KR20040050887A - 무전해 금도금 용액 - Google Patents

무전해 금도금 용액 Download PDF

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Publication number
KR20040050887A
KR20040050887A KR1020030089798A KR20030089798A KR20040050887A KR 20040050887 A KR20040050887 A KR 20040050887A KR 1020030089798 A KR1020030089798 A KR 1020030089798A KR 20030089798 A KR20030089798 A KR 20030089798A KR 20040050887 A KR20040050887 A KR 20040050887A
Authority
KR
South Korea
Prior art keywords
gold
gold plating
electroless gold
plating solution
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020030089798A
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English (en)
Korean (ko)
Inventor
이와이료타
도쿠히사도모아키
가토마사루
Original Assignee
간토 가가꾸 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 간토 가가꾸 가부시키가이샤 filed Critical 간토 가가꾸 가부시키가이샤
Publication of KR20040050887A publication Critical patent/KR20040050887A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
KR1020030089798A 2002-12-10 2003-12-10 무전해 금도금 용액 Withdrawn KR20040050887A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00357720 2002-12-10
JP2002357720A JP2004190075A (ja) 2002-12-10 2002-12-10 無電解金めっき液

Publications (1)

Publication Number Publication Date
KR20040050887A true KR20040050887A (ko) 2004-06-17

Family

ID=32588106

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030089798A Withdrawn KR20040050887A (ko) 2002-12-10 2003-12-10 무전해 금도금 용액

Country Status (5)

Country Link
US (1) US7022169B2 (https=)
JP (1) JP2004190075A (https=)
KR (1) KR20040050887A (https=)
CN (1) CN1506494A (https=)
TW (1) TW200416299A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100933243B1 (ko) * 2004-09-17 2009-12-22 신꼬오덴기 고교 가부시키가이샤 무전해 금 도금 공정 및 금층 형성 공정
KR101444687B1 (ko) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
KR101996915B1 (ko) * 2018-09-20 2019-07-05 (주)엠케이켐앤텍 카보닐 산소를 갖는 퓨린 또는 피리미딘계 화합물을 함유하는 치환형 무전해 금 도금액 및 이를 이용한 치환형 무전해 금 도금 방법
KR102041850B1 (ko) * 2019-04-08 2019-11-06 (주)엠케이켐앤텍 인쇄회로기판의 구리표면에 무전해 팔라듐 도금을 실시하기 위한 전처리 공정으로 금스트라이크 도금방법, 도금액 조성물 및 전처리 후의 무전해 팔라듐 도금과 무전해 금도금 방법

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4603320B2 (ja) * 2003-10-22 2010-12-22 関東化学株式会社 無電解金めっき液
CN1981347A (zh) * 2004-07-15 2007-06-13 积水化学工业株式会社 导电性微粒、导电性微粒的制造方法、和各向异性导电材料
JP5526462B2 (ja) * 2006-04-18 2014-06-18 日立化成株式会社 無電解金めっき液及び無電解金めっき方法
JP5026107B2 (ja) * 2007-02-23 2012-09-12 関東化学株式会社 無電解金めっき液およびそれを用いためっき方法
JP4758470B2 (ja) * 2008-12-18 2011-08-31 シャープ株式会社 突起電極の形成方法及び置換金めっき液
JP5370886B2 (ja) * 2009-03-10 2013-12-18 関東化学株式会社 金微細構造体形成用無電解金めっき液およびこれを用いた金微細構造体形成方法ならびにこれを用いた金微細構造体
CN102376863A (zh) * 2010-08-06 2012-03-14 晶元光电股份有限公司 发光元件的制造方法
TWI507672B (zh) * 2013-05-29 2015-11-11 Univ Nat Yang Ming 檢測試紙的製造方法、使用方法以及用於該製造方法之藥物組合
EP2845922A1 (en) * 2013-09-04 2015-03-11 Rohm and Haas Electronic Materials LLC Electroless metallization of dielectrics with alkaline stable pyrimidine derivative containing catalysts
CN103540973A (zh) * 2013-09-24 2014-01-29 沈阳建筑大学 一种用于芯片和线路板热沉的电镀金液及使用方法
KR20180051630A (ko) * 2015-12-18 2018-05-16 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 금 도금 용액
JP6607811B2 (ja) * 2016-03-11 2019-11-20 マクセルホールディングス株式会社 メッキ部品の製造方法、メッキ部品、触媒活性妨害剤及び無電解メッキ用複合材料
ES2834877T3 (es) * 2018-01-26 2021-06-21 Atotech Deutschland Gmbh Baño de enchapado en oro electrolítico
JP7219120B2 (ja) * 2019-03-04 2023-02-07 Ｅｅｊａ株式会社 電解金めっき液及びその製造方法、並びに金めっき方法及び金錯体
CN115710701B (zh) * 2022-12-22 2024-12-10 广东东硕科技有限公司 一种化学镀金液和应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
JPH03294484A (ja) 1990-04-13 1991-12-25 Hitachi Ltd 無電解金めっき液
JP3148427B2 (ja) 1992-11-13 2001-03-19 関東化学株式会社 無電解金めっき液
JP4116718B2 (ja) * 1998-11-05 2008-07-09 日本リーロナール有限会社 無電解金めっき方法及びそれに使用する無電解金めっき液
JP2001192886A (ja) 2000-01-06 2001-07-17 Ne Chemcat Corp 金−錫合金電気めっき浴
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100933243B1 (ko) * 2004-09-17 2009-12-22 신꼬오덴기 고교 가부시키가이샤 무전해 금 도금 공정 및 금층 형성 공정
KR101444687B1 (ko) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
KR101996915B1 (ko) * 2018-09-20 2019-07-05 (주)엠케이켐앤텍 카보닐 산소를 갖는 퓨린 또는 피리미딘계 화합물을 함유하는 치환형 무전해 금 도금액 및 이를 이용한 치환형 무전해 금 도금 방법
US11142826B2 (en) 2018-09-20 2021-10-12 Mk Chem & Tech Co., Ltd Substitution-type electroless gold plating solution containing purine or pyrimidine-based compound having carbonyl oxygen and substitution-type electroless gold plating method using the same
KR102041850B1 (ko) * 2019-04-08 2019-11-06 (주)엠케이켐앤텍 인쇄회로기판의 구리표면에 무전해 팔라듐 도금을 실시하기 위한 전처리 공정으로 금스트라이크 도금방법, 도금액 조성물 및 전처리 후의 무전해 팔라듐 도금과 무전해 금도금 방법

Also Published As

Publication number Publication date
TW200416299A (en) 2004-09-01
JP2004190075A (ja) 2004-07-08
US20040118317A1 (en) 2004-06-24
US7022169B2 (en) 2006-04-04
CN1506494A (zh) 2004-06-23

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20031210

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid