KR20090046719A - Substrate processing apparatus, coating apparatus and coating method - Google Patents

Abstract

The rectangular substrate to be processed on the floating stage is kept in a constant posture suitable for processing with a simple configuration to stably convey the floating substrate.

The 1st and 2nd holding | maintenance part 106L, 106R in the 1st (left) and 2nd (right) conveyance part 84L, 84R is the back surface (lower surface) and the right 2 of the left 2 corner of the board | substrate G. Two adsorption pads 108L, 108R, which are respectively bonded to the back surface (lower surface) of the corner by vacuum adsorption force, and the respective adsorption pads 108L, 108R are vertically spaced at two places at regular intervals in the transport direction (X direction). A pair of pad supports 110L and 110R for regulating and supporting displacement of the pair, and a pair of pad actuators 112L and 112R for lifting and lowering the pair of pad supports 110L and 110R independently. Have

Resist coating unit, conveyance part, pad actuator, pad support part, suction pad

Description

Substrate processing device and coating device and coating method {SUBSTRATE PROCESSING APPARATUS, COATING APPARATUS AND COATING METHOD}

TECHNICAL FIELD This invention relates to the substrate processing apparatus of a float conveyance system. Specifically, It is related with the application | coating apparatus and application | coating method which apply | coat a process liquid on a board | substrate, carrying a float conveyance on a stage.

In the photolithography process in the manufacturing process of a flat panel display (FPD) such as an LCD, a spinless coating method of applying a resist liquid on a substrate to be processed by relatively scanning a long-type resist nozzle having a slit-shaped discharge port is employed. It is used a lot.

As a form of such a spinless coating method, for example, as disclosed in Patent Literature 1, a stage for supporting a rectangular to-be-processed substrate (for example, a glass substrate) for FPD is constructed by floating type on a floating stage. It conveys in one horizontal direction (stage length direction) with a board | substrate floating, and discharges resist liquid in strip shape toward the board | substrate which passes directly under the long-form resist nozzle provided above the floating stage at the predetermined position in the middle of conveyance. By this, a floating conveying method is known in which a resist liquid is applied from one end to the other end on a substrate.

Moreover, in such a floating conveying system, for example, as disclosed in Patent Document 2, on the floating stage, the first conveying unit holds the left and right one side corner portions of the substrate, passes through the application position from the loading position, and the application position and the carrying out position. The substrate is conveyed to the first position set between the substrates, and the second conveying unit holds the left and right other side edge portions of the substrate and passes the substrate from the second position set between the carrying position to the carrying position to the carrying position. The spinless coating method which shortens the tact time is also known.

The conventional resist coating apparatus of this kind has a pair of guide rails disposed on both left and right sides of the stage to lift and convey the substrate on a floating stage, a pair of left and right sliders moving straight along these guide rails, and a substrate. The left and right rows of adsorption pads detachably adsorbable at regular intervals on the left and right sides of the < RTI ID = 0.0 > and < / RTI > Is provided with a connecting member.

Patent Document 1: Japanese Patent Publication 2005-244155

Patent Document 2: Japanese Patent Publication 2006-237482

According to the conventional floating coating method of the floating conveying method, the floating height of the substrate is variably controlled by the pressure of the gas supplied from the floating stage to the substrate to follow the floating height of the substrate. It is to be displaced up and down. However, when the front and rear ends of the substrate oscillate up and down during the floating conveyance, or when the substrate is bent in a mountain shape in a direction orthogonal to the conveying direction, the adsorption pad and the connection member holding the substrate also vibrate integrally with the substrate. The film thickness of the resist coating film fluctuated easily, and the substrate was not displaced up and down and could not be maintained or corrected in a constant posture suitable for the coating treatment.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the prior art, and provides a substrate processing apparatus capable of stably conveying floating by maintaining a rectangular to-be-processed substrate on a floating stage in a simple configuration suitable for processing. It aims to do it.

It is another object of the present invention to provide a floating conveying coating device and a coating method for improving the mechanism for holding a rectangular to-be-processed substrate to improve coating quality and tact time.

In order to achieve the above object, the substrate processing apparatus of the present invention has a stage for floating a rectangular to-be-processed substrate at a gas pressure, and a holding portion for detachably holding the substrate in a state of being floating on the stage. In order to float and convey the said board | substrate to a predetermined conveyance direction on a stage, the conveyance part which moves the said board | substrate integrally with the said holding | maintenance part in the said conveyance direction is provided, The said holding part is two corners on either side of the left and right with respect to the conveyance direction of the said board | substrate. And a substantially non-bending retaining member for locally holding the elevating member, and an elevating portion for elevating or displacing the holding member.

In the above-described configuration, the holding portion or the holding member provided in the transfer portion holds the two corners on the left and right sides of the substrate substantially without bending, so that the floating portion is lifted from the stage side when the transfer portion floats the rectangular substrate on the stage. Even if the pressure fluctuates, it is possible to suppress the fluctuation of the front end portion or the rear end portion of the substrate by the rigid holding force or the restraining force of the holding portion or the holding member, so that even when the substrate is bent in a shape in a direction perpendicular to the conveying direction, The substrate can be calibrated horizontally in the same direction by tight holding force or restraining force.

According to one preferred aspect of the present invention, the holding member includes two adsorption pads each capable of being adsorbed on the rear surfaces of the left and right two corners of the substrate, and two adsorption pads each positioned at a predetermined interval in the conveyance direction in the vertical direction, respectively. It has a pad support part for restraining and supporting a displacement. The lift unit includes first and second actuators that independently lift and drive the first and second pad support units, and a lift control unit that collectively controls the driving operation of these first and second actuators. In this case, in order to absorb the lifting error between the first and second pad supports, both the first and second pad supports have a horizontal axis of rotation which enables the suction pad to be rotationally displaced in a vertical plane around the first and second pad supports. It is preferable that one side of the second pad support portion has a straight axis of motion which enables the suction pad to be displaced straight in the horizontal direction. Moreover, as a preferable aspect, the lifting unit has first and second actuators for lifting and lowering the first and second pad supports independently, respectively, and a lifting control unit for collectively controlling the driving operation of the first and second actuators. . Here, the actuator may have a motor and a transmission mechanism for converting the rotational driving force of the motor into a straight motion in the vertical direction of the pad support. The lifting control unit may include an encoder for detecting the rotation angle of the motor, and may control the rotation amount of the motor using the output signal of the encoder as a feedback signal in order to control the lifting movement distance of the pad support.

As described above, in the configuration in which each of the adsorption pads is supported or lifted on two axes to be adsorbed to the left and right two corners of the substrate, the adsorption pads and the substrate front and rear ends are easily and stably set to any inclined posture or horizontal. Or adjustable.

Moreover, as another preferable aspect, a holding member has two adsorption pads which can respectively adsorb | suck to the back surface of two left and right corners of a board | substrate, and a single pad support part which supports each adsorption pad by restricting the displacement of the perpendicular direction. The lift unit may have an actuator for elevating and driving the pad support, and a lift control unit for controlling the driving operation of the actuator. In this case, it is preferable that the holding portion has a first pad attitude adjusting portion for adjusting the angle of the suction pad with respect to the horizontal line in the conveying direction. As described above, even when the adsorption pad is supported by one axis (single) pad support, the substrate holding function and the substrate posture correcting function are similar to those of the case where the adsorption pad is supported by the pair of (two axes) pad support. I can have it.

Moreover, as one more preferable aspect, you may have a 2nd pad attitude | position adjustment part for adjusting the angle of the adsorption surface of the adsorption pad with respect to the horizontal line orthogonal to a conveyance direction.

In one preferable aspect of the present invention, rotational displacement preventing means for preventing rotational displacement in a horizontal plane with respect to the holding portion of the substrate during floating conveyance is provided. As such rotation displacement preventing means, for example, protrusions are formed integrally with the upper surface of the suction pad and engage with both side surfaces orthogonal to the corner portions of the substrate at positions lower than the upper surface of the substrate. Alternatively, in a preferred embodiment, a locking member which is caught by the side surface of the front part in the conveying direction of the substrate at the time of deceleration of the floating conveyance and prevents rotational displacement toward the front of the substrate, or in the conveying direction of the substrate during the acceleration of the floating conveyance A catching member is used that is caught by the side of the rear portion of the substrate to prevent rotational displacement of the substrate to the rear. Or as another suitable form, the intermediate pad member which adsorb | sucks to the back surface of a board | substrate side edge part between two corners of the one side of the board | substrate hold | maintained by a holding member is used.

