KR20100003335A - Light-emitting device package and method of manufacturing the same - Google Patents

Light-emitting device package and method of manufacturing the same Download PDF

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Publication number
KR20100003335A
KR20100003335A KR1020080061075A KR20080061075A KR20100003335A KR 20100003335 A KR20100003335 A KR 20100003335A KR 1020080061075 A KR1020080061075 A KR 1020080061075A KR 20080061075 A KR20080061075 A KR 20080061075A KR 20100003335 A KR20100003335 A KR 20100003335A
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KR
South Korea
Prior art keywords
substrate
light emitting
groove
device package
emitting device
Prior art date
Application number
KR1020080061075A
Other languages
Korean (ko)
Inventor
김방현
박정수
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020080061075A priority Critical patent/KR20100003335A/en
Publication of KR20100003335A publication Critical patent/KR20100003335A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Abstract

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to prevent the moisture from permeating to the interface between the substrate and the molding unit by extending the interface between the substrate and the molding unit by forming a molding to the groove unit formed on the edge of the substrate. CONSTITUTION: A groove unit(11) is formed on at least part of an edge region of a substrate. A first lead pattern and a second lead pattern are separately formed on the substrate. A light emitting chip(30) is electrically connected to the first lead pattern and the second lead pattern. A molding unit(50) encapsulates the groove unit and the light emitting chip. The groove unit is formed on an upper side edge of the substrate. A step is formed on the groove unit. The first and second lead patterns include a penetration lead unit passing through the substrate.

Description

LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a light emitting device package and a method of manufacturing the same, and more particularly, to form a groove in the corner portion of the substrate and to form a molding portion to the groove to prevent the penetration of moisture into the interface between the substrate and the molding portion and It relates to a manufacturing method thereof.

In general, various light emitting chips are used in a light emitting device package. For example, a light emitting diode using a phenomenon in which a small number of carriers (electrons or holes) are injected using a pn junction structure of a semiconductor and emits light by recombination thereof ( Light Emitting Diode, LED) is used. Light emitting diodes include red light emitting diodes using GaAsP and the like, green light emitting diodes using GaP and the like, and blue light emitting diodes using an InGaN / AlGaN double hetero structure.

In the light emitting device package, as shown in FIG. 1, a light emitting diode 3 is mounted on one electrode 2a of a pair of electrodes 2a and 2b spaced apart from each other on a substrate 1 and the other electrode. It is connected with the wire 4 and electrically connected to 2b. In order to protect the light emitting diode 3 and the wire 4, a molding part 5 encapsulating the light emitting diode 3 and the wire 4 is formed using various resins. In this case, a problem may occur in which moisture penetrates into the interface between the substrate 1 and the molding part 5.

In particular, in recent years, a blue light emitting diode and a yellow light emitting phosphor capable of excitation from blue light are combined to realize white light. At this time, the phosphor is mixed with the molding resin when the molding part 5 is formed and distributed in the molding part 5. However, in the molding part 5 consisting of a mixture of the molding resin and the phosphor, precipitation of the phosphor occurs. In particular, since the viscosity of the molding resin decreases during curing of the molding part 5, the phosphor precipitates and precipitates on the upper surface of the light emitting diode 3 or on the upper surfaces of the electrodes 2a and 2b made of Ag or Au. In addition, in the light emitting device package having such a structure, moisture is easily introduced between the molding portion 5 and the substrate 1 or between the molding portion 5 and the electrodes 2a and 2b, and the introduced moisture reacts with the phosphor to chemically treat the phosphor. Cause deformation of properties. In particular, the sulfide-based phosphor easily reacts with moisture to cause severe brightness degradation and optical property changes, and to corrode electrodes to deteriorate reliability.

The present invention has been made to solve the above problems, by forming a groove portion at the edge of the substrate to form a molding portion to the groove portion to extend the interface between the substrate and the molding portion at the edge, thereby minimizing the effect of water penetration through the interface It is an object of the present invention to provide a light emitting device package and a method of manufacturing the same.

The light emitting device package according to the present invention for achieving the above object includes a substrate having a groove formed in at least a portion of the edge region; First and second lead patterns spaced apart from each other on the substrate; A light emitting chip electrically connected to the first lead pattern and the second lead pattern; And a molding part encapsulating the groove part and the light emitting chip.

