KR200269391Y1 - Integrated Circuit Chip Pack for Contact/Contactless Type Smart Card - Google Patents

Abstract

The present invention relates to an IC chip pack for contact / contactless smart cards that can be used not only on plastic cards but also on other equipment such as mobile communication terminals. The IC chip pack 1 of the present invention has a contact / non-contact including a chip side 10 to which the IC chip 11 is attached and a terminal side 20 on which the terminals C of the IC chip 11 are disposed. An IC chip pack (1) for a smart card, wherein the preliminary terminals (C4, C8) are formed on the terminal side (20) side among the terminals (C) from the IC chip (11). It is characterized in that it is also formed on the side. Preferably, the IC chip pack 1 of the present invention further includes an integrated RF antenna 40, and the terminal of the RF antenna 40 is the chipside 10 side of the preliminary terminals C4 and C8. Are connected to the preliminary terminals C4b and C8b. Preferably, the preliminary terminals C4b and C8b formed on the chip side 10 side of the preliminary terminals C4 and C8 are attached to the plastic card 7 when mounted on the plastic card 7 as one type of smart card. It is connected to the built-in RF antenna 7a. Preferably, the preliminary terminals C4a and C8a formed on the terminal side 20 side of the preliminary terminals C4 and C8 are mounted on the cellular phone 8 as one type of smart card. It is connected to the built-in RF antenna 8a.

Description

Integrated Circuit Chip Pack for Contact / Contactless Smart Card}

(Technology)

The present invention relates to an integrated circuit chip pack (IC chip pack) for contact / contactless smart cards. More specifically, the present invention is compatible with various forms such as not only plastic cards but also mounting to other equipment such as mobile communication terminals. The present invention relates to an IC chip pack for contact / contactless smart card that can be installed and used.

(Background)

A smart card may be defined as a card having an integrated circuit chip (IC chip) having a microprocessor, a card operating system, a security module, a memory, and the like, capable of processing a specific transaction.

Since the concept was first introduced in the financial services field since the concept was proposed as a portable means of microprocessor, smart card has been widely used as a means of remote payment, home banking, and POS system. It is growing rapidly due to changes in the information and communication environment, and its application field is widely applied in various fields such as communication, finance, transportation, and electronic commerce.

Smart cards may be classified into various types according to their classification criteria, but may be classified into contact cards, contactless cards, and combined cards, depending on how data is read from the cards.

The contact card refers to a card in which a card is activated by contacting the contact of the card with the contact of the interface device when the contact card is inserted into an interface device. Contact card has the disadvantage that there is a risk of electric shock or damage due to frequent contact of the contact. There is an advantage that can be used in the fields that require a high level of security and need to perform a specific encryption algorithm in the card.

In the contactless card, the computing and memory elements required for the information processing function are the same as the contact card, but the power supply for driving the IC chip in the card is provided through the electromagnetic coupling of the coils in the card, and the electromagnetic induction for communication with the interface device. A card in the form of a method. This non-contact card has the advantage of being strong in the external environment and less likely to damage the IC chip in the card due to static electricity induced at the contact point because there is no direct contact with the outside, whereas the manufacturing cost of the card and the interface device accommodating it are in contact. The disadvantage is that it is more expensive than the formula. Therefore, the contactless card is widely used for traffic, parking, access control, etc., which is a type of service that directly manipulates or requires less information in the card.

Combi cards and hybrid cards are two types of dual-use cards that support both contact and contactless cards. The two cards have something in common in that they support both contact and contactlessness, but there are differences in their structure.

A hybrid card is a card in which a contact card and a contact card are physically present in a single card. The hybrid card can support both contact and contactless information, whereas a hybrid card can provide independent hardware and software resources for contact and contactless. There is an inefficient aspect.

Combi card is a combination of cards that share the parts that can be shared by the contact / contact card in one card, it can bring the integration effect of heterogeneous applications through internal resource sharing. However, when the shared memory area is damaged, there may be a case where both contact / contactless card functions are paralyzed.

5 is a conceptual diagram of a general combination card. As shown, the combination card 100 is common to the CPU 110, the input / output unit 120, the main storage unit 130 (RAM, ROM, EEPROM), the contactless type to control the entire card in accordance with the control logic 111 A storage unit 140 (EEPROM), an access matrix 150, a wired I / F and logic 160, an RF antenna 170, and the like are used.

These smart cards, including the Combi card, are being standardized by various standardization organizations, and the International Organization for Standardization (ISO) has also established and recommended the basic standards of smart cards (ISO 1816).

6 is a terminal arrangement diagram of an IC chip terminal side applied to a smart card according to the ISO standard. As shown, the IC chip terminal side for the smart card has a total of eight terminals of C1 to C8, C1 is a power supply terminal, C2 is an initialization input terminal, C3 is a clock terminal, C4 is an unused spare terminal, C5 is the ground terminal, C6 is the program voltage terminal (not currently used), C7 is the serial data input / output terminal, and C8 is the unused spare terminal.

Traditionally, smart cards have been generally used in the form of plastic cards such as credit cards. However, smart cards have recently been used in devices other than plastic cards, especially in mobile communication terminals (mobile phones), which are expanding in size. Designs have been proposed.

In particular, a SIM card having a Subscriber Identification Module as a kind of smart card widely applied to a mobile phone using a time division multiple access (GSM) system or an asynchronous code division multiple access (W-CDMA) system. The user's ID number, password, user's identity information, and account information are stored to recognize the user's identity to cope with the user's mobility, the mobility of a terminal such as a mobile phone, and the mobility of a service.

As such, the recent use of smart cards shows that companies that provide different services (eg, credit card companies, banks, telecommunications companies, transportation agencies, etc.) share personally identifiable information about their subscribers with each other. A system that allows a wide range of services to be integrated by using both contact and contactless contacts with only one smart card that has entered information has been widely expanded.If only one smart card is held from the user's point of view, Services are becoming available for contact / contactless use.

However, in the prior art including the invention disclosed in the above-mentioned Patent Publication No. 2000-36900 and Patent Publication No. 2001-99971, the integrated IC chip itself is different from a conventional plastic card (eg, a mobile communication terminal). Since the IC chip is designed and manufactured in either a plastic card form or a mobile phone form, it has a plastic card form. It was practically impossible to use the built-in IC chip in a mobile phone or to use the built-in IC chip in a plastic card.

Therefore, for IC chip manufacturers, the IC chip must be manufactured in various structures to meet the type of IC chip mounting (e.g., plastic card built-in type, mobile phone built-in type, etc.). If you want to use a different type of smart card while you are in possession of a card, you have to prepare a smart card separately because you could not use the new IC chip of the smart card you have already used, which is a waste of resources. It was caused by an enemy factor.

The purpose of the present invention is to provide an IC chip pack for smart cards that can be used in a variety of forms, such as the form of a traditional plastic card or mounted on other equipment, such as a mobile phone, in particular contact and contactless use It is to provide an IC chip pack for a combination card.

1 is a schematic diagram of an exemplary IC chip pack of the present invention,

2 is a schematic cross-sectional view of the C4, C8 terminal portion of an exemplary IC chip pack of the present invention;

Figure 3 is a schematic diagram of an example of applying the exemplary IC chip pack of the present invention to a plastic card,

4 is a schematic diagram of an example in which an exemplary IC chip pack of the present invention is applied to a cellular phone;

5 is a conceptual diagram of a general combination card,

6 is a terminal arrangement diagram of an IC chip terminal side applied to a smart card according to the ISO standard,

<Description of Symbols for Main Parts of Drawings>

1: IC Chip Pack of the Invention 2: Substrate 3: Adhesive

4: first metal layer 5: protective film 6: second metal layer

7: plastic card 7a: RF antenna 8: cell phone

8a: RF antenna 9: perforation line 10: chipside

11: IC chip 20: terminal side

C1, C2, C3, C5, C7: Effective terminal

C4, C4a, C4b, C8, C8a, C8b: spare terminal

30, 30a, 30b: wire 40: RF antenna 50: plastic sheet

According to the present invention, there is provided an IC chip pack for contact / contactless smart card comprising a chip side to which the IC chip is attached and a terminal side on which the terminals of the IC chip are arranged.

