KR200252743Y1 - Temperatute control system of semiconductor marking device - Google Patents

Abstract

The present invention relates to a temperature control system of a semiconductor marking equipment, the marking means for proceeding the marking process to recognize the information about the wafer, and the cooling water for supplying the cooling water to cool the high heat generated from the marking means A heat exchange means for heat-exchanging the temperature of the supply means, the pure water heated from the marking means and the cooling water supplied from the cooling water supply means, and a pure water recovery means for filtering the pure water cooled by the heat exchange means and recovering it back to the marking means. In the marking equipment comprising an automatic flow rate control valve in the connection pipe interconnecting the cooling water supply pipe for supplying the cooling water from the cooling water supply means to the heat exchange means and the cooling water recovery pipe for recovering the cooling water from the heat exchange means to the cooling water supply means. Of the cooling water supply means On one side by receiving the temperature information of the cooling water recovered to the cooling water recovery pipe to control the operation of the automatic flow rate control valve to adjust the flow rate of the cooling water by installing a temperature controller for cooling the heated pure water from the marking means, In order to cool the heated pure water from the cooling water supply means, the flow rate of the coolant which is exchanged with the heated pure water is automatically adjusted to adjust the temperature of the pure water, thereby reducing the cooling rate and time, thereby contributing to the stabilization of the temperature of the equipment. Done.

Description

Temperature control system of semiconductor marking equipment {TEMPERATUTE CONTROL SYSTEM OF SEMICONDUCTOR MARKING DEVICE}

The present invention relates to a semiconductor marking equipment, and more particularly to a temperature control system of the semiconductor marking equipment to enable accurate temperature control of the marking equipment to contribute to the stabilization of the equipment.

Semiconductor marking equipment uses a laser to mark wafers with Arabic numerals or symbols in order to recognize wafer information such as lot number and product number of wafers. As a device, a lamp is used in such a semiconductor marking device to react with a laser to perform marking. When the marking operation is performed using the lamp, the lamp is extended to cool the high temperature emitted from the lamp to extend the life of the lamp and output the laser. It is essential to have a temperature control system to stabilize and maintain a uniform marking.

1 is a block diagram schematically showing a temperature control system of a semiconductor marking apparatus according to the prior art. As shown in the drawing, the conventional semiconductor marking apparatus includes a laser oscillator (not shown) and a lamp 11 for performing a marking process. Marking means (10) provided, a cooling water supply means 20 for supplying cooling water to cool the high heat generated by the marking means 10, and the cooling water and marking means supplied from the cooling water supply means ( The heat exchange means 30 to exchange heat of the pure water flowing through 10) and the pure water is filtered to recover the marking means 10 in order to maintain high purity of the laser oscillated in the laser cavity of the marking means 10. The state is largely composed of the pure water recovery means (40).

The pure water recovery means 40 is a reserve tank 41 for storing a predetermined amount of cooling water in advance, a pump 42 for pumping the cooling water from the reserve tank 41 to the marking means 10, and a marking means. It consists of an over stamp sensor 44 for measuring the temperature of the cooling water supplied to (10), and a particle filter 45 for filtering the cooling water supplied to the marking means (10).

On the other hand, the cooling water supply pipe 21 for supplying the cooling water from the cooling water supply means 20 to the heat exchange means 30 and the cooling water recovery pipe 22 for recovering the cooling water from the heat exchange means 30 to the cooling water supply means 20 again. It is connected to the connecting pipe 23, the connecting pipe 23 is provided with a manual flow control valve 50 for manually adjusting the flow rate of the cooling water supplied to the heat exchange means 30, the cooling water supply pipe A solenoid valve 60 is provided at 21.

And a temperature controller 70 is attached to one side of the marking means 10 to be connected to the solenoid valve 60.

Therefore, the cooling water from the cooling water supply means 20 is partially passed through the solenoid valve 60 and the heat exchange means 30 through the laser cavity through the laser cavity according to the flow rate setting of the manual flow control valve 50. After cooling, the liquid is recovered to the cooling water supply means 20, and part of the cooling water is directly recovered to the cooling water supply means 20 without passing through the heat exchange means 30.

The pure water stored in the reserve tank 41 is converted into pure pure water after being partially converted to pure pure water by the intake pressure of the pump 42, and then recovered into the reserve tank 43. After passing through the overstamp sensor 44, a part of the particle filter 45 finally removes impurities or contaminants of pure water, and is then supplied to the marking means to cool the lamp 11. Cooling while passing through the means 30 is repeated to the recovery tank 41 to recover the high heat generated in the marking means (10).

