KR20040097888A - Computer - Google Patents

Abstract

PURPOSE: A computer is provided to efficiently cool the computer without generating noise and using no cooling fan by cooling the computer with the air outside of a case after transferring the heat generated from heated components inside of the case to panels forming the case. CONSTITUTION: The computer is equipped with components, and the case embedded with the components and formed by the panels. The heated components are a CPU, a graphic card, and a power supply. The heat generated from each heated components is discharged to the outside by being transferred to the case through a heat transferring part. A plurality of heat radiating fins(23,25) are formed to an external surface of left/right panel(22,24).

Description

Computer {Computer}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a computer, and more particularly, to a computer capable of efficiently cooling noiselessly without using a cooling fan, using heat generated from heat generating parts included in a computer case.

Generally, various components for carrying out the functions of the computer are mounted in the case of the computer. Among these components, a main board, a central processing unit (CPU), a graphics card, a sound card, a power supply, a hard disk driver, a floppy disk driver, a CD-ROM driver, a DVD-ROM driver, and the like are typical. In addition, peripheral devices such as a monitor, a mouse, a keyboard, and the like, which are located outside the computer, are connected to components embedded in the computer case. In addition, a peripheral device such as an external storage device or a printer may be provided outside the computer.

However, among the components included in the computer case, heat generating components that generate heat during operation are included. Such heating units typically include a central processing unit, a graphics card, and a power supply. In the case of these heating components, when the temperature of the components increases due to the generated heat, the performance of the components is degraded, and in a severe case, the operation of the components is stopped. May be In addition, since the heat generated by the heat generating parts has increased in recent years due to the rapid development of computer performance, cooling of the heat generating parts is one of the most important problems to be solved in the computer industry.

At present, a method of cooling the heat generating parts included in the case of a computer is mainly to contact each of the heat generating parts with a heat sink that absorbs heat, and then pass the wind of the cooling fan to the heat sink. I use it. In order to absorb and dissipate heat more efficiently from heat-generating components, various researches, such as change of heat sink material or shape change, have been attempted. By the way, the common cooling system of such a computer has a cooling fan for each of the heat generating parts inside the case by the cooling fan attached to each of the heat generating parts, the hot air inside the case is returned to the case Another cooling fan provided is to be discharged to the outside. These problems have caused many problems.

That is, in order to cool the heat generating parts embedded in the case, since a large number of cooling fans that rotate at high speed must be installed, the following problems are caused. First, a lot of noise occurs when the computer is operating. In fact, most of the noise generated by computers is the mechanical noise of these cooling fans. These noises can be a source of deterioration in the work efficiency of computer workers and nervous workers who want a quiet work environment. Second, when the computer is operating, the cooling fan constantly introduces a large amount of external air into the case and circulates the internal air, so that external fine dust adheres to many components embedded in the computer case. This phenomenon is caused more severely by the static electricity generated in the components embedded in the case, and these dusts may cause malfunction or failure of the sensitive components.

In addition, there is a problem that the cooling of the heat generating parts is not efficient because it occurs inside the case. In other words, the temperature inside the case having a limited volume is higher than the outside temperature when the computer is operated and a little time passes, and it is impossible to cool the heating parts with the already warm air.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a computer capable of efficiently cooling the heat generating parts included in the case of the computer without generating noise.

1 is a schematic perspective view of a computer as a first embodiment according to the present invention;

2 is a schematic exploded perspective view of the computer shown in FIG. 1, FIG.

3 is an enlarged view of a corner portion of the seat plate illustrated in FIG. 2;

4 is a schematic front view of a state in which the front plate of the computer shown in FIG. 1 is removed;

5A is a view for explaining a heat conduction unit of the central processing unit of the computer shown in FIG. 2;

5B and 5B are views for explaining a modified form of the heat conductive portion shown in FIG. 5A,

6 is a view for explaining a heat conduction unit of the graphics card shown in FIG.

7 is a schematic exploded perspective view of the power supply shown in FIG.

8A, 8B, and 8C are views for explaining that components are mounted in a case by a guide rail and a guide member;

FIG. 9 is a view schematically illustrating a connection cable connecting a connection terminal of components inside a case of the computer illustrated in FIG. 1 to a peripheral device outside the case;

10 is a schematic perspective view of a computer of a second embodiment according to the present invention;

FIG. 11 is a schematic exploded perspective view of the computer shown in FIG. 10;

12 is a plan view of the top plate of the computer shown in Figure 10 removed;

FIG. 13 is a cross-sectional view taken along the line A-A of FIG. 10;

14 is a schematic perspective view of a computer of a third embodiment according to the present invention;

15 is a schematic exploded perspective view of the computer shown in FIG. 14;

16 is a plan view of a state in which a part of the upper plate of the computer shown in FIG. 14 is removed;

17 is a cross-sectional view taken along the line A-A of FIG. 14;

18 is a schematic perspective view of a computer of a fourth embodiment according to the present invention;

19 is a schematic exploded perspective view of the computer shown in FIG. 18.

20 is a schematic exploded view of a modified form of some of the components of the computer shown in FIG. 18;

<Description of the symbols for the main parts of the drawings>

1, 1a, 1b, 1c ... Computer 10 ... Components

22, 22a ... Seat plate 23 ... Heat dissipation

24, 24a ... Right plate 25 ... Heat dissipation

26 ... top plate 27 ... bottom plate

28, 28a ... front panel 29, 29a ... rear panel

32, 32c, 32f, 32v ... heat pipe 34 ... aluminum circuit board

40 ... guide rail 42 ... guide member

52 ... cable passing hole 54 ... electromagnetic shielding block

120 ... central processing unit 140 ... graphics card

160 ... power supply 190 ... wheels

192 ... legs

224, 240, 280, 290 ... plate body

226, 242, 282, 292 ... heat sink

In order to achieve the above technical problem, a computer according to the present invention includes a plurality of components and a case incorporating the components, and the components include a heat generating component that generates heat during operation. The case may include a plurality of plate parts, and heat generated from at least some of the heat generating parts of the heat generating parts may be transferred to the plate part through a heat conduction part that thermally connects the heat generating parts and the plate part. It is characterized in that it is radiated to the outside and cooled.

In addition, it is preferable that a plurality of heat radiation fins are formed to protrude from the outer surface of at least one of the plurality of plate portions.

At least one of the plate portions may include a plate portion body and a heat dissipation plate portion disposed outside the plate portion body and spaced apart from and facing the plate portion body.

On the other hand, it is preferable that the heat conduction part includes a heat pipe whose one end is thermally connected to the heat generating part and the other end is thermally connected to the heat sink.

On the other hand, it is preferable that the heat sink is thermally connected to the plate body facing the heat pipe through the heat pipe.

In addition, it is preferable that a plurality of heat radiation fins are formed on the heat sink portion to protrude.

On the other hand, it is preferable that a heat pipe is provided between the heat dissipation fans.

The heat generating part includes a central processing unit (CPU), and a heat conduction unit for transferring heat generated from the central processing unit to the plate unit, one end of which is thermally connected to the central processing unit, and the other end of the plate unit. It is preferable to include a heat pipe thermally connected to the.

In addition, a plurality of heat pipes are provided, and each diameter is preferably 8 mm or less.

The heat generating part includes a graphic card, and a heat conduction part for transferring heat generated from the graphic card to the plate part, one end of which is thermally connected to the central processing unit, and the other end of which is thermally connected to the plate part. It is preferable to include a heat pipe.

The heat conductive part may include a first heat transfer block in contact with one end of the heat pipe and the heat generating part, and a second heat transfer block in contact with the other end and the plate of the heat pipe, respectively.

The heat generating part includes a power supply, and a heat conduction part for transferring heat generated from the power supply to the plate part is provided in the power supply, and generates heat during operation among electrical components constituting the power supply. Preferably, at least some of the electrical parts are thermally connected and at least some of the side surfaces include a heat transfer member in surface contact with the inner surface of the plate.

In addition, it is preferable that the heat transfer member is an aluminum circuit board on which one side is in surface contact with the inner surface of the plate portion and the other side is mounted with electrical components that generate heat during operation.

On the other hand, at least one of the plate portion, it is preferable to be rotatably coupled to the other plate portion, to be able to open and close the inner space of the case.

On the other hand, among the plurality of components, component parts having a connection terminal connected by the computer peripheral devices and a connection cable that is located outside the case is included, the connection terminal is located inside the case, At least some of the plate portions of the plate portion is preferably provided with a cable through hole through which the connection cables can pass.

On the other hand, at least one of the plate portion, it is preferable that the electromagnetic wave blocking block for reducing the electromagnetic wave generated from the component to the outside of the case is provided.

Meanwhile, at least one of the plate portions is preferably made of aluminum.

On the other hand, at least one of the plurality of plate portion, the guide rail coupled to the inner surface and the guide member which is slidably coupled along the longitudinal direction of the guide rail to the guide rail, the component At least some of the components are preferably fixed to the guide member.

On the other hand, it is preferable to further include a leg portion in contact with the ground on the case so that the lower surface of the case is spaced apart from the ground on which the case is placed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 9 show a computer of a first embodiment according to the present invention, wherein FIG. 1 is a schematic perspective view, and FIG. 2 is a schematic exploded perspective view of the computer shown in FIG. 3 is an enlarged view of a corner portion of the seat plate illustrated in FIG. 2, and FIG. 4 is a schematic front view of a state where the front plate portion of the computer illustrated in FIG. 1 is removed.

The computer 1 according to the present invention includes a plurality of components 10 and a case in which the components 10 are embedded, and among the components 10, heat generating parts that generate heat during operation are included. Included. The case consists of a plurality of plate parts. In the case of the present embodiment, the case is formed as a generally hexahedron, and the plurality of plate portions are the seat plate portion 22, the right plate portion 24, the upper plate portion 26, the lower plate portion 27, the front plate portion 28, the back plate portion ( 29). The thickness of these plate parts is about 5-7 mm. The heat generating part includes a central processing unit 120, a graphic card 140, and a power supply 160, and heat generated from each heat generating part is transferred to the case through a heat conduction part and is emitted to the outside of the case. .

The seat plate part 22 forms the left side wall of the case, and is made by extrusion-processing an aluminum material having good thermal conductivity. On the outer surface of the seat plate portion 22, a plurality of heat dissipation fins 23 are formed to protrude along the longitudinal direction.

Meanwhile, referring to FIG. 3, a heat pipe 32f is installed between the heat dissipation fans 23 of the seat plate part 22, and a part of the outer circumferential surface is exposed to the outside and most of the heat pipe 32f is inserted into the seat plate part 22. It is. The heat pipes 32f are provided one by one between the heat dissipation fans 23. However, the number of installation of such heat pipe 32f can be added or subtracted as needed. It is preferable that the length of each heat pipe 32f is equal to the height of the seat plate part 22.

The heat pipe 32f absorbs the heat of the relatively hot portion and quickly transfers it to the relatively low temperature portion in the seat plate portion 22 that is in contact, thereby evenly distributing the heat of the seat plate portion 22 as a whole. It is also provided as an aid to the so-called heat transfer tube. Also, in the process of transferring heat, heat is radiated to the outside of the heat pipe 32f, so that the seat plate portion 22 It also performs the role of cooling the heat of). However, the specific configuration of the heat pipe 32f for absorbing or transferring heat is not only known in the related art, but since the specific configuration itself does not constitute the main contents of the present specification, further description thereof will be omitted. . Also, unless otherwise stated for the heat pipes exemplified herein, they are considered to be directional heat pipes. Here, the directionality of the heat pipe means that the height of the part in contact with the high temperature part must be equal to or higher than the height of the part in contact with the low temperature part.

In addition, the seat plate portion 22, with reference to Figure 5a, is rotatably coupled to the other plate portion to open and close the inner space of the case. That is, the seat plate portion 22 is rotatably coupled to the back plate portion 29 by a pair of hinges 220. On the other hand, if necessary, the seat plate portion 22 may be rotatably coupled to the front plate portion 28.

The right plate part 24 forms a right side wall of the case, and the seat plate part 22 forms the left side wall of the case, and the right plate part 24 forms the right side wall of the case. Except that it is not made, all structures, such as a material and a shape, are the same. That is, a plurality of heat dissipation fans 25 are formed on the outer surface of the right plate part 24, and a heat pipe 32f is provided between the heat dissipation fans 25.

On the other hand, the lower surface of the seat plate 22 and the right plate 24 is provided with a rolling wheel 190 on the front and rear, respectively. All four rolling wheels 190 facilitate the movement of the case, a pair of rolling wheels 190 installed in the seat plate portion 22 that the seat plate portion 22 to rotate to open and close the inside of the case. Make it easy In addition, the rolling wheel 190 also serves as a leg portion so that the lower surface of the case is spaced apart from the ground on which the case is placed. Since the case is separated from the ground, heat transmitted to the left and right plate portions 22 and 24 by the natural convection of air below the case can be effectively dissipated. Each of the wheels 190 is adjustable in height to level the case. And it has a general prevention means that the cloud of the rolling wheel 190 is prevented so that the position of the case can be fixed.

