KR20100064775A - Pulse width modulation control type high capacity ptc heater - Google Patents

Abstract

PURPOSE: A PWM control type high-capacity PTC(Positive Temperature Coefficient) heater is provided to reduce the heat-radiating through a pattern circuit to a plurality of power transistor and to perform an accurate operation control. CONSTITUTION: A PWM control type high-capacity PTC heater comprises a plurality of PTC rods(100), an upper housing(500), a lower housing(600), and a PCB(Printed Circuit Board)(700). The PCB is installed in the upper housing and comprises an anode terminal(810) and a cathode terminal(820). On the PCB are installed a plurality of power transistors(750) and the anodes(110) of the PTC rods. The power transistors are respectively parallel-connected to the anode terminal. The anode terminal is extended to have a long length in a flat type and is projected from a component mounting face of the PCB. The cross-sectional area of the anode decreases, as going from the start point to the end point of the power supply.

Description

Pulse Width Modulation Control Type High Capacity PTC Heater

The present invention relates to a PWM controlled high capacity PTC heater. More specifically, a plurality of power transistors mounted on a PCB board for operation control are independently connected in parallel to a positive power supply terminal mounted on a PCB board for power supply, and current is supplied thereto. As the cross-sectional area of the power supply is reduced from the start point of supply to the end point, self-heating by the electric resistance of the anode power terminal is reduced, heat dissipation function is performed on the PCB board, and heat generation through the pattern circuit for a plurality of power transistors is performed. This reduces the temperature increase inside the housing without the need for a separate vent and heat sink, which improves durability, enables accurate operation control, and reduces the manufacturing costs due to material savings at the anode power terminal. It is about.

The vehicle is provided with an air conditioning system for selectively supplying cold and warm air to each part of the room. In summer, the air conditioner is operated to supply cold air, and in winter, the heater is operated to supply warm air.

In general, the operating method of the heater is to circulate the inside of the engine, and the heated coolant and the air introduced by the blower exchange heat to supply the warm air to the interior of the vehicle and heat the heat. Energy efficient heating system.

In winter, however, a certain time is required before the engine heats up after starting, so heating does not occur immediately after starting. Therefore, the engine is heated for heating and the engine is idled for a predetermined time before driving until the temperature of the coolant becomes high, resulting in energy waste and environmental pollution.

In order to prevent such a problem, a method of heating a vehicle interior using a separate pre-heater during a predetermined time during which the engine is heated has been used. A heater using a conventional heating coil has a high heat generation and thus heating is effectively performed. Excessively high risk of fire and short life of electric wires caused frequent repair and replacement of parts.

Therefore, recently, a heater using a positive temperature coefficient (PTC) device has been developed, which has the advantage of having a low risk of fire and a long life, which can be used semi-permanently. The PitiC heater is mainly used a relatively small capacity heater, the recent trend has been developed to require a high capacity PitiC heater according to the needs of various models and users.

1 is a front view for briefly showing the structure of a conventional PWM control high capacity PTC heater according to the prior art.

In the conventional PWM control high capacity PTC heater according to the prior art, as shown in FIG. 1, a plurality of PTC rods 10, in which a PTC element is inserted therein and generates heat, are arranged in parallel and arranged. On both sides of the heat dissipation fin 20 for heat exchange with the air is arranged to contact the PTC rod 10, the pin guide 30 is mounted between the adjacent heat dissipation fins 20, the position of the heat dissipation fin 20 Is guided. The upper housing 50 and the lower housing 60 are respectively coupled to upper and lower end portions of the PTC rod 10 arranged as described above, and the PTC rods coupled between the upper housing 50 and the lower housing 60 ( 10) and the left and right sides of the heat dissipation fins 20 are mounted to the upper housing 50 and the lower housing 60 to elastically support inward direction so that they can be tightly coupled to each other.

