KR200272893Y1 - cool and hot combined bed mat heat exchange system - Google Patents

cool and hot combined bed mat heat exchange system Download PDF

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KR200272893Y1
KR200272893Y1 KR2020020001068U KR20020001068U KR200272893Y1 KR 200272893 Y1 KR200272893 Y1 KR 200272893Y1 KR 2020020001068 U KR2020020001068 U KR 2020020001068U KR 20020001068 U KR20020001068 U KR 20020001068U KR 200272893 Y1 KR200272893 Y1 KR 200272893Y1
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heat exchanger
cold
bed
mat
pipe
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KR2020020001068U
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Korean (ko)
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김재오
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주식회사 하이원
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Abstract

본 고안은 냉온겸용침대매트열교환장치에 관한 것인데,일반적인 침대매트에 사용하고 있는 발열매체는 전기패널이나 발열시트,히팅파이프(heating pipe)등에 의하여 침대바닥을 가온시켰었다.상기와 같은 발열매체에 의해서는 열효율및 이동성은 뛰어나지만 인체에 유해한 전자파에 노출되고 전기누전으로 인한 위험성이 상존한다.또한 기름이나 가스보일러에 의한 온수액슬파이프에 의한 온돌이나 침대의 발열매체도 있었으나, 설비장치비가 많이 들며 고정설치되어 이동성이 떨어진다.The present invention relates to a heat exchange device for a combined cold and hot bed, the heating medium used in the general bed mat was heated the bed bottom by an electrical panel, a heating sheet, a heating pipe (heating pipe). Although it has excellent thermal efficiency and mobility, it is exposed to electromagnetic waves harmful to the human body and there is a risk of electric leakage.Also, there was a heating medium of ondol or bed by hot water axle pipe by oil or gas boiler, but it cost a lot of equipment. Fixed installation inferior mobility

이에 본 고안에서는 직류전원의 극성을 역상으로 절환시켜 반도체의 한쪽극성이 냉각이나 온열되는 특성을 이용한 냉온겸용침대매트열교환장치로서, 소형으로 열교환장치수납박스(8)내에 내장해 침대매트(9)에 냉온수를 공급할수 있어서, 그 설치와 휴대가 간편하였으며, 주 동력원을 직류화 하여 누전에 의한 피해를 최소화 하고, 특히 전자파에 의한 피해를 줄일수 있는 유용한 고안인 것이다.Accordingly, in the present invention, the bed mat heat exchanger is a cold / double bed mat exchanger using the characteristic that one polarity of the semiconductor is cooled or heated by switching the polarity of the DC power in reverse phase. It is easy to install and carry, because it can supply cold and hot water, and it is a useful design that can minimize the damage caused by short circuit and reduce the damage caused by electromagnetic waves.

Description

냉온겸용침대매트열교환장치{cool and hot combined bed mat heat exchange system}Cool and hot combined bed mat heat exchange system

본 고안은 냉온겸용침대매트열교환장치에 관한 것으로,특히 반도체냉각온열소자의 냉온상태를 열교환기로 전달하고 열교환기내의 물을 순환모터를 이용해 옥이나 흙침대용매트내부로 순환시켜 여름에는 시원하게 겨울에는 따뜻한 냉온겸용침대매트열교환장치에 관한 것이다.The present invention relates to a heat exchanger for a combined cold and hot bed, in particular, to transfer the cold and cold state of the semiconductor cooling thermal element to the heat exchanger, and to circulate the water in the heat exchanger to the inside of the jade or earth bed mat using a circulation motor to cool in summer and warm in winter It relates to a cold and hot double bed mat heat exchanger.

일반적인 침대매트에 사용하고 있는 발열매체는 전기패널이나 발열시트,히팅파이프(heating pipe)등에 의하여 침대바닥을 가온시켰었다.The heating media used in the general bed mats were heated by the electric panel, the heating sheet, or the heating pipe.