The upper plate portion 26 and the lower plate portion 27 of the case is made of an aluminum material excellent in thermal conductivity. The upper plate portion 26 and the lower plate portion 27 are provided with cable passing holes 52 at the front and the rear, respectively. Through each cable through hole 52 can pass a variety of cables 310 for connecting the inside and the outside of the case (see Fig. 9).

On the other hand, each cable passing hole 52 is provided with an electromagnetic interference block 54 (EMI interception block). The electromagnetic wave blocking block 54 serves to reduce the electromagnetic waves generated from various electronic components mounted in the case to the outside of the case. The specific shape or configuration of the electronic block blocking block 54 corresponds to those commonly known in the art, and thus, further detailed description thereof will be omitted.

Each of the upper plate 26 and the lower plate 27 is provided with a plurality of ventilation holes 56. Each vent hole 56 is a circular hole having a small diameter. The air inside the case may be vented through the vent hole 56. And, the upper plate 26 is provided with a pair of handles 58, it can be conveniently used when the user moves the case.

The front plate portion 28 and the back plate portion 29 of the case are made of an aluminum material having excellent thermal conductivity. The front plate portion 28 is rotatably coupled to the upper plate portion 26 and the lower plate portion 27 by a hinge pin to open and close the inner space of the case. The front plate portion 28 is provided with a handle 284 for opening and closing operation of the front plate portion 28, and a display window 286 for displaying the operating state of the components embedded in the case. Meanwhile, in the present embodiment, the back plate 29 is fixed to the other plate parts. However, the back plate 29 may be rotatably coupled to the other plate parts as necessary.

Referring to FIG. 5A, which schematically illustrates the heat conduction portion of the central processing unit 120 of the heat generating part, FIGS. 2, 4 and the main board, which is spaced apart from and fixed to the right plate part 24. It is attached to the upper end of 110. A heat conduction unit is provided to transfer a lot of heat generated as the central processing unit 120 operates to the right plate unit 24.

The heat conductive part includes a plurality of heat pipes 32c. Each of the plurality of heat pipes 32c preferably has a diameter of 8 mm or less. In this embodiment, the heat pipes 32c are approximately 6 mm. The heat pipe 32c should have a diameter of 8 mm or less in this way, to provide flexibility that can be bent without difficulty, and can be bent easily into a desired shape, and the shape can be maintained even after squeezing. In addition, the heat pipe 32c should be flexible to minimize the work hardening occurring in the process of bending the heat pipe 32c to a desired shape, thereby making it reliable in durability.

On the other hand, three or more heat pipes 32c are preferable. In the present embodiment, six are provided. Thus, even when the computer 1 is in use, even if some of the six heat pipes 32c have a problem, the basic functions can still be performed by the remaining heat pipes 32c, and a troublesome hit is also required to repair them. Only the pipe 32c needs to be replaced.

One end of the heat pipe 32c is thermally connected to the central processing unit 120 through the first heat transfer block, and the other end is thermally connected to the inner surface of the right plate portion 24 through the second heat transfer block. . The first and second heat transfer blocks are made of a material having good thermal conductivity, for example, aluminum or copper, and the first heat transfer block is composed of a first member 320c and a second member 322c, and a second heat transfer. The block consists of a first member 324c and a second member 326c.

The first member 320c of the first heat transfer block is tightly coupled to the central processing unit 120 to receive heat generated from the central processing unit 120, and the first member 320c is again attached to the first member 320c. Two members 322c are tightly coupled. In addition, each of the first member 320c and the second member 322c is provided with six grooves each having a semicircular cross section on a surface in contact with each other, so that the first member 320c and the second member 322c mutually In close contact with each other, six heat pipe mounting holes are formed to meet the corresponding grooves to accommodate one end of the heat pipe 32c. The outer circumferential surface of one end of the heat pipe 32c is brought into close contact with the inner circumferential surface of each heat pipe mounting hole.

In order to efficiently transfer the heat of the heat pipe 32c received from the central processing unit 120 to the right plate part 24, the second heat transfer block is arranged in three pairs as shown in FIG. 5A. The first member 324c of the second heat transfer block is tightly coupled to the right side plate 24, and the second member 326c is tightly coupled to the first member 324c again. In addition, each of the first member 324c and the second member 326c is provided with two grooves each having a semicircular cross section on a surface in contact with each other, so that the first member 324c and the second member 326c are in close contact with each other. When contacted with each other, the corresponding grooves are formed to meet two heat pipe mounting holes for accommodating the other end of the heat pipe 32c. The outer circumferential surface of the other end of the heat pipe 32c is brought into close contact with the inner circumferential surface of each heat pipe mounting hole.

Meanwhile, as shown in FIG. 5A, a pair of heat transfer blocks 327 and 329 having a similar structure as that of the second heat transfer block made of the first and second members 324c and 326c are respectively formed of the right plate portion 24. It is provided on the inner side and the inner side of the upper plate part 22. The two heat transfer blocks 327 and 329 are connected to the heat pipe 328 so that the heat of the right plate portion 24 may be transferred to the upper plate portion 26. Heat transferred to the upper plate portion 26 is radiated to the atmosphere.

5B and 5C show a modified form of the heat conduction portion shown in FIG. 5A. 5B is a schematic perspective view of the assembled state, and FIG. 5C is an exploded perspective view of FIG. 5B.

The modified form of the heat conduction portion is a suitable form to be applied when the central processing unit 120 is mounted on the lower end of the main board 110, the heat pipe shown in Figure 5a is a directional heat pipe 32c The heat pipe 321 employed here is an undirected heat pipe 321, also called a meander customs heat pipe or a micro heat pipe. As shown in FIG. 5C, the non-directional heat pipe 321 is a state in which one long pipe is bent as a whole. The micro heat pipe 321 receives heat from a portion in contact with the high temperature portion and transmits heat to a portion in contact with the low temperature portion, regardless of the height of the high temperature portion and the low temperature portion that the heat pipe 321 is in contact with. That is, the portions of the heat pipe 321 in contact with the first heat transfer block made of the first and second members 320c and 322c receive heat generated from the central processing unit 120, and the first and second members. The portion in contact with the three second heating blocks 324c and 426c respectively transfer heat to the right plate part 24 via the second heating block. The heat transferred to the right plate part 24 is transmitted to the whole of the right plate part 24 to be radiated to the atmosphere. In addition, the heat pipes 32f provided in the right plate portion 24 allow heat to be transferred very quickly to the entire right plate portion 24.

However, the specific configuration of the micro heat pipe 321 for absorbing or transferring heat is not only known, and since the specific configuration itself does not constitute the main contents of the present specification, further description thereof will be omitted. do.

Referring to FIG. 6, which is a view of FIG. 2 and the graphics card 140 from below, the graphics card 140 of the heating parts is located below the main board 110 spaced apart from and fixed to the right plate part 24. It is installed. One side of the graphics card 140 is fixed to the support guide 191 by a screw 193. One end and the other end of the support guide 191 are fixed to the upper plate 26 and the lower plate 27 by screws or the like, respectively. A heat conduction part is provided to transfer heat generated as the graphic card 140 operates to the right plate part 24.

The heat conducting portion includes a pair of heat pipes 32v. One end of each heat pipe 32v is thermally connected to the heat generating part of the graphic card 140 through the first heat transfer block, and the other end is thermally connected to the inner surface of the right plate portion 24 through the second heat transfer block. It is connected. The first and second heat transfer blocks are made of a material having good thermal conductivity, for example, aluminum or copper, and the first heat transfer block includes a first member 320v and a second member 322v, and a second heat transfer. The block consists of a first member 324c and a second member 326c.

The structure and function of the first member 320v and the second member 322v, the heat pipe 32v and the first member 324v and the second member 326v of the second heating block are The first and second members 320c and 322c, the heat pipe 32c, and the first and second members 324 of the second heat transfer block of the first heat transfer block described above with respect to the heat conduction portion for the central processing unit 120. 326c), and thus, further description will be omitted.

The power supply 160 of the heat generating part includes a heat transfer member 34.

The heat transfer member 34 serves as a heat conduction portion for transferring heat generated from the power supply 160 to some of the plate portions. The heat transfer member 34 is provided in the power supply 160. The power supply 160 is composed of various electrical components and various materials, among which electrical components, such as power transistors, transformers, or various coils, which generate more heat than other electrical components in operation. The parts are thermally connected to the heat transfer member 34. The side surface of a part of the heat transfer member 34 is in surface contact with the inner surface of the plate portion. Therefore, when the power supply 160 is operated to generate heat in the electrical component, the heat is transmitted to the heat transfer member 34 which is thermally connected to the electrical component, and the transferred heat is in surface contact with the inner surface of the plate portion. It is transmitted to the plate portion through the portion of the heat transfer member 34.

In the present embodiment, the heat transfer member 34 is a circuit board made of aluminum. 2 and 5, one side surface 342 of the aluminum circuit board 34 is coupled to a surface contact with the inner side surface 222 of the seat plate portion 22. Referring to FIG. 7, which is a schematic separation perspective view of an aluminum circuit board 34, a power transistor, a transformer, or various coil components that generate a lot of heat during operation of the aluminum circuit board 34 are mounted. In addition, the power supply 160 includes a lower case 162 in which the aluminum circuit board 34 is fixed and the through part 163 is formed to expose the aluminum circuit board 34, and the heat generating parts are excluded. The upper case 164 and the substrate 166 on which the remaining parts are mounted are included.

The aluminum circuit board 34 serves as a heat conduction part for transferring heat generated from the power supply 160 to the seat plate part 22. That is, in order to transmit heat generated from the heat generating parts of the power supply 160 to the seat plate part 22 to dissipate to the outside of the case through the heat generators 23 of the seat plate part 22, the heat generating parts are made of aluminum having good thermal conductivity. It is mounted on the other side of the circuit board 34, and one side surface 342 of the aluminum circuit board 34 is coupled to be in close contact with the inner side surface 222 of the seat plate part 22.

In the present embodiment, the heat transfer member 34 is an example of a circuit board 34 made of aluminum, but the present invention is not limited thereto. That is, the circuit board is made of a material that has been commonly used, and the components that generate a lot of heat during operation among the electrical components mounted on the conventional circuit board, or directly contact the heat transfer member 34, which is a separate member, After thermally connecting through a well-transmitted object, the surface of a portion of the heat transfer member 34 may be in surface contact with the plate portion. In addition, the material of the circuit board 34 is not limited to aluminum, and other materials having a thermal conductivity similar to that of aluminum or better may be used.

On the other hand, the computer 1 of the present embodiment includes a guide rail 40 and a guide member 42 in order to fix some of the components 10 inside the case.

Referring to FIG. 8A, some of the components, for example, the main board 110 and the power supply 160 may be directly mounted to the inner surface of the plate portion by using screws or the like on the seat plate portion 22 and the right plate portion 24. Other components, such as the DVD ROM driver 180, the CD-RW driver 182, the floppy disk driver 184, the hard disk driver 186 and the USB port 188, the guide rail (40) ) And the guide member 42 are mounted inside the case.

The guide rail 40 has a rod shape having a cross section as shown in FIGS. 8B and 8C and includes a nut portion 402. If necessary, one guide rail 40 may be used alone, or two guide rails 40 may be used in pairs and parallel to each other. The guide rails 40 may be fixed alone or in pairs at any desired position of the inner surface of the plate portion.

The guide member 42 has a cross section corresponding to the cross section of the guide rail 40 so that one side end portion 420 is slidably coupled along the longitudinal direction of the guide rail 40 coupled to the plate portion. The other end 421 may have the same shape as the one end 420 as necessary. The component is fixed to the flat portion connecting the one end 420 and the other end 421 of the guide member 42 by a screw. Meanwhile, as shown in FIGS. 8B and 8C, when the bolt 404 penetrating the plate portion is fastened to the nut portion 402 provided on the guide rail 40, the guide rail 40 may be mounted on the inner surface of the plate portion. Of course, the position of the guide member 42, which was slidably coupled to the guide rail 40, is fixed to the position thereof.

In addition, as illustrated in FIG. 8A, when a plurality of components 180, 182, and 184 are mounted at the same time, each guide member 42 positioned on the left and right sides of the plurality of components 180, 182, and 184 is provided. It may be further provided with an auxiliary guide member (not shown) for interconnecting the other end 421 of the.

In addition, in the case of the computer 1 of the present embodiment, referring to FIG. 9 conceptually illustrating that the internal components 10 and the peripheral device 300 of the computer 1 are connected by a connection cable 310. Among the plurality of components 10 mounted inside the case, peripheral devices 300 such as a monitor, a printer, an external storage device, and the like, which are located outside the case, and various connection cables 310 are provided. The component parts 10 having the connection terminals 50 connected to each other are positioned inside the case without the connection terminal 50 of the component 10 being exposed to the outside of the case.

Meanwhile, the connection cables 310 connected to the connection terminal 50 provided in the component 10, the upper plate portion 26 so that the connection cable 310 can pass through, referring to FIGS. 2 and 9. Through the cable passing hole 52 provided at the rear of the, and the cable passing hole 52 provided at the front and rear of the lower plate portion 27, respectively, go out of the case is connected to the peripheral device (300). At this time, when the connection cable 310 is to be connected to the connection terminal 50 of the component 10 located inside the case, the front plate portion 28 or the seat plate portion which is coupled to open and close the inner space of the case. (22) can be opened and the work can be conveniently performed.

