KR20050005656A - Multi chamber system manufacturing semiconductor device - Google Patents

Abstract

PURPOSE: A multi-chamber system of manufacturing a semiconductor device is provided to increase efficiency by using a process chamber having a separable structure to exchange easily the process chamber. CONSTITUTION: A plurality of separable process chambers(200) includes sealing spaces for processing wafers, first gate valves, and first interruption valves. A wafer transfer chamber(100) is connected to the process chambers through the first gate valves to form the sealing spaces. A second valve is installed at a connection part between the process chamber and the wafer transfer chamber. An exhaust unit(500) is connected to each process chamber through the first interruption valves. A second interruption valve is installed at a connection part between the process chamber and the exhaust unit.

Description

Multi chamber system for semiconductor device manufacturing

The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a multi-chamber system used for manufacturing a semiconductor device.

Generally, a semiconductor device is implemented by depositing and patterning various materials on a wafer, which is a substrate, in a thin film form. For this purpose, various steps such as a deposition process, an etching process, a cleaning process, and a drying process are required. In each of these processes, the wafer, which is the object of processing, is mounted and processed in a process chamber having an optimal environment for the process. This semiconductor processing system uses a multi-chamber system having a process chamber for processing a wafer and a transfer chamber having a transfer space for transferring wafers into or into the process chamber, or from the process chamber to another process chamber. Wafers transferred to the process chamber are typically manufactured into semiconductor devices or chips through a series of semiconductor processes such as lithography, chemical or physical vapor deposition, and plasma etching.

Hereinafter, a multi-chamber system according to the prior art will be described with reference to the drawings and the problems thereof will be described.

1 is a schematic diagram illustrating a conventional multi-chamber system.

As shown in FIG. 1, the conventional multi-chamber system is provided with a transfer chamber 10 having one closed space at the center. A plurality of process chambers 20 are provided to be adjacent to the transfer chamber 10 around the transfer chamber 10. Each of the plurality of process chambers 20 has one enclosed space and performs a process of processing a wafer in the enclosed space.

Between the transfer chamber 10 and the plurality of process chambers 20 a plurality of opening and closing the connection between the sealed space of the transfer chamber 10 and the sealed space of the plurality of process chambers 20 Gate valve 10a is provided. One gate valve 10a is provided for each process chamber 20.

In order to perform the semiconductor process, the wafer to be processed is transferred from the outside into the transfer chamber 10. The wafer transferred to the transfer chamber 10 is transferred to a specific process chamber 20 by a wafer transfer device (not shown) to perform a process for processing the wafer. Thereafter, the wafer is transferred to the transfer chamber 10 again, and then transferred to another process chamber 20 for the next process to perform the next process. In this way, a series of semiconductor processes are performed in a multi-chamber system.

This multi-chamber system requires each process chamber to undergo PM (Preventive Maintenance) due to changes in process conditions due to cumulative use.

However, the conventional multi-chamber system has a structure that cannot be separated between the process chamber and the transfer chamber, so that when a problem occurs in one chamber or PM, the entire multi-chamber system should be shut down. When the PM proceeds, the process chamber cannot be used for at least several hours, and since the process chamber shares the transfer chamber, there is a considerable influence on other process chambers, which causes a burden on the semiconductor device fabrication. In addition, the conventional multi-chamber system is a problem for the safety of the operator, and it is difficult to maintain the accuracy of the PM because the operator must work in direct contact with the system when the PM inside the chamber. And since the chamber must be opened in the line for PM work, the environment inside the line may be contaminated.

Accordingly, an object of the present invention is to provide a multi-chamber system that solves the problems of the conventional multi-chamber system.

Another object of the present invention is to make a structure that can separate the chamber itself, when a problem occurs in one chamber or when replacing a new chamber prepared in advance, when the multi-chamber system that can maintain the operation of the overall multi-chamber system A chamber system is provided.

Still another object of the present invention is to provide a multi-chamber system that prevents environmental pollution in the line and safety of the operator when the chamber is PM.

