KR20050026974A - 타일 t/r 모듈용 수소 흡수재 및 emi 차폐물이결합된 유전체 상호접속 프레임 - Google Patents
타일 t/r 모듈용 수소 흡수재 및 emi 차폐물이결합된 유전체 상호접속 프레임 Download PDFInfo
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- KR20050026974A KR20050026974A KR1020057001757A KR20057001757A KR20050026974A KR 20050026974 A KR20050026974 A KR 20050026974A KR 1020057001757 A KR1020057001757 A KR 1020057001757A KR 20057001757 A KR20057001757 A KR 20057001757A KR 20050026974 A KR20050026974 A KR 20050026974A
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- KR
- South Korea
- Prior art keywords
- frame
- module
- frame component
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- frame structure
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0025—Modular arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/12743—Next to refractory [Group IVB, VB, or VIB] metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
Description
Claims (10)
- 전자기 스펙트럼의 선정된 부분을 거쳐 전자기 방사를 송수신하도록 구성된 T(transmit)/R(receive) 모듈(100)용 프레임 구조(106)에 있어서,합성 수지 유전체 재료로부터 단일 조각(single piece)으로서 형성된 적어도 하나의 프레임 컴포넌트(108, 110)를 포함하고,상기 프레임 컴포넌트(108, 110)는 복수의 전기 컨넥터들(112)과, 상기 프레임 컴포넌트(108, 110)의 선택된 부분상의 박막 코팅(114)을 지지하도록 구성되고,상기 박막 코팅(114)은 상기 프레임 구조(106)가 T/R 모듈(100)에 결합될 때 전자기 차폐물 및 그라운드 접속을 제공하도록 구성되는 것을 특징으로 하는 프레임 구조(106).
- 제1항에 있어서, 상기 박막 코팅(114)은 그라운드 접속 및 전자기 차폐물을 제공하는 금속층(116)을 포함하는 것을 특징으로 하는 프레임 구조(106).
- 제2항에 있어서, 상기 금속층(116)은 접속 재료의 박층(118)에 의해 상기 프레임 컴포넌트(108, 110)에 접속되는 것을 특징으로 하는 프레임 구조(106).
- 제3항에 있어서, 상기 금속층(116)은 알루미늄층을 포함하고, 접속 재료의 상기 박층(118)은 티타늄층을 포함하는 것을 특징으로 하는 프레임 구조(106).
- 제4항에 있어서, 상기 박막 코팅(114)은 또한 T/R 모듈을 오염시킬 수 있는 재료들에 대해 게더(120)를 제공하도록 구성되는 것을 특징으로 하는 프레임 구조(106).
- 제5항에 있어서, 상기 프레임 컴포넌트(108, 110)는 GaAs 반도체 재료를 포함하는 T/R 모듈(100)에 결합되도록 구성되고, 상기 박막 코팅(114)은 수소에 대한 게더(120)를 제공하도록 구성되는 것을 특징으로 하는 프레임 구조(106).
- 제6항에 있어서, 상기 박막 코팅(114)은 상기 금속층(116)의 상부에 배치된 티타늄 게더층(120)을 포함하는 것을 특징으로 하는 프레임 구조(106).
- 제7항에 있어서, 상기 박막 코팅(114)은 상기 티타늄 게더층(120)의 상부 상의 팔라듐층(122)을 포함하는 것을 특징으로 하는 프레임 구조(106).
- 제1항에 있어서, 상기 프레임 컴포넌트(108, 110)의 부분은 상기 프레임 컴포넌트(108, 110)가 상기 T/R 모듈(100)에 결합될 때 상기 T/R 모듈(100)의 일부와 인터페이스되도록 구성되고, 상기 합성 수지 유전체 재료는 상기 프레임 컴포넌트(108, 110)의 부분에, 프레임 컴포넌트(108, 110)가 압축율의 범위를 초과하여 효과적인 그라운드 접속을 모듈(100)에 제공할 수 있도록 한 압축율의 범위를 제공하는 것을 특징으로 하는 프레임 구조(106).
