KR20030097701A - Pattern inspection apparatus - Google Patents

Abstract

A pattern inspection apparatus which realizes a pattern inspection apparatus for automatically inspecting inspection by transmitted light, and at the same time, provides a pattern inspection apparatus which automatically inspects inspection by reflected light and inspection by transmitted light in one apparatus.

In the pattern inspection apparatus which image | photographs the pattern formed in the film-shaped strip | belt-shaped workpiece | work 1, and examines the external appearance of this pattern, 1st illumination means irradiated from one surface side of the said strip | belt-shaped workpiece | work 1 (6), the 2nd illumination means 7 irradiated from the other surface side of the said strip | belt-shaped workpiece | work, and the one or the other surface of the said strip | belt-shaped workpiece 1 are arrange | positioned, and image | photographed the said strip | belt-shaped workpiece | work It is characterized by including the imaging means 8 and the workpiece | work holding means 22 which provide a tension in the width direction of the said strip | belt-shaped workpiece | work.

Description

Pattern inspection device {PATTERN INSPECTION APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern inspection apparatus, and in particular, a pattern inspection for automatically inspecting a circuit pattern such as an integrated circuit formed on a TAB tape by irradiating illumination light from above and below a tape automated bonding (TAB) tape by a tape carrier method. Relates to a device.

In the semiconductor device, lead fining and micronization are progressing in response to the demand for high integration and high density mounting. Since it is advantageous to this polyfinization and micronization, the method of connecting a semiconductor chip with many lead wires provided in the film-type TAB tape is employ | adopted.

It is a figure which shows a part of film-like TAB tape.

In the figure, the TAB tape 101 is a metal foil, such as copper foil, affixed onto a film of an organic compound having a thickness of about 20 to 150 μm and a width of about 35 to 165 mm. The inside of the TAB tape 101 is larger than the outer diameter of the semiconductor chip. A large opening 102 is provided, and a circuit pattern for electrically connecting the semiconductor chip to an external circuit or the like is formed around the opening 102. One end of the circuit pattern is directed inward from the side of the opening 102 in order to connect with the semiconductor chip, and a flying lead 103 is formed in which the lead is exposed in the air. The other end of the circuit pattern is an external circuit. In order to connect with the back and the like, an outer lead 104 is formed which is exposed outward from the side of the opening 102.

A protective film such as a photo solder resist 105 is applied to the circuit pattern between the portion of the flying lead 103 at the periphery of the opening 102 and the outer lead 104.

In the manufacturing process of this TAB tape 101, it is determined whether the circuit pattern of each part of the said flying lead 103, the part of the outer lead 104, and the part of the photo solder resist 105 is formed correctly. It is necessary to inspect and the pattern inspection apparatus is used.

The pattern inspection apparatus irradiates the TAB tape 101 to be inspected with illumination light, detects the state of the circuit pattern with the imaging device or the eye, and determines whether the circuit pattern is good or not by comparing with the reference pattern.

For example, whether a protective film such as the photo solder resist 105 is accurately formed at a predetermined location, is not scratched, etc., is not formed at an unnecessary place, or is there any unevenness or dirt of wiring plating, etc. The light is reflected and inspected. In this case, the TAB tape 101 is held on a stage having a good plan view, irradiated with illumination light from above the TAB tape 101, and a circuit pattern image by the reflected light is provided on the TAB tape 101. The image is processed by imaging. The image of the circuit pattern processed is compared with the circuit pattern as a reference, and the quality is determined.

On the other hand, missing, disconnection, short, expansion, etc. of a circuit pattern wiring are examined by the illumination light by transmitted light. In particular, the circuit pattern of the portion to which the protective film such as the photo solder resist 105 is coated is irradiated with illumination light from the upper side of the TAB tape 101, and the circuit pattern image by the reflected light is picked up by the imaging device and image processed. , Contrast cannot be detected and cannot be detected. Therefore, normally, when detecting the circuit pattern of the part in which the protective film, such as the photo solder resist 105, was apply | coated, illumination light was irradiated from the lower side of the TAB tape 101, and it transmitted by the transmitted light which permeate | transmitted the TAB tape 101. The circuit pattern image is picked up by the imaging device provided above the TAB tape 101, and image processing is performed.

