KR20060040427A - Fabricating method of flat panel display - Google Patents

Fabricating method of flat panel display Download PDF

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KR20060040427A
KR20060040427A KR1020040090021A KR20040090021A KR20060040427A KR 20060040427 A KR20060040427 A KR 20060040427A KR 1020040090021 A KR1020040090021 A KR 1020040090021A KR 20040090021 A KR20040090021 A KR 20040090021A KR 20060040427 A KR20060040427 A KR 20060040427A
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South Korea
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pad
film
display device
flat panel
panel display
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KR1020040090021A
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Korean (ko)
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강태욱
김명섭
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삼성에스디아이 주식회사
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Publication of KR20060040427A publication Critical patent/KR20060040427A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3244Active matrix displays
    • H01L27/3276Wiring lines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3281Passive matrix displays
    • H01L27/3288Wiring lines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

Abstract

본 발명은 평판표시소자의 제조방법에 관한 것으로, 유기전계발광표시소자의 표시부에 박막트랜지스터, 애노드, 적어도 발광층을 포함하는 유기막 및 캐소드를 형성한 후 수분 및 산소 등의 침투를 방지하기 위한 보호막이 형성 시 상기 패드부에 보호막이 증착되는 것을 방지하기 위하여 상기 패드부를 보호하는 패드부 보호 희생막을 미리 부착한 후 보호막을 형성한 다음, 상기 패드부 보호 희생막을 제거함으로써 상기 패드부에 형성된 보호막을 간단한 방법을 제거할 수 있으므로 공정을 단순하게 하고 소자의 공정 수율 및 신뢰성을 향상시킬 수 있는 기술이다. The present invention is a protective film for preventing penetration of moisture and oxygen after forming the organic film, and a cathode containing as the thin film transistor, an anode, at least a light emitting layer on the display unit of the organic light emitting display device according to a manufacturing method of the flat panel display device in order to prevent the protective film is deposited on said pad portion in forming a protective film formed on the pad portion by portion to form a pre-attached to protect the pads protective sacrificial film after the protective film, and remove the pad portion protective sacrificial film above pad It can be removed with a simple way a technique that can simply and improve process yield and reliability of the elements of the process.
패드, 패드부 보호 희생막 Pad, the pad portion sacrificial protective film

Description

평판표시소자의 제조방법{Fabricating method of flat panel display} Method of manufacturing a flat panel display device {Fabricating method of flat panel display}

도 1 은 유기 전계 발광 표시 소자의 단면도. 1 is a cross-sectional view of an organic light emitting display device.

도 2a 내지 도 2c 는 도 1 의 선AA′에 따른 공정 단면도. A sectional view according to Fig. 2a to 2c is the line AA 'of Figure 1;

<도면의 주요 부위에 대한 부호의 설명> <Description of the Related part of the figure>

100 : 절연기판 200 : 표시소자부 100: insulating substrate 200: a display element section

300 : 패드부 400 : 패드부 보호 희생막 300: pad section 400: pad portion sacrificial protective film

500 : 보호막 500: protective layer

본 발명은 평판표시소자의 제조방법에 관한 것으로, 더욱 상세하게는 평판표시소자와 상기 평판표시소자를 구동시키기 위한 드라이버 IC를 전기적으로 연결하는 패드부에 보호막을 제거하는 평판표시소자의 제조방법에 관한 것이다. The present invention is method of manufacturing a flat panel display device for removing a protective film on the pad portion for electrically connecting the driver IC for driving, and more particularly, to a flat panel display device and the flat panel display device as a method of manufacturing a flat panel display device It relates.

일반적으로 사용되고 있는 표시 장치 중 하나인 음극선관(CRT)은 TV를 비롯하여 계측기기, 정보 단말기기 등의 모니터에 주로 이용되고 있으나, CRT 자체의 무게와 크기로 인하여 전자제품의 소형화, 경량화의 요구에 적극 대응할 수 없다. One of the display which is generally used in a device of the cathode ray tube (CRT) is, as well as a TV, but is mainly used to monitor, such as a measuring equipment, information terminal equipment, the miniaturization of electronic equipment due to the weight and size of the CRT itself, the weight requirements We can not respond actively.