The computer 1 of the first embodiment according to the present invention forms a case with plate parts made of aluminum material having excellent thermal conductivity, and has a heat conduction part inside the case, thereby preventing heat generated from the heating parts mounted inside the case. It is configured to be cooled by passing heat through the heat conducting portion to the plate portions and then dissipating the heat out of the case. In particular, heat generated from the heat generating parts is mainly transmitted to the seat plate 22 and the right plate 24, which form heat radiating fins 23 and 25 on the outer surface through the heat conducting portion, so that effective cooling due to the large heat dissipation area is achieved. It is possible.

That is, in order to cool the heating element in the conventional computer, all the cooling fans which have been used inevitably are removed, and the heat dissipation fans formed on the outside of the plate parts and some of the plate parts forming the heat generated inside the computer case. After delivery to the case, it is cooled by using natural convection of air that exists around the outside of the case. Therefore, the computer 1 of the present invention, unlike a conventional computer that uses a plurality of cooling fans to cool the heat generated therein, is capable of efficient cooling without any mechanical noise caused by the cooling fan. It is possible. In addition, cooling is more efficiently performed by using the air outside the case, which is 7-8 degrees Celsius lower than the air inside the case, for cooling.

In this embodiment, in order to transfer the heat generated from the central processing unit 120 and the graphics card 140 to the right plate portion 24 formed with the heat dissipation fins 25, heat pipes 32c and 32v having excellent thermal conductivity. By using, heat generated can be transferred to the right plate part 24 sufficiently effectively. Then, in order to transfer the heat generated from the power supply 160 to the seat plate portion 22 is formed with heat radiation, heat generating components of the components of the power supply 160 are mounted on the aluminum circuit board 34. By directly contacting the aluminum circuit board 34 to the inner surface 222 of the seat plate portion 22, a large amount of heat generated in the power supply 160 can be effectively transferred to the seat plate portion 22.

On the other hand, the computer 1 of the first embodiment is made of an aluminum material having a thickness (approximately 5 to 7 mm) having sufficient rigidity, since the plate portions including the seat plate portion 22 and the right plate portion 24 have sufficient rigidity. It is possible to fix the guide rail 40 and the guide member 42 at any desired position. Therefore, it is possible to easily mount the components inside the computer case, and it is possible to use the space inside the case more efficiently.

In addition, the computer 1 of the first embodiment is coupled to the seat plate 22 and the front plate 28 so as to open and close the inner space of the case, the cable through hole in the upper plate 26 and lower plate 27 52 are provided, and the connection terminals 50 of the component parts are located inside the case without being exposed to the outside of the case. Therefore, since the flow of the outside and the air is significantly reduced in comparison with the related art, the inflow of external dust is also reduced, and as a result, the internal components are safer from the dust.

In addition, since the plate parts forming the case are made of aluminum having a thickness of 5 to 7 mm, the connection terminal is inside the case, and each of the cable passing holes 52 is provided with an electromagnetic wave blocking block 54, Most of the leakage of electromagnetic waves from various electronic components to the outside of the case can be blocked.

In the case of the computer 1 of the first embodiment according to the present invention, the plate parts constituting the case are exemplified as aluminum, but the present invention is not limited thereto, and is also made of other materials having excellent thermal conductivity, such as copper. Can be.

In the case of the computer 1 of the first embodiment according to the present invention, it is exemplified that the heat dissipation fans 23 and 25 are formed in the seat plate portion 22 and the right plate portion 24, respectively, but the present invention is limited thereto. In addition, a heat radiation fan may be additionally or generally formed in another plate part as necessary.

In the case of the computer 1 of the first embodiment according to the present invention, since the heat pipes adopt all of the directionality, one end portion of the heat pipe is in contact with the high temperature portion where the temperature is relatively high and the other end portion is the one end portion. Although located at the same or higher position and in contact with the low temperature portion where the temperature is relatively low, the present invention is not limited thereto, and a non-directional heat pipe may be used. In this case, the hot portion does not have to be located at a lower position than the cold portion.

In the case of the computer 1 of the first embodiment according to the present invention, the heating element is exemplified as including the central processing unit 120, the graphics card 140 and the power supply 160, but the present invention is limited thereto. If necessary, other heat generating parts, for example, a hard disk driver 186 may be included, and a heat conducting part using a heat pipe may be provided therein.

In the case of the computer 1 of the first embodiment according to the present invention, the heat conduction unit related to the central processing unit 120 or the graphics card 140 is illustrated as including a heat pipe, but the present invention is not limited thereto. If necessary, other methods may be provided, for example, a heat conduction unit in contact with the central processing unit 120 or the graphics card 140, and the heat may be transferred to the plate unit by directly contacting the inside of the plate unit.

In the case of the computer 1 of the first embodiment according to the present invention, it has been exemplified that the heat conduction portion of the power supply 160 includes an aluminum circuit board 34 constituting the power supply 160. The present invention is not limited thereto, and if necessary, heat may be transferred to the plate by using a heat pipe as in the case of another method, for example, the CPU 120.

In the case of the computer 1 of the first embodiment according to the present invention, it is exemplified that the heat pipe 32f is installed between the heat generating plates 23 and 25 of the seat plate portion 22 and the right plate portion 24. However, the present invention is not limited thereto, and the heat pipe 32f may not be provided as necessary.

In the case of the computer 1 of the first embodiment according to the present invention, the guide rail 40 and the guide member 42 are used to incorporate some of the components into the case, but the present invention is limited thereto. It is not necessary to use other conventionally known methods.

10 to 19 show the computers 1a, 1b and 1c of the second, third and fourth embodiments according to the present invention.

The computer 1a, 1b, 1c of the second, third, and fourth embodiments will be described as a whole by first comparing the computer 1 of the first embodiment, and the computers 1a, 1b, 1c of the second, third, and fourth embodiments. Although the case has a relatively small case compared to the first embodiment, the heat generated from the heating parts included in the case is basically the plate parts forming the case through the heat conduction part without using a cooling fan. The same thing is that it is transmitted and diverted to the outside of the case to cool.

However, since the arrangement of the components included in the case is different, and the overall shape of the seat plate and the right plate portion on which the heat dissipation holes are formed is relatively small, the heat dissipation area is reduced, so that the plate portion does not cause cooling problems. The difference is that the heat dissipation area of the plate is increased by configuring the plate body and the heat sink.

In the following, the computer 1a of the second embodiment is compared with that of the computer 1 of the first embodiment, and will be mainly described. Therefore, the description of the portion where the description is omitted is appropriately applied to the description of the corresponding portion of the first embodiment. In addition, components using the same member numbers as those of the components of the computer 1 of the first embodiment are considered to play a role with the same or equivalent technical configuration.