- 제9항에 있어서, 각기 복수의 전기 컨넥터들(112) 각각의 각 부분들을 지지하도록 구성된 한 쌍의 상기 프레임 컴포넌트들(108, 110)을 포함하는 것을 특징으로 하는 프레임 구조(106).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/210,240 | 2002-08-01 | ||
US10/210,240 US6825817B2 (en) | 2002-08-01 | 2002-08-01 | Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050026974A true KR20050026974A (ko) | 2005-03-16 |
KR100668014B1 KR100668014B1 (ko) | 2007-01-16 |
Family
ID=31187256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057001757A KR100668014B1 (ko) | 2002-08-01 | 2003-07-29 | 타일 t/r 모듈용 수소 흡수재 및 emi 차폐물이결합된 유전체 상호접속 프레임 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6825817B2 (ko) |
EP (1) | EP1540769B1 (ko) |
JP (1) | JP4436249B2 (ko) |
KR (1) | KR100668014B1 (ko) |
DE (1) | DE60325977D1 (ko) |
IL (1) | IL166111A (ko) |
TW (1) | TWI244170B (ko) |
WO (1) | WO2004013934A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6853062B1 (en) * | 2003-12-02 | 2005-02-08 | Northrop Grumman Corporation | Single substrate hydrogen and microwave absorber for integrated microwave assembly and method of manufacturing same |
FR2877537B1 (fr) * | 2004-10-29 | 2007-05-18 | Thales Sa | Boitier microelectronique multiplans |
US7315069B2 (en) * | 2004-11-24 | 2008-01-01 | Northrop Grumman Corporation | Integrated multi-purpose getter for radio-frequency (RF) circuit modules |
US7777318B2 (en) | 2007-07-24 | 2010-08-17 | Northrop Grumman Systems Corporation | Wafer level packaging integrated hydrogen getter |
US20090133921A1 (en) * | 2007-11-28 | 2009-05-28 | Ult Technology Co., Ltd. | Flexible pc board made through a water cleaning process |
FR2975537B1 (fr) | 2011-05-17 | 2013-07-05 | Thales Sa | Element rayonnant pour antenne reseau active constituee de tuiles elementaires |
US9812804B2 (en) * | 2014-03-27 | 2017-11-07 | Intel Corporation | Pogo-pins for high speed signaling |
FR3023974B1 (fr) * | 2014-07-18 | 2016-07-22 | Ulis | Procede de fabrication d'un dispositif comprenant un boitier hermetique sous vide et un getter |
CN111157980A (zh) * | 2019-12-31 | 2020-05-15 | 中国电子科技集团公司第十三研究所 | 收发组件 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
DE3738506A1 (de) * | 1987-11-13 | 1989-06-01 | Dornier System Gmbh | Antennenstruktur |
FR2672438B1 (fr) * | 1991-02-01 | 1993-09-17 | Alcatel Espace | Antenne reseau notamment pour application spatiale. |
FR2710195B1 (fr) * | 1993-09-14 | 1995-10-13 | Thomson Csf | Assemblage antenne-circuit électronique. |
US6673400B1 (en) | 1996-10-15 | 2004-01-06 | Texas Instruments Incorporated | Hydrogen gettering system |
JP4055871B2 (ja) * | 1997-12-26 | 2008-03-05 | 三洋電機株式会社 | 混成集積回路装置 |
FR2773272B1 (fr) * | 1997-12-30 | 2000-03-17 | Thomson Csf | Antenne reseau et procede de realisation |
US6369924B1 (en) * | 1998-04-20 | 2002-04-09 | Stratos Lightwave, Inc. | Optical transceiver with enhanced shielding and related methods |
US6213651B1 (en) * | 1999-05-26 | 2001-04-10 | E20 Communications, Inc. | Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers |
JP2001007628A (ja) | 1999-06-25 | 2001-01-12 | Nec Corp | フェーズドアレイアンテナ |
JP2001111232A (ja) * | 1999-10-06 | 2001-04-20 | Sony Corp | 電子部品実装多層基板及びその製造方法 |
DE10049556A1 (de) * | 1999-10-08 | 2001-06-13 | Trw Inc | Integriertes Mikroelektronikmodul mit Getter-Volumenelement |
US6421011B1 (en) * | 1999-10-22 | 2002-07-16 | Lucent Technologies Inc. | Patch antenna using non-conductive frame |
JP4467154B2 (ja) * | 2000-07-31 | 2010-05-26 | 京セラ株式会社 | 弾性表面波装置 |
US6469671B1 (en) * | 2001-07-13 | 2002-10-22 | Lockheed Martin Corporation | Low-temperature-difference TR module mounting, and antenna array using such mounting |
US20030062610A1 (en) * | 2001-09-28 | 2003-04-03 | Kovacs Alan L. | Multilayer thin film hydrogen getter |
JP3862559B2 (ja) * | 2001-11-30 | 2006-12-27 | シャープ株式会社 | 光送受信モジュールおよび電子機器 |
DE10200561B4 (de) * | 2002-01-09 | 2006-11-23 | Eads Deutschland Gmbh | Radarsystem mit einem phasengesteuerten Antennen-Array |
-
2002
- 2002-08-01 US US10/210,240 patent/US6825817B2/en not_active Expired - Lifetime
-
2003
- 2003-07-29 EP EP20030766984 patent/EP1540769B1/en not_active Expired - Lifetime
- 2003-07-29 WO PCT/US2003/023810 patent/WO2004013934A1/en active Application Filing
- 2003-07-29 JP JP2004526229A patent/JP4436249B2/ja not_active Expired - Fee Related
- 2003-07-29 DE DE60325977T patent/DE60325977D1/de not_active Expired - Lifetime
- 2003-07-29 KR KR1020057001757A patent/KR100668014B1/ko active IP Right Grant
- 2003-07-31 TW TW92121225A patent/TWI244170B/zh not_active IP Right Cessation
-
2005
- 2005-01-03 IL IL166111A patent/IL166111A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW200414457A (en) | 2004-08-01 |
US6825817B2 (en) | 2004-11-30 |
IL166111A (en) | 2010-02-17 |
US20040023058A1 (en) | 2004-02-05 |
EP1540769B1 (en) | 2009-01-21 |
JP4436249B2 (ja) | 2010-03-24 |
WO2004013934A1 (en) | 2004-02-12 |
IL166111A0 (en) | 2006-01-15 |
EP1540769A1 (en) | 2005-06-15 |
JP2005535127A (ja) | 2005-11-17 |
KR100668014B1 (ko) | 2007-01-16 |
DE60325977D1 (de) | 2009-03-12 |
TWI244170B (en) | 2005-11-21 |
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