KR20080053726A - Led mounting structure - Google Patents

Led mounting structure Download PDF

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Publication number
KR20080053726A
KR20080053726A KR1020060125634A KR20060125634A KR20080053726A KR 20080053726 A KR20080053726 A KR 20080053726A KR 1020060125634 A KR1020060125634 A KR 1020060125634A KR 20060125634 A KR20060125634 A KR 20060125634A KR 20080053726 A KR20080053726 A KR 20080053726A
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South Korea
Prior art keywords
led
conductor
heat
mounting structure
pcb
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KR1020060125634A
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Korean (ko)
Inventor
오영성
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(주) 아토디스플레이
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Priority to KR1020060125634A priority Critical patent/KR20080053726A/en
Publication of KR20080053726A publication Critical patent/KR20080053726A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An LED(Light Emitting Diode) mounting structure is provided to rapidly radiate heat by forming the surfaces of a conductor and a heat radiation plate with carbon nanotubes. An LED mounting structure includes an LED(40), a conductor(30), and a PCB(20). The LED emits light. The conductor is positioned on a bottom surface of the LED. The PCB includes an insertion hole(25) into which the conductor is inserted. The conductor radiates heat emitted from the LED by being in contact with the bottom surface of the LED. A heat radiation plate(10) is mounted on a bottom surface of the PCB. The conductor transmits the heat emitted from the LED to the heat radiation plate by being in contact with the bottom surface of the LED and the heat radiation plate.

Description

투광등의 엘이디 장착구조 { LED MOUNTING STRUCTURE }LED mounting structure of floodlight {LED MOUNTING STRUCTURE}

도 1은 종래의 LED 장착구조를 도시한 사시도,1 is a perspective view showing a conventional LED mounting structure,

도 2는 종래의 다른 LED 장착구조를 도시한 사시도,Figure 2 is a perspective view showing another conventional LED mounting structure,

도 3은 본 발명의 실시예에 따른 투광등의 엘이디 장착구조의 사시도,Figure 3 is a perspective view of the LED mounting structure of the floodlight according to the embodiment of the present invention,

도 4는 본 발명의 실시예에 따른 투광등의 엘이디 장착구조의 분리도,4 is an exploded view of the LED mounting structure of the floodlight according to the embodiment of the present invention;

도 5는 본 발명의 실시예에 따른 컨덕터 일체형 LED의 정면도,5 is a front view of a conductor integrated LED according to an embodiment of the present invention,

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10 : 방열판, 20 : PCB,10: heat sink, 20: PCB,

25 : 삽입공, 30 : 컨덕터,25: insertion hole, 30: conductor,

40 : LED, 45 : 접지선40: LED, 45: ground wire

본 발명은 투광등의 엘이디 장착구조에 관한 것으로서, 특히 LED에서 발생하는 열을 방열시키기 위한 투광등의 엘이디 장착구조에 관한 것이다.The present invention relates to an LED mounting structure of a floodlight, and more particularly, to an LED mounting structure of a floodlight for dissipating heat generated from an LED.

LED(Light Emitting Diode)는 발광다이오드라고 하는 것으로써, 반도체의 p-n 접합구조를 이용하여 주입된 소수캐리어(전자 또는 양공)를 만들어내고, 이들의 재결합(再結合)에 의하여 발광시키는 것이다.Light emitting diodes (LEDs) are called light emitting diodes, which generate a small number of carriers (electrons or holes) injected using a p-n junction structure of a semiconductor, and emit light by recombination thereof.

LED는 일반 전구 및 형광등보다 전력량을 적게 사용하는바, 최근에는 다양한 용도로 사용되고 있다.LEDs use less power than ordinary light bulbs and fluorescent lamps, and have recently been used for various purposes.

이러한 상기 LED는 빛을 발산하면서 열도 함께 발생하게 되는데, 이때 발생하는 열을 외부로 신속하게 방열함으로서 온도가 상승하지 않도록 하여야 한다.The LED emits light while also generating heat, and at this time, the heat generated must be quickly radiated to the outside to prevent the temperature from rising.

특히, 투광등은 빛을 모아 일정한 방향으로 빛을 비추는 등으로써, 많은 열을 발생하게 된다.In particular, the floodlight generates a lot of heat by collecting light and shining light in a predetermined direction.

한편, 일반 PCB는 절연층에 에폭시 수지를 사용하기 때문에, 상기 LED를 일반 PCB에 장착할 경우 방열이 아닌 단열이 이루어져 온도가 상승하게 되는 문제점이 있다.On the other hand, since the general PCB uses an epoxy resin for the insulating layer, when the LED is mounted on the general PCB, there is a problem in that the temperature is increased due to heat insulation instead of heat radiation.

