KR20080061132A - Apparatus for forming organic layer - Google Patents

Apparatus for forming organic layer Download PDF

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KR20080061132A
KR20080061132A KR1020060136096A KR20060136096A KR20080061132A KR 20080061132 A KR20080061132 A KR 20080061132A KR 1020060136096 A KR1020060136096 A KR 1020060136096A KR 20060136096 A KR20060136096 A KR 20060136096A KR 20080061132 A KR20080061132 A KR 20080061132A
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shutter unit
unit
shutter
substrate
organic
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KR1020060136096A
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Korean (ko)
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양두석
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엘지디스플레이 주식회사
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • H01L51/0008Deposition of organic semiconductor materials on a substrate using physical deposition, e.g. sublimation, sputtering
    • H01L51/001Vacuum deposition

Abstract

An organic layer depositing apparatus is provided to prevent the droop of a shutter from generating and to control the thickness of an organic layer deposited on a substrate precisely. A deposition source(20) is arranged at the inner bottom surface of a chamber body(10) and receives organic materials. A substrate fixing unit(30) is arranged at the upper side of the chamber body and fixes a substrate. The organic material vaporized from the deposition source is deposited on the substrate. A shutter unit(50) is arranged between the organic materials receiving member and the substrate fixing unit and controls the deposition amount of the organic materials. A rotation shaft assembly(40) rotates the shutter unit and combined with the shutter unit eccentrically. A sag preventing member is formed at the shutter unit and prevents the sag of the shutter unit. THE shutter unit includes a sub shutter unit having the main shutter unit and the sub shutter unit.

Description

유기막 증착 장치{APPARATUS FOR FORMING ORGANIC LAYER} An organic film vapor deposition apparatus {APPARATUS FOR FORMING ORGANIC LAYER}

도 1은 본 발명의 일실시예에 의한 유기막 증착 장치를 도시한 단면도이다. 1 is a cross-sectional view showing an organic film vapor deposition apparatus according to an embodiment of the present invention.

도 2는 도 1에 도시된 셔터 유닛의 하나인 메인 셔터 유닛을 도시한 사시도이다. Figure 2 is a perspective view of the one of the main shutter unit of the shutter unit shown in Fig.

도 3은 도 1의 처짐 방지부 부분의 확대도이다. Figure 3 is an enlarged view of a portion of deflection preventing portions of Fig.

도 4는 메인 셔터 유닛의 다른 실시예를 도시한 사시도이다. Figure 4 is a perspective view showing another embodiment of the main shutter unit.

도 5는 도 1에 도시된 셔터 유닛의 하나인 서브 셔터 유닛을 도시한 사시도이다. Figure 5 is a perspective view of the shutter, one of the sub-unit of the shutter unit shown in Fig.

본 발명은 유기막 증착 장치에 관한 것이다. The present invention relates to an organic film vapor deposition apparatus. 보다 구체적으로, 본 발명은 유기막의 두께를 결정하는 셔터 유닛의 처짐을 방지한 유기막 증착 장치에 관한 것이다. More particularly, the present invention relates to an organic film vapor deposition apparatus which prevent the deflection of the shutter unit for determining the thickness of the organic film.

최근 들어, 방대한 데이터를 처리하는 정보처리장치 및 정보처리장치에서 처리된 정보를 표시하는 표시장치가 개발되고 있다. In recent years, there has been developed a display device that displays the processed information in the information processing apparatus and an information processing apparatus for processing a large amount of data.

대표적인 표시장치로는 액정표시장치, 유기 광 발생 장치 및 플라즈마 표시 패널 등을 들 수 있다. As a typical display device may include a liquid crystal display device, an organic light-generating device and a plasma display panel.

이들 중 액정표시장치는 액정을 이용하여 영상을 표시하고, 유기 광 발생 장치는 복수층의 유기막으로 이루어진 유기 발광층을 이용하여 영상을 표시하고, 플라즈마 표시 장치는 플라즈마를 이용하여 영상을 표시한다. The liquid crystal of which the display device displays an image using a liquid crystal and an organic light generating device displays an image using an organic light-emitting layer made of an organic film of a plurality of layers, and a plasma display apparatus displaying an image using a plasma.

이들 표시장치들 중 유기 광 발생 장치로부터 광을 발생하는 유기막은 주로 마스크를 사용하지 않기 위해 진공증착법이 사용되고 있다. Of these organic film display device for generating a light from the organic light-generating device has a vacuum deposition method is used mainly in order not to use a mask.