The computer 1a of the second embodiment according to the present invention is shown in FIG. 10 with a portion of the case virtually removed. FIG. 11 is a schematic exploded perspective view, FIG. 12 is a plan view of the upper plate removed, and FIG. 13 is a schematic cross-sectional view taken along the line A-A of FIG. 10.

The computer 1a of the second embodiment has a case in which heat generating parts are incorporated. The case consists of a plurality of plate portions. The plurality of plate portions are composed of a seat plate portion 22, a right plate portion 24, an upper plate portion 26, a lower plate portion 27, a front plate portion 28a and a rear plate portion 29a. The heat generating part includes a central processing unit 120, a graphic card 140, and a power supply 160, and heat generated from each heat generating part is transferred to the plate parts of the case through each heat conducting part. Radiates out of the case.

The seat plate portion 22 and the right plate portion 24 are similar to the first embodiment. That is, a plurality of heat dissipation fans 23 and 25 are formed to protrude along the longitudinal direction in each of the outer side surfaces, and a heat pipe 32f is provided between the heat dissipation fans 23 and 25. However, unlike the first embodiment, the seat plate portion 22 is not rotatably coupled and is detachably fixed to the other plate portions by screws.

The upper plate portion 26 and the lower plate portion 27 of the case is made of an aluminum material excellent in thermal conductivity. Although not shown in the drawings, the upper plate portion 26 and the lower plate portion 27 may be provided with a plurality of ventilation holes, and may be provided with cable passing holes in the front and rear of each. On the other hand, the upper plate 26 may be provided with a pair of handles (58).

The front plate portion 28a includes a plate body 280 and a heat sink plate 282 made of aluminum material having excellent thermal conductivity.

The plate body 280 of the front plate portion 28a forms an inner space of the case as a flat plate, and is made of a plate relatively thicker than the heat sink plate 282 to secure rigidity of the case. The lower portion of the plate body 280 is provided with a through hole 281 for mounting a device such as a CD ROM, a floppy disk drive, or the like. The right edge of the plate body 280 is provided with a through hole for mounting a device such as a USB port or various memory card readers.

The heat dissipation plate part 282 of the front plate part 28a is a plate member having a flat front and rear surface, and is spaced in parallel with the plate part body 280 to face each other. The heat sink 282 is fixed in a state spaced apart from the plate body 280 by a plurality of spacers 287 disposed between the plate body 280. The spacers 287 are preferably made of a material having excellent thermal conductivity, for example, copper or aluminum. The overall size of the heat sink 282 is slightly smaller in width and length than the plate body 280, so there is no inconvenience in using the device mounted in the through holes.

In addition, the heat sink 282 is thermally connected to the plate body 280 through a heat transfer block 284 made of a material having excellent thermal conductivity such as copper or aluminum to receive heat from the plate body 280. Heat dissipate Although not shown, the plate body 280 and the heat sink 282 may be thermally connected to each other through a heat pipe. In addition, although not shown, the heat dissipation body 280 may be provided with a through hole, and a heat pipe passing through the through hole may thermally connect the heat generating part and the heat dissipation unit 282 inside the case.

The back plate portion 29a includes a plate body 290 and a heat sink 292 made of aluminum material having excellent thermal conductivity.

The plate body 290 of the back plate portion 29a forms an inner space of the case. The through-hole 294 through which the heat pipe 32c mentioned later is provided in the substantially center part of the plate part main body 290 is provided. Cable passing holes 296 are provided at the upper portion of the plate body 290, and although not shown, each cable passing hole 296 is provided with an electromagnetic wave blocking block.

The heat sink plate 292 of the rear plate portion 29a is a plate member having a flat front and rear surface and is spaced in parallel with the plate body 290 to face each other. The heat sink 292 is fixed to the plate body 290 by the spacers 298 as in the case of the front plate 28a described above.

On the other hand, in the case of the computer 1a of the second embodiment, the leg portion 192 is provided on the lower surface of the lower plate portion 27 of the case (see Fig. 11).

The leg portion 192 allows the bottom surface of the case to be spaced apart from the ground on which the case is placed to allow smooth convection of air around the case. The upper portion of the leg 192 is provided with a rotating member 194 rotatably coupled to the body of the leg. By fixing the lower plate part 27 of the case to the rotating member 194, the case is rotatable with the rotating member 194 to help the user's convenience.

The central processing unit 120 of the heat generating component is mounted on the upper end of the main board 110 spaced apart from the seat plate portion 22. A heat conduction unit is provided to transfer a large amount of heat generated as the central processing unit 120 operates to the plate units. In the present embodiment, the heat generated from the central processing unit 120 is transmitted to the plate body 290 and the heat sink 292 of the seat plate 22 and the back plate 29a through the heat conduction unit.

The heat conductive part includes a plurality of heat pipes 32c. In the present embodiment, three pairs of heat pipes 32c are provided, all with two pairs. 12 and 13, a pair of heat pipes 32c1 disposed at an upper end thereof are thermally connected to the central processing unit 120 at one end thereof and a heat generating fan 25 is formed at an outer side thereof. It is thermally connected to the inner surface of the seat plate portion 22, the other pair of heat pipes 32c2 one end is thermally connected to the central processing unit 120 and the other end is the inner surface of the plate body 290 Thermally connected, one end of the pair of heat pipes 32c3 is thermally connected to the central processing unit 120, and the other end is thermally connected to the inner surface of the heat sink 292.

That is, one end of each of the heat pipes 32c1, 32c2, and 32c3 is thermally connected to the central processing unit 120 through one first heat transfer block. Then, the other end of the pair of heat pipes 32c1 is connected to the inner surface of the seat plate part 22 via one second heat transfer block, and the other end of the other pair of heat pipes 32c2 is connected to the other second. It is connected to the inner surface of the plate body 290 through the heat transfer block, the other end of the remaining pair of heat pipes (32c3) is thermally connected to the inner surface of the heat sink portion 292 through another second heat transfer block, respectively It is.

The first heat transfer block includes a first member 320c and a second member 322c, and each of the three second heat transfer blocks includes a first member 324c and a second member 326c. Description of the first and second heating blocks is the same as described above in the first embodiment. However, the pair of heat pipes 32c1 is bent in a U-shape, and the other pair of heat pipes 32c3 passes through the through-holes 294 formed in the plate body 290 of the rear plate portion 29a. It is slightly different in that it is thermally connected to the heat sink part 292 of the part 20a.

The graphic card 140 of the heat generating parts is mounted on the main board 110 spaced apart from and fixed to the inner surface of the seat plate portion 22. A heat conduction part is provided to transfer heat generated as the graphic card 140 operates to the front plate part 28a.