따라서, 최근에는 LED에서 발생하는 열을 신속하게 외부로 방열시키기 위한 다양한 방열판을 사용하고 있다.Therefore, recently, various heat sinks have been used for quickly radiating heat generated from LEDs to the outside.

도 1은 종래의 LED 장착구조를 도시한 사시도이다.1 is a perspective view showing a conventional LED mounting structure.

도 1에 도시된 바와 같이, LED(1)를 MPCB(Metal PCB, 2)에 장착하여 방열시키고 있다.As shown in FIG. 1, the LED 1 is mounted on an MPCB (Metal PCB) 2 to radiate heat.

상기 LED(1)는 양측에 접지선에 형성된 일반형 LED(LED EMITTER)이다.The LED 1 is a general type LED (LED emitter) formed on both sides of the ground line.

MPCB(2)는 일반 PCB와는 달리 절연층에 전기가 흐르지 않는 금속을 이용하여 방열효과를 증대시키고 있다.MPCB (2) increases the heat dissipation effect by using a metal that does not flow electricity to the insulating layer, unlike the general PCB.

이러한 MPCB(2)에 LED(1)를 조립하는 방법은 MPCB(2)에 LED(1)를 부착하고 납땜을 함으로서 이루어진다.The method of assembling the LED 1 to the MPCB 2 is achieved by attaching the LED 1 to the MPCB 2 and soldering it.

상기 MPCB(2)를 사용할 경우 방열 특성이 우수하고, 제품이 깨끗하며, 자동 삽입이 가능한 반면에, MPCB(2)의 단가 비중이 높다는 단점을 가지고 있다.The use of the MPCB (2) has the disadvantage that the heat dissipation characteristics are excellent, the product is clean, automatic insertion is possible, while the unit cost ratio of the MPCB (2) is high.

도 2는 종래의 다른 LED 장착구조를 도시한 사시도이다.2 is a perspective view showing another conventional LED mounting structure.

도 2에 도시된 바와 같이, 알루미늄재질의 방열판(4)에 방열 부착형 LED(LED STAR, 3)를 장착하고, 각각의 방열 부착형 LED(3)를 전선(5)을 이용하여 연결하고 있다.As shown in FIG. 2, a heat dissipation type LED (LED STAR) 3 is mounted on an aluminum heat sink 4, and each heat dissipation type LED 3 is connected using an electric wire 5. .

이러한 구조에서는 방열 부착형 LED(3)의 배열 모양에 관여치 않고 배열할 수 있고, 정전기에 의한 피해를 줄일 수 있으며, 손쉽게 제품을 제작할 수 있는 장점이 있는데 반해, 방열 부착형 LED(3)의 가격이 비싸고, 샘플제작은 가능하나 대량 생산에는 어려움이 있는 등의 단점이 있다.In such a structure, the heat dissipation-type LED 3 can be arranged without involving the shape of the heat dissipation-type LED 3, and the damage caused by static electricity can be reduced and the product can be easily manufactured. There are disadvantages such as high price and sample production but difficulty in mass production.

본 발명은 전술한 문제점을 해결하기 위하여 안출된 것으로서, 저렴한 일반 LED를 일반 PCB에 장착하여 비용을 최소화하면서 동시에 방열 기능도 가지고 있는 투광등의 엘이디 장착구조를 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an LED mounting structure of a floodlight having a heat dissipation function while minimizing cost by mounting an inexpensive general LED on a general PCB.

상기 목적을 달성하기 위하여 본 발명의 투광등의 엘이디 장착구조는, 투광등에 장착되는 LED 장착구조에 있어서, 빛을 발산하는 LED와; 상기 LED의 저면에 배치되는 컨덕터와; 상기 컨덕터가 삽입되는 삽입공이 형성된 PCB로 이루어지되, 상기 컨덕터는 상기 LED의 저면에 접하여 LED에서 발생하는 열을 방열하는 것을 특징으로 한다.In order to achieve the above object, the LED mounting structure of the floodlight of the present invention, the LED mounting structure mounted on the floodlight, the LED emitting light; A conductor disposed on a bottom surface of the LED; The conductor is formed of a PCB formed with an insertion hole is inserted, the conductor is characterized in that the heat radiating heat generated from the LED in contact with the bottom of the LED.