The coating apparatus of this invention has the stage which raises a rectangular to-be-processed board | substrate by the pressure of a gas, and the 1st holding part which detachably holds the edge part of right and left sides with respect to the conveyance direction of the said board | substrate which floats on the said stage, A first conveying part for moving the substrate integrally with the first holding part in a conveying direction so as to float and convey the substrate on the stage, and corner portions on the left and right sides with respect to the conveying direction of the substrate floating on the stage; It has a 2nd holding part which detachably holds, The 2nd conveying part which moves the said board | substrate integrally with the said 2nd holding part in a conveyance direction, and is arrange | positioned above the said stage, in order to float and convey the said board | substrate on the said stage. In order to form the coating film of a process liquid on the said board | substrate with a elongate nozzle, The processing liquid supply part which discharges a processing liquid from the nozzle toward the said board | substrate which passes directly under the nozzle in the said floating conveyance, The said 1st holding part localizes the two corners of the left and right one side with respect to the conveyance direction of the said board | substrate. A substantially non-bending first holding member to hold the first holding member and a first lifting unit for lifting or displacing the first holding member, wherein the second holding unit has two corners on the left and right sides with respect to the conveying direction of the substrate. And a second, non-bending substantially retaining member held locally, and a second lifting portion for lifting and displacing the second holding member.

Moreover, the coating method of this invention sets a carrying-in position, application | coating start position, application | coating end position, and carrying position in a line along a conveyance direction on a floating stage, and forms a rectangular to-be-processed board | substrate by the pressure of a gas on the floating stage. In the first section from the loading position to the coating start position on the floating stage, the two corners on the left and right sides are locally held by a lifting and holding member that does not substantially bend in the conveyance direction of the substrate. In the second section from the application start position to the application end position, the four corners of the substrate are locally held by an elevable holding member that is substantially not bent, and the first operation from the application end position to the carry-out position is performed. In three sections, two corners on the left and right sides of the substrate are transported. By the lifting possible holding member that does not bend in quality maintenance topically conveying the substrate in the transport direction, and applying a treatment liquid to an upper surface of the substrate while the substrate is moved to the second section.

In the coating apparatus or the coating method of this invention, in floating conveyance other than a coating process, a 1st or 2nd holding part hold | maintains two corners of left and right sides, and carries out uniaxial conveyance, and in floating conveyance at the time of a coating process, 1st and 2nd holding | maintenance is carried out. Biaxial conveyance is performed by simultaneously holding two corners on both the left and right sides of the additional substrate. At the time of single-axis conveyance, similarly to the substrate processing apparatus of this invention, a rectangular to-be-processed board | substrate can be hold | maintained in a fixed posture on a floating stage, and can carry out floating conveyance. In addition, during biaxial conveyance, the substrate can be conveyed by holding or correcting the substrate in a posture (usually a horizontal posture) that is more suitable for the coating process. The section in which both the first and second conveying units cooperate to perform biaxial conveyance is limited to the application position, and otherwise, the conveying or moving operation in each allocated section (load-in section, export-side section) alone In this case, the tact time can be shortened.

According to the substrate processing apparatus of the present invention, by carrying out the above-described configuration and action, the rectangular target substrate can be stably conveyed by stably maintaining a uniform posture on the floating stage in a simple configuration suitable for processing.

Further, according to the coating apparatus and the coating method of the present invention, the mechanism for holding the rectangular to-be-processed substrate in the floating conveying system can be improved by the above-described configuration and operation, thereby improving the coating quality and the tact time. Can be.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.

Fig. 1 shows a coating and developing treatment system as one configuration example to which the substrate processing apparatus, coating apparatus and coating method of the present invention can be applied. This coating and developing processing system 10 is installed in a clean room, for example, cleaning of a photolithography process, resist coating, prebaking, developing and post in an LCD manufacturing process using a rectangular glass substrate as a substrate G. A series of processes such as baking are performed. An exposure process is performed in the external exposure apparatus 12 provided adjacent to this system.

This coating and developing processing system 10 arranges a horizontally long process station (P / S) 16 at the center, and has a cassette station (C / S) 14 and an interface station at both ends thereof in the longitudinal direction (X direction). (I / F) 18 is disposed.

The cassette station (C / S) 14 is a cassette carrying in / out port of the system 10. The cassette station (C / S) 14 is formed by stacking the substrates G in multiple stages so that four or more cassettes C can be accommodated in one horizontal direction (Y direction). The cassette stage 20 which can be loaded side by side, and the conveyance mechanism 22 which carries out the board | substrate G with respect to the cassette C on this stage 20 are provided. The conveyance mechanism 22 has the conveyance arm 22a which can hold | maintain the board | substrate G by 1 sheet unit or 2 sheets unit, and is operable in the 4 axes of X, Y, Z, (theta), and an adjacent process station The (P / S) 16 side and the substrate G can be transferred.

The process station (P / S) 16 arranges each processing unit in a process flow or process order in a pair of parallel and reverse lines A and B extending in a horizontal system longitudinal direction (X direction) and have.

More specifically, on the process line A of the upstream portion from the cassette station (C / S) 14 side to the interface station (I / F) 18 side, an import unit (IN PASS) 24, a cleaning process unit (26), the 1st thermal processing part 28, the application | coating process part 30, and the 2nd thermal processing part 32 are arrange | positioned in this order from the upstream side along the 1st flat stream conveyance path 34. FIG.

More specifically, the IN PASS 24 receives the unprocessed substrate G from the conveyance mechanism 22 of the cassette station (C / S) 14 in one sheet or in units of two to a predetermined tact. It is comprised so that 1 sheet may be thrown into the 1st flat stream conveyance path 34 one by one. The washing | cleaning process part 26 installs the excimer UV irradiation unit (E-UV) 36 and the scrubber washing | cleaning unit (SCR) 38 sequentially from the upstream along the 1st horizontal flow conveyance path 34. As shown in FIG. The first thermal processing unit 28 is provided with an adhesion unit (AD) 40 and a cooling unit (COL) 42 in order from the upstream side.

The coating process unit 30 moves the sorter unit (SORTER) 43, the resist coating unit (COT) 44, the sorter unit (SORTER) 45, and the reduced pressure drying unit (VD) 46 in order from the upstream side. I install it. The board | substrate G conveyed in the stream flow from the 1st thermal processing part 28 is carried in to the resist coating unit (COT) 44 in the stream flow through the sorter unit (SORTER 43). Subsequently, in the resist coating unit (COT) 44, the substrate G on which the resist coating processing has been completed is sent to the reduced pressure drying unit (VD) 46 in a flat stream through the sorter unit SORTER 45. The reduced pressure drying unit (VD) 46 has a chamber which accommodates the board | substrate G, and which can depressurize, and the conveyance mechanism which carries in / out the board | substrate G to this chamber in parallel flow.

The second thermal processing unit 32 is provided with a pre-baking unit (PRE-BAKE) 48 and a cooling unit (COL) 50 in order from the upstream side. A pass unit (PASS) 52 is provided at the end point of the first flat stream conveyance path 34 adjacent to the downstream side of the second thermal processing unit 32. The board | substrate G conveyed on the 1st flat stream conveyance path 34 by the flat stream is passed to the interface station (I / F) 18 from the pass unit (PASS) 52 of this end point.

On the other hand, the developing unit (DEV) 54 and the post-baking unit (POST-) are located in the downstream process line B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side. BAKE) 56, the cooling unit (COL) 58, the inspection unit (AP) 60, and the outing unit (OUT-PASS) 62 follow this order from the upstream side along the 2nd horizontal flow conveyance path 64. They are arranged in line. Here, the post-baking unit (POST-BAKE) 56 and the cooling unit (COL) 58 constitute a third thermal processing unit 66. OUT PASS 62 receives the processed substrate G one by one on the second flat stream conveying path 64 one by one in the conveying mechanism 22 of the cassette station C / S 14. Or it is comprised so that it may pass in 2 sheets.

The auxiliary conveyance space 68 is provided between both process lines A and B. As shown in FIG. In addition, the shuttle (not shown) which can load the board | substrate G horizontally by one unit may be able to move bidirectionally in a process line direction (X direction) by a drive mechanism (not shown).

The interface station (I / F) 18 carries the conveying apparatus 72 for carrying out the said 1st and 2nd plane flow conveyance paths 34 and 64 or the adjacent exposure apparatus 12 and the board | substrate G. And the rotary stage (R / S) 74 and the peripheral device 76 are disposed around the conveying device 72. The rotary stage (R / S) 74 is a stage for rotating the substrate G in a horizontal plane, and is used for converting the direction of the rectangular substrate G during the transfer to the exposure apparatus 12. The peripheral device 76 is provided with, for example, a titler TITLER, a peripheral exposure device EE, and the like above the second flat stream conveyance path 64. Although not shown, the pass unit PASS at the time of receiving the board | substrate G from the conveying apparatus 72 and placing it on the 2nd flat stream conveyance path 64 is provided under the peripheral apparatus 76.

Fig. 2 shows a processing procedure of all the steps with respect to one substrate G in this coating and developing processing system. First, in the cassette station (C / S) 14, the conveyance mechanism 22 extracts one or two substrates G from one of the cassettes C on the stage 20, and removes the substrate G. The board | substrate G is carried in to the loading unit (IN PASS) 24 of the process line A side of the process station P / S 16 (step S1). The board | substrate G is carried on the 1st sheet flow conveyance path 34 one by one by the predetermined | prescribed tact from the loading unit (IN PASS) 24, or it is thrown in.

The substrate G introduced into the first flat stream conveying path 34 is first cleaned by the excimer UV irradiation unit (E-UV) 36 and the scrubber cleaning unit (SCR) 38 in the cleaning process unit 26. The treatment and the scrubbing washing treatment are sequentially performed (steps S2 and S3). The scrubber cleaning unit (SCR) 38 removes particulate contamination from the surface of the substrate by brushing or blow cleaning the substrate G that moves horizontally on the flat flow conveyance path 34, and then rinsing. The process is performed and the board | substrate G is dried using an air knife etc. last. When a series of cleaning processes in the scrubber cleaning unit (SCR) 38 are complete | finished, the board | substrate G goes down along the 1st planar conveyance path 34 as it is, and passes through the 1st thermal processing part 28. As shown in FIG.

In the first thermal processing unit 28, the substrate G is first subjected to an adhesion treatment using a HMDS in a vapor state in the adhesion unit AD 40 so that the surface to be treated is hydrophobic (step S4). After completion of this adhesion treatment, the substrate G is cooled to a predetermined substrate temperature in the cooling unit (COL) 42 (step S5). Subsequently, the board | substrate G descends along the 1st horizontal flow conveyance path 34, and is conveyed to the application | coating process part 30. FIG.

When entering the coating process part 30, the board | substrate G is carried in to the resist coating unit (COT) 44 from the sorter unit (SORTER) 43, and the spinless method of the floating conveyance using a long slit nozzle is carried out. As a result, a resist liquid is applied to the upper surface of the substrate (to-be-processed surface). Subsequently, it is sent to the pressure reduction drying unit (VD) 46 via the sorter unit (SORTER 45), and receives the drying process of normal temperature by pressure reduction here (step S6).

The board | substrate G which exited the application | coating process part 30 descends along the 1st horizontal flow conveyance path 34, and passes through the 2nd thermal processing part 32. As shown in FIG. In the second thermal processing unit 32, the substrate G is first subjected to prebaking as a heat treatment after resist application or a heat treatment before exposure in the pre-baking unit (PRE-BAKE) 48 (step S7). By this prebaking, the solvent remaining in the resist film on the substrate G is evaporated and removed to enhance the adhesion of the resist film to the substrate. Next, the substrate G is cooled to the predetermined substrate temperature in the cooling unit (COL) 50 (step S8). Then, the board | substrate G is taken in to the conveying apparatus 72 of the interface station (I / F) 18 from the pass unit (PASS) 52 of the end point of the 1st planar conveyance path 34. As shown in FIG.

In the interface station (I / F) 18, the substrate G is carried in the peripheral exposure apparatus EE of the peripheral device 76 after receiving a 90 degree direction change in the rotary stage 74, for example. Is subjected to exposure for removing the resist attached to the periphery of the substrate G at the time of development, and is then sent to the adjacent exposure apparatus 12 (step S9).

In the exposure apparatus 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Subsequently, when the substrate G, which has been exposed to the pattern, is returned from the exposure apparatus 12 to the interface station (I / F) 18 (step S9), first, the substrate G is loaded into the titler TITLER of the peripheral apparatus 76. Predetermined information is recorded there on the predetermined part on a board | substrate (step S10). Then, the board | substrate G is the viewpoint pass unit PASS of the 2nd flat stream conveyance path 64 attached to the process line B side of the process station (P / S) 16 from the conveyance apparatus 72. FIG. It is brought in.

In this way, the board | substrate G is conveyed to the downstream side of the process line B on the 2nd horizontal flow conveyance path 64 this time. In the first developing unit (DEV) 54, a series of developing processes such as developing, rinsing, and drying are performed while the substrate G is conveyed in a flat stream (step S11).

In the developing unit (DEV) 54, the substrate G, which has been subjected to a series of developing treatments, is loaded on the second flat stream conveying path 64 as it is, and the third thermal processing unit 66 and the inspection unit (AP) 60 are sequentially formed. To pass. In the third thermal processing unit 66, the substrate G is first subjected to post-baking as a heat treatment after the development treatment in the post-baking unit (POST-BAKE) 56 (step S12). By this post-baking, the developer or cleaning solution remaining in the resist film on the substrate G is evaporated and removed to enhance the adhesion of the resist pattern to the substrate. Next, the substrate G is cooled to a predetermined substrate temperature in the cooling unit (COL) 58 (step S13). In the inspection unit (AP) 60, non-contact line width inspection, film quality, film thickness inspection, etc. are performed with respect to the resist pattern on the board | substrate G (step S14).

The OUT PASS 62 receives the substrate G, which has been processed in the entire process, from the second flatbed conveyance path 64 one by one, or the cassette station C / S in units of one or two. It passes to the conveyance mechanism 22 of (14). On the cassette station (C / S) 14 side, the conveyance mechanism 22 receives the processed substrate G which has been received from the export unit (OUT PASS) 62 in units of one or two (usually original). In the cassette C (step S1).

In this coating and developing processing system 10, the present invention can be applied to a resist coating unit (COT) 44 in the coating process unit 30. 3 to 23, an embodiment to which the present invention is applied to the resist coating unit (COT) 44 will be described in detail.

3 to 5 show the entire structure of the resist coating unit (COT) 44 in this embodiment, FIG. 3 is a schematic plan view, FIG. 4 is a perspective view, and FIG. 5 is a schematic front view.

As shown in FIG. 3, the resist coating unit (COT) 44 has the stage 80 extended in the conveyance direction (X direction) of the 1st flat stream conveyance path 34 (FIG. 1). The substrate G to be subjected to the coating treatment is carried in from the sorter unit SORTER 43 to the region (loading region M ₁ ) of the transport upstream end of the stage 80 as indicated by arrow F _A. In addition, the area [out area (M _3)] of the conveying downstream ends of the substrate (G) receiving the resist film forming process of the spin-less method by injury conveying as shown by the arrow F _B on the stage 80 is stage 80 Is taken into the sorter unit (SORTER) 45 as indicated by the arrow F _C from. Above the region of the longitudinal center of the stage (80) applied area (M _2)] has the resist nozzle 82 of the elongated are arranged for supplying the resist solution to a substrate (G).

In addition, although the illustration of the sorter unit (SORTER) 43 of the carry-in side is not shown, the roller conveyance path provided in the conveyance direction (X direction) of the 1st horizontal flow conveyance path 34 (FIG. 1), and this roller conveyance path A plurality of adsorption pads capable of vacuum adsorption / detaching at the corners of the substrate back surface with respect to the upper substrate, and a substrate transfer mechanism for moving these adsorption pads in both directions in parallel with the transport direction. When the substrate on which the thermal treatment is completed is received on the roller conveyance path in the upstream side by the first thermal processing unit 28 on the upstream side, the adsorption pad rises and is adsorbed on the rear edge of the substrate to adsorb and hold the substrate. The substrate transfer mechanism is configured to transfer the substrate to the carry-in area M ₁ of the stage 80 through the substrate transfer mechanism. And after carrying in a board | substrate to carrying-in area | region M1, a suction pad is isolate | separated from a board | substrate, and a board | substrate conveyance mechanism and a suction pad are then returned to a home position.

Similarly, the sorter unit (SORTER) 45 on the carrying-out side has a roller conveying path laid in the conveying direction (X direction) of the first horizontal flow conveying path 34 (Fig. 1), and a substrate on the roller conveying path. A plurality of adsorption pads capable of vacuum adsorption / detaching at the corners of the rear surface, and a substrate transfer mechanism for moving these adsorption pads in both directions in parallel with the transport direction. When the substrate on which the resist coating process is completed arrives on the export area M ₃ on the stage 80 of the resist coating unit (COT) 44, the suction pad is raised to be adsorbed on the rear edge of the substrate to hold the substrate. The substrate transfer mechanism sends the substrate to the reduced pressure drying unit (VD) 46 adjacent to the downstream side via the suction pad. And after passing a board | substrate to the conveyance part in the pressure reduction drying unit (VD) 46, a suction pad is isolate | separated from a board | substrate, and a board | substrate conveyance mechanism and a suction pad are returned to the original position.

As shown in Fig. 4, the stage 80 is configured as a floating stage for causing the substrate G to float in the air by the force of gas pressure, and a plurality of jets for ejecting a predetermined gas (usually air) on its upper surface. 84 is formed in one surface. And the 1st (left) and 2nd (right) conveyance parts 84L and 84R of the linear motion type arrange | positioned at the left and right both sides of the stage 80 are each lifted on the stage 80 independently or in cooperation with each other. The substrate G is detachably held and the substrate G is conveyed in the stage longitudinal direction (X direction). On the stage 80, the board | substrate G carries out floating conveyance taking the horizontal posture in which a pair of sides are parallel to a conveyance direction (X direction), and a pair of other sides are orthogonal to a conveyance direction.

The stage 80 is divided into plural, for example, three regions M ₁ , M ₂ , and M ₃ along the longitudinal direction (X direction) (FIG. 5). The region M _{1 at one} end is a carry-in area, and as described above with reference to FIG. 3, the new substrate G to be subjected to the coating process is moved into the carry-in area M _{1 in a} straight stream from the sorter unit SORTER 43. It is brought in.

Fetch area (M ₁₎ is, and also the area starting at a portion transporting the substrate (G), flying height (H _a) compression of the high-pressure or a positive pressure so as to emerge as for importing the substrate (G) on the top surface stage in the area Many blower outlets 84 for blowing air are provided with a constant density. Here, the import region substrate flying height (H _a) in (G) of the (M ₁₎ is when without requiring a particularly high accuracy, for example, maintained in the range of 250 to 350㎛. Further, in the transport direction (X direction), the size of the fetch area (M ₁₎ is preferably that exceeds the size of the substrate (G). Further, an alignment portion 85 (FIG. 10) for positioning the substrate G on the stage 80 may be provided in the carry-in area M ₁ .

The region M ₂ set at the central portion in the longitudinal direction of the stage 80 is a resist liquid supply region or an application region, and the substrate G resists from the upper register nozzle 82 when passing through the application region M2. Receive the supply of the liquid (R). The substrate floating height H _{b in the} coating area M ₂ is the coating gap S between the lower end (discharge port) 82a of the resist nozzle 82 and the upper surface of the substrate (to-be-processed surface) (for example, 200 탆). This application | coating gap S is an important parameter which determines the film thickness and resist consumption of a resist coating film, and needs to be kept constant with high precision. In this regard, the ejection opening 84 that ejects compressed air of high pressure or constant pressure in order to stably float the substrate G to a desired floating height H _b in a predetermined arrangement pattern on the stage upper surface of the coating area M ₂ . And a suction port 88 that sucks air at negative pressure. Then, a force in the vertical upward direction by the compressed air is applied from the jet port 84 to the portion located in the application region M ₂ of the substrate G, and at the same time, a vertical downward pressure is caused by the negative pressure suction force from the suction port 88. By applying the force in the direction to control the balance of the bidirectional forces against each other, the floating height H _b for application is kept at the set value (for example, 30 to 50 µm).

The size of the application area (M ₂₎ in the transport direction (X direction) is, if a space enough to stably form the small coating gap (S), such as the right under the resist nozzle 82, Usually, it may be smaller than the size of the substrate G, and may be about 1/3 to 1/4, for example. Moreover, it is in the illustrated example the top surface of the coating area (M ₂₎ increased further by the amount corresponding to the other areas (M _1, M ₃₎ than the upper surface of the car (for example, 200 to 300㎛) of the flying height of the substrate (G) is while being kept in a horizontal posture third area _{(M 1, M 2, M} 3) is able to pass to the conveying direction.

The region M ₃ of the other end of the stage 80 located downstream of the coating region M ₂ is an unloading region. The substrate G subjected to the coating treatment in the resist coating unit (COT) 44 is subjected to the downstream pressure-sensitive drying unit VD (downstream) via the sorter unit SORTER 45 in a straight stream from this carrying out area M ₃ ( 46) (FIG. 1). In this carrying out area M ₃ , a plurality of blowout holes 84 for floating the substrate G at the floating height H _c (for example, 250 to 350 μm) for carrying out are provided on the stage upper surface with a constant density. .

The resist nozzle 82 has a slit-shaped discharge port 82a which can cover the substrate G on the stage 80 from one end to the other end in the longitudinal direction (Y direction), and has a sentence shape or an inverted shape. It is provided in the frame 94 (FIG. 3), and it can move up and down by the drive of the nozzle lifting part 95 (FIG. 10) which has a ball screw mechanism, for example, from the resist liquid supply part 96 (FIG. 10). It is connected to the resist liquid supply pipe 98 (FIG. 4).

As shown in Figs. 3, 4, 6 and 7, the first (left) and second (right) conveying portions 84L and 84R are arranged in parallel with both the left and right sides of the stage 80; 2nd guide rails 100L and 100R, 1st and 2nd sliders 102L and 102R provided so that a movement to a conveyance direction (X direction) on these guide rails 100L and 100R, and both guide rails 100L, First and second conveyance drives 104L and 104R for moving both sliders 102L and 102R straight or separately on 100R, and both sliders 102L and 102R to hold the substrate G as possible. Each of the first and second holding portions 106L and 106R mounted thereon is provided. Each conveyance drive part 104L, 104R is comprised by the linear drive mechanism, for example, a linear motor.

As shown in Figs. 3, 4, and 7 to 9, the first (left) holding part 106L has two adsorptions which are respectively coupled to the rear surface (lower surface) of the left two corners of the substrate G by vacuum suction force. A pair of pad support parts 110L which support the pad 108L and each adsorption pad 108L by restraining the displacement of a perpendicular direction in two places spaced at regular intervals in a conveyance direction (X direction), and a pair of these Each of the pad support 110L independently moves up or down and has a pair of pad actuators 112L.

The second (right) holding part 106R includes two adsorption pads 108R which are respectively coupled to the back surface (lower surface) of the right two corners of the substrate G by vacuum adsorption force, and the respective adsorption pads 108R are carried in the conveyance direction or the like. As long as the pair of pad supports 110R and the pair of pad supports 110R that independently support and regulate the displacement in the vertical direction in two places spaced at regular intervals in the X direction) It has a pair of pad actuator 112R.

As shown in Figs. 8 and 9, the suction pads 108L and 108R on both the left and right sides are provided with a plurality of suction ports 114 on the upper surface of the rectangular parallelepiped pad body made of stainless steel (SUS), for example. have. Each suction port 114 of the left suction pad 108L is connected to the outer left vacuum tube 116L through a vacuum passage in the pad body, and each suction port 114 of the right suction pad 108R is a vacuum in the pad body. It is connected to the vacuum tube 116R of the outer right side through a channel | path (FIG. 7). The vacuum tubes 116L and 116R on both sides pass through a vacuum source (not shown) of the first and second pad adsorption control units 118L and 118R (Fig. 10), respectively.

Each pad support part 110L (R) is an L-shaped rigid rod made of stainless steel (SUS), for example, and its lower end (base end) extends in the vertical direction and is coupled to the pad actuator 112L (R), respectively. And its upper end extends in the horizontal direction, and is respectively coupled to the suction pad 108L (R).

Here, the coupling relationship between the respective adsorption pads 108L (R) and a pair of front and rear pad supporters 110L (R) supporting the same may increase or decrease the lifting error between the pad supporters 110L (R). The structure which can absorb the (R)] side is preferable. For this purpose, both of the pad support parts 110L (R) have a horizontal axis of rotation which allows the adsorption pad 108L (R) to be rotationally displaced in a vertical plane around the pad support parts 110L (R). It is preferable that one side has a straight axis of motion which enables the suction pad 108L (R) to move in a straight direction in the horizontal direction. In this embodiment, for example, as shown in Fig. 9, the front bearing 120L (R) is provided through the joint portion 118L (R) at the front of the suction pad 108L (R). The rear bearing [124L (R)] is installed in the rear portion of the suction pad 108L (R) through the linear motion guide 122L (R) in the X direction, and the front bearing 120L (R) and The upper end portions extending in the horizontal direction of the front and rear both pad support portions 110L (R) are respectively joined to the rear bearing 124L (R).

Each pad actuator [112L (R)], for example, uses the servomotor [126L (R)] and the rotational driving force of this servomotor [126L (R)] to go straight in the vertical direction of the front pad support part [110L (R)]. For example, it has the transmission mechanism 128L (R) which consists of a ball screw mechanism of a linear motion guide type integrated with a movement. Each servomotor 126L (R) is provided with a rotary encoder (not shown) for detecting each rotation angle. By controlling the rotation amounts of both servomotors 126L (R), respectively, using the output signals of these rotary encoders as feedback signals, the lifting movement distances of the front and rear pad holding portions 110L (R) are approximately matched with each other. You can.

In addition, in this embodiment, as shown in FIG. 7 and FIG. 8, in order to further raise the precision of the above-mentioned lifting movement control with respect to each pad support part 110L (R), each pad support part 110L (R) of FIG. The linear scale 130L (R) which measures a lifting position or a lifting movement distance, and feeds back each is provided. Each linear scale 130L (R) optically reads the scale portion 132L (R) extending in the Z direction provided on the slider 102L (R) and the scale of the scale portion 132L (R). In order to achieve this, each of the pad supporting sections 110L (R) has a scale reading section 134L (R).