According to a feature of the present invention, among the terminals from the IC chip, a preliminary terminal is formed at the chip side as well as being formed at the terminal side.

Preferably, the IC chip pack of the present invention has a built-in RF antenna, the terminal of the RF antenna is connected to the spare terminal of the chip side of the spare terminal.

That is, preferably in the IC chip pack of the present invention, the spare terminal formed on the terminal side of the spare terminals is used for connection with a terminal of an RF antenna embedded in other equipment such as a mobile phone, and the The spare terminal formed on the chip side is used for connection with the RF antenna embedded in a conventional plastic card and / or the RF antenna embedded in the IC chip pack itself.

Hereinafter, an IC chip pack for a contact / contactless smart card according to the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are merely illustrative of the IC chip pack for contact / contactless smart card according to the present invention, it is not intended to limit the scope of the present invention.

1 is a schematic diagram of an exemplary IC chip pack of the present invention, Figure 2 is a schematic cross-sectional view of the C4, C8 terminal portion of an exemplary IC chip pack of the present invention, Figure 3 is a schematic diagram of an example of applying the exemplary IC chip pack of the present invention to a plastic card 4 is a schematic diagram of an example in which an exemplary IC chip pack of the present invention is applied to a cellular phone.

As shown in Fig. 1 and Fig. 2, the IC chip pack 1 for contact / contactless smart cards according to the present invention, like the conventional basic IC chip pack, and the chip side 10 to which the IC chip 11 is attached; And a terminal side 20 on which terminals C of the IC chip 11 are disposed. 1 is a schematic view from the chipside 10 side of an exemplary IC chip pack 1 according to the present invention.

Specifically, the IC chip 11 is die-bonded to the upper surface (chip side: 10) of the substrate 2 (e.g., epoxy tape) by the adhesive 3, and the IC chip 11 is designed for its design. The wires 30 are bonded at the fitting positions, and the bonded wires 30 are electrically bonded to the first metal layer 4 bonded to the bottom surface of the substrate 2 (terminal side 20). The effective terminals C1, C2, C3, C5, and C7 illustrated in the description will be described. The IC chip 11 and the wire 30 are made of a protective film 5 such as epoxy resin. The above-described effective terminals C1, C2, C3, C5, and C7 form a terminal electrically connected to the outside when the IC chip pack 1 of the present invention functions as a contact type.

According to a feature of the present invention, among the terminals C of the IC chip 11, the preliminary terminals C4 and C8 described in the related art are different from the other effective terminals C1, C2, C3, C5, and C7. Similarly, it is formed on the terminal side 20 and also on the chip side 10.

That is, two wires 30a and 30b are bonded to both sides of the preliminary terminal corresponding portion of the IC chip 11, and a pair of wires 30a are connected to the terminal side 20 like the other wires 30. The first preliminary terminals C4a and C8a are formed by being pulled out toward the first metal layer 4, but the other pair of wires 30b are drawn toward the chipside 10 to be connected to the first metal layer 4. To the second metal layer 6 bonded to the opposite side of the substrate, that is to the second metal layer 6 bonded to the upper surface of the substrate 2 opposite to the first metal layer 4 bonded to the lower surface of the substrate 2. As a result, the second preliminary terminals C4b and C8b are formed.

Preferably, in the IC chip pack 1 itself, as shown in FIG. 1, an RF antenna 40 may be incorporated. That is, for example, the RF antenna 40 is wound around the IC chip 11 along the surface of the plastic plate 50 to which the substrate 2 is fixed, and the RF antennas are formed on the second preliminary terminals C4b and C8b. Both terminals 40 are connected and covered with the protective film 5 so that the RF antenna 40 is integrated into the IC chip pack 1 integrally. As such, since the RF antenna 40 is integrally integrated, only the IC chip pack 1 according to the present invention can use RF by contacting the effective terminals C1, C2, C3, C5, and C7. Contactless use with an antenna 40 is possible.

