KR20040058840A - An array substrate for Liquid crystal display and method for fabricating the same - Google Patents

Abstract

PURPOSE: An array substrate for an LCD(Liquid Crystal Display) and a manufacturing method thereof are provided to form a metal layer between a driving chip attached to a pad portion of a small LCD panel and a substrate and inscribe the metal layer with an inverse panel ID mark, thereby managing production's record and analyzing badness in field easily. CONSTITUTION: A TFT(Thin Film Transistor), as a switching device, is positioned at a lower substrate. A gate wire and a data wire crossing the TFT are formed. The TFT is comprised of a gate electrode, source and drain electrodes and a semiconductor layer formed on an upper portion of the gate electrode. A pixel region is defined by crossing the gate wire and data wire. A storage capacitor is constructed at a partly upper portion of the gate wire and connected in parallel to a transparent pixel electrode constructed to the pixel region. A panel ID mark(160) capable of tracing the production's record is formed on a metal layer below a driving chip(140) formed on a pad(118) of the LCD panel(130).

Description

An array substrate for liquid crystal display and a method for manufacturing the same {An array substrate for Liquid crystal display and method for fabricating the same}

The present invention relates to an image display device, and more particularly, to an array substrate for a liquid crystal display (LCD) including a thin film transistor (TFT) and a manufacturing method thereof.

In particular, the present invention relates to an array substrate for a liquid crystal display device including a panel ID mark on a pad of a small COG type liquid crystal panel, and a manufacturing method thereof.

In general, the driving principle of the liquid crystal display device uses the optical anisotropy and polarization of the liquid crystal. Since the liquid crystal is thin and long in structure, the liquid crystal has directivity in the arrangement of molecules, and the direction of the molecular arrangement can be controlled by artificially applying an electric field to the liquid crystal.

Accordingly, if the molecular arrangement direction of the liquid crystal is arbitrarily adjusted, the molecular arrangement of the liquid crystal is changed, and light is refracted in the molecular arrangement direction of the liquid crystal due to optical anisotropy to express image information.

Currently, the active matrix liquid crystal display (AM-LCD) in which the above-described thin film transistor and pixel electrodes connected to the thin film transistor are arranged in a matrix manner is attracting the most attention due to its excellent resolution and ability to implement video.

1 is an exploded perspective view schematically illustrating a general liquid crystal display device.

As shown in the drawing, the general color liquid crystal panel 30 includes a black matrix 24 formed between the sub color filter 22 and each of the color filters 22 and a common electrode 26 deposited on the color filter and the black matrix. ) Is formed of an upper substrate 20 on which the upper substrate 20 is formed, a pixel electrode P formed on the pixel region P and a lower substrate 10 on which the switching element T and the array wiring are formed. The liquid crystal 25 is filled between the 20 and the lower substrate 10.

The lower substrate 10 may also be referred to as an array substrate, and the thin film transistor T, which is a switching element, may be positioned in a matrix type, and the gate wiring 12 may cross the plurality of thin film transistors TFT. ) And data wiring 14 are formed.

In this case, the pixel area P is an area defined by the gate wiring 12 and the data wiring 14 intersecting. A transparent pixel electrode 16 is formed on the pixel area P as described above. .

The pixel electrode 16 and the common electrode 26 use a transparent conductive metal having relatively high light transmittance, such as indium-tin-oxide (ITO).

The driving of the liquid crystal panel having the configuration as described above is due to the electro-optical effect of the liquid crystal.

Hereinafter, a structure of a small COG type liquid crystal panel will be described with reference to the accompanying drawings.

2 is a plan view showing a liquid crystal panel of a conventional general small COG method.

Hereinafter, a description will be given with reference to the liquid crystal panel having only one pad as shown in FIG. 2.

The conventional small COG type liquid crystal panel 30 includes an upper substrate 20 and a lower substrate 10 and a liquid crystal layer (not shown) interposed therebetween. In the active region AR1 of the lower substrate 10, a plurality of gate lines 12a are formed in a first direction, and a plurality of data lines 14a are formed in a second direction. Square A1 indicated by a dotted line in the drawing shows the wirings on the lower substrate, which are hidden by the upper substrate. The gate line 12a and the data line 14a in the active region cross each other to define a pixel region (P in FIG. 1), and a gate electrode (not shown) and an active layer ( A thin film transistor (T in FIG. 1) including a source electrode (not shown) and a drain electrode (not shown) is configured.

In addition, a driving chip 40, which is an LCD controller formed of a semiconductor integrated circuit, is formed on the pad 18 of the lower substrate 10. The gate wiring 12b extending from the gate wiring 12a in the active area AR1 is formed. ) And the data line 14b extending from the data line 14a in the active area AR1 are connected to the driving chip 40 as shown in the figure. The driving chip 40 is connected to an external printed circuit board (PCB) (not shown) on which a CPU or the like is mounted through the printed wiring 50.

