KR20080061950A

KR20080061950A - Multi layer board having electromagnetic bandgap power delivery system

Info

Publication number: KR20080061950A
Application number: KR1020060137161A
Authority: KR
Inventors: 이준호
Original assignee: 주식회사 하이닉스반도체
Priority date: 2006-12-28
Filing date: 2006-12-28
Publication date: 2008-07-03

Abstract

A multi-layer substrate having an EBG PDS(Electromagnetic Band Gap Power Delivery System) is provided to implement the partial EBG PDS without an additional conductive layer by utilizing a signal layer, a power layer, or a ground layer. A multi-layer substrate having an EBG PDS includes a signal layer(S_TOP), a first power/ground layer(P/G_1), an EBG patch, and a second power/ground layer(P/G_2). The first power/ground layer is connected to some region(100) of the signal layer through a first via(110). The EBG patch is patterned in some region(C) of the first power/ground layer corresponding to some region of the signal layer. The second power/ground layer is connected to the EBG patch through a second via.

Description

MULTI LAYER BOARD HAVING ELECTROMAGNETIC BANDGAP POWER DELIVERY SYSTEM}

1 is a diagram illustrating a multilayer substrate to which an electromagnetic bandgap power transmission system according to the prior art is applied.

2 shows an example of a four-layer substrate.

3 is a diagram illustrating an electromagnetic bandgap power transmission system according to an embodiment of the present invention in FIG. 2.

4 is a diagram showing an electromagnetic bandgap power transmission system according to an embodiment of the present invention on a three-layer substrate.

5 shows an example of a five-layer substrate.

6 is a diagram illustrating an electromagnetic bandgap power transmission system according to an embodiment of the present invention in FIG. 5.

7 is a graph comparing input impedance Z ₁₁ characteristics between a signal line GF charged with a ground voltage and a signal line EF to which an electromagnetic bandgap power transmission system according to an exemplary embodiment of the present invention is applied.

8 is a graph comparing the transfer impedance Z ₂₁ between a signal line GF charged with a ground voltage and a signal line EF to which an electromagnetic bandgap power transmission system according to an exemplary embodiment of the present invention is applied.

The present invention relates to a multilayer substrate, and more particularly to a multilayer substrate employing a partial electromagnetic bandgap power delivery system.

In general, an electromagnetic bandgap (EBG, hereinafter referred to as 'EBG') power delivery system (PDS, hereinafter referred to as 'PDS') is used to improve the power ground network noise of digital systems. As a proposed technique, it acts like a band stop filter in the PDS to suppress PDS noise in a specific frequency band and also has an effect on reducing the occurrence of electromagnetic interference (EMI).

Conventional EBG PDS can be divided into Uniplanar Compact Photonic Bandgap (UC-EBG) used without additional conducting layer, or EGB implemented using Uniplanar Compact Photonic Bandgap (UC-PBG) and additional conductive layer. .

Among the advantages of UC-EBG in digital systems, there is no need to add layers, but signal lines routed over the surface of UC-EBG are affected by UC-EBG. In the case of a digital signal to be transmitted, there is a problem in that the signal transmission characteristics deteriorate in a specific frequency band.

Due to such drawbacks of UC-EBG, an EBG PDS having a structure as shown in FIG. 1 has been proposed in order not to affect signal transmission in a digital system. However, since the use of an additional conductive layer (EBG layer) is essential for the implementation of the EBG PDS, there is a problem that the manufacturing cost increases.

Accordingly, it is an object of the present invention to implement an EBG PDS without increasing the number of conductive layers, thereby reducing power costs and improving power ground network noise.

According to a first embodiment of the present invention for achieving the above object, a multilayer substrate includes a signal layer; A first power / ground layer connected to a portion of the signal layer through a first via; An electromagnetic bandgap patch patterned on an area of the first power / ground layer corresponding to a part of the signal layer; And a second power supply / grounding layer connected to the electromagnetic bandgap patch through a second via.

In the above configuration, it is preferable that some regions of the signal layer charge the power supply voltage or the ground voltage through the first power supply / ground layer.

According to a second embodiment of the present invention for achieving the above object, a multilayer substrate includes a signal layer; A power / ground layer connected to a portion of the signal layer through vias; And an electromagnetic bandgap patterned in an area of the power / ground layer corresponding to a part of the signal layer.

In the above configuration, it is preferable that a part of the signal layer charges a power supply voltage or a ground voltage through the power supply / grounding layer.