At this time, the groove portion is characterized in that formed on the upper edge of the substrate, or the groove portion is characterized in that formed continuously on the upper edge of the substrate.

And, the groove portion is characterized in that the stepped region is formed.

In addition, the first and second lead patterns may extend to the bottom surface of the substrate including a through lead portion penetrating the substrate.

In addition, the light emitting device package manufacturing method according to the present invention comprises the steps of forming a plurality of grooves in the substrate; Forming a plurality of first and second lead patterns so as to be spaced apart from each other between grooves formed in the substrate; Mounting the light emitting chip and electrically connecting the first lead pattern and the second lead pattern; And forming a molding part to seal the light emitting chip by applying a molding agent to an upper surface of the substrate including the groove part.

The grooves formed on the substrate may be formed in plural and spaced apart from each other in a lattice shape, or the grooves formed on the substrate may be connected in a lattice shape.

In addition, after the forming of the molding unit, cutting the substrate in a package unit with a groove formed on the substrate as a boundary.

According to the present invention, as the groove is formed at the edge of the substrate to form the molding to the groove, there is an effect of preventing the penetration of moisture by extending the interface between the substrate and the molding.

In addition, the interface between the substrate and the molding part is formed in a direction opposite to the traveling direction of the light emitted from the light emitting chip, so that the effect on the light emitted from the light emitting chip can be reduced even if water penetrates through the interface. .

Hereinafter, a light emitting device package and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view showing a light emitting device package according to a first embodiment of the present invention, Figure 3 is a longitudinal cross-sectional view showing a light emitting device package according to a first embodiment of the present invention.

As shown in the drawing, the light emitting device package according to the first embodiment of the present invention includes a substrate 10 having a groove 11 formed at at least one point of an edge region of an upper surface thereof; First and second lead patterns 20a and 20b spaced apart from each other on the substrate 10; A light emitting chip 30 mounted on the first lead pattern 20a and electrically connected to the second lead pattern 20b; And a molding part 50 encapsulating the groove part 11 and the light emitting chip 30.

The substrate 10 is for mounting the light emitting chip 30, and is made of, for example, a rectangular insulator. At this time, in particular, the groove 11 is formed in the corner portion of the upper surface of the substrate 10. In this case, the size and shape of the groove 11 may be variously changed. However, the groove 11 is preferably formed in a direction opposite to the direction in which the light emitted from the light emitting chip 30 is emitted. For example, in the present embodiment, the groove 11 is formed in a fan shape recessed in the vertical direction on the upper surface of the substrate 10.

The first and second lead patterns 20a and 20b are for applying an external power source to the light emitting chip 30 and are spaced apart from each other. In this case, the first and second lead patterns 20a and 20b are formed on the upper surface of the substrate 10 so that the light emitting chip 30 is mounted or the wires 40 are bonded to the first and second upper lead patterns ( 21a and 21b, first and second lower lead patterns 25a and 25b formed on a lower surface of the substrate 10 to mount the light emitting device package on a separate printed circuit board, and the substrate 10. And first and second through lead portions 23a and 23b penetrating through the first and second upper lead patterns 21a and 21b to connect the first and second lower lead patterns 25a and 25b. In this case, the first and second through-lead portions 23a and 23b form through holes penetrating the substrate 10 up and down, and fill the through holes with conductors, or the conductors are formed on the inner circumferential surface of the through holes. It can be formed by plating. Of course, the first and second lead patterns 20a and 20b are not limited to the configurations shown, but may be variously changed and applied to apply an external power source to the light emitting chip 30.

The light emitting chip 30 is a means for generating light by application of an external power source, and may be selectively adopted among chips that emit light in the infrared region from the infrared region. For example, a horizontal light emitting diode may be used. In the present embodiment, the light emitting chip 30 is mounted on the first lead pattern 20a and the light emitting chip 30 and the second lead pattern 20b are connected by a wire 40. However, the present invention is not limited thereto. And the second lead patterns 20a and 20b may be mounted on other portions, and the first and second lead patterns 20a and 20b and the light emitting chip 30 may be connected to each other by a wire 40.

The wire 40 is for electrically connecting the light emitting chip 30 and the second lead pattern 20b. The wire 40 is formed of gold (Au) or aluminum (Al) through a process such as a wire bonding process. Is formed.