As described above, the holding portion 106L (R) has a front and rear pair of front and rear via a pair of hard front and rear pad support portions 110L (R) that do not substantially bend the respective adsorption pads 108L (R). Since the pad actuator 112L (R) drives up and down in two axes, each suction pad 108L (R) can be moved up and down stably while maintaining a constant posture (horizontal posture or inclined posture).

In the first and second conveying sections 84L and 84R, all of the parts mounted on the movable sliders 102L and 102R, and electrical wiring and piping connecting the fixed control unit and the power supply source are all flexible cable bares. It is stored in (not shown).

In addition, although the detailed illustration is abbreviate | omitted, many ejection openings 84 formed in the upper surface of the stage 80, and the compressed air supply mechanism (not shown) which supply these to the compressed air for generating a floating force, and also of the stage 80 application area (M ₂₎ in the outlet (84) are mixed and brought by a number of the suction port 88 and the vacuum mechanism (not shown) for supplying a vacuum pressure to these defined areas (M ₁₎ or out area (M ₃ ) the substrate G is floated at the lift heights H _a and H _c suitable for carrying in and out and high-speed transfer. In the application region M ₂ , the float G is stably and suited for the accurate resist coating scan. the (H _b), a substrate stage (10) emerging portion 136 for injury to consist.

10 shows the configuration of a control system in the resist coating unit (COT) 44 of the present embodiment. The controller 138 is made of a microcomputer, and each part in the unit, in particular, the stage substrate floating part 136, the resist liquid supply part 96, the nozzle lifting part 95, and the first (left) conveying part 84L 1st conveyance drive part 104L, 1st pad adsorption control part 118L, 1st pad actuator 112L], 2nd (right) conveyance part 84R (2nd conveyance drive part 104R, 2nd pad adsorption | suction control part ( 118R, the second pad actuator 112R] and the entire operation (sequence).

Next, with reference to Figs. 11 and 12A to 12I, the coating processing operation in the resist coating unit (COT) 44 of the present embodiment will be described. Fig. 11 shows, in a timing chart, the position or state of each part in the unit (COT) 44 in one cycle of the coating processing operation. 12A to 12I show, in schematic plan views, the position or state of the main movable portion at each time point in one cycle.

The controller 138 draws and executes a resist coating processing program stored in a storage medium such as an optical disk into the main memory to control a programmed series of coating processing operations.

FIG. 12A corresponds to the time point t ₀ of FIG. 11, immediately after the unprocessed new substrate G _i is brought into the loading region M ₁ of the stage 80 from the sorter unit SORTER 43 (FIG. 1). Shows the state of. At this time, the first (left), the carry section (84L) is a point in which the film returning the first slider (102L) in the conveying time position (P _a) corresponding to the fetch position within the fetch area (M _1). The 1st pad adsorption control part 118L starts supply of a vacuum to the 1st adsorption pad 108L at this time. The first pad actuator 112L has already lowered the first suction pad 108L to its original position (retracted position). On the other hand, the second (right side) the transport section (84R) is a condition where the film get to the stage 80 is taken out area (M _3), the substrate (G _{i -1)} one before the completion of the coating process on. The second slider 102R arrives at the transport end position P _b corresponding to the discharging position in the discharging area M ₃ , and the second pad suction control unit 118R applies the vacuum suction force from the second suction pad 108R. It's off.

Subsequently, the alignment portion 85 is operated in the carry-in region M ₁ to press the pressing member (not shown) from the four sides to the substrate G _{i in} the floating state as indicated by the arrow J, thereby pressing the substrate G _i on the stage ( 80) is arranged on the position (time point t _l of Figure 12b, Figure 11). A second conveying unit (84R) is corresponding to the application start position from the conveyance ending point position (P _b) a second slider (102R) and then guide the substrate (G _i-1) to the sorter units (SORTER) (45) the transport stop position (P _c) returned to the high speed (V _1). The sorter unit SORTER 45 takes out the received substrate G _i-1 from the carry-out area M ₃ of the stage 80 in parallel flow (see FIG. 12B and the time point t _{l in} FIG. 11). Further, the coating start position is set between the right position i.e. the resist solution supply position (P _s) under the import position and the resist nozzle 82 in the carry zone (M _1).

When the alignment of the substrate G _i is completed in the carry-in area M ₁ , immediately after that, the first pad actuator 112L is operated in the first conveying part 84L to move the first suction pad 108L to its original position ( UP from the retracted position to the advancing movement position (coupling position). A first suction pad (108L), so that before the vacuum is turned on as soon as the contact with the two corners of the left and right side (left side) of the floating state substrate (G _i) is coupled by a vacuum suction force (Fig. 12c, the time t in FIG. 11 ₂ ). A second conveying unit (84R) is conveyed rest position (P _c) first discloses the supply of vacuum to second slider (102R), a second suction pad (108R) while waiting (time t ₂ in FIG. 12c, FIG. 11 in ).

Next, the first transport unit (84L) is a holding portion (106L) the substrate (G _i) carrying the first sliders (102L) while being kept in a left second corner point position in the (P _a) a substrate transport direction (X from Direction) and move straight at a relatively high speed V ₂ at a relatively high speed, and stop there once upon arrival at the upstream conveyance stop position P _c corresponding to the application start position on the stage 80 (FIG. 12D, FIG. 12). Time point t ₃ ). The coating start position and the position immediately below the substrate (G _i) the front end (the coating start line), the resist nozzle 82 of the resist film forming region on the. Further, in the substrate transfer to the transfer point position (P _a), the upstream-side transport stop position (P _c) from a substrate (G _i) right side edge portion (in particular 2 right corner) of, but is a free end, the stage The height position is constrained by the floating force by the substrate floating portion 136 and is approximately the same height as the left two corners of the substrate G _i coupled to the first holding portion 106L of the first conveying portion 84L. Move. Because the left side edge portion prior to conveying portion and a slightly different height of the coating in the first place, the substrate (G _i) the right side edge portion added the substrate (G _i) of the, there is no particular hindrance.

In the first transfer section and the first slider (102L) is when you get to the side carrying stop position upstream (P _o), a second transfer section (84R) there were atmosphere (84L) as the second pad actuator ( 112R is activated to raise the second adsorption pad 108R from its original position (retracted position) to its advancing movement position (engaged position). A second suction pad (108R), so the vacuum is turned on, upon contact with the second right and left corners of the other side (right side) of the substrate (G _i) is coupled by a vacuum suction force. In this way, at the conveyance stop position P _c corresponding to the application | coating start position on the stage 80, the 1st and 2nd conveyance parts 84L and 84R oppose across the board | substrate G _i of the floating state, the substrate is, respectively, keeping the left and right second corner (all four corners) of (G _i) (FIG. 12e, the time t ₄ in Fig. 11). On the other hand, although not shown, the nozzle elevating unit 95 is activated to lowering of the resist nozzle 82 is set a gap (S) between the discharge port (82a) and the substrate (G _i) of the resist nozzle 82 is a value (for example, 200 mu m).

Next, the first and second conveyance sections 84L and 84R simultaneously move the sliders 102L and 110R at a relatively slow constant speed V ₃ from the conveyance stop position P _c to the substrate conveyance direction (X direction). Continue to move (time t ₅ in Fig. 11). On the other hand, the resist liquid supply part 95 starts to discharge the resist liquid R from the resist nozzle 82. In this way, the long type resist which extends in the Y direction toward the upper surface of the substrate G _i passing through the resist liquid supply position P _s immediately below the resist nozzle 82 at a constant speed V ₃ in the X direction. by strip-resist solution (R) is ejected at a constant flow rate of the shape from the nozzle 82, the resist solution coating film (RM) goes is formed toward the rear end from the front end portion of the substrate (G _i) (FIG. 12f, FIG. 11 At the time t ₆ ).

When the rear end (coating end line) of the substrate G _i reaches the resist liquid supply position P _s immediately below the resist nozzle 82, the coating process is terminated at this timing, and the resist liquid supply portion 96 becomes the resist nozzle. At the same time as the discharge of the resist liquid R from the 82, the first and second conveying portions 84L and 84R move the respective sliders 102L and 102R immediately before the conveyance end position P _b . position (downstream-side transportation path stop position) (Pd) is stopped at the same time (Fig. 12g, the time t ₇ in FIG. 11).

In the first conveying part 84L, as soon as the first slider 102L arrives at the conveying stop position P _d , the first pad adsorption control unit 118L stops supplying the vacuum to the first adsorption pad 108L. At the same time, the first pad actuator 112L lowers the first adsorption pad 108L from its forward movement position (combination position) to its original position (retraction position), and thus the first adsorption pad 108L from the left end of the substrate G _i . ) Are separated (time points t ₈ of FIG. 12G and FIG. 11). At this time, the first pad adsorption control unit 118L supplies the positive pressure (compressed air) to the first adsorption pad 108L to speed separation from the substrate G _i . Subsequently, the first slider 102L is moved at a high speed V _{5 in the} direction opposite to the substrate conveyance direction to return to the conveyance time point position P _a (see FIG. 12H and time point t _{9 in} FIG. 11).