The conventional small liquid crystal panel 30 as described above has a structure of a COG method having one pad 18 and a driving chip 40 attached thereon, wherein the driving chip 40 has one or more than two. It may be configured as. However, in the liquid crystal panel having the above-described structure, there is no free space for writing a panel ID for managing the history and the like of the liquid crystal panel.

Therefore, it is difficult to manage the production history of the liquid crystal panel, and in particular, when a defect occurs in the field after module assembly, it is not easy to distinguish when the problem liquid crystal panel is manufactured, and thus the problem of failure analysis is not easy. have.

The present invention has been proposed to solve the above-described problem, by forming a metal layer between the drive chip and the substrate attached to the pad portion of the small liquid crystal panel and inscribed the reverse ID panel ID thereon, the production history management of the panel and This is to facilitate the failure analysis in the field.

1 is an exploded perspective view schematically illustrating a general liquid crystal display device.

Figure 2 is a plan view showing a liquid crystal panel of a conventional general small COG method.

3 is a plan view showing a liquid crystal panel of a small COG method according to the present invention.

4 is an enlarged plan view of a portion A2 of FIG. 3.

5 is an enlarged plan view of a portion B of FIG. 3;

6A to 6G are cross-sectional views illustrating a process of manufacturing an array substrate of a small COG type liquid crystal panel according to the present invention, as cut lines V-V of FIG. 4 and cut lines VI-VI of FIG.

7A to 7B illustrate a method of writing an ID of a liquid crystal panel according to the present invention.

8 is a view showing a structure in which a small COG type liquid crystal panel according to the present invention is mounted in a mobile telephone.

<Explanation of symbols for the main parts of the drawings>

100: substrate 112a, 112b: gate wiring

114a, 114b: Data wiring 118: Pad

130: liquid crystal panel 140: driving chip

160: panel ID mark 170: photoresist

190: Laser Equipment

According to an aspect of the present invention, there is provided an array substrate for a liquid crystal display device comprising: a substrate including a pad; A plurality of gate lines formed in a first direction of the substrate and a plurality of data lines formed in a second direction; A driving chip electrically connected to the plurality of gate lines and the plurality of data lines; And an ID mark formed on the metal layer between the pad and the driving chip.

The number of pads is one.

The metal layer may be formed of the same material as the gate line and the gate line at the same time.

The metal layer is formed of the same material as the data line and formed simultaneously with the data line.

A method of manufacturing an array substrate for a liquid crystal display device according to the present invention is a liquid crystal display device comprising a driving chip for driving a liquid crystal panel and a panel ID mark for identification of the liquid crystal panel.

Preparing a substrate having a pad; Forming a metal layer using a conductive metal material on the substrate; Forming a photoresist layer on the metal layer; Exposing and developing the photoresist layer using a mask having a transmissive portion and a blocking portion; Removing the metal layer exposed by the developed photoresist; Removing the developed photoresist to form a gate electrode and a plurality of gate wirings on the substrate and simultaneously forming a panel ID metal layer for the panel ID mark on the pad; Forming the panel ID mark on the panel ID metal layer; And sequentially forming a first insulating layer, a semiconductor layer, a source and a drain electrode, a data wiring, a second insulating layer, and a pixel electrode on the substrate on which the gate electrode, the gate wiring, and the panel ID mark are formed.

According to another aspect of the present invention, there is provided a method of manufacturing an array substrate for a liquid crystal display device, the method including: a driving chip for driving the liquid crystal panel and a panel ID mark for identifying the liquid crystal panel;

Preparing a substrate having a pad; Forming a gate electrode and a plurality of gate wirings using a conductive metal material on the substrate; Forming a first insulating layer on the substrate on which the gate electrode and the gate wiring are formed; Forming a semiconductor layer on the gate electrode; Forming a photoresist layer on the semiconductor layer and the first insulating layer; Exposing and developing the photoresist layer using a mask having a transmissive portion and a blocking portion; Removing the metal layer exposed by the developed photoresist; Removing the developed photoresist to form a plurality of data lines with source and drain electrodes on the substrate, and simultaneously forming a panel ID metal layer for the panel ID mark on the pad; Forming the panel ID mark on the panel ID metal layer; And sequentially forming a second insulating layer and a pixel electrode on the source and drain electrodes, the data line and the substrate on which the panel ID mark is formed.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

3 is a plan view showing a liquid crystal panel of a small COG type according to the present invention.