상기 PCB의 저면에 장착되는 방열판을 더 포함하여 이루어지되, 상기 컨덕터는 상기 LED의 저면과 방열판에 접하여 LED에서 발생하는 열을 상기 방열판으로 이동시키도록 한다.It further comprises a heat sink mounted on the bottom of the PCB, the conductor is in contact with the bottom and the heat sink of the LED to move the heat generated from the LED to the heat sink.

상기 컨덕터는 상기 LED의 저면에 일체로 형성될 수 있다.The conductor may be integrally formed on the bottom of the LED.

또한, 상기 컨덕터 및/또는 방열판의 표면은 탄소나노튜브로 이루어짐이 바람직하다.In addition, the surface of the conductor and / or the heat sink is preferably made of carbon nanotubes.

이하에서는 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 대하여 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

도 3은 본 발명의 실시예에 따른 투광등의 엘이디 장착구조의 사시도이고, 도 4는 본 발명의 실시예에 따른 투광등의 엘이디 장착구조의 분리도이며, 도 5는 본 발명의 실시예에 따른 컨덕터 일체형 LED의 정면도이다.Figure 3 is a perspective view of the LED mounting structure of a floodlight according to an embodiment of the present invention, Figure 4 is an exploded view of the LED mounting structure of a floodlight according to an embodiment of the present invention, Figure 5 is in accordance with an embodiment of the present invention Front view of a conductor integrated LED.

도 3(a)는 각 구성요소가 분리된 상태를 도시한 것이고, 도 3(b)는 각 구성요소를 결합한 상태를 도시한 것이다.3 (a) shows a state in which each component is separated, and FIG. 3 (b) shows a state in which each component is combined.

도 3 및 도 4에 도시된 바와 같이, 본 발명의 투광등의 엘이디 장착구조는 일반형 LED(40)와, 컨덕터(conductor, 30)와, PCB(20)와, 방열판(10)으로 이루어진다.3 and 4, the LED mounting structure of the floodlight of the present invention is composed of a general type LED 40, a conductor (30), a PCB (20), and a heat sink (10).

상기 일반형 LED(40)는 LED EMITTER이라고 불리는 것으로서, 양측에 접지선(45)이 돌출되어 있다.The general type LED 40 is called an LED emitter, and ground lines 45 protrude from both sides.

상기 LED(40)는 빛을 발산하는 것으로서, 상기 접지선(45)이 상기 PCB(20)에 장착되어 상기 PCB(20)로부터 공급되는 전원이 상기 접지선(45)을 따라 유입되어 상기 LED(40)가 빛을 발산하게 된다.The LED 40 emits light, and the ground wire 45 is mounted to the PCB 20 so that power supplied from the PCB 20 flows along the ground wire 45 to allow the LED 40 to flow. Will emit light.

상기 컨덕터(30)는 상기 LED(40)의 저면에 배치되어 상기 방열판(10)이 장착되지 않은 경우에는 상기 LED(40)에서 발생하는 열을 직접 방열하고, 상기 방열판(10)이 장착된 경우에는 상기 방열판(10)으로 이동시키기 위한 매개체 역할을 하는 것으로서, 상기 LED(40)의 단면형상과 상기 컨덕터(30)의 단면 형상은 상호 동일하게 함이 바람직하다.When the conductor 30 is disposed on the bottom surface of the LED 40 and the heat sink 10 is not mounted, the conductor 30 directly radiates heat generated from the LED 40, and when the heat sink 10 is mounted. There is a role as a medium for moving to the heat sink 10, the cross-sectional shape of the LED 40 and the cross-sectional shape of the conductor 30 is preferably equal to each other.

상기 컨덕터(30)는 도 4에 도시된 바와 같이 상기 LED(40)와 별개로 제작되어 후에 결합시킬 수도 있고, 도 5에 도시된 바와 같이 상기 LED(40)의 저면에 일체로 형성할 수도 있다.The conductor 30 may be manufactured separately from the LED 40 as shown in FIG. 4 and later coupled thereto, or may be integrally formed on the bottom surface of the LED 40 as shown in FIG. 5. .

이때, 상기 컨덕터(30)의 두께는 후술하는 바와 같이 상기 PCB(20)의 두께와 동일하거나 크게 형성함이 바람직하다.At this time, the thickness of the conductor 30 is preferably formed to be equal to or larger than the thickness of the PCB 20, as will be described later.

상기 컨덕터(30)는 열전도율이 좋은 재질 즉 백금, 은, 동, 알루미늄 등으로 이루어지도록 한다.The conductor 30 is made of a material having good thermal conductivity, that is, platinum, silver, copper, aluminum, and the like.