이러한 CRT를 대체하기 위해 소형, 경량화의 장점을 가지고 있는 평판 표시 장치가 주목받고 있다. A flat panel display device is attracting attention, which has the advantages of small size, light weight as a replacement for such CRT. 상기 평판 표시 소자에는 LCD(liquid crystal display), OLED(organic light-emitting display) 등이 있다. The flat panel display device has, such as LCD (liquid crystal display), OLED (organic light-emitting display).

이러한 평판 표시 소자는 박막 트랜지스터(thin film transistor, TFT)가 형성되는 TFT 기판과, 적색, 녹색 및 청색의 발광 소자로 구성된다. The flat panel display device is composed of a light-emitting element of the TFT substrate is formed a thin film transistor (thin film transistor, TFT), red, green, and blue.

상기한 바와 같은 평판 표시 소자의 주변에는 외부로부터 신호를 받기 위한 패드부가 구비되어 있다. The periphery of the flat panel display device as described above is provided with additional pads for receiving a signal from the outside. 상기 패드부는 주사전압 또는 신호전압을 발생시키는 드라이버 IC에 연결되어 있으며, 상기 드라이버 IC에 전기적으로 접속하기 위해 이방 전도성 필름(anisotropic conductive film ; ACF)과 같은 도전성 필름에 의한 접착공정을 필요로 한다. The pad unit is connected to the driver IC for generating a scanning voltage or the signal voltage, the anisotropic conductive film to electrically connect the driver IC; and a bonding step with a conductive film, such as the (anisotropic conductive film ACF) as necessary.

일반적으로 패드부는 유기전계발광표시소자의 표시소자부의 주변에 구비되며 상기 표시소자부의 제조공정 시 동시에 형성된다. In general, the pad portion being provided around the display device portion of an organic light emitting display device is formed at the same time in the manufacturing process the display element portion.

상기 패드부를 구성하는 다수 개의 패드전극은 상기 표시소자부의 박막트랜지스터영역에 소오스/드레인전극 형성 시 동시에 형성된다. A plurality of pad electrodes constituting the pad portion is formed simultaneously when forming the source / drain electrodes in thin film transistor region of said display device. 상기 표시소자부의 애노드, 적어도 발광층을 포함하는 유기막 및 캐소드를 형성한 후 상기 표시소자부를 수분 및 산소 등으로부터 보호하기 위한 보호막을 형성한다. The display element anode portion, after forming the organic layer and the cathode including at least a light emitting layer to form a protective film for protecting from the display element unit, such as moisture and oxygen. 이때, 상기 패드부에도 보호막이 형성된다. At this time, the protective film is also formed on the pad portion.

그 후, 상기 패드부를 드라이버 IC에 전기적으로 연결하기 위하여 절연막인 상기 보호막을 제거하여야한다. Then, the protective film must be removed in the insulating layer to electrically connect to the pad parts of the driver IC. 이때, 상기 패드부에 형성된 보호막을 제거하기 위하여 상기 패드부 주변에 홀(hole) 등을 형성한 후 상기 유기전계발광표시소자를 습식박리장치에 넣어 상기 패드부 상의 보호막을 제거하였다. In this case, after forming the holes (hole) and so on around the pad section to remove the protective film formed on the pad part to put the organic light emitting display device in liquid separation apparatus to remove the protective film on the pad portion.

그러나, 상기와 같이 유기전계발광표시소자를 습식박리장치에 넣어 보호막을 제거하는 경우 상기 표시소자부에 수분 등이 침투하여 소자의 신뢰성 및 수율을 저하시킬 수 있는 문제점이 있다. However, there is a problem that can degrade the reliability and yield of the device by the moisture penetrating in the display element portion when removing the protective film into an organic light emitting display device in liquid separation apparatus as described above.

본 발명의 목적은 상기한 종래 기술의 문제점을 해결하기 위한 것으로, 보호막을 형성하기 전 패드부에 패드부 보호 희생막을 부착시키고 보호막을 제거한 다음 상기 패드부 보호 희생막을 제거함으로써 공정을 단순하게 하고 패드부로부터 불순물이 침투하여 표시소자부의 특성 및 신뢰성을 저하시키는 것을 방지할 수 있는 평판표시소자의 제조방법을 제공하는데 그 목적이 있다. An object of the present invention is to simplify the process by eliminating as to solve the problems of the prior art, the attachment film protective pads sacrifice the entire pad portion to form a protective film and removing the protective film, and then the pad portion protective sacrificial film pad to the penetration of impurities from the portion to provide a method of manufacturing a flat panel display device capable of preventing lowering the display device characteristic and reliability, it is an object portion.

