KR20080054327A - 발광 다이오드용 패키지 및 그 제조 방법, 및 발광다이오드 - Google Patents

발광 다이오드용 패키지 및 그 제조 방법, 및 발광다이오드 Download PDF

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Publication number
KR20080054327A
KR20080054327A KR20070035583A KR20070035583A KR20080054327A KR 20080054327 A KR20080054327 A KR 20080054327A KR 20070035583 A KR20070035583 A KR 20070035583A KR 20070035583 A KR20070035583 A KR 20070035583A KR 20080054327 A KR20080054327 A KR 20080054327A
Authority
KR
South Korea
Prior art keywords
emitting diode
light emitting
sheet
package
layer
Prior art date
Application number
KR20070035583A
Other languages
English (en)
Korean (ko)
Inventor
가즈마 미츠야마
이츠키 야마모토
고우지 구도우
히로유키 후카에
시게오 후쿠모토
겐고 니시야마
Original Assignee
교리츠 엘렉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교리츠 엘렉스 가부시키가이샤 filed Critical 교리츠 엘렉스 가부시키가이샤
Publication of KR20080054327A publication Critical patent/KR20080054327A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

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  • Led Device Packages (AREA)
KR20070035583A 2006-12-12 2007-04-11 발광 다이오드용 패키지 및 그 제조 방법, 및 발광다이오드 KR20080054327A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006334700 2006-12-12
JPJP-P-2006-00334700 2006-12-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020080105252A Division KR101304748B1 (ko) 2006-12-12 2008-10-27 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법

Publications (1)

Publication Number Publication Date
KR20080054327A true KR20080054327A (ko) 2008-06-17

Family

ID=39699970

Family Applications (2)

Application Number Title Priority Date Filing Date
KR20070035583A KR20080054327A (ko) 2006-12-12 2007-04-11 발광 다이오드용 패키지 및 그 제조 방법, 및 발광다이오드
KR1020080105252A KR101304748B1 (ko) 2006-12-12 2008-10-27 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020080105252A KR101304748B1 (ko) 2006-12-12 2008-10-27 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법

Country Status (2)

Country Link
JP (1) JP5130015B2 (ja)
KR (2) KR20080054327A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100820516B1 (ko) 2006-12-22 2008-04-07 엘지이노텍 주식회사 라이트 유닛 및 이를 갖는 액정 표시 장치
JP2010109119A (ja) * 2008-10-30 2010-05-13 Sanyo Electric Co Ltd 発光モジュール及びその製造方法
KR101014063B1 (ko) * 2009-08-26 2011-02-10 엘지이노텍 주식회사 발광 소자 및 이를 이용한 라이트 유닛

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10229221A (ja) * 1997-02-17 1998-08-25 Kouha:Kk 発光ダイオード表示装置およびそれを利用した画像表示装置
JP2004200207A (ja) * 2002-12-16 2004-07-15 Matsushita Electric Works Ltd 発光装置
US6809261B1 (en) * 2003-06-23 2004-10-26 Agilent Technologies, Inc. Physically compact device package
KR100613066B1 (ko) * 2004-07-09 2006-08-16 서울반도체 주식회사 일체형 방열판을 갖는 발광 다이오드 패키지 및 그것을제조하는 방법
JP2006253288A (ja) * 2005-03-09 2006-09-21 Fuji Photo Film Co Ltd 発光装置及びその製造方法
JP2006339224A (ja) * 2005-05-31 2006-12-14 Tanazawa Hakkosha:Kk Ｌｅｄ用基板およびｌｅｄパッケージ
JP3978456B2 (ja) * 2005-11-02 2007-09-19 株式会社トリオン 発光ダイオード実装基板

Also Published As

Publication number Publication date
JP2008172196A (ja) 2008-07-24
KR20080100317A (ko) 2008-11-17
KR101304748B1 (ko) 2013-09-05
JP5130015B2 (ja) 2013-01-30

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