On the other hand, the second conveying unit conveyed from (84R) In the second holding portion (106R) the substrate (G _i) downstream (P _d) a substrate rest position to the second slider (102R) while keeping the 2 right corner in the the end point position (P _b) to kinda moving at a relatively high speed constant velocity (V _4), the substrate transport direction (X direction) in the (time t ₉ in FIG. 12h, 11). At this time, the left edge portion (particularly the left two corners) of the substrate G _i is a free end, but the height position is also constrained by the floating force by the upper stage 136 of the stage substrate portion, and thus the right side of the substrate G _i . Move about the same height as 2 corners. In the first place, because the left side edge of the substrate portion (G _i) right side edge portion and a bit portion after carrying different coating height of the substrate (G _i), there is no particular hindrance.

As soon as the slider 102R arrives at the transport end position P _b , the pad adsorption control unit 118R stops supplying the vacuum to the adsorption pad 108R, and at the same time, the pad actuator 112R receives the adsorption pad ( 108R) thereby to separate the suction pad (108R) on the right-hand side corner of the second substrate (G _i) lowering the original position (retracted position) from moving in progress position (engaged position). At this time, the suction pad controller (118B) is the static pressure will be quickly separated from the (compressed air) supply to the board (G _i) (FIG. 12h, 12i also, the time t ₁₀ in Fig. 11) to the suction pad (108R).

Moreover, the edge part or edge part of the board | substrate G may protrude out of the stage on the stage 80. FIG. In particular, the fetch area (M ₁₎ in the import side of sorter units (SORTER) (43) out of the rear end stage, that is, the substrate (G) in a state of holding that is adsorbed to the adsorption pads on the back surface of the rear end of the substrate (G) In a state of being protruded, the substrate G may be carried over on the stage 80. In addition, in the carrying out area M ₃ , the front end of the substrate G protrudes out of the stage, that is, the export-side sorter unit SORTER 45 adsorbs the suction pad to the rear surface of the front end of the substrate G. The substrate G may be guided from the stage 80 to the sorter unit SORTER 45 in a state that is easy to cause.

As described above, in the present embodiment, the carry-in area M ₁ , the coating area M ₂ , and the carry-out area M ₃ are provided on the stage 80, and the substrates are sequentially transferred to each of these areas. The operation, the resist liquid supply operation, and the substrate carrying out operation are performed independently or in parallel in each region. By such a pipeline system, the time T _IN required to carry out the operation on the stage 80 with respect to one substrate G, and the export region (from the carry-in region M ₁ on the stage 80) M ₃ T) time required to transfer to _(C) and, out area (M ₃₎ Duration of the time (T _oUT), the more that the coating (1) cycles each other as required to carried out of the (T _C + than T _lN + T _0UT) can shorten the cycle time drastically.

In order to transport the substrate G _i on the stage 80, the first and second transfer portions 84L and 84R disposed on both the left and right sides of the stage 80 are respectively the left two corners and the right two corners of the substrate. It moves in the board | substrate conveyance direction, maintaining either. Here, the first conveying section (84L) is between the taken out position in the elongated resist nozzle 82 is directly applied through the coating position of the bottom position and the out area (M ₃₎ from the fetch position within the fetch area (M ₁₎ The board | substrate which floats on the stage 80 is hold | maintained and conveyed to the application | coating end position set in the drawing. On the other hand, the 2nd conveyance part 84R hold | maintains and conveys the board | substrate which floats on the stage 80 from the application | coating start position set between a carrying in position and an application | coating position to a carrying out position to a carrying out position.

The section which the 1st and 2nd conveyance parts 84L and 84R hold | maintain and convey a board | substrate together is not the whole conveyance section from a loading position to a carrying out position, but is an intermediate section from an application | coating start position to an application | coating end position. When the 1st conveyance part 84L conveys the board | substrate G _i to the application | coating end position, it completes the role of conveyance to the said board | substrate G _i from there, and returns to a carrying-in position immediately, and a subsequent new board | substrate G _{i Commence} the return of ₊₁ ). On the other hand, the 2nd conveyance part 84R conveys board | substrate G _i independently from an application | coating end position to a carrying out position, and then it returns to an application | coating start position, and the 1st conveyance part 84L moves to the next board | substrate until the position ( Wait for G _{i + 1} ) to return alone.

Moreover, in this embodiment, in the 1st and 2nd conveyance part 84L. 84R, the two left corners or the right two corners of the board | substrate G of the state which floated on the stage 80 were respectively carried out by two suction pads [108L]. (R)] locally, while supporting each suction pad 108L (R) with a substantially rigid rigid pad support 110L (R), and lifting and lowering the pad actuator 112L (R). The structure which raises and lowers or moves up and down to a desired height position by the driving force is minimized. In addition, each suction pad [108L (R)] is lifted and driven in two axes by a pair of pad support portions 110L (R) and a pair of pad actuators 112L (R) and controlled by a servo. It is possible to stably move the lift or lift by maintaining a constant posture or angle with respect to the horizontal line in the conveying direction (X direction).

According to the structure of such 1st and 2nd conveyance parts 84L and 84R, the front end part of the board | substrate G is each row or angle | corner of a stage upper surface in the middle of carrying out floating conveyance of the board | substrate G on the stage 80. At the moment of almost completely covering the individual blower outlet 84 or suction port 88, or at the moment when the rear end of the substrate G opens each row or each individual blower outlet 84 or suction port 88 at once. Even if the floating pressure received from the (80) side changes rapidly, the vibration of the front end portion or the rear end portion of the substrate G can be suppressed by the rigid holding force or the restraining force of the holding portions 106L and 106R.

Moreover, the board | substrate G (especially the front end part or the back end part) which floats and conveys on the stage 80 by the floating characteristic of the stage 80, the size, thickness, etc. of the board | substrate G orthogonal to a conveyance direction ( In the Y direction), as shown in Fig. 13, it may be curved in a mountain shape. When the substrate G passes directly under the resist nozzle 82 in the form of a curved shape in this manner, the film thickness of the resist coating film formed on the substrate G varies in profile along the curved shape.

To solve this problem, it is effective to incline the suction pads 108L and 108R to the holding portions 106L and 106R to some extent with respect to the horizontal line in the conveying direction (X direction) as shown in FIGS. 14 and 15. Becomes That is, the suction pads 108L and 108R of the front part are inclined upward at a predetermined angle toward the front of the conveying direction (X direction), and the conveying direction (X direction) of the suction pads 108L and 108R of the rear part. (C) takes an upward inclined posture at an angle toward the rear of the panel. In this way, the front end and the rear end of the substrate G are also inclined at the same angle in the conveying direction (X direction) along the inclined attitudes of the suction pads 108L and 108R, and the direction orthogonal to the conveying direction ( In the Y direction), the curve of the mountain shape is removed and the horizontal correction is performed. Thereby, the board | substrate G maintains the state parallel to the edge part of the board | substrate with respect to the line-shaped or slit-shaped discharge port 82a of the resist nozzle 82, and passes directly under it, and is orthogonal to a conveyance direction. A resist coating film of uniform film thickness is formed on the substrate G in the (Y direction).

On the other hand, in the conveyance direction (X direction), the variation in the film thickness of the resist coating film appears at the front end and the rear end of the substrate G with the inclined attitude of the suction pads 108L and 108R, but the film is limited to the periphery of the product region. Because of the thickness variation, the quality of the application process (film thickness uniformity in the product area) is not affected.

In this embodiment, each suction pad 108L (R) is supported and lifted by the biaxial pad supporter 110L (R) and the pad actuator 112L (R) in each holding part 106L (R). Therefore, the attitude | position which each suction pad 108L (R) inclines at arbitrary angles with respect to the horizontal line of a conveyance direction (X direction) as mentioned above can be implement | achieved easily.

As a modified example, as shown in Fig. 16, each suction pad 108L (R) in each holding portion 106L (R) has a single-axis (single) pad support portion 110L (R) and a pad. It is also possible to adopt a configuration in which the actuator 112L (R) is supported and lifted and moved, and a configuration in which the suction pad 108L (R) is inclined at an angle with respect to the horizontal line in the conveyance direction (X direction) can be adopted. Do.

The structure example of FIG. 16 has the upper support block 140 which installed the adsorption pad 108L (R) on the upper surface, and the base block 142 fixed horizontally to the upper end of the pad support part 110L (R), The upper support block 140 is rotatably coupled to the base block 142 via the shaft 144 at one end in the conveying direction (X direction), while at the other end the compression coil spring 146 and the differential screw ( It is possible to adjust the inclination angle of the upper support block 140 with respect to the base block 142 through 148.