상기와 같은 발열매체에 의해서는 열효율 및 이동성은 뛰어나지만 인체에 유해한 전자파에 노출되고 전기누전으로 인한 위험성이 상존한다.The heat generating medium is excellent in thermal efficiency and mobility, but is exposed to electromagnetic waves harmful to the human body, and there is a risk of electric leakage.

또한 기름이나 가스보일러에 의한 온수액슬파이프에 의한 온돌이나 침대의 발열매체도 있었으나, 설비장치비가 많이 들며 고정설치되어 이동성이 떨어진다.In addition, there was a heating medium of the ondol or bed by the hot water axle pipe by oil or gas boiler, but the installation cost is high and the mobility is poor because it is fixedly installed.

이를 위해 본 고안의 선행기술로 실용신안출원 제2000-0007266호 물을 이용한 냉온겸용장판을 고안한바 있었다.To this end, as a prior art of the present invention has been devised a cold and hot combined plate using Utility Model Application No. 2000-0007266 water.

상기 선행기술에 의해서는 액슬파이프내로 순환되는 냉온수에 의한 냉온겸용장판으로 사용되어 전자파의 염려는 덜수있었으나, 역시 이동성이 불편하고 보일러와 아이스팩 등을 수납하는 부대장치의 규모가 적지 않았으며,냉온사용방법이 복잡하며, 특히 아스팩을 별도로 얼려 사용해야하는 불편이 있었다.According to the prior art, it was used as a cold and hot mixed plate by cold and hot water circulated into the axle pipe, so that there was less concern about electromagnetic waves, but also the mobility was inconvenient and the scale of the auxiliary device for storing the boiler and the ice pack was not small. The method is complicated, especially the inconvenience of having to use separately frozen aspack.

본 고안은 상기와 같은 점을 감안하여, 종래에 비하여 콘트롤박스를 소형으로 제작될수 있도록, 공지의 반도체냉각온열소자를 이용해 냉온상태를 열교환기로 전달하고 열교환기내의 물을 순환모터를 이용해 옥이나 흙침대용매트내부로 순환시켜 여름에는 시원하게 겨울에는 따뜻하게 하는 냉온겸용침대매트열교환장치을 제공하고자 하는 것이다.In view of the above, the present invention provides a compact control box in comparison with the prior art, using a known semiconductor cooling and heating element to transfer the cold and hot state to the heat exchanger, and the water in the heat exchanger using the circulating motor for jade or earth The purpose of the present invention is to provide a heat exchange device for a combined cold / hot bed mat that circulates inside the mat for bed and cools in the summer and warms in the winter.

또한, 냉온소자의 동력원을 직류화시켜 전기누전을 최소화 시켜, 이동성과 경제성을 향상시켰으며, 전기패널이나 발열시트를 사용하지않아 전자파에 노출될 염려를 줄이며,별도의 부가장치 없이 냉온을 겸용할수 있는 침대매트열교환장치를 제공하고자 하는 것이다.In addition, by minimizing the electric leakage by directing the power source of the cold and warm element, it improved the mobility and economical efficiency, reduces the risk of exposure to electromagnetic waves by not using the electric panel or the heating sheet, and can combine the cold and hot without additional equipment. It is to provide a bed mat heat exchanger.

도 1은 본 고안의 열교환장치사시도1 is a perspective view of a heat exchange device of the present invention

도 2는 본 고안의 열교환장치분해사시도Figure 2 is an exploded perspective view of the heat exchanger device of the present invention

도 3은 본 고안에 따른 사용상태 참고도3 is a reference state of use according to the present invention

도 4는 본 고안에 따른 장치배관도4 is a device piping diagram according to the present invention

※도면의 주요 부분에 대한 부호의 설명※ Explanation of code for main part of drawing

1:열교환기본체 1':열교환그릴1: heat exchanger base 1 ': heat exchanger grill

2:열교환기커버 2':조립나사2: Heat exchanger cover 2 ': Assembly screw

3:순환모터니플 4:회수용액슬파이프니플3: Circulating motor nipple 4: Recovery axle pipe nipple

5;5':반도체냉각온열소자 6;6':방열판5; 5 ': semiconductor cooling thermal element 6; 6': heat sink