The liquid crystal panel 130 according to the present invention includes an upper substrate 200, a lower substrate 100, and a liquid crystal layer (not shown) disposed between the upper and lower substrates 200 and 100. The dotted line A2 shown in the drawing shows wirings on the lower substrate 100 that are not covered by the upper substrate 200. As illustrated, a plurality of gate lines 112a formed in the first direction cross the plurality of data lines 114a formed in the second direction and vertically in the active region AR2 to define a pixel area. The thin film transistor (T in FIG. 4) is formed near the intersection point between the wiring 112a and the data wiring 114a. The thin film transistor includes a gate electrode (not shown), an active layer (not shown), a source and a drain electrode (not shown), the gate electrode is connected to the gate wiring 112a, and the source electrode is the data. It is connected to the wiring 114a.

The liquid crystal panel 130 has one pad 118, and a driving chip 140 is formed on the pad 118. Gate lines 112b and data lines 114b extending from the gate and data lines 112a and 114a in the active area AR2 are connected to the driving chip 140, respectively, and the driving chip 140 Is connected to an external printed circuit board (PCB, not shown) on which a CPU or the like is mounted.

Unlike the conventional small COG type liquid crystal panel, the liquid crystal display device 130 according to the present invention includes a panel ID mark 160 formed of a metal layer under the driving chip 140.

4 is an enlarged plan view of a portion A2 of FIG. 3.

As shown, the thin film transistor T, which is a switching element, is positioned on the lower substrate 100, and the gate wiring 112a and the data wiring 114a intersecting the thin film transistor T are formed.

The thin film transistor T includes a gate electrode 123, a source electrode 141, a drain electrode 143, and a semiconductor layer 136 formed on the gate electrode.

An area defined by the intersection of the gate line 112a and the data line 114a is defined as a pixel area P. FIG.

A storage capacitor C is formed on a portion of the gate line 112a and is connected in parallel with the transparent pixel electrode 161 formed in the pixel area.

FIG. 5 is an enlarged plan view of a portion B of FIG. 3. As described above, in the present invention, a panel ID mark 160 capable of tracking the production history of the liquid crystal panel is formed on the metal layer under the driving chip 140 formed on the pad 118 of the liquid crystal panel 130. have. Hereinafter, a method of manufacturing a liquid crystal display according to the present invention having such a panel ID mark will be described with reference to the accompanying drawings.

6A to 6G are cross-sectional views illustrating a manufacturing process of an array substrate of a small COG type liquid crystal panel according to the present invention, as cut lines V-V of FIG. 4 and cut lines VI-VI of FIG.

First, as shown in FIG. 6A, first, a conductive metal such as aluminum (Al), chromium (Cr), and molybdenum (Mo) is deposited on the substrate 100.

Subsequently, as shown in FIG. 6B, a photoresist (hereinafter referred to as “PR”) is coated on the deposited metal layer 123a to form a PR layer 170.

Next, as shown in FIG. 6C, the mask 180 including the blocking portion M1 and the transmitting portion M2 is positioned on the substrate 100 on which the PR layer 170 is formed, and then the light is placed above the mask. Is irradiated to expose the PR layer 170. The blocking unit M1 may correspond to a region where a gate electrode formed in a later process is located, and the transflective unit corresponds to another region.

When the partially exposed PR layer 170 is developed, as shown in FIG. 6D, the PR layer 170 has a portion N2 from which the entire portion is removed, and the remaining portion N1 remains.

The process of removing the exposed metal layer 123a between the PR layers developed in the shape described above is performed.

As illustrated in FIG. 6E, the metal layer 123a exposed between the patterned PR layers 170a and 170b may be removed by wet etching or dry etching.

As shown in FIG. 6E, a process of ashing, that is, dry etching, the PR layers 170a and 170b is performed in a continuous process to expose the metal layers 123 and 160.

Through the above-described process, as shown in 6f, the gate electrode 123 and the panel ID mark metal layer 160 are formed.

Next, as illustrated in FIG. 6G, the ID of the liquid crystal panel may be engraved using the laser 190 on the panel ID mark metal layer 160.

In the above-described process, only the formation of the metal layer 160 for the gate electrode 123 metal panel ID mark is described. However, the plurality of gate wires 112a and 112b of FIG. 3 are also formed at the same time as the gate electrode 123. do.

Next, in order to complete the array substrate of the liquid crystal panel 130 according to the present invention, as illustrated in FIG. 6H, the gate electrode 123 and the panel ID mark 160 are oxidized on the substrate 100. An inorganic insulating film such as silicon (SiO 2) or silicon nitride (SiNx) is deposited to form a first insulating layer 125.

Next, a pure amorphous silicon layer and an amorphous silicon layer doped with impurities thereon are formed on the first insulating layer and patterned to form a semiconductor layer 136 on the gate electrode.

Next, by depositing and patterning the above-described conductive metal on the semiconductor layer 136, a plurality of data wirings perpendicularly intersecting with the plurality of gate wirings 112a and 112b of FIG. 3. The source electrode 141 which is composed of three portions 114a and 114b and protrudes from the data line 114a in a portion adjacent to the gate electrode 123 to partially overlap with the active layer, and is spaced apart from the predetermined distance. The drain electrode 143 is formed.