Hereinafter, an exemplary application of the IC chip pack 1 according to the present invention will be described with reference to FIGS. 3 and 4.

First, the IC chip pack 1 of the present invention can be applied to a plastic card (eg, credit card) 7 which is the most common use mode in the related art. In this case, as the RF antenna for contactless use, the RF antenna 40 embedded in the IC chip pack 1 may be used, or an RF antenna 7a separately embedded in the plastic card 7 may be used. All may be employed.

When the RF card 7a is separately embedded in the plastic card 7, the terminals of the RF antenna 7a are connected to the second preliminary terminals C4b and C8b. According to this configuration, the plastic card 7 can be used as a contact type by the contact of the effective terminals C1, C2, C3, C5, C7, while the RF antenna (embedded in the plastic card 7) It may also be used in a non-contact manner by the action of 7a) or by the RF antenna 40 embedded in the IC chip pack 1.

When the RF chip 40 is provided in the IC chip pack 1 itself, when the RF card 7a is also incorporated in the plastic card 7 itself, there are two RF antennas. In this case, since the RF antenna 7a embedded in the plastic card 7 will show better induction electromotive force than the RF antenna 40 of the IC chip pack 1 itself, the actual RF is used in the plastic card 7 embedded. The RF antenna 40, which is the antenna 7a and the IC chip pack 1, is kept in reserve.

Next, the IC chip pack 1 of the present invention can be applied to a mobile communication terminal 8: (for example, a cellular phone). The IC chip pack 1 of the present invention may be mounted directly on its mounting portion provided at any position of the mobile phone 8, or the IC chip pack 1 may be mounted on the mounting kit 8b configured to conveniently mount the IC chip pack 1. The chip pack 1 may be mounted by inserting the chip pack 1 into the slot 8c formed in the mobile phone 8.

As the IC chip pack 1 of the present invention is mounted on the cellular phone 8 as described above, the effective terminals C1, C2, C3, C5, and C7 of the IC chip pack 1 correspond to those provided in the cellular phone 8. Connected to the terminals, the contact use of the IC chip pack 1 is thus made through the communication connection of the mobile phone 8.

In the example in which the IC chip pack 1 is applied to the cellular phone 8, the non-contact use of the IC chip pack 1 is based on the RF antenna 40 embedded in the IC chip pack 1 itself or the RF antenna 8a separately embedded in the cellular phone 8. Through).

When the IC chip pack 1 is applied to the mobile phone 8 in a non-contact manner using only the RF antenna 40, depending on the mounting position of the IC chip pack 1 with respect to the mobile phone 8, the mobile phone 8 is generally used. The applied electromagnetic shielding action may interfere with communication for forming induced electromotive force between the IC chip pack 1 and the reader, thereby lowering its reliability. Therefore, it is preferable to use a separate RF antenna 8a embedded in the mobile phone 8 at a position not affected by the electromagnetic wave blocking action. That is, when the separate RF antenna 8a is embedded in the mobile phone 8 and the IC chip pack 1 is mounted in the mobile phone 8, the first preliminary terminals C4a and C8a of the IC chip pack 1 are RF antennas. It is preferable to configure the cellular phone 8 to be connected to the terminal of 8a.

The mounting position of the RF antenna 8a on the mobile phone 8 is not particularly limited as long as it is not subjected to the electromagnetic wave blocking action of the mobile phone or is able to communicate smoothly with the reader. For example, the mobile phone biocap case 8d or the battery may be used. It can be attached to the case 8e or the like. Preferably, the RF antenna 8a may be integrally embedded in the plastic resin when molding the mobile phone case 8d, the battery case 8e, or the like. When the separate RF antenna 8a is embedded in the mobile phone 8 as described above, the contactless use of the IC chip pack 1 can be reliably used without being affected by the electromagnetic wave blocking action of the mobile phone 8.