According to an aspect of the present invention for achieving some of the above technical problems, the multi-chamber system according to the present invention comprises: a confined space for processing a wafer, having a first gate valve and a first shut-off valve A plurality of process chambers; A wafer transfer chamber having a closed space connected to the process chambers through the first gate valve and openable and having a second gate valve at a connection portion with the process chamber; A second connection part with the process chamber part connected to the respective process chambers through the first shut-off valve and functioning to evacuate the inside of the process chambers and to maintain the inside of the process chamber in a vacuum state; It characterized in that it comprises an exhaust device having a shut-off valve.

Preferably, the multi-chamber system is to provide a multi-chamber system having a guide pin in the coupling portion for smooth coupling of the processor chambers, the process chambers having a groove formed to align with the guide pin of the coupling portion. In addition, it characterized in that it comprises a support mechanism for supporting the lifting and lowering for the separation and coupling of the processor chambers.

The above system can maintain the operation of the entire multi-chamber system, thus facilitating facility operation and increasing efficiency.

1 is a schematic diagram illustrating a conventional multi-chamber system

2 is a schematic diagram illustrating a multi-chamber system according to an embodiment of the invention.

3 is a cross-sectional view through II ′ of FIG. 2.

* Description of the symbols for the main parts of the drawings *

100: transfer chamber 200: processor chamber

200a: first gate valve 100a: second gate valve

200b: 1st shutoff valve 500b: 2nd shutoff valve

300: support mechanism 400: guide pin

500: exhaust device

The multichamber system described above will now be described with reference to FIG. 2 or 3 without any intention other than to provide a thorough understanding of the present invention described below.

2 is a schematic diagram illustrating a multi-chamber system according to an embodiment of the present invention.

As shown in Figure 2, the multi-chamber system according to the present embodiment is provided with a transfer chamber 100 having a closed space in the center and the transfer chamber (centered around the transfer chamber 100) A plurality of process chambers 200 are provided to be adjacent to the periphery of 100.

Each of the plurality of process chambers 200 has a closed space and performs a wafer processing process in the closed space.

Between the transfer chamber 100 and the plurality of process chambers 200 a plurality of opening and closing the connection between the sealed space of the transfer chamber 100 and the closed space of the plurality of process chambers 200 Connecting members 100a and 200a are provided. The connection members 100a and 200a may be installed at the side of the transfer chamber 100 of the process chambers 200 and may include a first gate valve for opening and closing an enclosed space and the outside of the process chamber 200. 200a) and second gate valves 100a installed at the process chamber 200 side of the transfer chamber 100 to block spatial connection between the sealed space and the outside of the transfer chamber 100. do.

3 is a cross-sectional view taken along the line II ′ of FIG. 2.

As shown in FIG. 3, the multi-chamber system includes one process chamber 200, the transfer chamber 100, the first gate valve 200a, the second gate valve 100a, and the process chamber. The exhaust device 500 which is connected adjacent to the 200 is provided. The process chambers 200 are configured to be separated from the upper portion 210 and the lower portion 220.

The exhaust device 500 functions to exhaust the inside of the process chamber 200 and maintain the inside of the process chamber 200 in a vacuum state.

Between the exhaust device 500 and the process chamber 200, connecting members 100b and 500b for opening and closing a connection between the closed space of the exhaust device 500 and the closed space of the process chamber 200 are provided. It is provided. The connection members 200b and 500b are installed at the exhaust device 500 side of the process chamber 200 so as to open and close the closed space and the outside of the process chamber 200. And a second shut-off valve 500b installed at the side of the process chamber 200 of the exhaust device 500 to block spatial connection between the space of the exhaust device 500 and the outside. In addition, the multi-chamber system is provided with a guide pin for alignment when the processor chamber 200 is coupled, the process chamber 200 has a groove formed to be aligned with the guide pin 400. In addition, the support mechanism 300 is provided to support the lifting and lowering for the separation and coupling of the processor chambers.

