,

A rectangular enclosure 10-1 having a fluorescent frame width,

In the lower part of the rectangular housing (10-1) is installed a lighting means 100, which is built by combining the PCB substrate 20, the LED 22 is mounted in the diffusion cover 30, and each lighting means on the upper rectangular housing LED lighting lamps, characterized in that the heat dissipation opening 40 and heat dissipating heat generated from the lighting means to the upper position of the upper cover 50 is configured.