The molding part 50 is to encapsulate and protect the light emitting chip 30 and the wire 40, and the forming method and shape may be variously implemented. In general, the molding part 50 may be formed of a transparent silicone resin or an epoxy resin. However, the present invention is not limited thereto, and any material may be used as long as the resin is transparent enough to transmit light depending on the use of the light emitting device package. In addition, phosphors may be mixed to implement white light.

The molding part 50 is formed on the groove part 11 formed on the upper surface of the substrate when the light emitting chip 30 and the wire 40 are encapsulated on the upper surface of the substrate 10 to form the substrate 10 and the molding part 50. Extends the interface.

In this way, the interface between the groove 11 and the molding part 50 is formed in a direction opposite to the traveling direction of the light emitted from the light emitting chip 30, so that moisture is transferred to the light emitting chip 30 even though water penetration is performed through the interface. By preventing penetration, the influence on the light emitted from the light emitting chip 30 may be reduced.

4 is a longitudinal cross-sectional view illustrating a light emitting device package according to a modification of the first exemplary embodiment of the present invention. As shown in FIG. 4, at least one stepped region 11a is formed on a wall of the groove 11 to form a substrate ( 10) the interface between the molding part 50 can be further extended. Of course, the stepped region 11a is not limited to those formed in a stepped manner as shown in the drawing, and may be variously modified and implemented.

A process of manufacturing the light emitting device package according to the first embodiment configured as described above will be described.

The light emitting device package manufacturing method according to the first embodiment of the present invention comprises the steps of forming a plurality of grooves (11) in the substrate (10); Forming a plurality of first and second lead patterns (20a, 20b) to be spaced apart from each other between the grooves (11) formed in the substrate (10); Mounting a light emitting chip (30) on each of the first lead patterns (20a), and electrically connecting the respective light emitting chips (30) to the second lead patterns (20b); Forming a molding part encapsulating the light emitting chip 30 by applying a molding agent to an upper surface of the substrate 10 including the groove part 11; And cutting the substrate 10 in package units such that the groove 11 formed in the substrate 10 is cut.

This will be described in detail with reference to the accompanying drawings.

5A to 5E are perspective views illustrating a method of manufacturing a light emitting device package according to a first embodiment of the present invention.

First, as illustrated in FIG. 5A, a plurality of grooves 11 are formed on the upper surface of the substrate 10 so as to be disposed on a grid spaced apart from each other. At this time, if the depth of the groove 11 is not penetrated, it may be any. In addition, the diameter of the groove portion should not be too small to be filled with the molding agent. In addition, the shape of the groove 11 may be formed in various shapes, for example, as shown in the figure is formed in a circular shape recessed in the vertical direction. If the stepped region 11a is formed in the groove 11 as shown in FIG. 4, the groove 11 is first drilled, and the second hole is formed by increasing the diameter of the circle rather than the first drill. can do.

As such, when the groove part 11 is formed in the substrate 10, first and second lead patterns 20a and 20b are formed in the substrate 10 in package units as shown in FIG. 5B. In this case, although not shown in the drawing together with the first and second upper lead patterns 21a and 21b formed on the upper surface of the substrate 10, the first and second lower lead patterns 25a and 25b and the first and second parts are shown. The through lead portions 23a and 23b are formed together.

5C, the light emitting chip 30 is mounted on the first upper lead pattern 21a, and the light emitting chip 30 and the second upper lead pattern 21b are connected by wires 40.

Then, the molding part 50 is formed on the upper surface of the substrate 10 as shown in FIG. 5D. The molding part 50 may be formed using, for example, a transparent silicone resin or an epoxy resin, and may be used by mixing phosphors in some cases. In this case, the molding part 50 may be formed on all regions of the upper surface of the substrate 10 including the groove part 11 using various methods. For example, it may be formed by a transfer molding method using a mold having a cavity having a predetermined shape. In this case, the molding part 50 is not limited to being formed on all regions of the upper surface of the substrate, and if the molding part 50 can encapsulate the groove part 11, the light emitting chip 30, and the wire 40, any shape and shape may be used. It may be formed in size.

If the molding part 50 is formed in this way, the substrate 10 is cut in package units as shown in FIG. 5E. In this case, it is preferable that the groove 11 formed in the substrate 10 is cut so that the groove 11 is formed at the edge of the substrate 10, that is, at the top edge of the substrate 10. In addition, by the groove 11, the bonding surface of the molding unit 50 and the substrate 10 is widened to increase the adhesive strength, thereby preventing the molding unit 50 from being peeled from the substrate 10 during cutting.