상기한 목적을 달성하기 위한 본 발명에 따른 평판표시소자의 제조방법은, Method of manufacturing a flat panel display device according to the present invention for achieving the above object,

제1전극, 적어도 발광층을 포함하는 유기막 및 제2전극을 포함하는 표시소자부 및 상기 표시소자부와 전기적으로 연결되는 다수 개의 패드전극을 포함하는 패드부를 형성하는 공정과, A first electrode, at least a step of forming a pad including a plurality of electrode pad portions and the display element is electrically connected to the display element unit including an organic film and a second electrode including a light emitting layer and,

상기 패드부 상부 및 측면에 패드부 보호 희생막을 형성하는 공정과, A step of forming a unit and the upper surface of the sacrificial film pad protection pad portion,

상기 패드부 보호 희생막을 포함하는 전체표면 상부에 보호막을 형성하는 공정과, A step of forming a protective film on the whole upper surface portion including the sacrifice protection film the pad,

상기 패드부 보호 희생막을 제거하여 상기 패드부를 노출시키는 공정을 포함하고, By removing the sacrificial film protects the pad portion includes the step of exposing parts of the pad,

상기 패드부 보호 희생막은 상기 보호막 두께보다 2배 이상 두껍게 형성하는 것과, With forming the thick pad portion sacrificial protective film is more than twice the thickness of the protective film,

상기 패드부 보호 희생막은 접착필름인 것을 특징으로 한다. It characterized in that the film is an adhesive film portion protecting the sacrificial pad.

이하 첨부된 도면을 참조하여, 본 발명의 실시예를 설명한다. Reference to the accompanying drawings, a description will be given of an embodiment of the present invention.

도 1 은 유기 전계 발광 표시 소자의 단면도로서, 투명절연기판(100) 상에 유기전계발광표시소자의 표시소자부(200)가 형성되어 있고, 상기 표시소자부(200)와 연결되는 외부 회로 모듈을 포함하는 패드부(300)가 형성되어 있다. 1 is a cross-sectional view of an organic electro-luminescence display device, the transparent insulation and the display element unit 200 of the organic light emitting display devices on a substrate 100 is formed, the module an external circuit connected to the display device 200 a pad portion 300 including a is formed. 상기 표시소자부(200)는 애노드(도시안됨), 적어도 발광층을 포함하는 유기막(도시안됨) 및 캐소드(도시안됨)을 포함하고, 상기 패드부(300)는 상기 표시소자부(200)에 연결되는 다수 개의 패드전극(도시안됨)을 포함한다. The display element 200 includes an anode (not shown), and comprises at least (not shown), an organic layer (not shown) and the cathode comprises a light-emitting layer, wherein the pad portion 300 to the display device 200 It includes a plurality of pads connected to electrodes (not shown). 이때, 상기 표시소자부(200)는 상기 애노드와 전기적으로 연결되는 박막트랜지스터를 더욱 포함할 수도 있다. In this case, the display device 200 may further comprise a thin film transistor is connected to said anode and electrically.

도 2a 내지 도 2c 는 도 1 의 선AA′에 따른 공정 단면도이다. Figures 2a to 2c are sectional views along the line AA 'of Figure 1;

우선, 상기 패드부(300)는 표시소자부(200)와 동시에 제조되며, 이하에서는 주로 패드부의 제조방법에 대하여 설명한다. First, the pad part 300 is manufactured simultaneously with the display device 200, the following description will mainly be described with respect to the pad portions producing method.

절연기판(100) 상부의 상기 패드부(300) 상부에 패드부 보호 희생막(400)을 형성한다. An insulating substrate 100, the pads protect the upper part of the pad portion 300 of the upper portion to form a sacrificial layer 400. The 이때, 상기 패드부 보호 희생막(400)은 접착필름이며 후속 공정으로 형성되는 보호막(500)의 두께보다 두껍게 형성되어야 한다. In this case, the pad portion sacrificial protection film 400 is an adhesive film to be formed thicker than the thickness of the protective film 500 is formed in a subsequent process. 바람직하게는 보호막(500)의 두께(t)보다 2배 이상 두껍게 형성하여야 보호막(500)이 자동 패터닝될 수 있다. Preferably can be a protective film 500 is automatically patterned to be formed to be thicker than twice the thickness (t) of the protective film (500).