Therefore, in order to test one TAB tape, two types of inspection apparatuses are required: an inspection apparatus having an illumination device for illuminating the TAB tape from above and an inspection apparatus having an illumination device for illuminating the TAB tape from below. I am doing it.

As inspection apparatus which irradiates and inspects a workpiece | work from the upper and lower directions, for example, Unexamined-Japanese-Patent No. 11-312241 and 2001-21333 are known.

By using the inspection apparatus as shown in the above known art, two kinds of inspection apparatus are not necessary.

However, the TAB tape tester has the following problems, and the tester as described above has not been realized.

When imaging the reflected light or the transmitted light from a TAB tape with an imaging device, if the position which examines a TAB tape is not in the depth of focus range of an imaging device, it will become blurred and cannot be inspected. Therefore, as described above, when inspected by the reflected light, the TAB tape is held and inspected by vacuum adsorption or the like on a stage having a good plan view.

However, in the case where the inspection is to be performed by transmission, illumination from the bottom cannot be performed while the TAB tape is held on the stage. Therefore, the method of applying a tension and maintaining a plane by the mechanism which conveys a tape without using a stage can be considered.

Usually, when conveying a TAB tape in a test | inspection apparatus or an exposure apparatus, a TAB tape is clamped between rollers and conveyed by rotating a roller. In these apparatuses, the roller for conveyance is provided in the conveyance downstream, and a brake roller is provided in the upstream, and is conveyed so that meandering or slip may not generate | occur | produce. The tension along the conveyance direction is given to TAB tape by the action of this conveyance roller and a brake roller.

However, the warpage of the TAB tape in the width direction (orthogonal to the conveying direction) is not corrected only by adding the tension in the conveying direction of the TAB tape in this manner.

In the TAB tape, a metal film having a different expansion coefficient or the like is formed on the surface of a film-type tape substrate which is a resin, and is heat treated. Therefore, warpage often occurs in the width direction of the tape.

In addition, with the tension only in the conveyance direction, it is not possible to prevent the vertical vibration of the tape due to the vibration of the apparatus or the like. When the warp and the vibration in the tape width direction become larger than the depth of focus of the imaging device, the captured image is in a blurred state, and image processing cannot be performed, and it is impossible to determine whether the circuit pattern is good or not.

Therefore, when the circuit pattern on the TAB tape is inspected by the transmitted light, it is difficult to realize the automatic inspection device by performing image processing using the imaging device. Therefore, the transmitted light is visually observed to prevent the tape from bending or vibrating. Therefore, a method of inspecting while adjusting the focus manually has been adopted.

That is, the inspection by the reflected light can be inspected by the automatic inspection apparatus, but the inspection by the transmitted light cannot be inspected by the automatic inspection apparatus, and the inspection apparatus which combines the inspection by the reflected light and the transmitted light is realized. It is not.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to realize a pattern inspection apparatus for automatically inspecting inspection by transmitted light, and at the same time, a pattern inspection apparatus which automatically inspects inspection by reflected light and inspection by transmitted light by one device. To provide.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention employ | adopted the following means.

1st means is a pattern inspection apparatus which image | photographs the pattern formed in the film-shaped strip | belt-shaped workpiece | work, and examines the external appearance of this pattern, The illumination means which irradiates from one surface side of the said strip | belt-shaped workpiece, and the said strip | belt-shaped workpiece | work It is provided with the imaging means which is arrange | positioned at the other surface side of the said band-shaped workpiece | work, and the workpiece holding means which gives tension in the width direction of the said band-shaped workpiece | work, It is characterized by the above-mentioned.

As for a 2nd means, in a 1st means, the said imaging means is provided so that a movement to the width direction of the said strip | belt-shaped workpiece | work is possible with the said illumination means at the time of imaging. It is characterized by the above-mentioned.