Next, a protective layer 146 having a drain contact hole formed on the drain electrode by depositing and patterning a transparent organic insulating film such as benzocyclobutene (BCB) and acrylic resin (resin) on the drain electrode. And a pixel electrode 148 on the passivation layer.

The lower substrate 100 configured as described above is bonded to the upper substrate (not shown) by a failure turn (not shown) formed along the edge of the lower substrate 100.

7A to 7B illustrate a method of writing an ID of a liquid crystal panel according to the present invention. In the process of FIG. 6G, when the panel ID is processed by the laser 190, the ID of the panel is engraved in reverse phase as shown in FIG. 7A. Because the driving chip 140 is attached to the substrate on the panel ID mark after the panel ID is written on the panel ID mark metal layer 160, the driving chip 140 is disposed in the front direction of the liquid crystal panel. This is because the panel ID cannot be identified. Therefore, the panel ID numbers or letters are inscribed in reverse, and when the driving chip 140 is attached, the panel ID can be normally confirmed as shown in FIG. 7B by looking through the transparent glass substrate on the back of the liquid crystal panel.

In the above-described embodiment, the panel ID mark metal layer 160 is formed at the same time as the gate electrode and the gate wiring are formed of the same material as the gate electrode and the gate wiring, but the panel ID mark is formed using the data wiring material. It may be formed at the same time when the wiring is formed. In this case, however, the gate metal material under the panel ID mark metal layer 160 should be etched.

8 is a view showing a structure in which a small COG type liquid crystal panel according to the present invention is mounted in a mobile phone. As illustrated, the driving chip 140 of the liquid crystal panel 130 is connected to the printed circuit board 195 on which the central processing unit is mounted through the printed wiring 150. Finally, the liquid crystal panel and the printed circuit board 195 are mounted in a mobile phone case (not shown).

When the liquid crystal panel according to the present invention having the aforementioned panel ID mark is applied, even in a small COG type liquid crystal display device, the panel ID can be checked at any time during or after the production of the liquid crystal panel. It is easy to manage and has an effect of easy defect analysis in the field.

Claims (8)

A substrate comprising a pad; A plurality of gate lines formed in a first direction of the substrate and a plurality of data lines formed in a second direction; A driving chip electrically connected to the plurality of gate lines and the plurality of data lines; A metal layer formed between the pad and the driving chip and having an ID mark formed thereon Array substrate for a liquid crystal display device comprising a. The method of claim 1, And the number of said pads is one. The method of claim 1, And the metal layer is formed of the same material as the gate line and simultaneously with the gate line. The method of claim 1, And the metal layer is formed of the same material as the data line at the same time as the data line. A liquid crystal display device comprising a driving chip for driving a liquid crystal panel and a panel ID mark for identifying the liquid crystal panel. Preparing a substrate having a pad; Forming a metal layer using a conductive metal material on the substrate; Forming a photoresist layer on the metal layer; Exposing and developing the photoresist layer using a mask having a transmissive portion and a blocking portion; Removing the metal layer exposed by the developed photoresist; Removing the developed photoresist to form a gate electrode and a plurality of gate wirings on the substrate and simultaneously forming a panel ID metal layer for the panel ID mark on the pad; Forming the panel ID mark on the panel ID metal layer; Sequentially forming a first insulating layer, a semiconductor layer, a source and a drain electrode, a data wiring, a second insulating layer, and a pixel electrode on the substrate on which the gate electrode, the gate wiring, and the panel ID mark are formed. Method of manufacturing an array substrate for a liquid crystal display device comprising a. The method of claim 5, wherein And the number of said pads is one. A liquid crystal display device comprising a driving chip for driving a liquid crystal panel and a panel ID mark for identifying the liquid crystal panel. Preparing a substrate having a pad; Forming a gate electrode and a plurality of gate wirings using a conductive metal material on the substrate; Forming a first insulating layer on the substrate on which the gate electrode and the gate wiring are formed; Forming a semiconductor layer on the first insulating layer corresponding to the gate electrode; Forming a metal layer using a conductive metal material on the semiconductor layer and the first insulating layer; Forming a photoresist layer on the semiconductor layer and the first insulating layer; Exposing and developing the photoresist layer using a mask having a transmissive portion and a blocking portion; Removing the metal layer exposed by the developed photoresist; Removing the developed photoresist to form a plurality of data lines with source and drain electrodes on the substrate, and simultaneously forming a panel ID metal layer for the panel ID mark on the pad; Forming the panel ID mark on the panel ID metal layer; Sequentially forming a second insulating layer and a pixel electrode on the source and drain electrodes, the data line and the substrate on which the panel ID mark is formed. Method of manufacturing an array substrate for a liquid crystal display device comprising a. The method of claim 7, wherein And the number of said pads is one.