다음, 상기 패드부(300) 및 표시소자부(200)가 구비되어 있는 절연기판(100) 전 표면에 보호막(500)을 형성한다. To form the following, the pad section 300 and the display element insulating portion which is provided with a (200) substrate 100, a protective film 500 on the entire surface. 이때, 상기 보호막(500)은 상기 표시소자부 (200)로 수분 및 산소 등이 침투되는 것을 방지하기 위하여 형성되는 것이며, 실리콘질화막, 실리콘산화질화막,알루미늄산화막(Al2O3) 및 무기유기막의 적층구조로 이루어지는 군에서 선택되는 하나 이상의 박막을 사용하여 형성될 수 있다. At this time, as the protection layer 500 is the display element 200 as will be formed in order to prevent the moisture and oxygen penetration, a silicon nitride film, a silicon oxynitride film, an aluminum oxide (Al2O3), and an inorganic organic layer laminate structure It can be formed using at least one thin film selected from the group consisting of. 상기 보호막(500)의 두께(t)는 상술된 바와 같이 상기 패드부 보호 희생막(400)의 두께(T)보다 얇게 형성된다. The thickness (t) of the protective film 500 is formed to be thinner than the thickness (T) of the pad portion sacrificial protective film 400, as described above. 상기 보호막(500)은 상기 패드부 보호 희생막(400)의 가장자리에서 자동패터닝된다. The protective film 500 is automatically patterned at an edge of the pad portion sacrificial protection film 400.

그 다음, 상기 패드부 보호 희생막(400)을 제거하여 상기 패드부(300)를 노출시킨다. Then, by removing the pad protection portion sacrificial layer 400 to expose the pad portion 300. 이때, 상기 패드부 보호 희생막(400) 상부에 형성된 보호막(500a)이 제거되고, 상기 표시소자부(200) 및 절연기판(100) 상부에만 보호막(500b)이 남게된다. At this time, the protective film (500a) formed in the upper portion of the protective pad portion sacrificial layer 400 is removed, the display element portion 200 and the insulating substrate 100, only the upper protective layer (500b) remains. 상기 패드부 보호 희생막(400)은 특정 장치를 이용하여 선택적으로 부착 및 제거할 수 있다. The protective pad portion sacrificial layer 400 can be selectively attached and removed by using a specific device.

그 후, 도시되어 있지는 않지만 COG(chip on glass) 또는 FPC(flexible printed circuit) 등의 커넥터를 ACF(anisotropic conductive film) 등을 이용하여 패드부(300)에 접속시킨다. Thereafter, although not shown by using a COG (chip on glass) or a FPC (flexible printed circuit) connector, the ACF (anisotropic conductive film), etc., such as thereby connected to the pad portion 300. The

상기한 바와 같은 본 발명의 실시예에 따르면, 평판표시소자의 패드부를 보호하기 위한 희생막을 형성하고 보호막을 형성한 후 상기 희생막을 제거함으로써 보호막을 제거하여 패드부를 노출시키는 공정을 단순하게 하고, 패드부를 노출시키는 동안 표시소자부가 손상되는 것을 방지하여 소자의 신뢰성 및 공정 수율을 향상시킬 수 있는 이점이 있다. According to an embodiment of the present invention as described above, and after the formation of the sacrificial film for protecting parts of the pad of the flat panel display device and a protective film to simplify the process for exposing parts of the pad by removing the protection film by removing the sacrificial film, the pad there is an advantage that can prevent the display element unit is damaged to improve the reliability and process yield of the device for exposing parts.

Claims (8)