상기 PCB(20)는 절연층이 에폭시 수지를 사용하는 일반 PCB(FR-4)로서, 상기 LED(40)에 전원을 공급하는 역할을 한다.The PCB 20 is a general PCB (FR-4) in which the insulating layer uses an epoxy resin, and serves to supply power to the LED 40.

상기 PCB(20)에는 상기 컨덕터(30)가 삽입되기 위한 삽입공(25)이 형성되어 있다.The PCB 20 has an insertion hole 25 for inserting the conductor 30.

상기 삽입공(25)의 형상은 상기 컨덕터(30)의 단면 형상과 동일하게 형성함이 바람직하다.The shape of the insertion hole 25 is preferably formed to be the same as the cross-sectional shape of the conductor 30.

상기 컨덕터(30)의 두께를 상기 PCB(20)의 두께와 같거나 약간 더 크게 형성함으로서, 상기 LED(40)에서 발생하는 열이 상기 방열판(10)으로 쉽게 이동되도록 할 수 있다.By forming the thickness of the conductor 30 to be equal to or slightly larger than the thickness of the PCB 20, the heat generated from the LED 40 can be easily transferred to the heat sink 10.

상기 방열판(10)은 상기 PCB(20)의 저면에 장착되어 상기 컨덕터(30)에 의해 이동되는 열과 상기 PCB(20)의 열을 외부로 방열하는 기능을 수행한다.The heat sink 10 is mounted on the bottom surface of the PCB 20 and performs a function of dissipating heat transferred by the conductor 30 and heat of the PCB 20 to the outside.

상기 방열판(10)은 알루미늄 재질로 이루어지고, 상기 방열판(10)은 상기 컨덕터(30) 및 PCB(20)의 저면과 접촉하고 있도록 하여 방열의 효과를 더욱 향상시키도록 하다.The heat sink 10 is made of aluminum, the heat sink 10 is in contact with the bottom surface of the conductor 30 and the PCB 20 to further improve the effect of heat dissipation.

더욱 바람직하게는 상기 컨덕터(30) 및/또는 방열판(10)의 표면을 탄소나노튜브(Carbon nanotube, CNT)로 이루어짐이 바람직하다.More preferably, the surface of the conductor 30 and / or the heat sink 10 is made of carbon nanotubes (CNTs).

상기 컨덕터(30) 및/또는 방열판(10)의 표면을 탄소나노튜브 공정을 통해 제작함으로서, 방열 면적을 확대할 수 있는 바 보다 신속하게 열을 방출할 수 있고, 별도의 방열기가 필요 없게 되는 효과가 있다.By manufacturing the surface of the conductor 30 and / or the heat sink 10 through a carbon nanotube process, the heat dissipation area can be expanded more quickly than the bar can be released, the effect that no separate radiator is required There is.

이러한 구조의 본 발명은, 일반 PCB(20)와 일반 LED(40)를 사용하기 때문에 비용을 저렴하게 할 수 있고, 조립 공수를 줄일 수 있다.According to the present invention having such a structure, since the general PCB 20 and the general LED 40 are used, the cost can be reduced, and the number of assembly operations can be reduced.

본 발명의 전체적인 작동과정은 아래와 같다.The overall operation of the present invention is as follows.

상기 PCB(20)를 통해 공급되는 전기는, 상기 LED(40)의 접지선(45)을 통해 상기 LED(40)에 전달되고, 상기 LED(40)에서는 전기에 의해 빛과 열을 발산하게 된다.The electricity supplied through the PCB 20 is transmitted to the LED 40 through the ground line 45 of the LED 40, and the LED 40 emits light and heat by electricity.

상기 LED(40)에서 발생된 열은 상기 컨덕터(30)를 거쳐 상기 방열판(10)으로 이동하여 외부로 방열되게 된다.The heat generated by the LED 40 is moved to the heat sink 10 through the conductor 30 to radiate heat to the outside.

이때, 상기 PCB(20)의 삽입공(25)에 상기 컨덕터(30)가 삽입되어 있기 때문에, 상기 컨덕터(30)의 외주면과 접하고 있는 상기 PCB(20)에 열이 유입될 수 있는데, 그 양이 매우 작고 또한 상기 PCB(20)에 유입된 열은 상기 방열판(10)을 통해 곧바로 외부로 방열되게 되는바, 상기 LED(40)에서 발생된 열은 거의 상기 방열판(10)을 통해 신속하게 외부로 방열되게 된다.At this time, since the conductor 30 is inserted into the insertion hole 25 of the PCB 20, heat may flow into the PCB 20 which is in contact with the outer circumferential surface of the conductor 30. This very small and the heat introduced into the PCB 20 is immediately radiated to the outside through the heat sink 10, the heat generated from the LED 40 is almost external quickly through the heat sink 10 Heat dissipation

따라서, 에폭시 수지로 이루어진 상기 PCB(20)에 열이 유입되어 단열 효과를 증대시키는 것을 방지할 수 있다.Therefore, heat may be prevented from being introduced into the PCB 20 made of an epoxy resin to increase an insulation effect.