In order to perform the semiconductor process, the wafer is first transferred from the outside into the transfer chamber 100. The wafer transferred to the transfer chamber 100 is transferred to a specific process chamber 200 by a wafer transfer device (not shown) to perform a process for processing a wafer. Thereafter, the wafer is transferred to the transfer chamber 100 again, and then transferred to another process chamber 200 for the next process to perform the next process. In this way, a series of semiconductor processes are performed in a multi-chamber system.

At this time, in order to transfer the wafer to the transfer chamber 100 to perform the next process, or to transfer to another process chamber 200 from the transfer chamber 100, the first gate valve 200a and the second gate valve 100a. ) All open. Also, when the wafer is transferred to the transfer chamber 100 after the process is being performed or the process is completed, only one of the first gate valve 200a or the second gate valve 100a is opened. The first shut-off valve 200b or the second shut-off valve 500b may be used in an open state when performing a process.

When a simple problem that can be solved without separating the process chamber 200 occurs, it is possible to solve the problem by separating the upper portion 210 and the lower portion 220 of the process chamber 200. However, when a serious problem occurs in the process chamber 200 or needs to be PM, the operation of the problem chamber is stopped and the chamber is separated and replaced with a newly prepared chamber to be coupled to the transfer chamber 100. do. Before the process chamber 200 is separated, the second gate valve 100a installed in the transfer chamber 100 is closed. This is to separate the one chamber so as not to affect the process performance of the other remaining chamber. In addition, the second gate valve 200a installed at the side of the chamber to be separated prevents chamber contamination and maintains the original state until the chamber is coupled with the transfer chamber 100 again after PM work or after solving a problem. To function.

Before the chamber is separated, the second shutoff valve 500b installed in the exhaust device 500 is closed. This is to protect the exhaust device and to prevent contamination of the environment in the line. And the first shut-off valve (200b) installed on the remaining chamber side to prevent the contamination of the chamber until after the PM operation or after solving the problem to combine the chamber with the transfer chamber 100 again to maintain the original state Do it.

The guide pin 400 of the coupling part serves as a guide for quick and accurate coupling when the separated chamber is coupled, and a groove is formed in a predetermined portion of the process chamber 200 to be aligned with the guide pin. .

In addition, the support mechanism 300 is used as a mechanism for supporting the process chamber when separating or combining the process chamber.

The above description of the embodiments is merely given by way of example with reference to the drawings in order to provide a more thorough understanding of the present invention and should not be construed as limiting the invention. In addition, various changes and modifications are possible to those skilled in the art without departing from the basic principles of the present invention.

As described above, according to the present invention has the following effects.

According to the present invention, when one of the plurality of processor chambers fails or needs to be PM, the processor chamber can be easily removed and replaced with a new processor chamber to maintain the operation of the entire multi-chamber system. Operation is easy and efficiency is increased.

Another effect of the present invention can be separated from the chamber when the chamber to the PM can be made in a certain place can prevent the safety of workers and environmental pollution in the line.

Claims (5)

A plurality of separable process chambers having a confined space for processing a wafer and having a first gate valve and a first shutoff valve; A wafer transfer chamber having a closed space connected to the process chambers through the first gate valve and openable and having a second gate valve at a connection portion with the process chamber; And And an exhaust device connected to each of the process chambers through the first shutoff valve and having a second shutoff valve at a connection portion with the process chamber part. The method of claim 1, The multi-chamber system is a multi-chamber system for manufacturing a semiconductor device characterized in that it has a guide pin in the coupling portion of the processor chambers. The method of claim 2, And the process chambers have grooves formed to align with the guide pins of the coupling portion when the process chambers are coupled to the multi-chamber system. The method of claim 3, The process chamber is a multi-chamber system for manufacturing a semiconductor device, characterized in that the upper and lower structure is removable. The method of claim 4, wherein The multi-chamber system is a multi-chamber system for semiconductor device manufacturing, characterized in that it further comprises a support mechanism for supporting the chamber to lift and lower the chamber for separation and coupling of the chamber.