The heat conduction unit includes a heat transfer block 39. One side surface of the heat transfer block is thermally connected to the heating element of the graphic card 140, and the other side is thermally connected to the inner surface of the front plate 28. Since the heat transfer block 39 is made of a material having good thermal conductivity, for example, aluminum or copper, the heat generated from the heat generating parts of the graphic card 140 is transferred to the plate body of the front plate portion 28a through the heat transfer block 39. Is passed to 280. Some of the heat transmitted is radiated from the plate body 280 to the atmosphere, and a portion of the heat is transferred to the heat sink plate 282 through another heat transfer block 284 provided between the plate body 280 and the heat sink plate 282. After being radiated to the atmosphere.

The power supply 160 among the heat generating parts includes an aluminum circuit board 34. One side surface of the aluminum circuit board 34 is coupled to the inner surface of the right plate portion 24 to be in surface contact. As to the aluminum circuit board 34, the above-described descriptions of the first embodiment are applied to the present embodiment.

Further, the computer 1a of the second embodiment includes a guide rail 40 and a guide member for fixing some of the components, for example, components such as the hard disk driver 186, in a desired position inside the case. (42) is provided.

On the other hand, in the case of the computer 1a of the second embodiment, the front plate portion 28a and the rear plate portion 29a are exemplified as having a plate body and a heat sink portion having both flat surfaces, respectively, but the present invention is not limited thereto. In addition, a plurality of heat dissipation beams may be formed on a portion of the outer surface of each of the plate parts or the inner and outer surfaces of the heat dissipation plate as necessary.

On the other hand, in Figs. 14 to 17, the computer 1b of the third embodiment according to the present invention is shown.

When the computer 1b of the third embodiment is compared with the computer 1a of the second embodiment, the seat plate 22b and the right plate 24b of the computer 1b are different from each other in that they have a plate body and a heat sink. . Accordingly, the left and right plate parts 22b and 24b also have different configurations of heat transfer parts for receiving heat from the heat generating parts.

In the following description, the computer 1b of the third embodiment is compared with the computer 1a of the second embodiment, with the main focus on the differences. Therefore, for the description of the omitted portions, the description of the corresponding portions of the computer 1a of the second embodiment is applied. Components that use the same member numbers as those of the components of the computer 1a of the second embodiment are considered to play the same or equivalent technical configurations.

The computer 1b of the third embodiment is shown in FIG. 14 with a portion virtually removed. FIG. 15 is a schematic exploded perspective view, FIG. 16 is a plan view of the upper plate portion removed, and FIG. 17 is a schematic cross-sectional view taken along the line A-A of FIG. 10.

The computer 1b of the second embodiment has a case in which heat generating parts are incorporated. The case consists of a plurality of plate portions. The plurality of plate portions includes a left plate portion 22b, a right plate portion 24b, an upper plate portion 26, a lower plate portion 27, a front plate portion 28a and a rear plate portion 29a. The heat generating part includes a central processing unit 120, a graphic card 140, and a power supply 160, and heat generated from each heat generating part is transferred to the case through a heat conduction part and is emitted to the outside of the case. .

The seat plate portion 22b includes a plate body 224 and a heat sink plate 226 each made of an aluminum material having excellent thermal conductivity.

The plate body 224 is a flat plate member on both sides. The plate body 224 forms the inner space of the case together with the other plate portions, and is made of a plate relatively thicker than the heat sink 226 to secure the rigidity of the case. The plate body 224 is provided with a groove 225 for passing the heat pipe of the heat conduction portion to be described later.

The heat dissipation plate part 226 is a plate member having flat both sides, and faces the plate part body 224 spaced apart in parallel. The heat sink 226 is fixed in a state spaced apart from the plate body 224 by a plurality of spacers 227 disposed between the plate body 224. The spacers 227 are preferably made of a material having excellent thermal conductivity, such as copper or aluminum.

The right plate part 24b includes a plate body 240 and a heat sink plate 242. The heat sink 242 is located outside the plate body 240 and faces the plate body 240 spaced apart. The spacer 247 is disposed between the plate body 240 and the heat sink 242. Since the description of the right plate part 24b is almost the same as the case of the seat plate part 22b mentioned above, further description is abbreviate | omitted. However, the groove 225 provided in the seat plate portion 22b is not provided in the right plate portion 24b.

Regarding the front plate portion 28a and the rear plate portion 29a, the same descriptions as described above in the second embodiment apply.

Also in the case of the computer 1b of the third embodiment, the leg portion 192 is provided as in the second embodiment.

The central processing unit 120 is mounted on the upper end of the main board 110 spaced apart from the seat plate portion 22b. A heat conduction unit is provided to transfer a large amount of heat generated as the central processing unit 120 operates to the plate units. The heat generated by the central processing unit 120 is transferred to the plate body 224 and the heat sink 226 of the seat plate 22b and the plate body 290 and the heat sink 292 of the back plate 29a through the heat conduction unit. Delivered.

In comparison with the case of the second embodiment, the heat generated in the central processing unit 120 is transferred to the plate body 224 and the heat sink 226 of the seat plate portion 22b through the heat pipe, respectively. All configurations except for this are very similar to each other.

That is, referring to FIG. 17, all six heat pipes 32c are provided, and one end of each of them is thermally heated to the central processing unit 120 by a heat transfer block made of first and second members 320c and 322c. Is connected. The other end portions of the upper two heat pipes 32c4 and 32c5 among the six heat pipes 32c pass through the through holes 294 provided in the plate body 290 of the rear plate portion 29a and the heat sink 292. The other ends of the other two heat pipes 32c6 and 32c7 are connected to the plate body 290 of the rear plate part 29a, and one of the other heat pipes 32c8 and 32c9 is connected. The other end of the 32c8 is connected to the heat sink 226 through the groove 225 of the plate body 224 of the seat plate 22b, and the other end of the other heat pipe 32c9 is the seat plate 22b. It is connected to the plate body 224 of. Here, each other end of the heat pipes 32c is thermally connected to each corresponding surface by a heat transfer block composed of first and second members 324c and 326c.

The graphic card 140 of the heat generating parts is mounted on the main board 110 as in the second embodiment, and a heat conduction part is provided to transfer heat generated during operation to the front plate part 28a. The technical configuration of the heat conductive portion is the same as in the second embodiment.

The power supply 160 among the heat generating parts includes an aluminum circuit board 34 constituting the heat conducting portion. One side surface of the aluminum circuit board 34 is surface-contacted and fixed to the inner surface of the plate body 240 of the right plate portion 24b.