The differential screw 148 is a relatively large lead fixed to the base block 142 inside the large diameter cylindrical screw 150 having a relatively large lead P1 screwed to the screw hole of the upper support block 140. The thin diameter screw 152 which has P2) is screwed together. When the large diameter screw 150 is turned, the large diameter screw 150 moves in a vertical direction integrally with the upper support block 140 through the fixing nut 154 with a lead corresponding to the difference P1-P2 of both leads. (Displacement), the inclination angle or horizontality of the suction pad 108L (R) can be adjusted. The compression coil spring 146 acts to prevent backlash of the differential screw 148.

17 shows another modification of the suction pad 108L (R). This configuration example integrally provides the suction pad 108L (R) at the X-axis tip of the L-shaped block 160 having an L-shape in the XY plane (horizontal plane), and extends the X-axis of the L-shaped block. The division grooves 166 and 168 are formed in the middle of each of the portion 162 and the Y-axis extension 164, and the division grooves 166 are formed by the X-axis differential screw 170 and the Y-axis differential screw 172. And 168, respectively, can be adjusted independently so that the inclination angle or horizontality of the suction pad 108L (R) with respect to the horizontal lines of the X-axis and Y-axis can be arbitrarily adjusted.

18-23, when the 1st and 2nd conveyance parts 84L and 84R carry out the board | substrate G independently (uniaxial conveyance) in this embodiment, the board | substrate G is a suction pad by the moment force. The mechanism for completely preventing the deviation (rotational displacement in the horizontal plane) from [108L (R)] is shown.

The rotation displacement preventing means shown in Fig. 18 is to provide an L-shaped protrusion or step portion 174 on the upper surface of the suction pad 108L (R). The L-shaped protrusion 174 can prevent rotational displacement of the substrate G due to the moment by engaging the both sides of the corner portions of the substrate G that are held on the upper surface of the suction pad 108L (R) at right angles. have. However, the upper surface of the L-shaped protrusion 174 should be a protruding height such that the upper surface of the substrate G does not exceed the upper surface of the substrate G so that the L-shaped protrusion 174 does not contact or slip contact with the lower end portion of the resist nozzle 82 during the coating process. There is a need.

The rotational displacement preventing means shown in Fig. 19 catches the rotational displacement to the rear of the substrate G by catching the side surface G _B of the rear portion in the conveying direction (X direction) of the substrate G at the time of acceleration of floating conveyance. It is set as the structure provided with the latching member 176 which prevents. The locking member 176 is formed, for example, as a conical body rotatably provided through the vertical support shaft 180 at one end of the rod-shaped support 178 extending in the horizontal direction. The other end of the horizontal support 178 is coupled to the actuator 184 of the linear motion type through the vertical support shaft 182. The actuator 184 is provided in the slider 102L (R).

At the time of accelerating the substrate G in the floating conveyance, the actuator 184 advances and moves immediately before that, so that the locking member 176 is rearward of the substrate G as shown from the downward retreat position (return movement position). It is raised to the height of the side portion position (GO movement position) applied to the (G _B). For example, in the uniaxial conveyance by the 2nd (right side) conveyance part 84R, when accelerating the board | substrate G, the moment of a left rotation (counterclockwise direction) is applied to the board | substrate G when it sees from upper direction, and the moment force As a result, the substrate G is about to be displaced to the rear against the suction force of the second suction pad 108R of the second holding portion 106R of the two corners. However, since the locking member 176 is caught by the rear side surface G _B of the substrate G to prevent rotational displacement to the rear of the substrate G, the substrate G is maintained in the XY plane while maintaining its posture. It can move to a conveyance direction (X direction). In addition, after the end of the acceleration movement, the locking member 176 may be immediately retracted to the return movement position.

Such locking type rotational displacement preventing means can be modified as shown in FIGS. 20 and 21. The rotational displacement preventing means of Fig. 20 couples the proximal end of the rod-shaped locking member 186 to a rotary actuator 188 such as a motor, and the distal end of the locking member 186 is the rear side surface G of the substrate G. _The locking member 186 is rotated between the moving movement position applied to _B ) and the return movement position retreating far below the substrate G. In addition, the actuator 188 may be provided in the slider 102L (R). The rotation displacement preventing means of Fig. 21 is a traveling movement position in which the distal end portion of the locking member 186 is caught on the rear side surface G _B of the substrate G in the conveying direction (X direction) by using a linear motion actuator 190. And the rod-shaped locking member 186 is linearly moved between the position (return movement position) which retracts farther back than the board | substrate G. As shown in FIG.

All the rotational displacement prevention means of FIGS. 19-21 are caught by the side surface G _B of the back part in the conveyance direction (X direction) of the board | substrate G at the time of acceleration of floating conveyance, and the back of the board | substrate G is carried out. To prevent rotational displacement. Although not shown, rotational displacement preventing means for preventing rotational displacement in the forward direction of the substrate G by catching the side surface of the front portion in the conveyance direction (X direction) of the substrate G at the time of deceleration of floating conveyance is also described above. Can be configured similarly.

The rotation displacement preventing means 192 shown in Fig. 22 is adsorbed on the rear surface of the side edge portion of the substrate G in the middle of two holding portions 106L (R) holding two corners on one side of the substrate G. An intermediate suction pad 194 holding (G) locally is provided. 22, the intermediate | middle suction pad 194 is integrally formed or provided in the one end part of the horizontal support member 200 provided in the vertical support member 196 so that rotation is possible through the shaft 198. As shown in FIG. By rotating the horizontal support member 196 using a pair of linearly moving actuators 202 and 204, the suction port 206 of the intermediate suction pad 194 adheres to the back side of the side edge of the substrate G. The intermediate suction pad 194 can be moved between the advanced moving position and the return moving position where the suction port 206 of the intermediate suction pad 194 retreats downward from the rear side of the side edge of the substrate G. .

As shown in FIG. 23, for example, in the uniaxial conveyance by the 2nd (right) conveyance part 84R, at the time of acceleration of the board | substrate G, it turns left as shown by the arrow J of a dotted line seen from above. (Clockwise) moment is applied to the substrate G, and the moment force causes the substrate G to rotate backward against the suction force of the second suction pad 108R of the second holding portion 106R of the two corners. I try to be. However, since the intermediate adsorption pad material 194 of the rotation displacement preventing means 192 is adsorbed to the rear side of the side edge of the substrate G to stop the rotational displacement of the substrate G to the rear, the substrate G is XY. It can move to a conveyance direction (X direction), maintaining a posture in surface. At the time of deceleration of the substrate G, a moment of right turn (clockwise) is applied to the substrate G as shown by the arrow K of the dashed line as viewed from above, and the substrate G is divided into two corners by the moment force. Attempts to be rotationally displaced forward against the suction force of the second suction pad 108R of the second holding part 106R. However, also in this case, the intermediate suction pad material 194 of the rotation displacement preventing means 192 is attracted to the rear surface of the side edge of the substrate G to stop the rotational displacement toward the front of the substrate G. ) Can move in the conveyance direction (X direction) while maintaining the posture within the XY plane.

Further, the intermediate suction pad material 194 of the rotation displacement preventing means 192 is sufficiently far from the suction pad 108R (L) of the holding portion 106R (L), and thus is shown in, for example, FIGS. 14 and 15. There is no effect (interference) that impairs the substrate posture correcting function of the holding portion 106R (L).

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to the said embodiment, A various deformation | transformation is possible within the range of the technical idea.

Although the above embodiment relates to a resist coating apparatus and a resist coating method in a coating development processing system of LCD manufacture, the present invention can be applied to any substrate processing apparatus or application as long as it is a floating conveying method using a floating stage. As the treatment liquid in the present invention, in addition to the resist liquid, for example, a coating liquid such as an interlayer insulating material, a dielectric material, a wiring material, etc. can be used, and a developing solution, a rinse liquid, or the like can also be used. The substrate to be processed in the present invention is not limited to an LCD substrate, but other flat panel display substrates, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like can also be used.

1 is a plan view showing the configuration of an applicable coating and developing treatment system of the present invention.

2 is a flowchart showing a procedure of a process in the coating and developing processing system of the embodiment;

Fig. 3 is a schematic plan view showing the overall configuration of the resist coating unit in the embodiment.

4 is a perspective view showing an entire structure of a resist coating unit in the embodiment;

Fig. 5 is an approximately front view showing the overall configuration of the resist coating unit in the embodiment.

FIG. 6 is a partial cross-sectional side view schematically showing the configuration of a conveying unit in the resist coating unit of the embodiment; FIG.

7 is an enlarged cross-sectional view showing a configuration example of a holding unit in the resist coating unit of the embodiment;

8 is a perspective view showing an example of a configuration of a holding unit in the resist coating unit of the embodiment;

Fig. 9 is a perspective view showing a suitable configuration example in which the pad support portion supports the suction pad in the holding portion.

Fig. 10 is a block diagram showing the configuration of a control system in the resist coating unit of the embodiment.

Fig. 11 is a timing chart for explaining the coating processing operation in the resist coating unit of the embodiment.