The upper housing 50 is provided with positive and negative power supply terminals 80a and 80b for supplying current to the PTC rod 10, and the current is supplied to the PTC rod 10 through the positive power supply terminal 80a. Then, the heating function is performed while passing through the PTC element of the PTC rod 10 and operates in such a manner that a current flows through the cathode power terminal 80b. At this time, in the case of the PWM control high capacity PTC heater, since the high capacity is exhibited by controlling the operation of the PTC rod 10, for example, the PTC rod 10, such as a pulse width modulation (PWM) control method, may be used. The PCB substrate 70 is mounted inside the upper housing 50 for the operation control. The PCB substrate 70 is mounted with a power transistor (not shown) to control the operation of the PTC rod 10, and is also equipped with a positive and negative power supply terminal 80b and the PTC rod 10, respectively. In this way, current is supplied to the PTC rod 10 from the positive and negative power supply terminals 80a and 80b.

Since the PWM control high capacity PTC heater having such a structure exerts a large amount of heat through a high current, unnecessary heat is generated from the PTC rod 10 and the PCB substrate 70 controlling the same during operation, thereby causing an internal space in the upper housing 50. The temperature is increased and each component mounted on the PCB substrate 70 has a problem such as damage or malfunction by this heat. In order to solve this problem, as shown in FIG. 1, the upper housing 50 has a separate vent 51 formed at a portion coupled to the PTC rod 10 so that the heat in the inner space of the upper housing 50 is vented. It is configured to be discharged to the outside through the 51.

However, the vent 51 may not have a great heat dissipation effect and thus may not sufficiently prevent a temperature rise in the inner space of the upper housing 50. Accordingly, the vent hole 51 may be damaged or malfunction. In order to form the size of the upper housing 50 has to be increased by the size of the vent opening 51, there is a problem such as the size of the PTC heater increases.

Therefore, the present invention has been invented to solve such a problem, and a plurality of power transistors mounted on the PCB board for operation control are independently connected in parallel to the anode power terminals mounted on the PCB board for power supply, and the current is supplied. The anode power terminal is formed in a flat plate shape such that the conduction cross-sectional area is reduced from the power supply start point to the last point, thereby reducing self-heating due to the electrical resistance of the cathode power terminal and performing heat dissipation function on the PCB substrate. As the heat generated through the pattern circuit for the power transistor is reduced, the temperature inside the housing is prevented without the need for a separate vent and heat dissipation device, which improves durability, enables accurate operation control, and reduces manufacturing costs due to material reduction of the anode power terminal. PWM controlled high capacity PTC To provide the foundation has its purpose.

According to the present invention, the upper housing 500 and the lower housing 600 are coupled to both side ends of the plurality of PTC rods 100 which are electrically inserted with the PTC element inserted therein, and the upper housing 500 The inside of the PCB board 700 is provided with a positive and negative power supply terminal (810,820), the PCB substrate 700 is a plurality of power transistors 750, the current is supplied through the positive power terminal 810. And a PWM control high capacity PTC heater mounted with the anode terminal 110 of the PTC rod 100, wherein the plurality of power transistors 750 are independently connected in parallel with the anode power terminal 810, respectively. The current is supplied, and the anode power terminal 810 is formed to extend in a flat shape so as to protrude to the component mounting surface of the PCB substrate 700, and the cross-sectional area decreases from the starting point to the last point. As far as possible Provided is a PWM controlled high capacity PTC heater.

According to the present invention, a plurality of power transistors mounted on the PCB substrate for operation control are independently connected in parallel to the anode power terminals mounted on the PCB board for power supply, and the current is supplied, and the anode power terminals are flat. As the cross-sectional area of the power supply is reduced from the power supply start point to the last point, the self-heating caused by the electrical resistance of the anode power terminal is reduced, the heat dissipation function is performed on the PCB board, and the heat generation through the pattern circuit for the plurality of power transistors. This reduction prevents an increase in temperature inside the housing without a separate vent and heat dissipation device, thereby improving durability, enabling accurate operation control, and reducing manufacturing costs due to material savings of the anode power terminal.

According to the present invention, the upper housing 500 and the lower housing 600 are coupled to both side ends of the plurality of PTC rods 100 which are electrically inserted with the PTC element inserted therein, and the upper housing 500 The inside of the PCB board 700 is provided with a positive and negative power supply terminal (810,820), the PCB substrate 700 is a plurality of power transistors 750, the current is supplied through the positive power terminal 810. And a PWM controlled high-capacity PTC heater equipped with the anode terminal 110 of the PTC rod 100, wherein the plurality of power transistors 750 are independently connected in parallel with the anode power terminal 810 so that a current is generated. The anode power terminal 810 is supplied to extend in a flat shape so as to protrude to the component mounting surface of the PCB substrate 700, and the cross-sectional area is reduced from the starting point to the last point to the last point. Provided is a PWM controlled high capacity PTC heater.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

2 is an exploded perspective view briefly illustrating a structure of a PWM control high capacity PTC heater according to an embodiment of the present invention, and FIG. 3 is a top housing internal structure of the PWM control high capacity PTC heater according to an embodiment of the present invention. 4 is a plan view schematically illustrating a shape of the anode power terminal according to an embodiment of the present invention.