  1. 제1전극, 적어도 발광층을 포함하는 유기막 및 제2전극을 포함하는 표시소자부 및 상기 표시소자부와 전기적으로 연결되는 다수 개의 패드전극을 포함하는 패드부를 형성하는 공정과, A first electrode, at least a step of forming a pad including a plurality of electrode pad portions and the display element is electrically connected to the display element unit including an organic film and a second electrode including a light emitting layer and,
    상기 패드부 상부 및 측면에 패드부 보호 희생막을 형성하는 공정과, A step of forming a unit and the upper surface of the sacrificial film pad protection pad portion,
    상기 패드부 보호 희생막을 포함하는 전체표면 상부에 보호막을 형성하는 공정과, A step of forming a protective film on the whole upper surface portion including the sacrifice protection film the pad,
    상기 패드부 보호 희생막을 제거하여 상기 패드부를 노출시키는 공정을 포함하는 것을 특징으로 하는 평판표시소자의 제조방법. Method of manufacturing a flat panel display device comprising the step of exposing parts of the pad to remove the sacrificial portion protective film the pad.
  2. 제 1 항에 있어서, According to claim 1,
    상기 표시소자부는 상기 제1전극과 전기적으로 연결되는 박막 트랜지스터가 더 형성되는 것을 특징으로 하는 평판표시소자의 제조방법. The display element unit manufacturing method of the flat panel display device, characterized in that the thin film transistor connected to the with the first electrode is further formed.
  3. 제 1 항에 있어서, According to claim 1,
    상기 패드부 보호 희생막은 상기 보호막 두께보다 2배 이상 두껍게 형성되는 것을 특징으로 하는 평판표시소자의 제조방법. Method of manufacturing a flat panel display device characterized in that the thicker the pad portion sacrificial protective film is more than twice the thickness of the protective film.
  4. 제 1 항에 있어서, According to claim 1,
    상기 패드부 보호 희생막은 접착필름인 것을 특징으로 하는 평판표시소자의 제조방법. Method of manufacturing a flat panel display device characterized in that the film is an adhesive film portion protecting the sacrificial pad.
  5. 제 1 항에 있어서, According to claim 1,
    상기 보호막은 실리콘질화막, 실리콘산화질화막,알루미늄산화막(Al2O3) 및 무기유기막의 적층구조로 이루어지는 군에서 선택되는 하나 이상의 박막을 사용하여 형성되는 것을 특징으로 하는 평판표시소자의 제조방법. The protective film A method of manufacturing a flat panel display device characterized in that is formed using at least one thin film selected from the group consisting of a silicon nitride film, a silicon oxynitride film, an aluminum oxide (Al2O3), and an inorganic organic film laminated structure.
  6. 제 1 항에 있어서, According to claim 1,
    상기 패드부 보호 희생막은 상기 패드부에 선택적으로 부착하는 것을 특징으로 하는 평판표시소자의 제조방법. Method of manufacturing a flat panel display device characterized in that selectively adhere to the pad portions film portions protect the sacrificial pad.
  7. 제 1 항에 있어서, According to claim 1,
    상기 패드부 보호 희생막은 상기 패드부에서 선택적으로 제거하는 것을 특징으로 하는 평판표시소자의 제조방법. Method of manufacturing a flat panel display device characterized in that the selective removal of the sacrificial film in the pad portion the pad protection unit.
  8. 제 1 항에 있어서, According to claim 1,
    상기 평판표시소자는 유기 전계 발광 표시 소자인 것을 특징으로 하는 평판표시소자의 제조방법. The flat panel display device manufacturing method of the flat panel display device characterized in that the organic electro-luminescence display device.
KR1020040090021A 2004-11-05 2004-11-05 Fabricating method of flat panel display KR20060040427A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100768718B1 (en) * 2006-06-29 2007-10-19 주식회사 대우일렉트로닉스 Mothod for manufacturing organic light emitting diode device panel
KR100805124B1 (en) * 2007-03-05 2008-02-21 삼성에스디아이 주식회사 Method for manufacturing display device
US8022618B2 (en) 2007-09-03 2011-09-20 Samsung Mobile Display Co., Ltd. Structure of organic light emitting display apparatus
KR20130015033A (en) * 2011-08-02 2013-02-13 엘지디스플레이 주식회사 Organic emitting display device and method for manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100768718B1 (en) * 2006-06-29 2007-10-19 주식회사 대우일렉트로닉스 Mothod for manufacturing organic light emitting diode device panel
KR100805124B1 (en) * 2007-03-05 2008-02-21 삼성에스디아이 주식회사 Method for manufacturing display device
US7723134B2 (en) 2007-03-05 2010-05-25 Samsung Mobile Display Co., Ltd. Method of manufacturing display device
US8022618B2 (en) 2007-09-03 2011-09-20 Samsung Mobile Display Co., Ltd. Structure of organic light emitting display apparatus
KR20130015033A (en) * 2011-08-02 2013-02-13 엘지디스플레이 주식회사 Organic emitting display device and method for manufacturing the same

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