Fig. 12A is a schematic plan view showing one step of the coating processing operation in the resist coating unit of the embodiment.

Fig. 12B is a schematic plan view showing one step of the coating processing operation in the resist coating unit of the embodiment.

Fig. 12C is a schematic plan view showing one step of the coating processing operation in the resist coating unit of the embodiment.

12D is a schematic plan view showing one step of the coating processing operation on the resist coating unit of the embodiment;

Fig. 12E is a schematic plan view showing one step of the coating processing operation in the resist coating unit of the embodiment.

Fig. 12F is a schematic plan view showing one step of the coating processing operation in the resist coating unit of the embodiment.

Fig. 12G is a schematic plan view showing one step of the coating processing operation in the resist coating unit of the embodiment.

Fig. 12H is a schematic plan view showing one step of the coating processing operation in the resist coating unit of the embodiment.

12I is a schematic plan view showing one step of the coating processing operation in the resist coating unit of the embodiment;

Fig. 13 is a schematic perspective view showing a case where the substrate is bent and curved during floating conveyance.

FIG. 14 is a schematic side view illustrating a configuration and method for horizontally correcting a curved warp of a substrate in an embodiment. FIG.

FIG. 15 is a schematic perspective view showing a configuration and method for horizontally correcting a curved warp of the substrate in the embodiment; FIG.

Fig. 16 is a side view showing the configuration of one modification of the retaining portion in the embodiment.

17 is a perspective view illustrating a configuration of another modified example of the holding unit in the embodiment.

18 is a perspective view showing an example of the configuration of a rotation displacement preventing means according to the embodiment;

Fig. 19 is a perspective view showing another example of the configuration of the rotation displacement preventing means in the embodiment;

20 is a perspective view illustrating another configuration example of the rotational displacement preventing means in the embodiment;

Fig. 21 is a perspective view showing another example of the configuration of the rotation displacement preventing means in the embodiment;

22 is a perspective view illustrating another configuration example of the rotation displacement preventing means in the embodiment;

FIG. 23 is a schematic plan view for explaining the operation of the rotation displacement preventing means of FIG.

[Description of the code]

44: resist coating unit (COT)

80: stage

82: resist nozzle

84L: 1st (left) conveyance part

84R: 2nd (right) conveyance part

84: spout

88: suction port

100L, 10OR: 1st and 2nd guide rail

102L, 102R: First and Second Sliders

104L, 104R: first and second conveyance drive units

106L, 106R: first and second holding parts

108L.108R: First and Second Suction Pads

110L, 110R: first and second pad support

112L, 112R: First and Second Pad Actuators

118L, 118R: first and second pad adsorption control

136: stage substrate floating part

138: controller

M ₁ : Import area

M ₂ : application area

M ₃ : export area

174: L-shaped protrusion

176, 186: locking member

184, 188, 190: Actuator

192: rotational displacement prevention means

194: middle adsorption pad

Claims (15)

A stage for causing a rectangular to-be-processed substrate to float at a gas pressure, Carrying part which hold | maintains the said board | substrate of the state which floated on the said stage detachably, and conveys the said board | substrate integrally with the said holding | maintenance part in the said conveyance direction so that the board | substrate may float conveyance in a predetermined conveyance direction on the said stage. With wealth, And a holding member for substantially holding the two corners on the left and right sides in the conveying direction of the substrate, and a lifting portion for lifting or shifting the holding member. The vertical direction according to claim 1, wherein the holding member is capable of adsorbing two adsorption pads respectively on the rear surfaces of the left and right two corners of the substrate, and each of the adsorption pads at two locations spaced at predetermined intervals in the conveying direction, respectively. Has a pad support for regulating and supporting displacement of And a lifting control unit configured to collectively control driving operations of the first and second actuators, wherein the lifting unit independently lifts and drives the first and second pad supports. The said 1st and 2nd pad support part has a horizontal rotation axis which enables rotational displacement of the said adsorption pad in the perpendicular surface around it, and the said 1st and 2nd pad support part has A substrate processing apparatus having a linear axis of motion which enables the suction pad to be linearly displaced in the horizontal direction. 2. The pad according to claim 1, wherein the holding member includes two suction pads each capable of adsorbing the two rear corners of the left and right one corners of the substrate, and a single pad support portion for supporting the respective suction pads by restricting the displacement in the vertical direction. Have, And an actuator for elevating and driving the pad support, and an elevating control unit for controlling a driving operation of the actuator. The substrate processing apparatus according to claim 4, wherein the holding unit has a first pad posture adjusting unit for adjusting the angle of the suction surface of the suction pad with respect to the horizontal line in the conveying direction. The substrate processing apparatus in any one of Claims 1-5 in which the said holding part has a 2nd pad attitude | position adjustment part for adjusting the angle of the adsorption surface of the said adsorption pad with respect to the horizontal line orthogonal to a conveyance direction. The said actuator has a motor and the transmission mechanism of any one of Claims 2-5 which converts the rotational driving force of the said motor into the linear movement of the pad support part in the perpendicular direction, A substrate processing apparatus including an encoder for the lifting control unit detecting an angle of rotation of the motor, and controlling an amount of rotation of the motor by using the output signal of the encoder as a feedback signal to control the lifting movement distance of the pad support unit; . The substrate processing apparatus according to any one of claims 1 to 5, wherein the holding portion has rotational displacement preventing means for preventing rotational displacement in a horizontal plane with respect to the holding portion of the substrate during floating conveyance. 9. The substrate processing apparatus of claim 8, wherein the rotation displacement preventing means is formed integrally with the upper surface of the suction pad, and has protrusions that engage with both side surfaces that are perpendicular to each other at corners of the substrate at positions lower than the upper surface of the substrate. The substrate processing apparatus according to claim 8, wherein the rotation displacement preventing means has a locking member that is caught by the side of the front portion in the conveying direction of the substrate at the time of deceleration of the floating conveyance to prevent rotational displacement of the substrate. 9. A substrate processing apparatus according to claim 8, wherein said rotational displacement preventing means has a locking member which is caught by the side surface of the rear portion in the conveying direction of said substrate at the time of acceleration of floating conveyance and prevents rotational displacement to the rear of said substrate. 9. An intermediate pad member according to claim 8, wherein said rotation displacement preventing means has an intermediate pad member which is adsorbed on the rear surface of the substrate side edge portion between two corners of one side of said substrate held by said holding member to prevent rotation displacement of said substrate. Substrate processing apparatus. A stage for causing a rectangular to-be-processed substrate to float at a gas pressure, It has a 1st holding | maintenance part which detachably holds the left and right edge part with respect to the conveyance direction of the said board | substrate which floats on the said stage, and conveys the said board | substrate integrally with the said 1st holding | maintenance part in order to float and convey the said board | substrate on the said stage. A first conveying unit to move in the direction; It has a 2nd holding | maintenance part which detachably holds the left and right edge parts with respect to the conveyance direction of the said board | substrate which floats on the said stage, and conveys the said board | substrate integrally with the said 2nd holding | maintenance part in order to float and convey the said board | substrate on the said stage. A second conveying unit to move in the direction; A nozzle having a long nozzle disposed above the stage, for discharging the processing liquid from the nozzle toward the substrate passing directly below the nozzle in the floating conveyance to form a coating film of the processing liquid on the substrate; A processing liquid supply unit, The first holding portion has a substantially non-bending first holding member for locally holding two corners on the left and right sides with respect to the conveying direction of the substrate, and a first lifting portion for lifting or shifting the first holding member. , The second holding part has a substantially unbending second holding member for locally holding two corners on the left and right sides with respect to the conveying direction of the substrate, and a second lifting part for lifting or shifting the second holding member. Application device. The carry-out part according to claim 13, further comprising an carrying-in portion for carrying in the substrate at a carrying-in position provided at one end of the stage, and an carrying-out portion for carrying out the substrate from a carrying-out position provided at the other end of the stage, The first conveying unit floats and conveys the substrate on the stage from the carry-in position to the first position set between the application position and the carry-out position through the application position. And the second conveying unit floats and conveys the substrate on the stage from the second position set between the carry-in position and the application position to the carry-out position through the application position. A carry-in position, an application start position, an application end position, and an export position are set in a line along the conveyance direction on the floating stage, By using the pressure of the gas on the floating stage to float a rectangular target substrate to a desired height, On the floating stage, in the first section from the loading position to the coating start position, the two corners on the left and right sides of the substrate are locally held by a lifting and lowering holding member that does not substantially bend in the conveying direction of the substrate, and the coating is performed. In the second section from the start position to the coating finish position, the four corners of the substrate are locally held by an elevable holding member that is substantially inflexible, and in the third section from the coating finish position to the carrying out position, the substrate The two corners on the left and right sides with respect to the conveying direction of are locally held by an elevating and retaining member which does not substantially bend to convey the substrate in the conveying direction, And a process liquid applied to an upper surface of the substrate while the substrate moves through the second section.

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