PWM control high capacity PTC heater according to an embodiment of the present invention, as shown in Figs. Arranged in line, the heat dissipation fins 200 for heat exchange with air are disposed on both sides of the PTC rod 100 in contact with the PTC rods 100, and the pin guides 300 are disposed between the heat dissipation fins 200 adjacent to each other. ) Is mounted so that the heat dissipation fins 200 are separated from each other. The upper and lower housings 500 and the lower housing 600 are respectively coupled to upper and lower ends of the PTC rod 100 disposed as described above, and the upper housing together with the upper and lower housings 500 and 600 to form a frame structure of the PTC heater. Side frames 400 are mounted on both left and right sides of the 500 and the lower housing 600.

The internal space of the upper housing 500 is equipped with a PCB substrate 700 for controlling the operation of the PTC rod 100 to exhibit high capacity performance, the PCB substrate 700 of the PTC rod 100 A power transistor 750 for operation control is mounted, and the anode terminal 110 of the PTC rod 100 is mounted through the clip 740 and electrically connected thereto. That is, the PCB substrate 700 is separately equipped with a power terminal 800 consisting of a positive power terminal 810 and a negative power terminal 820 for power supply, the current supplied from the positive power terminal 810 is a PCB substrate It is controlled through the power transistor 750 along the circuit of 700 and is transmitted to the positive terminal 110 of the PTC rod 100. As such, the current is transferred to the positive terminal 110 of the PTC rod 100 so that the PTC element inside the PTC rod 100 generates heat, which is again supplied through the outer cover of the PTC rod 100. It is configured in such a way that it flows out to the terminal 820. At this time, the negative electrode terminal 900 is in electrical contact with the outer surface of the one end end cover of the PTC rod 100 is configured to flow the current through the negative electrode terminal 900 to the negative electrode power terminal 820. In addition, the PCB substrate 700 according to an embodiment of the present invention in order to receive information about the vehicle state from the ECU of the vehicle to control the operation of the PTC load 100 according to Figures 2 and 3 As shown in FIG. 2, a communication port 730 for communicating with the vehicle ECU may be separately installed.

Here, a brief look at the configuration of the PTC rod 100, the tube-shaped cover forming the outer shape of the PTC rod 100 according to an embodiment of the present invention, the inside of the cover to protrude to one end of the cover It may be configured to include a positive terminal 110 to be inserted, the PTC element which is installed in contact with the positive terminal 110 to be located inside the cover, and an insulator for insulating the positive terminal 110 and the cover. Therefore, when the current is supplied through the anode terminal 110, the current flows through the cover through the PTC device, and in this process, the PTC device generates heat. Such a configuration of the PTC rod 100 may be variously modified in other forms.

PWM controlled high capacity PTC heater according to an embodiment of the present invention is capable of outputting 2000W for a vehicle, the current of 80A to 200A is used for this output and the voltage can be manufactured to use both 12V or 24V . Therefore, the electric resistance generated by the power terminal 800 or the PCB 700 by the high current or heat generated by it may increase, so the PWM controlled high capacity PTC heater according to an embodiment of the present invention minimizes this. It is formed into a structure.

As shown in FIG. 2, the PWM control high-capacity PTI-C heater according to an embodiment of the present invention includes a plurality of power transistors 750 mounted on the PCB 700 so that heat generated on the PCB 700 may be reduced. ) Are independently connected in parallel to the positive power terminal 810 to receive current. That is, according to the prior art, a plurality of power transistors 750 are configured in a series connection method in which a current is supplied through one pattern circuit connected to one cathode power terminal 810. According to an embodiment of the present invention Unlike the conventional technology, the PWM control high-capacity PTC heater is configured in a parallel connection manner in which the anode power terminal 810 and the plurality of power transistors 750 are connected to each other through circuits on independent PCB substrates 700.