On the other hand, the present invention can be formed in the entire edge of the substrate rather than being formed separately in another embodiment.

6 is a perspective view showing a light emitting device package according to a second embodiment of the present invention, Figure 7 is a perspective view showing a substrate used in the method of manufacturing a light emitting device package according to a second embodiment of the present invention.

As shown in FIG. 6, the light emitting device package according to the second embodiment of the present invention is implemented by changing the shape of the groove formed in the substrate while having similar components to those of the first embodiment. The description of the same configuration is omitted, and the same reference numerals are used for the same configuration and names below.

The groove portion 61 is continuously formed along the upper edge of the substrate 60. In detail, the groove 61 is formed in a continuous lattice shape on the upper surface of the substrate 60. Of course, the groove 61 may have a stepped region illustrated in FIG. 4.

And, since the molding part 70 is formed on the upper surface of the substrate 60 including the groove part 61, an interface extension between the substrate 60 and the molding part 70 may be implemented at all edges of the substrate 60. Can be.

The light emitting device package manufacturing method according to the second embodiment is manufactured in the same manner as in the first embodiment. However, as the substrate 60 used, as shown in FIG. 7, a groove 61 having a predetermined depth is formed in a lattice shape.

Thus, when the substrate 60 is formed in a lattice shape by cutting the substrate 60 in package units, the light emitting device package in which the groove 61 is continuously formed along the edge of the substrate 60 can be obtained. have.

Although described above with reference to the drawings and embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit of the invention described in the claims below. I can understand.

1 is a longitudinal sectional view showing a general chip type light emitting device package,

2 is a perspective view showing a light emitting device package according to a first embodiment of the present invention;

3 is a longitudinal sectional view showing a light emitting device package according to a first embodiment of the present invention,

4 is a longitudinal sectional view showing a light emitting device package according to a modification of the first embodiment of the present invention;

5A to 5E are perspective views illustrating a method of manufacturing a light emitting device package according to the first embodiment of the present invention.

6 is a perspective view showing a light emitting device package according to a second embodiment of the present invention;

7 is a perspective view illustrating a substrate used in a method of manufacturing a light emitting device package according to a second embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: substrate 11: groove

20a and 20b: first and lead patterns 30: light emitting chip

40: wire 50: molding part

Claims (9)

A substrate having a groove formed in at least a portion of the edge region; First and second lead patterns spaced apart from each other on the substrate; A light emitting chip electrically connected to the first lead pattern and the second lead pattern; A light emitting device package comprising a molding unit for sealing the groove and the light emitting chip. The method according to claim 1, The groove is a light emitting device package, characterized in that formed on the upper edge of the substrate. The method according to claim 1, The groove portion is a light emitting device package, characterized in that formed continuously on the upper edge of the substrate The method according to claim 1 to 3, Light emitting device package characterized in that the stepped region is formed in the groove portion The method according to claim 1, The first and second lead patterns include a through lead portion penetrating the substrate extends to the bottom surface of the substrate. Forming a groove in the substrate; Forming a plurality of first and second lead patterns so as to be spaced apart from each other between grooves formed in the substrate; Mounting the light emitting chip and electrically connecting the first lead pattern and the second lead pattern; A method of manufacturing a light emitting device package, comprising: forming a molding part encapsulating a light emitting chip by applying a molding agent to an upper surface of the substrate including a groove part. The method according to claim 6, A plurality of grooves formed in the substrate is formed, the light emitting device package manufacturing method characterized in that the spaced apart from each other in a grid shape. The method according to claim 6, The groove formed in the substrate is a light emitting device package manufacturing method, characterized in that formed in a grid shape connected. The method according to claim 6, And after the forming of the molding part, cutting the substrate in package units with a groove formed in the substrate as a boundary.
KR1020080061075A 2008-06-26 2008-06-26 Light-emitting device package and method of manufacturing the same KR20100003335A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9039216B2 (en) 2010-04-01 2015-05-26 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
KR20220107384A (en) * 2021-01-25 2022-08-02 주식회사 에스엘바이오닉스 Semiconductor light emitting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9039216B2 (en) 2010-04-01 2015-05-26 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
KR20220107384A (en) * 2021-01-25 2022-08-02 주식회사 에스엘바이오닉스 Semiconductor light emitting device

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