The third means is a pattern inspection apparatus for imaging a pattern formed on a film-shaped band-shaped work and inspecting the appearance of the pattern, wherein the first lighting means is irradiated from one surface side of the band-shaped work, and the 2nd illumination means irradiated from the other surface side of a strip | belt-shaped workpiece | work, imaging means arrange | positioned at one or the other surface side of the said strip | belt-shaped workpiece, and tension | tensile_strength in the width direction of the strip | belt-shaped workpiece | work It is characterized by comprising a work holding means for providing a.

As for a 4th means, in a 3rd means, the said imaging means is provided so that it can move to the width direction of the said strip | belt-shaped workpiece | work with the said 1st illumination means and the 2nd illumination means at the time of imaging. It features.

1 is a perspective view showing the configuration of a test apparatus according to the present invention;

FIG. 2 is an enlarged cross-sectional view of portions of the fall lighting device 6, the transparent lighting device 7, and the imaging device 8 in the inspection device shown in FIG.

3 is a perspective view showing a tensioning mechanism in the width direction of the TAB tape 1 in the inspection apparatus shown in FIG. 1;

4 is an enlarged perspective view of a part of the actuator 15 for grip shown in FIG. 3;

5 is a diagram showing a control relationship with each part of the inspection apparatus controlled by the control apparatus installed in the pattern inspection apparatus;

FIG. 6 is a view showing a state in which the image capturing pattern is captured while the imaging device 8 moves in the width direction of the TAB tape 1 in the state illuminated by the fall lighting device 6;

7 is a view showing a state in which the imaging device 8 picks up the inspection target pattern while the imaging device 8 moves in the width direction of the TAB tape 1 in the state illuminated by the transmissive illumination device 7;

8 is a diagram showing a procedure of pass / fail determination in the pattern inspection apparatus according to the present embodiment;

9 is a view for explaining acceptance judgment;

It is a figure which shows a part of TAB tape of a film form.

<Description of Symbols for Main Parts of Drawings>

1: TAB tape 2: Transport roller

3: brake roller 4: tape roller

5: test pattern 6: a fall lighting device

61: LED 62: filter

63: lens 7: transmission lighting device

8: imaging device 81: CCD line sensor

9: Observation window 10: Base plate

11: slide plate 12: motor

13: ball screw 14: frame

15: actuator for grip 151: motor

152: inclined member 153: rotation moving member

16: Upper member for grip 17: Lower member for grip

18: Actuator for slide 19: Slide plate

20: slide plate stopper 21: control device

22: tape tensioning mechanism 23: tape conveying mechanism

24: defective punch mechanism 25: master data

An embodiment of the present invention will be described with reference to FIGS. 1 to 9.

1 is a perspective view showing the configuration of a test apparatus according to the invention of the present embodiment.

In the same figure, 1 is a TAB tape, 2 is a conveyance roller provided in the conveyance downstream of an imaging position, 3 is provided in the conveyance upstream of an imaging position, and it is attached to the TAB tape 1 with the conveyance roller 2 in it. Brake rollers which are tensioned in the conveying direction and conveyed without meandering or slipping, 4 are tape rollers, 5 are inspected patterns at the imaging position, and 6 are arranged above the TAB tape 1 A fallen fall lighting device, 7 is a transmissive lighting device disposed under the TAB tape 1, 8 is irradiated by the fall lighting device 6, and reflected light from the TAB tape 1 and a transmitting lighting device 7 ) Is an image pickup device for imaging the inspection pattern 5 on the TAB tape 1 by receiving light transmitted from the TAB tape 1, and 9 is an upper portion of the cover covering the fall lighting device 6. Installed in the chamber, and during the inspection, the reflected light or transmitted light from the TAB tape (1) Observation window for passing through the device 8, 10 is the base plate, 11 is the fall lighting device 6, the transmission lighting device 7 and the frame supporting the image pickup device 8 integrally constitute a base plate ( 10) slide plate provided to be movable in the width direction of the TAB tape (1), 12 is the motor, 13 is rotated by the drive of the motor 12 to move the slide plate 11 the width of the TAB tape (1) The ball screw 14 for moving in the direction is integrally comprised with the slide plate 11, and is a frame which supports the fall lighting device 6, the transmissive lighting device 7, and the imaging device 8. As shown in FIG.