In addition, the anode power terminal 810 may be formed to extend in a flat shape that is capable of such a parallel connection and is mounted to protrude on the component mounting surface of the PCB substrate 700 so as to reduce self-heating due to electrical resistance. . In this case, as shown in FIGS. 2 and 4, the anode power terminal 810 is preferably formed such that its cross-sectional area decreases from the start point to the last point where power is supplied.

That is, since the anode power terminal 810 is connected to the plurality of power transistors 750 sequentially from the starting point of the power supply as shown in Figs. 2 and 3, toward the power transistor 750 of the last order Since the amount of current that is energized is reduced, and accordingly the electrical resistance generated by itself is reduced, it is preferable that the current is supplied so that its energizing cross-sectional area decreases from the start point of the power supply to the last point. As shown in FIG. 4, the cross-sectional area may be reduced in such a way that the protruding height with respect to the PCB substrate 700 of the planar anode power terminal 810 is reduced to be inclined.

Accordingly, in the PWM control high capacity PTC heater according to the embodiment of the present invention, the length of the pattern circuit on the PCB substrate 700 is shortened according to the parallel connection of the power transistor 750 and the positive power supply terminal 810. Since the pattern circuit is formed independently and the flow of current supplied to the plurality of power transistors 750 is distributed and supplied through each pattern circuit, the heat generated by the electrical resistance through the pattern circuit is reduced and thus the PCB The heat in the substrate 700 is reduced. In addition, as the cross-sectional area of the electricity supply is formed to decrease from the power supply start point to the last point, it has a proper shape required for supplying current, thereby preventing unnecessary material loss and thereby reducing costs.

On the other hand, the positive electrode power terminal 810 of the PWM control high-capacity PTC heater according to an embodiment of the present invention is formed in a flat form of the current flow volume is extended so that the electrical resistance and heat caused by the current does not exceed the threshold value desirable. That is, the positive electrode power terminal 810 coupled to the PCB substrate 700 is formed to have an effective conduction volume suitable for the allowable current required for maximum output. Therefore, in the anode power terminal 810, its own electrical resistance to current is reduced, and thus heat generated by the electrical resistance itself is significantly reduced.

In addition, the cathode power terminal 810 formed as described above has a structure in which heat generation is reduced in itself, and also a heat dissipation function for conducting heat by conducting heat from the PCB substrate 700. That is, since it is mounted to protrude on the component mounting surface of the PCB substrate 700 in a flat plate shape so that the contact area with air is extended, the heat generated by various components and circuits mounted on the PCB substrate 700 is positively connected to the anode power terminal 810. ) Is conducted and radiated heat.

Therefore, in the PWM control high capacity PTC heater according to the embodiment of the present invention, since the heat of the PCB substrate 700 is reduced and thus the temperature in the space inside the upper housing 500 does not increase, a separate heat dissipation device and a vent hole Is unnecessary and can be miniaturized, and also prevents thermal damage of each component mounted on the PCB 700 and prevents malfunction.

According to this structure, the size of the expanded cross-sectional area of the anode power terminal 810 may be selected so that heat above a threshold selected according to the user's needs is not generated, and the threshold is a PCB substrate 700 without a separate heat sink and a vent. Can be selected freely below the amount of heat generated to prevent thermal damage and malfunction.

In addition, the positive electrode power terminal 810 according to an embodiment of the present invention is at least a portion as shown in Figure 2 and 3 so that the effect of reducing the self-heating and the heat dissipation effect of the PCB substrate 700 can be improved In the PCB it is preferable that the elongated portion is formed along the periphery of the periphery 700.

On the other hand, the negative electrode power terminal 820 mounted on the PCB 700 is also formed to extend in a flat shape as shown in Figure 2 for the heat dissipation effect is protruded to the component mounting surface of the PCB substrate 700 It is preferable.

In addition, according to an embodiment of the present invention, the positive electrode power terminal 810 and the plurality of power transistors 750 mounted on the PCB 700 are preferably connected through a pattern circuit of the shortest distance, respectively. The amount of heat generated on the pattern circuit between the anode power terminal 810 and the power transistor 750 may also be minimized.