7;7':팬 8:열교환장치수납박스7; 7 ': Fan 8: Heat exchanger storage box

8':수납박스뚜껑8 ': storage box lid

8a:콘트롤박스 8b:통기공8a: Control Box 8b: Aerator

8c:경첩 8d:전원코드8c: Hinge 8d: Power Cord

8e:배출관 8f:회수관8e: exhaust pipe 8f: recovery pipe

9:침대매트 10:순환모터9: bed mat 10: circulation motor

11:보충수탱크 11a:공기배출구11: Refill water tank 11a: Air outlet

11b:뚜껑 12:직류전원공급기11b: lid 12: DC power supply

상기와 같은 점을 감안하여 이하 첨부된 도면에 의하여 본 고안의 일실시 구성및 작용을 알아보면 다음과 같다.In consideration of the above-mentioned point, one embodiment configuration and operation of the present invention by the accompanying drawings as follows.

도 1은 본 고안의 열교환장치사시도,도 2는 본 고안의 열교환장치분해사시도,도 3은 본 고안에 따른 사용상태 참고도,도 4는 본 고안에 따른 장치배관도로서,도 1 및 도 2에 도시된바와 같이 지그재그형의 열교환그릴(1')의 일편관로와 관통된 순환모터니플(3)과 지그재그형의 열교환그릴(1')의 타편관로와 관통된 회수용액슬파이프니플(4)이 조립된 열교환기본체(1)의 상측부에 조립나사(2')로 조립한 열교환기커버(2)의 각 상하면에는 공지의 반도체냉각온열소자(5;5'),방열판(6;6'),팬 (7;7')을 순서대로 부착조립하되 상기 순환모터니플(3)에는 순환모터(10)를 회수용액슬파이프니플(4)에는 상부에 뚜껑(11b)과 그 측근에 공기배출구(11a)가 형성된 보충수탱크(11)를 조립하는 것이다.1 is a perspective view of the heat exchanger of the present invention, Figure 2 is an exploded perspective view of the heat exchanger of the present invention, Figure 3 is a reference state of use according to the present invention, Figure 4 is a device piping view according to the present invention, Figures 1 and 2 As shown, the one-pipe conduit of the zigzag-type heat exchanger grill 1 'and the perforated circulation motor nipple 3 and the other conduit of the zigzag-shaped heat exchanger grill 1' and the perforated recovery liquid pipe nipple 4 The upper and lower surfaces of the heat exchanger cover 2 assembled with the assembling screw 2 'on the upper side of the assembled heat exchange base body 1 are known semiconductor cooling and heating elements 5 and 5' and heat sinks 6 and 6, respectively. '), The fan (7; 7') in order to attach and assemble the circulation motor nipple (3) in the circulation motor 10, the recovery liquid pipe nipple (4) in the upper lid (11b) and the air in the vicinity It is to assemble the replenishment water tank 11 in which the outlet 11a is formed.

한편, 도 3및 도 4에 도시된바와 같이 상기의 반도체냉각온열소자(5;5')을 냉온상태로 절환할수 있도록, 전원코드(8d)의 교류전원을 직류로 공급하기 위한 직류전원공급기(12)를 인입시키며, 반도체냉각온열소자(5;5')에 공급되는 직류전원의 극성을 역상으로 절환시켜 냉각온열상태로 바꾸기 위한 절환스위치와 온도를 조절하기 위한 상승,하강,외출모드 스위치를 콘트롤박스(8a)에 부착해 수납박스뚜껑(8')에 부착한다.Meanwhile, as shown in FIGS. 3 and 4, the DC power supply for supplying the AC power of the power cord 8d to DC in order to switch the semiconductor cooling thermal elements 5 and 5 'to a cold temperature state ( 12) and switch the switch for changing the polarity of DC power supplied to the semiconductor cooling thermal element (5; 5 ') to reverse phase and changing it to the state of cooling and heating, and the up, down and out mode switch for adjusting the temperature. Attached to the control box 8a, it is attached to the storage box lid 8 '.