FIG. 2 is an enlarged cross-sectional view of portions of the fall lighting device 6, the transmissive lighting device 7, and the imaging device 8 in the inspection device shown in FIG.

In the figure, 61, 62, and 63 are respectively provided in the cover of the fall lighting device 6, the LED, the filter, the lens, and 81 are installed in the imaging device 8, and the longitudinal axis direction of the TAB tape 1 It is a CCD line sensor provided so that it may follow a conveyance direction.

As shown in the figure, the fall illumination device 6 irradiates the illumination light from above the TAB tape 1, reflects the light irradiated onto the TAB tape 1 from its surface, and the observation window 9. It inputs to the CCD line sensor 81 of the imaging device 8 via the said power supply.

On the other hand, the LED, the filter, and the lens similar to the fall lighting device 6 are also provided in the transmissive lighting device 7, and the transparent lighting device 7 irradiates the illumination light from the lower side of the TAB tape 1, and the TAB tape ( The light irradiated to 1) is transmitted through the TAB tape 1 and input to the CCD line sensor 81 of the imaging device 8 through the observation window 9.

FIG. 3: is a perspective view which shows the tensioning mechanism of the width direction of the TAB tape 1 used as a workpiece holding means in the test | inspection apparatus shown in FIG.

In the figure, 15 is provided on both sides of the TAB tape 1, and the grip actuator which operates between the TAB tape 1, 16, 17 is a grip for sandwiching the TAB tape 1 between them. Upper member and lower member for grip, 18 is a slide actuator for driving the slide plate 19 to apply tension in the width direction of the TAB tape 1, 19 is an upper member 16 for grip and a lower member for grip The slide plate 20 which supports 17 and is driven by the slide actuator 18 is a slide plate stopper.

FIG. 4 is an enlarged perspective view showing a part of the grip actuator 15 shown in FIG. 3.

In the figure, 151 is a motor, 152 is an inclined member which is movable in the arrow direction a by the rotational movement of the motor 151, 153 is mounted on the upper member 16 for grip and at the same time the inclined member 152 It is a rotational movement member which rotates an image and moves the upper side member 16 for grips up and down in the arrow direction b of illustration.

In the state where the TAB tape 1 is being conveyed, the upper member 16 for grip is raised, and the upper member 16 for grip is inclined during tape conveyance along with the lower member 17 for pin and the pin. It acts as a tape guide to prevent. When the inspection position of the TAB tape 1 moves to the imaging position, the conveyance of the TAB tape 1 is stopped, and as shown in FIG. 4, the motor 151 of the grip actuator 15 is driven to grip The upper member 16 is lowered. When the upper member 16 for grip is lowered, the TAB tape 1 is sandwiched and held between the upper and lower members 17 for grip. In that state, as shown in FIG. 3, by operating the slide actuator 18, the upper member 16 for grips and the lower member 17 for grips integrally comprised with the slide plate 19 are TAB. The tape 1 is moved in the width direction of the TAB tape with the tape 1 sandwiched therebetween. Thereby, tension can be added to the TAB tape 1 in the width direction of the TAB tape 1, and the TAB tape 1 can be maintained in a good plan view.

Next, the procedure of the inspection operation | movement of the pattern inspection apparatus which concerns on this embodiment is demonstrated using FIGS.

FIG. 5: is a figure which shows the control relationship with each part of the inspection apparatus controlled by the control apparatus provided in the pattern inspection apparatus, The control apparatus 21 is the imaging device 8, the fall lighting apparatus 6, The control signal is transmitted and controlled to the tape tensioning mechanism 22, the transmissive illumination device 7, the tape conveyance mechanism 23, the defective product punch mechanism 24, and the like at a predetermined timing of the inspection operation. The master device 25 which is a reference | standard of a pattern test | inspection is input into the control apparatus 21 previously, and there are two types of master data 25 which are used for fall illumination and the transmission light.

First, the tape conveyance mechanism 23 is driven by the control unit 21, the TAB tape 1 is conveyed, and the test pattern 5 stops at the imaging position. Next, the tension is added in the width direction of the tape while the peripheral portion of the TAB tape 1 is sandwiched between the upper member 16 for grip and the lower member 17 for grip of the tape tensioning mechanism 22.