Next, looking at the structure of the upper housing 500 in more detail, the upper housing 500 has one side to accommodate the PCB substrate 700 in the internal space as shown in Figure 2 according to an embodiment of the present invention It includes an open housing body 510, and a housing cover 520 coupled to the housing body 510 to cover the open surface of the housing body 510, the air in the housing body 510 A flow hole 511 is formed to be introduced into the housing cover 520, and a ventilation hole 521 for dissipating heat inside the upper housing 500 is preferably formed in the housing cover 520. At this time, according to an embodiment of the present invention, the upper housing 500 does not have a separate vent hole 521, and the inner space of the upper housing 500 is formed by various holes for assembling various parts and minute gaps during assembly. It may be formed to be ventilated.

In the housing body 510 and the housing cover 520, fixing protrusions 513 and fixing holes 524 corresponding to mutual couplings are formed, respectively, through the fixing protrusions 513 and the fixing holes 524, respectively. Without the fixing means of the housing body 510 and the housing cover 520 may be detachably coupled.

In addition, two power holes 522 may be formed in the housing cover 520 such that the above-described positive power terminal 810 and the negative power terminal 820 may be inserted and protrude to the outside. 522 is preferably formed to be separated from each other and located adjacent to each other. According to this structure, the positive and negative power supply terminals 810 and 820 may be connected to the power supply from the housing cover 520 in the same direction, thereby facilitating the miniaturization of the PTC heater and the wiring for the power supply connection. At this time, between the two power holes 522 so that the positive power terminal 810 and the negative power terminal 820 protruding to the outside through the two power holes 522 formed in the adjacent position are in contact with each other so that a short circuit accident does not occur. It is preferable that the separation plate 523 is formed in FIG. 2.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

1 is a front view for briefly showing the structure of a conventional PWM control high capacity PTC heater according to the prior art,

Figure 2 is an exploded perspective view briefly showing the structure of a PWM control high capacity PTC heater according to an embodiment of the present invention,

3 is a plan view for briefly showing the internal structure of the upper housing of the PWM control high capacity PTC heater according to an embodiment of the present invention;

Figure 4 is a perspective view briefly showing the shape of the positive electrode power terminal according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: PTC rod 500: upper housing

510: housing body 520: housing cover

600: lower housing 700: PCB substrate

800: power terminal 810: positive power terminal

820: negative electrode power supply terminal 900: negative electrode terminal

Claims (6)

The upper housing 500 and the lower housing 600 are respectively coupled to both side ends of the plurality of PTC rods 100 which are electrically inserted with the PTC element inserted therein, and an anode inside the upper housing 500. And a plurality of PCB substrates 700 including cathode power terminals 810 and 820, and a plurality of power transistors 750 and PTC rods to which current is supplied to the PCB substrate 700 through the cathode power terminal 810. In the PWM control high capacity PTC heater equipped with the anode terminal 110 of (100), The plurality of power transistors 750 are independently connected in parallel with the anode power terminal 810 and are supplied with current. The anode power terminal 810 is formed to extend in a flat shape so as to protrude to the component mounting surface of the PCB substrate 700, it is formed so that the cross-sectional area is reduced from the start point to the last point from which power is supplied PWM controlled high capacity PTC heater. The method of claim 1, The positive electrode power terminal 810 is a PWM control high capacity PTC heater, characterized in that formed in such a way that the protrusion height of the PCB substrate 700 decreases toward the last point from the power supply start point. The method of claim 1, The positive electrode power terminal 810 is a PWM control high capacity fitness heater, characterized in that formed in the form of an extended current supply volume so that the electrical resistance and heat caused by the current does not exceed the threshold. The method of claim 3, wherein The positive electrode power terminal 810 is PWM control high capacity PTC heater, characterized in that extending at least along the periphery of the edge portion of the PCB substrate 700 in at least some section. The method of claim 4, wherein The negative electrode power terminal 820 is formed to extend elongated in a flat plate type PWM control high capacity PTC heater, characterized in that is mounted to protrude on the component mounting surface of the PCB (700). 6. The method according to any one of claims 1 to 5, The plurality of power transistors 750 is PWM control high capacity PTC heater, characterized in that connected to each of the anode power terminal 810 through the shortest distance pattern circuit.

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