본 발명인 투광등의 엘이디 장착구조는 전술한 실시예에 국한하지 않고, 본 발명의 기술 사상이 허용되는 범위 내에서 다양하게 변형하여 실시할 수 있다.The LED mounting structure of the floodlight of the present invention is not limited to the above-described embodiment, and may be variously modified and implemented within the range in which the technical idea of the present invention is permitted.

이상에서 설명한 바와 같은 본 발명의 투광등의 엘이디 장착구조에 따르면 다음과 같은 효과가 있다.According to the LED mounting structure of the floodlight of the present invention as described above has the following effects.

첫째, LED에서 발생하는 열을 방열판으로 이동시켜주는 컨덕터를 이용함으로서, 일반 PCB에 LED를 장착하여 방열을 효과를 얻으면서 동시에 저렴한 비용으로 제작할 수 있다.First, by using the conductor to move the heat generated from the LED to the heat sink, it can be manufactured at a low cost at the same time to obtain the heat dissipation effect by mounting the LED on the general PCB.

둘째, 컨덕터를 LED와 일체로 형성함으로서, 조립공정을 보다 단순화시킬 수 있다.Second, by forming the conductor integrally with the LED, it is possible to simplify the assembly process.

셋째, 컨덕터 및/또는 방열판의 표면을 탄소나노튜브로 이루어지도록 함으로써, 방열 면적을 확대할 수 있는바, 보다 신속하게 열을 방출할 수 있고 별도의 방 열기가 필요없게 되는 효과가 있다.Third, by making the surface of the conductor and / or the heat sink made of carbon nanotubes, the heat dissipation area can be expanded, the heat can be released more quickly and there is no need for a separate heat release.

Claims (5)

투광등에 장착되는 LED 장착구조에 있어서,In the LED mounting structure mounted to the floodlight, 빛을 발산하는 LED와;LED emitting light; 상기 LED의 저면에 배치되는 컨덕터와;A conductor disposed on a bottom surface of the LED; 상기 컨덕터가 삽입되는 삽입공이 형성된 PCB로 이루어지되,Wherein the conductor is made of a PCB formed insertion hole is inserted, 상기 컨덕터는 상기 LED의 저면에 접하여 LED에서 발생하는 열을 방열하는 것을 특징으로 하는 투광등의 엘이디 장착구조.The conductor is LED mounting structure of the floodlight, characterized in that the heat radiating heat generated from the LED in contact with the bottom surface of the LED. 제 1항에 있어서,The method of claim 1, 상기 PCB의 저면에 장착되는 방열판을 더 포함하여 이루어지되,It further comprises a heat sink mounted on the bottom of the PCB, 상기 컨덕터는 상기 LED의 저면과 방열판에 접하여 LED에서 발생하는 열을 상기 방열판으로 이동시키는 것을 특징으로 하는 투광등의 엘이디 장착구조.The conductor is LED mounting structure of the floodlight, characterized in that for moving the heat generated from the LED to the heat sink in contact with the bottom surface and the heat sink. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2, 상기 컨덕터는 상기 LED의 저면에 일체로 형성된 것을 특징으로 하는 투광등의 엘이디 장착구조.The conductor is LED mounting structure of the floodlight, characterized in that formed integrally on the bottom of the LED. 제 1항에 있어서,The method of claim 1, 상기 컨덕터의 표면은 탄소나노튜브로 이루어진 것을 특징으로 하는 투광등 의 엘이디 장착구조.LED structure of the floodlight, characterized in that the surface of the conductor is made of carbon nanotubes. 제 2항에 있어서,The method of claim 2, 상기 방열판의 표면은 탄소나노튜브로 이루어진 것을 특징으로 하는 투광등의 엘이디 장착구조.LED mounting structure, such as a surface of the heat sink is made of carbon nanotubes.
KR1020060125634A 2006-12-11 2006-12-11 Led mounting structure KR20080053726A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115727294A (en) * 2023-01-10 2023-03-03 东北农业大学 LED lighting module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115727294A (en) * 2023-01-10 2023-03-03 东北农业大学 LED lighting module

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