Next, as shown to Fig.6 (a), illumination light is irradiated to the test | inspection pattern on TAB tape 1 by the fall lighting device 6. The reflected light from the inspection pattern is received by the CCD line sensor 81 of the imaging device 8.

Next, as shown in FIG. 6 (b), the frame 14 moves in the width direction of the TAB tape 1 while being illuminated by the fall lighting device 6. As a result, the fall illumination device 6 and the imaging device 8 both move in the width direction of the TAB tape 1, and the other edge (at one edge A of the TAB tape 1) is moved. Scanning toward B), the to-be-tested pattern between the edge A of the TAB tape 1 and the edge B is imaged in the imaging device 8. The information of the to-be-tested pattern image | photographed is memorize | stored in the control part 21 corresponding to the position of the tape width direction.

When the imaging by the imaging device 18 reaches the edge B of the TAB tape 1, the illumination by the fall lighting device 6 is stopped, and as shown in FIG. 7 (a), the transmission lighting device ( 7), illumination light is irradiated to the inspection pattern on the TAB tape 1, and transmitted light transmitted through the inspection pattern is received by the CCD line sensor 81 of the imaging device 8.

Next, as shown in FIG. 7B, the frame 14 moves in the width direction of the TAB tape 1 while being illuminated by the transmissive lighting device 7. As a result, both the transmissive illumination device 7 and the imaging device 8 move in the width direction of the TAB tape 1, and move one edge A from the other edge B of the TAB tape 1. Scanning is performed, the inspection pattern between the edge B of the TAB tape 1 and the edge A is imaged in the imaging device 8. The information of the to-be-tested pattern image | photographed is memorize | stored in the control part 21 corresponding to a position in the width direction of a tape as before.

When the imaging by the imaging device 8 reaches the edge A of the TAB tape 1, the illumination by the transmissive lighting device 7 is stopped, and the tape conveyance mechanism 23 is driven again, so that the TAB tape 1 ) Is conveyed, and the new inspection pattern 5 is controlled to stop at a predetermined imaging position.

As described above, the information (reflected illumination image) by the reflected light of the pattern under test on the TAB tape 1 obtained by the reciprocating movement of the imaging device 8 and the transmitted light (transmission illumination image) as described above. The two pieces of information of) are compared with each master data 25 stored in the control device 21 to determine whether the two pieces of information are determined.

Next, the procedure of the quality judgment in the pattern inspection apparatus which concerns on this embodiment is demonstrated using FIG. 8 and FIG.

As shown in FIG. 8, the fall-off illumination image and the transmission illumination image are acquired by the image acquisition process mentioned above. Initially, the fall illumination image and the master data 1 for fall illumination are image compared, and then the transmission illumination image and the master data 2 for transmission illumination are image compared. Subsequently, a good or bad product is judged according to the result of the image comparison of both.

In both image comparisons, when there is no defect (defect) in both, it is determined as good quality, the TAB tape 1 is conveyed, the next inspection position is inspected, and the next image is obtained.

As a result of both image comparisons, when there is a defect in any one of the image comparisons, the fallen illumination image and the transmitted illumination image are compared at the position where the defect is found. For example, FIGS. 9 (a) and 9 (b) show a state in which garbage (foreign matter) is attached on the protective tape of the TAB tape and an expansion state in the wiring pattern, respectively, and FIGS. 9 (c) and (d). As shown in the figure, when the expansion of the pattern is seen in the transmission illumination image, it is determined only by this, as shown in Figs. 9 (c) and 9 (d), whether the pattern is expanded or if there is garbage on the back surface. Can not. As shown in Fig. 9 (e, f), according to the fall-off illumination image, when there is garbage on the back side, the pattern is not seen to be expanded, and only when the pattern is actually expanded, the pattern is seen to be expanded. .

Therefore, in the transmission illumination image, if the expansion of the pattern is not seen and if the expansion of the pattern is not seen in the falloff illumination image, it is not the expansion of the pattern but is treated as rubbish on the protective film adhered to the back side, and its size or position Determines whether the range is acceptable. Also in the fall illumination image, if the expansion of the pattern is seen, it is treated as the expansion of the pattern, and judging whether or not the size or position is within the allowable range is judged.