한편, 열교환기본체(1)에 조립된 순환모터(10)에는 침대매트(9)로 인입되는 배출관(8e)을 보충수탱크(11)에는 침대매트(9)로 부터 인출되는 회수관(8f)이 배관장치된다.On the other hand, the circulation pipe 10 assembled to the heat exchange main body 1 has a discharge pipe 8e drawn into the bed mat 9 and a recovery pipe 8f drawn out from the bed mat 9 in the supplement water tank 11. ) Is plumbed.

본 고안에 따른 반도체냉각온열소자(5;5'),방열판(6;6'),팬 (7;7')을 순서대로 부착조립된 열교환기본체(1)및 열교환기커버(2)와 순환모터(10),보충수탱크(11)와 직류전원공급기(12)는 열교환장치수납박스(8) 바닥에 설치하며, 상부뚜껑에는 콘트롤박스(8a)와 통기공(8b)이, 열교환장치수납박스(8) 측면에는 회수관(8f) 및 배출관(8e)이 형성된 것이다.The heat exchange base body (1) and the heat exchanger cover (2), which are assembled and assembled with the semiconductor cooling thermal elements (5; 5 '), the heat dissipation plates (6; 6'), and the fans (7; 7 ') according to the present invention in order. The circulation motor 10, the supplementary water tank 11, and the DC power supply 12 are installed at the bottom of the heat exchanger storage box 8, and the control box 8a and the vent hole 8b are provided on the upper lid, and the heat exchanger The recovery box 8f and the discharge pipe 8e are formed at the side of the storage box 8.

이와 같이 구성된 본 고안의 일실시 작용으로는 먼저, 열교환기본체(1)와 열교환기커버(2)의 상하면에 반도체냉각온열소자(5;5'),방열판(6;6'),팬(7;7')을 순서대로 부착조립된 열교환장치와 순환모터(10)와 보충수탱크(11)및 직류전원기(12)는 열교환장치수납박스(8)내부에 설치하며, 상기 반도체냉각온열소자(5;5')에 공급되는 직류전원의 극성을 역상으로 절환시켜 냉각온열상태로 바꾸기 위한 전자부품으로 이루어진 콘트롤박스(8a)에는 냉각,온열절환스위치와 절환된 온도를 조절하기 위한 상승,하강,외출모드스위치가 수납박스뚜껑(8')에 부착하는데, 배출관(8e)과 회수관 (8f)이 배설된 침대매트(9)의 온도조절은 반도체소자의 한쪽은 온열이 되고, 다른 한쪽은 냉열이 되는 기능을 이용한 공지의 반도체냉각온열소자(5;5')를 이용해 열교환기본체(1)내의 지그재그형 열관환그릴(1')내부에 물을 냉각시키거나 온열시켜 침대매트(9)를 냉각시키거나 온열시키게 된다.One embodiment of the present invention configured as described above, first, the semiconductor cooling thermal element (5; 5 '), the heat radiation plate (6; 6'), the fan (top and bottom of the heat exchange base body 1 and the heat exchanger cover 2) The heat exchanger, the circulation motor 10, the supplemental water tank 11, and the DC power supply 12, each of which is assembled with the 7; 7 ') in order, are installed in the heat exchanger storage box 8, and the semiconductor cooling and heating element (5; 5 ') control box (8a) consisting of electronic components for changing the polarity of the DC power supplied to the reverse phase to change the cooling heat state state, the cooling, thermal switching switch and the rising, falling to adjust the temperature switched The go-out mode switch is attached to the storage box lid 8 ', and the temperature control of the bed mat 9 in which the discharge pipe 8e and the recovery pipe 8f are disposed is heated on one side of the semiconductor element and the other on the other side. Jig in the heat exchange body (1) using a known semiconductor cooling thermal element (5; 5 ') using a function of cooling heat Geuhyeong gwanhwan heat thereby to cool the water to as to draw the inner (1 ') or thermal cooling of the mattress (9) or heat.

