KR20090027772A - 반도체장치 - Google Patents
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- KR20090027772A KR20090027772A KR1020097002823A KR20097002823A KR20090027772A KR 20090027772 A KR20090027772 A KR 20090027772A KR 1020097002823 A KR1020097002823 A KR 1020097002823A KR 20097002823 A KR20097002823 A KR 20097002823A KR 20090027772 A KR20090027772 A KR 20090027772A
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Abstract
Description
Claims (12)
- 제1 기판과 제2 기판 사이에 배치되는 박막 집적회로로서,하지 절연막;상기 하지 절연막 위의 박막트랜지스터;상기 박막트랜지스터 위의 도전층; 및상기 박막트랜지스터 위의 절연막을 포함하는 상기 박막 집적회로를 포함하고,상기 박막 집적회로는 상기 제1 기판과 상기 제2 기판으로 봉지(封止)되어 있고, 상기 제1 기판은 상기 박막 집적회로 외측의 영역에서 상기 제2 기판과 접하여 있는, 반도체장치.
- 제1 기판과 제2 기판 사이에 배치되는 박막 집적회로로서,하지 절연막;상기 하지 절연막 위의 박막트랜지스터;상기 박막트랜지스터 위의 도전층; 및상기 박막트랜지스터 위의 절연막을 포함하는 상기 박막 집적회로를 포함하고,상기 박막 집적회로는 상기 제1 기판과 상기 제2 기판으로 봉지(封止)되어 있고, 상기 제1 기판은 상기 제1 기판과 상기 제2 기판의 가장자리부에서 상기 제2 기판과 접하여 있는, 반도체장치.
- 제1 기판과 제2 기판 사이에 배치되는 박막 집적회로로서,하지 절연막;상기 하지 절연막 위의 박막트랜지스터;상기 박막트랜지스터 위의 도전층; 및상기 박막트랜지스터 위의 절연막을 포함하는 상기 박막 집적회로를 포함하고,상기 박막 집적회로는 상기 제1 기판과 상기 제2 기판으로 봉지(封止)되어 있고, 상기 제1 기판은 상기 박막 집적회로 외측의 영역에서 상기 제2 기판과 접하여 있고,상기 제1 기판과 상기 제2 기판 중 어느 하나 또는 모두에 도전성 재료가 코팅되어 있는, 반도체장치.
- 제1 기판과 제2 기판 사이에 배치되는 박막 집적회로로서,하지 절연막;상기 하지 절연막 위의 박막트랜지스터;상기 박막트랜지스터 위의 도전층; 및상기 박막트랜지스터 위의 절연막을 포함하는 상기 박막 집적회로를 포함하고,상기 박막 집적회로는 상기 제1 기판과 상기 제2 기판으로 봉지(封止)되어 있고, 상기 제1 기판은 상기 제1 기판과 상기 제2 기판의 가장자리부에서 상기 제2 기판과 접하여 있고,상기 제1 기판과 상기 제2 기판 중 어느 하나 또는 모두에 도전성 재료가 코팅되어 있는, 반도체장치.
- 제1 기판과 제2 기판 사이에 배치되는 박막 집적회로로서,하지 절연막,상기 하지 절연막 위의, 박막트랜지스터와 용량 소자를 포함하는 소자 군(群),상기 소자 군을 덮는 제1 절연막,상기 제1 절연막 위의, 상기 소자 군에 전기적으로 접속된 제1 도전층, 및상기 제1 도전층 위의 제2 절연막을 포함하는 상기 박막 집적회로와;상기 제1 기판 또는 상기 제2 기판에 부착되는 제2 도전층을 포함하고,상기 박막 집적회로는 상기 제1 기판과 상기 제2 기판으로 봉지(封止)되어 있고, 상기 제1 기판은 상기 박막 집적회로 외측의 영역에서 상기 제2 기판과 접하여 있고,상기 제2 도전층은 안테나이며, 상기 제1 도전층에 전기적으로 접속되어 있는, 반도체장치.
- 제1 기판과 제2 기판 사이에 배치되는 박막 집적회로로서,하지 절연막,상기 하지 절연막 위의, 박막트랜지스터와 용량 소자를 포함하는 소자 군(群),상기 소자 군을 덮는 제1 절연막,상기 제1 절연막 위의, 상기 소자 군에 전기적으로 접속된 제1 도전층, 및상기 제1 도전층 위의 제2 절연막을 포함하는 상기 박막 집적회로와;상기 제1 기판 또는 상기 제2 기판에 부착되는 제2 도전층을 포함하고,상기 박막 집적회로는 상기 제1 기판과 상기 제2 기판으로 봉지(封止)되어 있고, 상기 제1 기판은 상기 제1 기판과 상기 제2 기판의 가장자리부에서 상기 제2 기판과 접하여 있고,상기 제2 도전층은 안테나이며, 상기 제1 도전층에 전기적으로 접속되어 있는, 반도체장치.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서, 상기 절연막은 산화규소, 질화규소, 산화질화규소, 및 질화산화규소로 이루어진 군에서 선택되는 재료를 포함하는, 반도제장치.
- 제 5 항 또는 제 6 항에 있어서, 상기 제1 절연막은 산화규소, 질화규소, 산화질화규소, 및 질화산화규소로 이루어진 군에서 선택되는 재료를 포함하는, 반도 제장치.
- 제 1 항 내지 제 6 항 중 어느 한 항에 있어서, 상기 제1 기판과 상기 제2 기판 각각이 수지를 포함하는, 반도제장치.
- 제 1 항 내지 제 6 항 중 어느 한 항에 있어서, 상기 제1 기판과 상기 제2 기판 각각이 섬유질 재료를 포함하는, 반도체장치.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서, 상기 도전층이 안테나인, 반도체장치.
- 제 5 항 또는 제 6 항에 있어서, 상기 제1 기판과 상기 제2 기판 중 어느 하나 또는 모두에 도전성 재료가 코팅되어 있는, 반도체장치.
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US8698156B2 (en) | 2014-04-15 |
US20090212297A1 (en) | 2009-08-27 |
KR101175277B1 (ko) | 2012-08-21 |
CN101527270A (zh) | 2009-09-09 |
KR101020661B1 (ko) | 2011-03-09 |
JP4579057B2 (ja) | 2010-11-10 |
CN1993829A (zh) | 2007-07-04 |
CN101789378A (zh) | 2010-07-28 |
US20140220745A1 (en) | 2014-08-07 |
KR100970194B1 (ko) | 2010-07-14 |
KR20110122204A (ko) | 2011-11-09 |
CN101527270B (zh) | 2012-07-04 |
KR101226260B1 (ko) | 2013-01-28 |
EP1774595A4 (en) | 2011-05-18 |
US8123896B2 (en) | 2012-02-28 |
CN101789378B (zh) | 2012-07-04 |
KR20120030577A (ko) | 2012-03-28 |
KR20090009996A (ko) | 2009-01-23 |
EP1774595A1 (en) | 2007-04-18 |
US9536755B2 (en) | 2017-01-03 |
KR20070028477A (ko) | 2007-03-12 |
CN1993829B (zh) | 2010-06-02 |
US20080044940A1 (en) | 2008-02-21 |
JP2006019717A (ja) | 2006-01-19 |
WO2005119781A1 (en) | 2005-12-15 |
KR101187403B1 (ko) | 2012-10-02 |
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