In addition, the electromagnetic bandgap preferably includes an electromagnetic bandgap patch patterned in an area of the power / ground layer, and a via connecting the electromagnetic bandgap patch and the signal layer.

According to a third embodiment of the present invention for achieving the above object, a multilayer substrate includes a signal layer; Power / ground layer; And an electromagnetic bandgap patch patterned on a portion of the signal layer and connected to the power / grounding ray through vias.

In the above configuration, the signal layer is preferably arranged inside the substrate.

According to a fourth embodiment of the present invention for achieving the above object, a multilayer substrate includes a first signal layer; A first power / ground layer connected to a portion of the first signal layer through a first via; A first electromagnetic bandgap patch patterned on an area of the first power / ground layer corresponding to a partial area of the first signal layer; A second signal layer; A second electromagnetic bandgap patch patterned on a portion of the second signal layer; A second power / ground layer connected to the electromagnetic bandgap patch through a second via and to the second electromagnetic bandgap patch through a third via; A third signal layer, wherein a portion of the third signal layer is connected to the second power / ground layer through a fourth via; And a third electromagnetic bandgap patch patterned on an area of the second power / ground layer corresponding to a partial area of the third signal layer, wherein the third electromagnetic bandgap patch and the third electromagnetic bandgap patch are formed through a fifth via. It is characterized in that some regions of the three signal layers are connected.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The structure of FIG. 6 is disclosed as an embodiment of the present invention, and the embodiment of the present invention utilizes a power or ground layer formed in the remaining space of the signal layer or above and below the signal layer. By implementing an EBG PDS, power ground network noise can be improved without additional conductive layers.

First, when designing a general multi-layer printed circuit board (PCB), multi-layer module, or multi-layer package, extra areas of the signal layer are filled with planes to supply power. Or connected to ground.

For example, in a structure having four layers as shown in FIG. 2, some regions 10 and 20 of the top signal layer S_TOP and the bottom signal layer S_BOT are powered or grounded through vias 11 and 21. It is connected to the layers P / G_1 and P / G_2, respectively, to fill a power or ground voltage.

The redundant areas of the top signal layer S_TOP and the bottom signal layer S_BOT excluding the areas 10 and 20 charged with the power or ground voltage may be filled in a plane shape and connected to a power source or a ground.

In this structure, as shown in FIG. 3, the EBG structure 30 is patterned under the region 10 where the power or ground voltage is charged in the top signal layer S_TOP. . In this case, each EBG patch 32 is connected to the power source or the ground layer P / G_2 through the via 31.

That is, according to the embodiment of the present invention, since the power or ground layer A below the region 10 where the power or ground voltage is charged is unnecessary, the EBG PDS is used by patterning the portion into the EBG structure 30. Can be implemented.

In addition, according to the embodiment of the present invention, as shown in FIG. 3, the EBG structure 40 is patterned on the region 20 where the power or ground voltage is charged in the lowermost signal layer S_BOT. In this case, each EBG patch 42 is connected to the power source or the ground layer P / G_1 through the via 41.

Similarly, in the embodiment of the present invention, since the power or ground layer B on the upper portion of the region 20 in which the power or ground voltage is charged is unnecessary, the EBG PDS is removed by patterning and using the EBG structure 40. Can be implemented.

As another example, in the structure having three layers as shown in FIG. 4, the redundant region of the intermediate signal layer S_MID may be directly patterned into the EBG structures 50 and 60 to be implemented as an EBG PDS. In this case, each of the EBG patches 52 and 62 is connected to the power source or the ground layers P / G_1 and P / G_2 through the vias 51 and 61, respectively.

5 and 6 show the implementation of the EBG PDS without the additional pattern as described above in a structure having five layers.

Specifically, in the structure having five layers as shown in FIG. 5, some regions 100 to 300 of the uppermost signal layer S_TOP, the intermediate signal layer S_MID, and the lowermost signal layer S_BOT are vias 110, 210, and 310. Is connected to a power supply or ground layer (P / G_1), respectively, to charge the power supply or ground voltage.

In the signal layers S_TOP, S_MID, and S_BOT, the remaining regions except for the regions 100 to 300 where the power or ground voltage is charged are filled in a plane shape and connected to the power or ground layers P / G_1 and P / G_2. Can be used.