As described above, two basic applications of the IC chip pack 1 according to the present invention have been described. Most preferably, the IC chip pack 1 has a built-in RF antenna 40 and is a basic use form of the IC chip pack 1. In addition to embedding the RF antenna 7a in the plastic card 7, the mobile phone 8, which is an additional form of use, also incorporates the RF antenna 8a, and the IC chip pack 1 of the plastic card 7 It is preferable that the perforation line 9 is formed in the circumference so that the IC chip pack 1 can be easily cut out from the plastic card 7.

According to such a system, when a user who has been given a smart card in the form of a plastic card 7 intends to use the smart card in the form of a mobile phone, the IC chip pack 1 is cut out from the plastic card 7 and the mobile phone ( 8). At this time, the connection with the RF antenna 7a of the plastic card 7 is disconnected at the moment of cutting the IC chip pack 1, but when the IC chip pack 1 is mounted on the cellular phone 8, the RF antenna 8a of the cellular phone 8 is again. ), It is possible to continue contactless use despite the electromagnetic wave blocking action of the mobile phone (8). Then, if you want to use the smart card in a different form from the mobile phone mounting form again by detaching the IC chip pack (1) from the mobile phone (8) it is possible to use non-contact by its RF antenna 40.

As a result, according to the IC chip pack 1 of the present invention, the contact / contactless combination card can be used in a variety of different forms, as well as in the form of a basic basic plastic card and a mobile phone mounting form, which has recently increased in application.

In the above, the present invention has been described by setting C1, C2, C3, C5, and C7 as effective terminals from the IC chip 11, and setting C4 and C8 as spare terminals, but these terminals are in accordance with the international standard for smart cards. It is only intended to describe the present invention and is not intended to limit the scope of the present invention. Therefore, if the corresponding international standard is changed or newly established, it is natural that the present invention can be applied to conform to these changed or newly established international standards.

As described above, the IC chip pack 1 of the present invention is a smart card IC chip pack that can be used in a variety of forms, as well as a conventional plastic card form and a mobile phone form, and can be used in combination of contact and non-contact type, Recognizing the identity of the user through the user's ID, password, identity information, account information, etc. is particularly suitable for use as a SIM card that can be used regardless of the user's location, type of terminal, and type of service.

The IC chip pack 1 of the present invention described above can be used in combination with contact and non-contact by using a variety of forms, including a conventional plastic card form and a mobile phone mounting form of its recent application, IC chip pack ( The manufacturer of 1) may manufacture a single type of IC chip pack irrespective of its application type, and the user can freely convert and use the IC chip pack 1 to a desired form, thereby maintaining consistency in the use of smart cards. It is expected to be suitable for SIM cards that require the user to be able to use the device regardless of the location, type of terminal, or type of service.

Claims (3)

In an IC chip pack (1) for a contact / contactless smart card comprising a chip side (10) to which an IC chip (11) is attached and a terminal side (20) on which terminals (C) of the IC chip (11) are arranged. Among the terminals C from the IC chip 11, the preliminary terminals C4 and C8 are formed on the terminal side 20 side, and are also formed on the chip side 10 side. Chip pack for contactless / contactless smart cards. According to claim 1, further comprising an integrally integrated RF antenna 40, the terminal of the RF antenna 40 is a preliminary terminal (C4b) toward the chip side 10 of the preliminary terminals (C4, C8) And C8b). An IC chip pack for contact / contactless smart cards. The preliminary terminals C4b and C8b formed on the chip side 10 in the preliminary terminals C4 and C8 are mounted on the plastic card 7 as one type of smart card. When connected to the RF antenna 7a embedded in the plastic card 7; The spare terminals C4a and C8a formed on the terminal side 20 side of the spare terminals C4 and C8 are built in the mobile phone 8 when mounted on the mobile phone 8 as one type of smart card. An IC chip pack for contact / contactless smart card, characterized in that connected to an RF antenna (8a).