KR20060107860A - 엠램을 위한 금속화 구조 및 엠램 어레이 소자 - Google Patents
엠램을 위한 금속화 구조 및 엠램 어레이 소자 Download PDFInfo
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- KR20060107860A KR20060107860A KR1020067019755A KR20067019755A KR20060107860A KR 20060107860 A KR20060107860 A KR 20060107860A KR 1020067019755 A KR1020067019755 A KR 1020067019755A KR 20067019755 A KR20067019755 A KR 20067019755A KR 20060107860 A KR20060107860 A KR 20060107860A
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- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
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- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
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- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
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- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/308—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices lift-off processes, e.g. ion milling, for trimming or patterning
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- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
- H01F41/34—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography
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Abstract
Description
실시예 | 1a | 1b | 2a | 2b | 3 | 4 |
캡(20) | 비정질 탄소 다이아몬드-유사 탄소(DLC) | 비정질 실리콘 | 실리콘 카바이드(BLOKTM AMAT) | DARC(실리콘이 풍부한 옥시질화물) | ||
ILD1(22) | TEOS | Si-N | TEOS | Si-N | TEOS | TEOS |
ILD2(26) | TEOS | Si-N | TEOS | Si-N | TEOS | TEOS |
에칭 저지층(32) (선택) | SiC 또는 Si-N | SiC | SiC 또는 Si-N | SiC | SiC 또는 Si-N | SiC 또는 Si-N |
스페이서 (36) | SiC 또는 Si-N | SiC | SiC 또는 Si-N | SiC | Si-N | --- |
캡(20)을 선택적으로 제거하기 위한 에천트 | 산소 플라즈마 | Cl, HBr, HI, NF3 (할로겐화합물) 플라즈마 | Cl2/NF3 탄소없음 | NF3/Cl2 |
Claims (8)
- 메모리 셀 위에서 T자 형상의 단면을 가지며, 각각의 가장 밑바닥 표면의 적어도 일부는 상기 메모리 셀의 상부표면과 접촉하는 구리선들과,상기 메모리 셀의 주위에 형성되며 상기 메모리 셀보다 높고 상기 구리선들의 측면의 적어도 일부와 접촉하는 절연 스페이서와,상기 절연 스페이서의 적어도 외부 표면을 따라서 상기 절연 스페이서와 접촉하는 절연 재료를 포함하는터널링 자기저항 엠램을 위한 금속화 구조.
- 제1항에 있어서,상기 절연재료는 TEOS(테트라에틸오르토실리케이트)로부터 형성된 실리콘 산화물을 포함하는 터널링 자기저항 엠램을 위한 금속화 구조.
- 제1항에 있어서,상기 메모리 셀 주위에 위치하고, 상기 메모리 셀 보다 키가 크며 상기 구리선들의 측면들의 적어도 일부와 접촉하는 절연 스페이서를 더 포함하는 터널링 자기저항 엠램을 위한 금속화 구조.
- 제3항에 있어서,상기 스페이서는 실리콘 카바이드 및 실리콘 질화물로 구성된 군으로부터 선택된 재료를 포함하는 터널링 자기저항 엠램을 위한 금속화 구조.
- 기판으로부터의 돌출부로서 구성되어 있고 상부표면과 바깥표면을 갖는 자기 메모리 셀과,상기 자기 메모리 셀의 바깥 표면과 접촉하는 부분과, 상기 자기 메모리 셀의 상부 표면 위에서 연장하는 부분을 구비하는, 상기 자기 메모리 셀 주위의 절연 스페이서와,상기 스페이서의 내부 표면 사이에서 상기 자기 메모리 셀의 상부표면과 접촉하는 전극으로서, 상기 스페이서의 상부 표면 위에서 연장하면서 상기 스페이서의 내부 표면에 의해 한정되는 폭 이상으로 넓어지는 상부영역을 갖는 전극을 포함하는 엠램 어레이 소자.
- 제5항에 있어서,상기 자기 메모리 셀은 터널링 자기저항 구조를 포함하는 엠램 어레이 소자.
- 제5항에 있어서,상기 스페이서는 실리콘 카바이드 및 실리콘 질화물로 구성된 군으로부터 선택된 재료를 포함하는 엠램 어레이 소자.
- 제5항에 있어서,상기 전극은 구리 및 알루미늄으로 구성된 군으로부터 선택된 재료를 포함하는 엠램 어레이 소자.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/135,921 US6783995B2 (en) | 2002-04-30 | 2002-04-30 | Protective layers for MRAM devices |
US10/135,921 | 2002-04-30 |
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KR1020047017428A Division KR100692417B1 (ko) | 2002-04-30 | 2003-04-21 | 엠램 장치를 형성하는 방법 |
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KR20060107860A true KR20060107860A (ko) | 2006-10-16 |
KR100755240B1 KR100755240B1 (ko) | 2007-09-04 |
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KR1020067019755A KR100755240B1 (ko) | 2002-04-30 | 2003-04-21 | 엠램을 위한 금속화 구조 및 엠램 어레이 소자 |
KR1020047017428A KR100692417B1 (ko) | 2002-04-30 | 2003-04-21 | 엠램 장치를 형성하는 방법 |
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Country Status (10)
Country | Link |
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US (2) | US6783995B2 (ko) |
EP (2) | EP1793400B1 (ko) |
JP (1) | JP4378631B2 (ko) |
KR (2) | KR100755240B1 (ko) |
CN (1) | CN100338700C (ko) |
AT (1) | ATE363720T1 (ko) |
AU (1) | AU2003239168A1 (ko) |
DE (1) | DE60314129T2 (ko) |
TW (1) | TWI238439B (ko) |
WO (1) | WO2003094182A1 (ko) |
Cited By (1)
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KR20170024486A (ko) * | 2015-08-25 | 2017-03-07 | 삼성전자주식회사 | 자기 소자 및 그 제조 방법 |
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WO2003094182A1 (en) | 2003-11-13 |
EP1500116B1 (en) | 2007-05-30 |
US20030203510A1 (en) | 2003-10-30 |
TWI238439B (en) | 2005-08-21 |
KR100692417B1 (ko) | 2007-03-13 |
ATE363720T1 (de) | 2007-06-15 |
US7211849B2 (en) | 2007-05-01 |
EP1500116A1 (en) | 2005-01-26 |
DE60314129T2 (de) | 2008-01-24 |
US6783995B2 (en) | 2004-08-31 |
TW200405392A (en) | 2004-04-01 |
EP1793400A3 (en) | 2009-09-30 |
JP4378631B2 (ja) | 2009-12-09 |
KR100755240B1 (ko) | 2007-09-04 |
EP1793400B1 (en) | 2014-01-08 |
CN1656580A (zh) | 2005-08-17 |
US20040264240A1 (en) | 2004-12-30 |
KR20050013543A (ko) | 2005-02-04 |
DE60314129D1 (de) | 2007-07-12 |
JP2005524238A (ja) | 2005-08-11 |
AU2003239168A1 (en) | 2003-11-17 |
EP1793400A2 (en) | 2007-06-06 |
CN100338700C (zh) | 2007-09-19 |
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