진공증착법은 진공 챔버의 하부에 증착원과 그 상부에 성막용 기판인 피처리기판을 설치하여 박막을 형성한다. A vacuum vapor deposition method is to install the substrate in the deposition substrate for the evaporation source and the upper to the lower portion of the vacuum chamber to form a thin film.

진공증착법을 이용한 유기막 증착 장치의 개략적인 구성을 살펴보면, 진공챔버에 연결된 진공 배기계를 이용하여 진공 챔버의 내부를 일정한 진공을 유지시킨 다. Looking at the schematic structure of the organic film deposition apparatus using a vacuum deposition method, and that by using a vacuum exhaust system connected to the vacuum chamber to maintain a constant vacuum inside the vacuum chamber.

이어서, 진공 챔버의 하부에 배치된 적어도 유기막 소오스가 수납된 증착원으로부터 유기박막재료인 유기물을 증발 온도 이상으로 가열하여 증발시켜 기판에 유기막을 증착한다. Then evaporated by heating the organic thin film of organic material above the evaporating temperature from the at least an evaporation source accommodating organic film source disposed below the vacuum chamber and depositing an organic film on the substrate. 구체적으로, 증착원은 그 내부에 유기물이 수용되는 도가니(crucible)와 도가니의 주변에 감겨져 전기적으로 가열하는 가열장치를 포함하며, 가열장치의 온도가 상승함에 따라 상기 도가니도 함께 가열되어 일정온도가 되면 유기물이 증발되기 시작한다. Specifically, the evaporation source comprises a heating device for wound electrically heated in the vicinity of the crucible (crucible) and the crucible which organic material is accommodated therein, as the temperature of the heater rises is also heated with the furnace has a constant temperature When the organic material begins to evaporate.

도가니로부터 증발된 유기물은 상기 기판으로 이동되어 흡착, 증착, 재 증발 등의 연속적 과정을 거쳐 기판 위에 고체화되어 얇은 박막을 형성한다. The organic material evaporated from the crucible is solidified on the substrate is moved to the substrate through a continuous process, such as adsorption, deposition, re-evaporated to form a thin film.

한편, 기판 위에 형성된 유기막의 두께를 조절하기 위해서 진공 챔버의 기판 및 증착원 사이에는 회전축에 연결된 셔터가 배치된다. On the other hand, there is arranged a shutter connected to the rotating shaft between the substrate and the evaporation source of the vacuum chamber in order to control the thickness of the organic film formed on a substrate. 회전축의 회전에 의하여 셔터가 개방/폐쇠 됨에 따라 증착원으로부터 증발된 유기물이 기판에 부착되는 양이 변경되어 유기막의 두께를 조절할 수 있다. The amount of the evaporated organic material from the evaporation source to be attached to the substrate by the rotation as the shutter is opened / takedown of the rotation axis is changed it is possible to adjust the thickness of the organic film.

그러나, 종래 유기막 증착 장치에서 셔터를 회전시키는 회전축은 셔터의 일측에 편심된 상태로 배치되기 때문에 회전축에 결합된 셔터 중 회전축으로부터 멀리 떨어진 셔터의 단부는 모멘트에 의하여 휨이 발생되고, 휨이 발생된 셔터로는 유기물의 증착량을 정밀하게 제어할 수 없는 문제점을 갖는다. However, the conventional organic rotation axis of the film to rotate the shutter in the deposition apparatus, since arranged in an eccentric state to one side of the shutter of the shutter end portion remote from the axis of rotation of the shutter coupled to the rotating shaft is a bending is caused by the moment, bending occurs with the shutter has a problem that can not precisely control the deposition amount of the organic material.

본 발명의 하나의 목적은 셔터의 처짐을 방지하여 기판에 증착되는 유기막의 두께를 정밀하게 제어할 수 있는 유기막 증착 장치를 제공한다. One object of the present invention is to provide an organic film vapor deposition apparatus that is capable of preventing deflection of the shutter to precisely control the thickness of an organic film deposited on the substrate.