In this structure, as shown in FIG. 6, portions C and D of the power or ground layers P / G_1 and P / G_2 formed on and under the signal layers S_TOP and S_BOT and a power or ground voltage. A portion 200 of the charged signal layer S_MID may be patterned into the EBG structures 400 to 600.

Specifically, in the power source or ground layer P / G_1 formed under the top signal layer S_TOP, the lower part C of the region 100 in which the power source or ground voltage is charged is patterned into the EBG structure 400. In this case, the EBG patch 420 is connected to the power source or the ground layer P / G_2 through the via 410.

Similarly, in the power source or ground layer P / G_2 formed on the lowermost signal layer S_BOT, the upper part D of the region 300 in which the power source or ground voltage is charged is patterned into the EBG structure 600. In this case, the EBG patch 520 is connected to the region 300 where the power or ground voltage of the lowermost signal layer S_BOT is charged through the via 610.

In the intermediate signal layer S_MID, the region 200 in which the power voltage or the ground voltage is charged is an EBG including a plurality of EBG patches 520 connected to the power or ground layer P / G_2 through the via 510. Patterned directly into structure 500. Here, the redundant area of the intermediate signal layer S_MID may also be directly patterned into the EBG structure 500 to be implemented as an EBG PDS.

In addition, in the top and bottom signal layers (S_TOP, S_BOTTOM), the remaining areas, except for the areas 100 and 300 where the power or ground voltage is charged, are filled in a plane shape and connected to the power or ground layer (PWR / GND1, PWR / GND2). Can be.

7 and 8 are graphs comparing impedance characteristics between a signal line GF charged with a ground voltage according to frequency and a signal line EF to which a partial EBG PDS is applied.

As shown in FIG. 7, it can be seen that the signal line EF to which the partial EBG PDS is applied has a significantly improved input impedance Z ₁₁ than the signal line GF to which the ground voltage is charged without the partial EBG PDS. .

In addition, as shown in FIG. 8, the signal line EF to which the partial EBG PDS is applied has a significant improvement in the transfer impedance Z ₂₁ characteristics than the signal line GF to which the ground voltage is charged without the partial EBG PDS. Can be.

As such, the embodiment of the present invention implements a partial EBG PDS utilizing a signal layer, a power layer, or a ground layer, thereby eliminating the need for an additional conductive layer, thereby eliminating power ground network noise without increasing manufacturing costs. It has the effect of suppressing and reducing EMI generation.

While the invention has been shown and described with reference to specific embodiments, the invention is not limited thereto, and the invention is not limited to the scope of the invention as defined by the following claims. Those skilled in the art will readily appreciate that modifications and variations can be made.

Claims

Signal layer;

A first power / ground layer connected to a portion of the signal layer through a first via;

An electromagnetic bandgap patch patterned on an area of the first power / ground layer corresponding to a part of the signal layer; And

And a second power / ground layer connected to the electromagnetic bandgap patch through a second via.

The method of claim 1,

And a portion of the signal layer charges a supply voltage or a ground voltage through the first power / ground layer.

Signal layer;

A power / ground layer connected to a portion of the signal layer through vias; And

And an electromagnetic bandgap patterned in an area of the power / ground layer corresponding to a part of the signal layer.

The method of claim 4, wherein

And a portion of the signal layer charges a power voltage or a ground voltage through the power / ground layer.

The method of claim 4, wherein

Wherein the electromagnetic bandgap comprises an electromagnetic bandgap patch patterned in the region of the power / ground layer and a via connecting the electromagnetic bandgap patch and the signal layer.

Signal layer;

Power / ground layer; And

An electromagnetic bandgap patch patterned on a portion of the signal layer, the electromagnetic bandgap patch being connected to the power / grounding ray through vias.

The method of claim 6,

And the signal layer is disposed within the substrate.

A first signal layer;

A first power / ground layer connected to a portion of the first signal layer through a first via;

A first electromagnetic bandgap patch patterned on an area of the first power / ground layer corresponding to a partial area of the first signal layer;

A second signal layer;

A second electromagnetic bandgap patch patterned on a portion of the second signal layer;

A second power / ground layer connected to the electromagnetic bandgap patch through a second via and to the second electromagnetic bandgap patch through a third via;

A third signal layer, wherein a portion of the third signal layer is connected to the second power / ground layer through a fourth via; And

And a third electromagnetic bandgap patch patterned on a region of the second power / ground layer corresponding to a portion of the third signal layer.

And a fifth via is connected between the third electromagnetic bandgap patch and a portion of the third signal layer.