때문에 기존처럼 침대매트(9)내에 전기패널이나 발열시트와 같이 직접 전열기가 배시되지 않아 전자파에 의한 노출염려가 줄어드는 것이다.Therefore, as in the conventional mat mat (9), such as an electric panel or a heating sheet is not directly disposed in the heater is less likely to be exposed to electromagnetic waves.

본 고안에 따른 방열판(6;6')과 팬(7;7')의 작용은 열교환기본체(1)와 열교환기커버(2)에 접촉된 한쪽 반도체소자가 냉열이 될때, 다른쪽 반도체소자면이 온열이 되기 때문에 냉각효과를 한층 올리기 위해, 설치된 것이다.The action of the heat sink (6; 6 ') and the fan (7; 7') according to the present invention is that when one semiconductor element in contact with the heat exchange base (1) and the heat exchanger cover (2) becomes cold heat, the other semiconductor element Since the cotton is heated, it is installed to further increase the cooling effect.

한편, 보충수탱크(11)에는 공기배출구(11a)가 형성되어 있어,배출관(8e)과 침대매트(9),회수관(8f)과 열교환기본체(1)내부의 온수나 냉수가 순환될때 내부의 공기를 배출시키거나 압력을 저감시켜 물의순환을 원활히 시키는 작용을 한다.On the other hand, the replenishment water tank 11 is formed with an air outlet 11a, when the hot water or cold water inside the discharge pipe 8e and the bed mat 9, the recovery pipe 8f and the heat exchange base 1 is circulated. It acts to smooth out the circulation of water by releasing the air inside or reducing the pressure.

한편, 증발에 의해 냉수나 온수의 양이 부족하면 보충수탱크(11)의 뚜껑 11b)을 통해 온수나 냉수를 보충시킬수 있게 되며, 수납박스뚜껑(8')의 통기공(8b)은 열교환장치수납박스(8)내부의 공기흐름을 유지하여 공기배출구(11a)에 의한 수분등이 증발되더라도 외부와 통기성을 유지하여 내부에 습기를 저감시키도록 하는것이다.On the other hand, if the amount of cold water or hot water is insufficient due to evaporation, the hot water or cold water can be replenished through the lid 11b of the replenishment water tank 11, and the vent hole 8b of the storage box lid 8 'is a heat exchanger. By maintaining the air flow inside the storage box (8), even if the moisture by the air outlet (11a) evaporates to maintain moisture and the outside to reduce the moisture inside.

이와 같이 구성된 본 고안은 반도체냉각온열소자(5;5')에 공급되는 직류전원의 극성을 역상으로 절환시켜 반도체의 한쪽극성이 냉각이나 온열되는 특성을 이용한 냉온겸용침대매트열교환장치로서, 소형으로 열교환장치수납박스(8)내에 내장해 침대매트(9)에 냉온수를 공급할수 있어서, 그 설치와 휴대가 간편하였으며, 주 동력원을 직류화 하여 누전에 의한 피해를 최소화 하고, 특히 전자파에 의한 피해를 줄일수 있는 유용한 고안인 것이다.The present invention configured as described above is a cold and hot mat mat heat exchanger using the characteristic that one polarity of the semiconductor is cooled or heated by switching the polarity of the DC power supplied to the semiconductor cooling thermal element (5; 5 ') in reverse phase. It is built in the heat exchanger storage box (8) and can supply cold and hot water to the bed mat (9), which is easy to install and carry.The main power source is DC to minimize the damage caused by short circuit, especially the damage caused by electromagnetic waves. It is a useful design that can be reduced.