이와 같은 본 발명의 하나의 목적을 구현하기 위한 유기막 증착 장치는 챔버 몸체. The organic film deposition device for implementing the object of the present invention, such as the chamber body. 상기 챔버 몸체의 내측 바닥면에 배치되며 유기물을 수납하는 증착원, 상기 챔버 몸체의 상측에 배치되며 상기 증착원으로부터 증발된 상기 유기물이 증착되는 기판을 고정하는 기판 고정 유닛, 상기 유기물 수납부재 및 상기 기판 고정 유닛의 사이에 배치되어 상기 기판에 증착되는 상기 유기물의 증착량을 조절하기 위한 셔터 유닛 및 상기 셔터 유닛을 회전시키는 회전축 어셈블리를 포함하며, 셔터 유닛에는 상기 셔터 유닛의 처짐을 방지하는 처짐 방지부가 형성된 유기막 증착 장치를 포함한다. An evaporation source, is disposed on the upper side of the chamber body substrate holding unit, the organic substance storage member for fixing the substrate the evaporated the organic material from the evaporation source deposition is placed on the inner bottom surface of the chamber body for storing the organic material and the is disposed between the substrate holding unit comprises a rotation shaft assembly for rotating the shutter unit and a shutter unit for adjusting the deposition rate of the organic material deposited on the substrate, a shutter unit is provided with anti-sag to prevent the deflection of the shutter unit portion is formed includes an organic film vapor deposition apparatus.

이하, 첨부된 도면들을 참조하여 본 발명의 실시예들에 따른 유기막 증착 장 치에 대하여 상세하게 설명하지만, 본 발명이 하기의 실시예들에 제한되는 것은 아니며, 해당 분야에서 통상의 지식을 가진 자라면 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 본 발명을 다양한 다른 형태로 구현할 수 있을 것이다. Hereinafter, embodiments of the invention with reference to the accompanying drawings, for example, the description in detail with respect to the organic film sheet deposition value according to, but not limited to the embodiments of to the present invention, one of ordinary skill in the art Here, if will be able to implement the present invention may be made without departing from the scope of the present invention in various other forms.

도 1은 본 발명의 일실시예에 의한 유기막 증착 장치를 도시한 단면도이다. 1 is a cross-sectional view showing an organic film vapor deposition apparatus according to an embodiment of the present invention.

도 1을 참조하면, 유기막 증착 장치(100)는 챔버 몸체(10), 증착원(20), 기판 고정 유닛(30), 회전축 어셈블리(40) 및 셔터 유닛(50)을 포함한다. 1, the organic film deposition apparatus 100 includes a chamber body 10, the evaporation source 20, a substrate holding unit 30, the rotating shaft assembly 40 and shutter unit 50.

챔버 몸체(10)는 기판(1)에 불순물이 포함되지 않은 유기막(2)을 형성하기에 적합한 공정 환경을 제공한다. The chamber body 10 provides the processing environment suitable for forming the organic film (2) that does not contain an impurity to the substrate (1). 본 실시예에서, 챔버 몸체(10)는 돔 형상, 육면체 플레이트 형상 등 다양한 형상으로 형성될 수 있다. In this embodiment, the chamber body 10 may be formed in a dome-shaped, six-sided plate shape and the like various shapes.

챔버 몸체(10)는 진공 펌프(15)를 더 포함할 수 있다. The chamber body 10 may further include a vacuum pump 15. 진공 펌프(15)는 챔버 몸체(10)와 연결된 배관(12) 상에 연결되어 챔버 몸체(10) 내부를 초 진공압 상태로 만든다. Vacuum pump 15 is connected to the piping 12 connected to the chamber body 10 made of a pneumatic second state in which the internal chamber body (10).

증착원(20)은 챔버 몸체(10)의 바닥에 배치될 수 있다. Evaporation source 20 may be disposed at the bottom of the chamber body 10. 증착원(20)은 기판(1) 상에 증착되는 유기막을 이루는 유기물이 수납된다. Evaporation source 20 is the organic material constituting the organic film deposited on the substrate (1) is housed.

본 실시예에서, 증착원(20)에는 홀 수송층, 홀 주입층, 유기 발광층, 전자 수송층 및 전자 주입층을 형성하기 적합한 유기물들이 수납될 수 있다. In this embodiment, the evaporation source 20 has a hole transport layer, a hole injection layer, organic light-emitting layer, suitable organic materials to form an electron transport layer and an electron injection layer may be accommodated.

증착원(20)은 가열 유닛(미도시)을 더 포함할 수 있다. Evaporation source 20 may further include a heating unit (not shown). 가열 유닛은 증착원에 수납된 유기물이 증발 또는 승화되기에 적합한 온도로 가열한다. Heating unit is housed in the organic material evaporation source is heated to a temperature suitable for being evaporated or sublimated.

기판 고정 유닛(30)은 챔버 몸체(10)의 상부에 배치된다. A substrate holding unit 30 is placed on top of the chamber body 10. 기판 고정 유닛(30)은 증착원(20)으로부터 증발된 유기물이 부착되도록 증착원(20)과 마주하는 곳에 기판(1)을 고정한다. A substrate holding unit 30 holding a substrate (1), where facing the evaporation source 20 so that the vaporized organic material from the evaporation source 20 is attached. 기판 고정 유닛(30)은 기판(1)을 진공압에 의하여 고정하거나 기판(1)을 정전기 등을 이용하여 고정할 수 있다. A substrate holding unit 30 is fixed, or the substrate 1 by the vacuum pressure to the substrate 1 can be fixed by using static electricity. 이외에도 다양한 방법에 의하여 기판 고정 유닛(30)은 기판(1)을 고정할 수 있다. In addition, by a variety of methods substrate holding unit 30 may hold the substrate (1).

회전축 어셈블리(40)는 제1 회전축(42) 및 제2 회전축(44)을 포함한다. The rotating shaft assembly 40 comprises a first axis of rotation 42 and second axis of rotation (44). 본 실시예에서, 제1 회전축(42)은 내경을 갖는 중공축일 수 있고, 제2 회전축(44)은 제1 회전축(42)의 내부에 배치된다. In this embodiment, the first rotation shaft 42 may be hollow and holidays having an inner diameter, the second rotary shaft 44 is disposed inside the first rotary shaft (42).

본 실시예에서, 제1 회전축(42) 및 제2 회전축(44)은 서로 다른 회전 유닛(46)에 결합 될 수 있고, 제1 회전축(42)의 내부에 배치된 제2 회전축(44)은 제1 회전축(42)의 단부로부터 소정 길이 돌출된다. In this embodiment, the first rotation axis 42 and second rotational axis 44 to each other can be coupled to another rotary unit 46, the second rotary shaft 44 disposed inside the first rotating shaft 42 is the predetermined length is projected from the end of the first rotating shaft (42).

도 2는 도 1에 도시된 셔터 유닛의 하나인 메인 셔터 유닛을 도시한 사시도이다. Figure 2 is a perspective view of the one of the main shutter unit of the shutter unit shown in Fig. 도 3은 도 1의 처짐 방지부 부분의 확대도이다. Figure 3 is an enlarged view of a portion of deflection preventing portions of Fig.

도 2 및 도 3을 참조하면, 셔터 유닛(50)은 메인 셔터 유닛(56) 및 서브 셔터 유닛(58)를 포함한다. Figure 2 If and 3, the shutter unit 50 includes a main shutter unit 56 and the sub shutter unit 58.

메인 셔터 유닛(56)은, 평면상에서 보았을 때, 초승달 형상을 갖는 메인 셔터 판(54) 및 메인 셔터 판(54) 상에 결합 되어 메인 셔터 판(54)을 지지하는 프레임(53)을 포함한다. The main shutter unit 56, as viewed in plan, coupled to the main shutter plate 54 and the main shutter plate 54 has a crescent shape comprises a frame 53 for supporting the main shutter plate 54 . 본 실시예에서, 메인 셔터 판(54)은 제1 면적을 갖는다. In this embodiment, the main shutter plate 54 has a first area.

프레임(53)의 단부에는 제2 회전축(44)이 통과하는 제1 결합공(51) 및 회전축 어셈블리(40)의 제1 회전축(42)과 결합 되는 부싱(bushing;52) 및 프레임(53)의 처짐을 방지하는 처짐 방지부(55)를 포함한다. The first engagement hole 51 and the first rotary shaft 42 a bushing combined with the rotating shaft assembly 40 to the end of the frame 53, passes through the second rotation axis (44) (bushing; 52) and the frame 53 in comprises a deflection prevention portion 55 to prevent deflection.

처짐 방지부(55)는 부싱(52)의 표면으로부터 연장되어 프레임(53)의 에지를 따라 배치되어 프레임(53)이 처지는 것을 방지한다. Deflection preventing portion 55 is extended from the surface of the bushing 52 is disposed along the edge of the frame 53 prevents the frame 53 sagging.

본 실시예에서, 처짐 방지부(55)를 갖는 메인 셔터 유닛(52)의 프레임(53)은, 평면상에서 보았을 때, L자 형상으로 형성되는 것이 바람직하며, L 자 형상으로 처짐 방지부(55)를 형성함으로써 메인 셔터 판(54)의 처짐을 다시 방지할 수 있다. Frame 53 in the present embodiment, the deflection preventing portion 55, the main shutter unit 52 having, when viewed in a plane, preferably formed in an L-shape and, L-a deflection prevention portion (55 shaped ) it is possible to prevent the deflection of the main shutter plate 54 again by forming.

도 4는 메인 셔터 유닛의 다른 실시예를 도시한 사시도이다. Figure 4 is a perspective view showing another embodiment of the main shutter unit.

도 4를 참조하면, 메인 셔터 유닛(56)의 처짐을 방지하기 위하여, 평면상에서 보았을 때, L자 형상을 갖는 프레임(53)의 측면은 메인 셔터 유닛(56)의 처짐을 방지하기 위해 약 90°절곡하여 처짐 방지부(55a)를 형성 할 수 있다. 4, in order to prevent sagging of the main shutter unit 56, as viewed in plan, the side of the frame 53 having an L-shape is from about 90 to prevent sagging of the main shutter unit 56 ° by bending to form the deflection prevention portion (55a). 본 실시예에서, 프레임(53)의 절곡 각도는 90°보다 작게 형성되어도 무방하다. Bending angle in the present embodiment, the frame 53 is may be formed to be smaller than 90 °.

도 5는 도 1에 도시된 셔터 유닛의 하나인 서브 셔터 유닛을 도시한 사시도이다. Figure 5 is a perspective view of the shutter, one of the sub-unit of the shutter unit shown in Fig.

도 5를 참조하면, 서브 셔터 유닛(58)은 초승달 형상을 갖는 메인 셔터 유닛(56)과 오버랩되고, 이로 인해 서브 셔터 유닛(58) 및 메인 셔터 유닛(56)은, 평면상에서 보았을 때, 원판 형상을 갖게 된다. 5, the sub shutter unit 58 is overlapped with the main shutter unit 56 having a crescent shape, whereby the sub-shutter unit 58 and the main shutter unit 56, as viewed in plan, the disk It will have a shape.

서브 셔터 유닛(58)은 제2 회전축(44)과 결합되는 제2 결합공(59a)을 갖는고, 서브 셔터 유닛(58)은 제2 회전축(44)에 의하여 회전된다. Sub-shutter unit 58 are first and having a second engaging hole (59a) is coupled with the second rotating shaft 44, the sub shutter unit 58 is rotated by the second rotation axis (44). 서브 셔터 유닛(58)은 유기물이 제2 회전축(44) 부분에 증착되는 것을 방지하는 쉴드부(59)를 포함한다. Sub-shutter unit 58 includes a shield portion 59 to prevent the organic material is deposited on the second rotation axis (44) portion. 본 실시예에서, 서브 셔터 유닛(58)은 메인 셔터 유닛(56)의 제1 면적보다 작은 제2 면적을 갖는다. In this embodiment, the sub shutter unit 58 has a second smaller area than the first area of ​​the main shutter unit 56.

본 실시예에서, 메인 셔터 유닛(56) 및 서브 셔터 유닛(58)은 서로 다른 높이로 배치되고, 서브 셔터 유닛(58)이 메인 셔터 유닛(56)과 오버랩되도록 회전됨으로써 메인 셔터 유닛(56) 및 서브 셔터 유닛(56)의 사이에는 개구가 형성되고, 서브 셔터 유닛(56)의 회전 각도에 대응하여 개구 면적이 변경됨으로써 기판(1)에 형성되는 유기막(2)의 두께를 정밀하게 제어할 수 있다. In this embodiment, the main shutter unit 56 and the sub-shutter unit 58 are each arranged in different heights, the sub shutter unit 58 is rotated whereby the main shutter unit 56 to overlap with the main shutter unit 56 and there is an opening is formed, the opening area changed correspondingly to the rotational angle of the sub shutter unit 56 being precisely the thickness of the organic film 2 formed on substrate 1, the control between the sub shutter unit 56 can do.

이상에서 상세하게 설명한 바에 의하면, 회전축에 결합되어 증발된 유기물의 증착량을 조절하는 메인 셔터 유닛 및 서브 셔터 유닛에 편심 결합된 회전축에 의하여 메인 셔터 유닛 및 서브 셔터 유닛의 처짐을 방지하여 유기막의 품질을 보다 향상시키는 효과를 갖는다. From what specifically described above, and coupled to the rotating shaft prevents the deflection of the main shutter unit and a sub shutter unit by an eccentric coupled to the main shutter unit and a sub shutter unit for controlling the deposition amount of the vaporized organic material rotating shaft quality organic film to have the effect of further improved.