On the other hand, the heat sink 242 of the right plate portion 24b is thermally connected to the plate body 240 through the heat pipe 340. As shown in FIG. 15, the heat pipe 340 has a U shape, and one end of the heat pipe 340 is fixed to the outer surface of the plate body 240 through the heat transfer block 342, and the other side is fixed. The end portion is fixed to another inner surface of the heat sink 242 by another heat transfer block 344. At this time, since the heat pipe 340 is directional, the height of one end portion is disposed lower than the height of the other end portion.

Therefore, after the heat generated from the power supply 160 is transferred to the plate body 240 of the right plate portion 24b through the aluminum circuit board 34, some of them are radiated to the atmosphere by natural convection, and the rest Some of the heat is transferred to the heat sink 242 through the heat pipe 340 and then radiated to the atmosphere.

18 and 19 show a computer 1c of a fourth embodiment according to the present invention. 18 is a perspective view of the computer 1c with a portion virtually removed, and FIG. 19 is a schematic exploded perspective view of the computer 1c.

Comparing the computer 1c of the fourth embodiment with the computer 1b of the third embodiment, the computer 1c of the present embodiment has left and right plate portions 22b and 24b and front and rear plate portions 28a and 29a. The plurality of heat dissipation beams 229, 249, 289, and 299 are formed to protrude from the outer surface of each of the heat dissipation parts 226, 242, 282, and 292. In this case, however, the heat dissipation fins are relatively short in protruding length compared with the heat dissipation fins of the first embodiment.

A plurality of heat dissipation fins 229, 249, 289, and 299 formed on each outer surface of the heat dissipating plate parts 226, 242, 282, and 292 in the lengthwise and vertical directions to extend the substantial heat dissipation area, thereby dissipating the heat dissipating fins. It is possible to dissipate a relatively large amount of heat to the atmosphere faster compared to the computer 1b of the third embodiment without the device. Therefore, since the amount of heat generated generally increases as the performance of the computer increases, the computer 1c of the fourth embodiment can be more suitably used when the amount of heat generated is relatively large. Although not shown, when a greater cooling capacity is required, the heat dissipation fins may be formed not only on the outer surface of the heat sink plate parts 226, 242, 282, and 292 but also on the inner surface thereof to further increase the actual heat dissipation area. .

In the case of the computer 1c of the fourth embodiment, the rest of the components except for the heat sinks 226, 242, 282, and 292 are the same as those of the computer 1b of the third embodiment. The above detailed description is omitted.

On the other hand, in Fig. 20, a form modified in relation to the right plate part 24b among the components of the computer 1c of the fourth embodiment is shown.

In the modified embodiment, the heat dissipation fins 248d protruding in the longitudinal direction of the plate portion 240d are formed. Instead of the directional heat pipe 340, a heat pipe 340d having no directivity, also called a micro heat pipe or a meander custom pipe heat pipe, is used. Therefore, the height of one end and the other end of the heat pipe 340d need not be different. The heat pipe 340e is fixed to the outer surface of the plate body 240d and the inner surface of the heat sink 249 through the first heat transfer block 342e and the second heat transfer block 344e, respectively.

As described above, according to the computer according to the present invention, the heat generated from the heat generating parts inside the computer case is transferred to the plate parts constituting the case, and then cooled by using air existing outside the case, thereby cooling the cooling fan. It is possible to cool efficiently without noise without using.

Claims (20)

A computer comprising a plurality of components and a case in which the components are contained, wherein the components include heat generating parts that generate heat during operation. The case consists of a plurality of plate parts, The heat generated from the heat generating parts of at least some of the heat generating parts is transferred to the plate through a heat conducting portion that thermally connects the heat generating parts and the plate portion is emitted to the outside of the case and cooled. The method of claim 1, And a plurality of heat radiation fins protrude from an outer surface of at least one of the plurality of plate portions. The method of claim 1, At least one of the plate portion, the plate portion, characterized in that it comprises a plate body and a heat sink plate which is located on the outer side of the plate body and spaced apart facing the plate body. The method of claim 3, And the heat conducting portion comprises a heat pipe having one end thermally connected to the heat generating part and the other end thermally connected to the heat sink portion. The method of claim 3, And the heat sink is thermally connected to the plate body facing the heat sink through a heat pipe. The method of claim 3, The heat dissipation unit is characterized in that a plurality of heat dissipation fan is formed to protrude. The method according to claim 2 or 6, And a heat pipe between the heat dissipation fans. The method of claim 1, The heating component includes a central processing unit (CPU), And a heat pipe for transferring heat generated from the central processing unit to the plate unit, the heat pipe having one end thermally connected to the central processing unit and the other end thermally connected to the plate unit. The method of claim 8, The heat pipe is provided with a plurality, characterized in that each diameter is 8mm or less. The method of claim 8, And said heat pipe is a micro heat pipe. The method of claim 1, The heating component includes a graphics card, And a heat pipe for transferring heat generated from the graphics card to the plate portion, the heat pipe having one end thermally connected to the central processing unit and the other end thermally connected to the plate portion. The method of claim 8 or 11, wherein the heat conductive portion, A first heat transfer block in contact with one end of the heat pipe and the heat generating component, And a second heat transfer block in contact with the other end of the heat pipe and the plate, respectively. The method of claim 1, The heating component includes a power supply, The heat conduction unit for transferring the heat generated from the power supply to the plate portion, Is provided in the power supply, and thermally connected to at least some of the electrical components that generate heat during operation among the electrical components constituting the power supply, at least some side surface is in surface contact with the inner surface of the plate portion Computer comprising a heat transfer member. The method of claim 13, The heat transfer member is a computer, characterized in that the one side is in surface contact with the inner surface of the plate portion and the other side is an aluminum circuit board mounted with electrical components that generate heat during operation. The method of claim 1, At least one of the plate portion, the computer, characterized in that rotatably coupled to the other plate portion, to open and close the inner space of the case. The method of claim 1, Among the plurality of components, component parts having connection terminals connected by computer cables and peripheral devices located outside the case are included. The connection terminal is located inside the case, At least a portion of the plate portion of the plate portion is a computer, characterized in that a cable through hole through which the connection cable can pass. The method of claim 1, And at least one of the plate portions is provided with an electromagnetic wave blocking block for reducing electromagnetic waves generated by the component from coming out of the case. The method of claim 1, At least one of said plate portions is made of aluminum. The method of claim 1, At least one of the plurality of plate portions, the guide rail coupled to the inner surface, and a guide member coupled to the guide rail so as to slide along the longitudinal direction of the guide rail, At least some of the components are fixed to the guide member. The method of claim 1, And at least one leg in contact with the ground in the case such that the bottom surface of the case is spaced apart from the ground on which the case is placed.