If it is determined that the defect is not defective, the TAB tape is conveyed, the next inspection position is inspected, and if it is determined that the defect is defective, the processing for the defective article punch is performed, and the TAB tape is conveyed, and the next inspection position is inspected.

As described above, according to the invention of the present embodiment, by providing a tape tensioning mechanism, the bending and vibration of the tape can be suppressed to the range of the depth of focus of the imaging position without providing a stage for adsorbing and holding the TAB tape. It becomes possible. As a result, even the inspection by the transmitted light can realize the automatic inspection using the imaging device.

In addition, since the inspection by the reflected light and the inspection by the transmitted light can be performed automatically by one apparatus, it is possible to make efficient inspection and inspection of the defective part precisely by image processing and comparing each inspection result. do.

According to invention of Claim 1, the pattern inspection apparatus which image | photographs the pattern formed in the film-shaped strip | belt-shaped workpiece | work, and examines the external appearance of this pattern, The illumination means irradiated from one surface side of the said strip | belt-shaped workpiece, and the said strip | belt Pattern inspection which is arrange | positioned at the other surface side of a shape workpiece | work, the imaging means which image | photographs the said strip | belt-shaped workpiece | work, and the workpiece | work holding means which gives a tension in the width direction of the said strip | belt-shaped workpiece | work, and inspects the inspection by transmitted light automatically It becomes possible to realize the device.

According to the invention as set forth in claim 2, the imaging means is provided so as to be movable in the width direction of the strip-shaped workpiece together with the illumination means at the time of imaging. Constant lighting can always be achieved.

According to invention of Claim 3, the pattern inspection apparatus which image | photographs the pattern formed in the film-shaped strip | belt-shaped workpiece | work, and examines the external appearance of this pattern, WHEREIN: 1st illumination means irradiated from one surface side of the said strip | belt-shaped workpiece | work, and 2nd illumination means irradiated from the other surface side of the said strip | belt-shaped workpiece | work, the imaging means arrange | positioned at one side or the other surface side of the said strip | belt-shaped workpiece, and the width | variety of the said strip | belt-shaped workpiece | work It is possible to realize the pattern inspection apparatus which is provided with the workpiece | work holding means which gives tension in a direction, and which automatically inspects the inspection by reflected light and the inspection by transmitted light in one apparatus.

According to invention of Claim 4, the said imaging means is provided so that it can move to the width direction of the said strip | belt-shaped workpiece | work with the said 1st illumination means and the 2nd illumination means at the time of image pick-up, In addition, illumination light can always be uniformly obtained from a 1st lighting means or a 2nd lighting means with respect to a to-be-tested pattern.

Claims (4)

In the pattern inspection apparatus which image | photographs the pattern formed in the film-form strip | belt-shaped workpiece | work, and inspects the external appearance of this pattern, Illumination means for irradiating from one surface side of the strip-shaped workpiece, imaging means for imaging the strip-shaped workpiece, and a workpiece provided with tension in the width direction of the strip-shaped workpiece, disposed on the other surface side of the strip-shaped workpiece. A pattern inspection apparatus comprising a holding means. The method of claim 1, The said imaging means is provided so that the movement to the width direction of the said strip | belt-shaped workpiece with the said illumination means at the time of imaging is possible, The pattern inspection apparatus characterized by the above-mentioned. In the pattern inspection apparatus which image | photographs the pattern formed in the film-form strip | belt-shaped workpiece | work, and inspects the external appearance of this pattern, 1st illumination means irradiated from one surface side of the said strip-shaped workpiece | work, 2nd illumination means irradiated from the other surface side of the said strip | belt-shaped workpiece, and one or the other surface side of the said strip | belt-shaped workpiece, are arrange | positioned, And a workpiece holding means for applying a tension in the width direction of the belt-shaped workpiece, and a pattern holding device for imaging the belt-shaped workpiece. The method of claim 3, The said imaging means is provided so that the movement to the width direction of the said strip | belt-shaped workpiece | work is possible with the 1st illumination means and the 2nd illumination means at the time of imaging.