앞서 설명한 본 발명의 상세한 설명에서는 본 발명의 실시예들을 참조하여 설명하였지만, 해당 기술분야의 숙련된 당업자 또는 해당 기술분야에 통상의 지식을 갖는 자라면 후술될 특허청구범위에 기재된 본 발명의 사상 및 기술 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다. In the description of the invention previously described features of the present invention defined by the claims to be described later has been described with reference to exemplary embodiments of the present invention, Those of ordinary skill in the skilled in the art or the art of the art and without departing from the technical area it will be appreciated that, can make various changes and modifications of the invention within.

Claims (6)

  1. 챔버 몸체; The chamber body;
    상기 챔버 몸체의 내측 바닥면에 배치되며 유기물을 수납하는 증착원; Disposed on the inner bottom surface of the chamber body, and an evaporation source for receiving the organic material;
    상기 챔버 몸체의 상측에 배치되며 상기 증착원으로부터 증발된 상기 유기물이 증착되는 기판을 고정하는 기판 고정 유닛; It is disposed on the upper side of the chamber body substrate holding unit for holding a substrate that is the evaporated the organic material from the evaporation source deposition;
    상기 유기물 수납부재 및 상기 기판 고정 유닛의 사이에 배치되어 상기 기판에 증착되는 상기 유기물의 증착량을 조절하기 위한 셔터 유닛; Said organic material storage member, and is disposed between the substrate holding unit shutter unit for adjusting the deposition rate of the organic material deposited on the substrate; And
    상기 셔터 유닛을 회전시키며 상기 셔터 유닛과 편심 결합된 회전축 어셈블리를 포함하며, Rotate the shutter unit includes a shutter unit and an eccentric coupling a rotating shaft assembly,
    상기 셔터 유닛에는 상기 셔터 유닛의 처짐을 방지하는 처짐 방지부가 형성된 유기막 증착 장치. The shutter unit is provided with deflection organic film vapor deposition apparatus preventing part is formed to prevent the deflection of the shutter unit.
  2. 제1항에 있어서, 상기 서텨 유닛은 제1 면적을 갖고 상기 회전축 어셈블리의 중공축과 결합되는 제1 결합공을 갖는 메인 셔터 유닛 및 상기 회전축 어셈블리의 중공축 내부에 배치된 회전축과 결합되는 제2 결합공을 갖고 상기 제1 면적보다 작은 제2 면적을 갖는 서브 셔터 유닛을 포함하는 것을 특징으로 하는 유기막 증착 장치. The method of claim 1, wherein the seotyeo unit is the coupled with the rotation shaft disposed within the hollow shaft of the main shutter unit and the rotary shaft assembly having a first coupling hole has a first area coupled with the hollow shaft of the rotary shaft assembly 2 an organic film vapor deposition apparatus comprising a shutter sub-unit has a coupling hole having a second area larger than the first area.
  3. 제2항에 있어서, 상기 메인 셔터 유닛은 셔터판 및 셔터판에 부착된 L 자형 프레임을 포함하는 것을 특징으로 하는 유기막 증착 장치. The method of claim 2, wherein said main shutter unit is an organic film vapor deposition apparatus characterized in that it comprises an L-shaped frame attached to the shutter plate and the shutter plate.
  4. 제3항에 있어서, 상기 처짐 방지부는 상기 제1 결합공으로부터 돌출되며 상기 회전축에 끼워지는 부싱 및 상기 부싱으로부터 상기 L자형 프레임으로 연장된 처짐 방지편을 포함하는 것을 특징으로 하는 유기막 증착 장치. The method of claim 3, wherein the deflection preventing portion of the first coupling protrudes from the ball and the organic film vapor deposition apparatus characterized in that it includes a deflection preventing member extending in the L-shaped frame from the bushing and the bushing is fitted on the rotating shaft.
  5. 제2항에 있어서, 상기 서브 셔터 유닛은 상기 제2 결합공 주변에 형성되어 유기물이 증착되는 것을 방지하는 쉴드를 포함하는 것을 특징으로 하는 유기막 증착 장치. The method of claim 2, wherein said sub-shutter unit is an organic film vapor deposition apparatus characterized in that it comprises a shield to prevent the organic material is deposited is formed in the periphery of the second fitting hole.
  6. 제3 항에 있어서, 상기 L자형 프레임의 측면은 상기 메인 셔터 유닛의 처짐을 방지하기 위해 절곡된 것을 특징으로 하는 유기막 증착 장치. 4. The method of claim 3 wherein the L-shaped side surface of the frame is an organic film vapor deposition apparatus characterized in that the bending in order to prevent deflection of the main shutter unit.
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