KR20080054327A - 발광 다이오드용 패키지 및 그 제조 방법, 및 발광다이오드 - Google Patents
발광 다이오드용 패키지 및 그 제조 방법, 및 발광다이오드 Download PDFInfo
- Publication number
- KR20080054327A KR20080054327A KR20070035583A KR20070035583A KR20080054327A KR 20080054327 A KR20080054327 A KR 20080054327A KR 20070035583 A KR20070035583 A KR 20070035583A KR 20070035583 A KR20070035583 A KR 20070035583A KR 20080054327 A KR20080054327 A KR 20080054327A
- Authority
- KR
- South Korea
- Prior art keywords
- emitting diode
- light emitting
- sheet
- package
- layer
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006334700 | 2006-12-12 | ||
JPJP-P-2006-00334700 | 2006-12-12 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080105252A Division KR101304748B1 (ko) | 2006-12-12 | 2008-10-27 | 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20080054327A true KR20080054327A (ko) | 2008-06-17 |
Family
ID=39699970
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20070035583A KR20080054327A (ko) | 2006-12-12 | 2007-04-11 | 발광 다이오드용 패키지 및 그 제조 방법, 및 발광다이오드 |
KR1020080105252A KR101304748B1 (ko) | 2006-12-12 | 2008-10-27 | 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080105252A KR101304748B1 (ko) | 2006-12-12 | 2008-10-27 | 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5130015B2 (ja) |
KR (2) | KR20080054327A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100820516B1 (ko) | 2006-12-22 | 2008-04-07 | 엘지이노텍 주식회사 | 라이트 유닛 및 이를 갖는 액정 표시 장치 |
JP2010109119A (ja) * | 2008-10-30 | 2010-05-13 | Sanyo Electric Co Ltd | 発光モジュール及びその製造方法 |
KR101014063B1 (ko) * | 2009-08-26 | 2011-02-10 | 엘지이노텍 주식회사 | 발광 소자 및 이를 이용한 라이트 유닛 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10229221A (ja) * | 1997-02-17 | 1998-08-25 | Kouha:Kk | 発光ダイオード表示装置およびそれを利用した画像表示装置 |
JP2004200207A (ja) * | 2002-12-16 | 2004-07-15 | Matsushita Electric Works Ltd | 発光装置 |
US6809261B1 (en) * | 2003-06-23 | 2004-10-26 | Agilent Technologies, Inc. | Physically compact device package |
KR100613066B1 (ko) * | 2004-07-09 | 2006-08-16 | 서울반도체 주식회사 | 일체형 방열판을 갖는 발광 다이오드 패키지 및 그것을제조하는 방법 |
JP2006253288A (ja) * | 2005-03-09 | 2006-09-21 | Fuji Photo Film Co Ltd | 発光装置及びその製造方法 |
JP2006339224A (ja) * | 2005-05-31 | 2006-12-14 | Tanazawa Hakkosha:Kk | Led用基板およびledパッケージ |
JP3978456B2 (ja) * | 2005-11-02 | 2007-09-19 | 株式会社トリオン | 発光ダイオード実装基板 |
-
2007
- 2007-04-11 KR KR20070035583A patent/KR20080054327A/ko not_active Application Discontinuation
- 2007-10-16 JP JP2007268986A patent/JP5130015B2/ja not_active Expired - Fee Related
-
2008
- 2008-10-27 KR KR1020080105252A patent/KR101304748B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2008172196A (ja) | 2008-07-24 |
KR20080100317A (ko) | 2008-11-17 |
KR101304748B1 (ko) | 2013-09-05 |
JP5130015B2 (ja) | 2013-01-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5175488B2 (ja) | 多層反射面構造を有するledパッケージ | |
KR100764432B1 (ko) | 아노다이징 절연 층을 갖는 엘이디 패키지 및 그 제조방법 | |
US7391153B2 (en) | Light emitting device provided with a submount assembly for improved thermal dissipation | |
JP4989614B2 (ja) | 高出力ledパッケージの製造方法 | |
JP4279388B2 (ja) | 光半導体装置及びその形成方法 | |
US8044423B2 (en) | Light emitting device package | |
KR101400271B1 (ko) | 광디바이스 제조 방법 및 이에 의해 제조된 광디바이스 | |
WO2007126074A1 (ja) | 半導体発光モジュール、装置、およびその製造方法 | |
JP2008244165A (ja) | 照明装置 | |
KR20090072941A (ko) | 고출력 led 패키지 및 그 제조방법 | |
JP6348660B2 (ja) | オプトエレクトロニクス半導体部品およびオプトエレクトロニクス半導体部品の製造方法 | |
KR101253247B1 (ko) | 광 디바이스용 기판 | |
JP2008270327A (ja) | 静電気対策部品およびこれを用いた発光ダイオードモジュール | |
KR101304748B1 (ko) | 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법 | |
KR101329194B1 (ko) | 광 모듈 및 그 제조 방법 | |
JP2002280613A (ja) | 照明装置の製造方法及び部材 | |
JP2012049486A (ja) | Ledパッケージとその製造方法、及び該ledパッケージを用いて構成したledモジュール装置とその製造方法 | |
JP4976895B2 (ja) | 発光装置 | |
JP4593974B2 (ja) | 発光装置および照明装置 | |
JP2008227137A (ja) | 静電気対策部品およびこれを用いた発光ダイオードモジュール | |
US20160155727A1 (en) | Light emitting diode device and light emitting device using the same | |
JP2004327564A (ja) | 発光素子収納用パッケージおよび発光装置 | |
KR100989902B1 (ko) | 반도체 패키지와 이의 제조방법 | |
JP2006324283A (ja) | 発光素子収納用パッケージ | |
JP2003060240A (ja) | 発光ダイオード及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application | ||
A107 | Divisional application of patent | ||
J201 | Request for trial against refusal decision | ||
WITB | Request for withdrawal (abandonment) before grant | ||
J121 | Written withdrawal of request for trial |