Claims (2)

지그재그형의 열교환그릴(1')의 일편관로와 관통된 순환모터니플(3)과 지그재그형의 열교환그릴(1')의 타편관로와 관통된 회수용액슬파이프니플(4)이 조립된 열교환기본체(1)의 상측부에 조립나사(2')로 조립한 열교환기커버(2)의 각 상하면에는 공지의 반도체냉각온열소자 (5;5'),방열판(6;6'),팬 (7;7')을 순서대로 부착조립하되 상기 순환모터니플(3)에는 순환모터(10)를 회수용액슬파이프니플(4)에는 상부에 뚜껑(11b)과 그 측근에 공기배출구(11a)가 형성된 보충수탱크(11)를 조립함을 특징으로 하는 냉온겸용침대매트열교환장치.Heat exchange in which the one-way pipe of the zigzag heat exchanger grill 1 'and the circulated motor nipple 3 and the other-side pipe of the zigzag heat exchanger grill 1' and the perforated recovery axle pipe nipple 4 are assembled. The upper and lower surfaces of the heat exchanger cover 2 assembled with the assembling screw 2 'on the upper part of the basic body 1 are known semiconductor cooling elements 5 and 5', heat sinks 6 and 6 ', and fans. (7; 7 ') in order to assemble in order, but the circulation motor nipple (3) for the circulation motor 10, the recovery fluid pipe nipple (4) in the upper lid (11b) and the air outlet (11a) in the vicinity Combined cold water mat mat heat exchanger, characterized in that assembling the replenishment water tank (11). 제1항에 있어서, 반도체냉각온열소자(5;5')는 냉온상태로 절환할수 있도록, 전원코드(8d)의 교류전원을 직류로 공급하기 위한 직류전원공급기(12)를 인입시키며, 반도체냉각온열소자(5;5')에 공급되는 직류전원의 극성을 역상으로 절환시켜 냉각온열상태로 바꾸기 위한 절환스위치와 온도를 조절하기 위한 상승,하강,외출모드 스위치를 콘트롤박스(8a)에 부착해 수납박스뚜껑(8')에 부착함을 특징으로 하는 냉온겸용침대매트열교환장치.2. The semiconductor cooling thermal element (5; 5 ') draws in a DC power supply (12) for supplying an AC power of the power cord (8d) to a direct current so as to be switched to a cold state. A switch for switching the polarity of the DC power supplied to the heating elements 5 and 5 'to the reverse phase and changing it into a cooling and heating state and a rising, falling and outgoing mode switch for adjusting the temperature are attached to the control box 8a. Hot and cold bed mat heat exchanger, characterized in that attached to the storage box lid (8 ').
KR2020020001068U 2002-01-14 2002-01-14 cool and hot combined bed mat heat exchange system KR200272893Y1 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726190B1 (en) * 2005-03-17 2007-06-11 비엔디코리아(주) Heating mat using a warm water
KR101101866B1 (en) * 2009-07-28 2012-01-05 (주) 글로벌오디피 Cool and hot water supplying apparatus of mattress
KR101238236B1 (en) * 2011-02-23 2013-03-04 성창식 Heat medium supply device for mat cooling and heating
KR101457018B1 (en) 2013-06-21 2014-10-31 (주)메덱스 Boiler for both heating and cooling
KR101458422B1 (en) * 2013-02-19 2014-11-07 백효정 Cold and Hot water creation module and its boiler also its mat
KR101814499B1 (en) * 2015-12-23 2018-01-05 (주) 존인피니티 Boiler for supplying cold and hot water

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726190B1 (en) * 2005-03-17 2007-06-11 비엔디코리아(주) Heating mat using a warm water
KR101101866B1 (en) * 2009-07-28 2012-01-05 (주) 글로벌오디피 Cool and hot water supplying apparatus of mattress
KR101238236B1 (en) * 2011-02-23 2013-03-04 성창식 Heat medium supply device for mat cooling and heating
KR101458422B1 (en) * 2013-02-19 2014-11-07 백효정 Cold and Hot water creation module and its boiler also its mat
KR101457018B1 (en) 2013-06-21 2014-10-31 (주)메덱스 Boiler for both heating and cooling
KR101814499B1 (en) * 2015-12-23 2018-01-05 (주) 존인피니티 Boiler for supplying cold and hot water

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