However, the prior art as described above is to control the temperature by adjusting the flow rate of the pure water by driving the solenoid valve 60 when the coolant supply means 20 reaches the lower limit and the upper limit within the set temperature range, Since the manual flow control valve 50 is installed in front of the solenoid valve 60 to manually adjust the flow rate of the cooling water, there is a problem that it is difficult to accurately control the temperature. In particular, the temperature of the surrounding environment or the output of the marking means 10 is variably controlled without manual flow rate control, so it is difficult to establish an accurate temperature control range standard and the valve must be manually adjusted every time it changes. There was a problem.

The present invention is to solve this problem, it is an object of the present invention to provide a temperature control system of the semiconductor marking equipment to enable a stable and accurate temperature control of the pure water by automatically adjusting the flow rate of pure water.

Figure 1 is a schematic block diagram showing a temperature control system of a semiconductor marking equipment according to the prior art.

Figure 2 is a schematic block diagram showing a temperature control system of a semiconductor marking equipment according to the present invention.

** Explanation of symbols for main parts of drawings **

10; Marking means 20; Cooling water supply means

21; Cooling water supply pipe 22; Cooling water return line

23; Connector 30; Heat exchange means

40; Pure water recovery means 70; Thermostat

80; Automatic Flow Control Valve

The present invention for achieving the above object is a marking means for proceeding the marking process to recognize the information on the wafer, the cooling water supply means for supplying a cooling water to cool the high heat generated from the marking means, and Marking equipment comprising a heat exchange means for heat-exchanging the temperature of the pure water heated from the marking means and the cooling water supplied from the cooling water supply means, and a pure water recovery means for filtering the pure water cooled by the heat exchange means and recovering the purified water back to the marking means. An automatic flow control valve is installed in the connection pipe interconnecting a cooling water supply pipe for supplying cooling water from the cooling water supply means to the heat exchange means and a cooling water recovery pipe for recovering the cooling water from the heat exchange means to the cooling water supply means. One side of the cooling water supply means Receiving the temperature information of the cooling water is recovered by the water tube is characterized in that a climate control installation which to cool the heated pure water from the marking means by controlling the flow rate of the coolant to control the operation of the automatic flow control valve.

Hereinafter, the temperature control system of the semiconductor marking equipment according to the present invention will be described according to the embodiment shown in the accompanying drawings. The same code | symbol is attached | subjected about the structure same as a prior art.

In the semiconductor marking device according to the present invention, as shown in FIG. 2, a marking means 10 is installed to perform a marking operation, and one side of the marking means 10 cools the temperature of the marking means 10. A heat exchange means 30 is provided, and one side of the heat exchange means 30 is provided with coolant supply means 20 for supplying coolant to the heat exchange means 30, and a reserve is provided on one side of the heat exchange means 30. The pure water recovery means 40 provided with the tank 41 is provided.

One side of the reservoir tank 41 is provided with a pump 42, a pure water filter 43, an overtemp sensor 44, and a particle filter 45.

At this time, the pure water pumped by the pump 42 is branched to the pure water filter 43 and the overtemp sensor 44, respectively, and the pure water introduced into the pure water filter 43 is recovered to the reserve tank 41 again. In addition, the pure water introduced into the overtemp sensor 44 is introduced into the marking means 10 to cool the amount of heat generated by the marking means 10.

And between the cooling water supply pipe 21 for supplying the cooling water from the cooling water supply means 20 to the heat exchange means 30 and the cooling water recovery pipe 22 for recovering the cooling water from the heat exchange means 30 to the cooling water supply means 20. The formed connection pipe 23 is provided with an automatic flow rate control valve 80, one side of the cooling water supply means 20, the reserve from the automatic flow rate control valve 80, the cooling water recovery pipe 22 and the heat exchange means 30 A thermostat 70 is connected to the pipe for supplying cooling water to the tank 41 to control the temperature. The automatic flow rate control valve 80 is a valve with an automatic flow rate regulator called a mass flow controller. It is widely used in the semiconductor manufacturing process.

Therefore, the pure water changed to a high temperature to cool the lamp 11 during the marking process is introduced into the heat exchange means 30 and the temperature is reduced by heat exchange with the cooling water supplied from the coolant supply means 20.

That is, the coolant supplied through the coolant supply means 20 is recovered by the coolant recovery pipe 22 to the coolant supply means 20, wherein the temperature information is transmitted to the temperature controller 70, and the transferred temperature. By operating the automatic flow rate control valve 80 in accordance with the information to reduce the cooling rate and time by adjusting the amount of cooling water flowing.

The pure water cooled by the cooling water passes through the reservoir tank 41 and passes through the respective filters 42 and 45 to the marking means 10 again to cool the heat of the lamp 11. Done.

As described above, the temperature control system according to the present invention is supplied from the cooling water supply means for cooling the heated pure water from the marking means and automatically adjusts the flow rate of the cooling water in which heat is exchanged with the heated pure water to automatically adjust the temperature of the pure water. By controlling the cooling rate and time can be reduced to contribute to the temperature stabilization of the equipment.

Claims (1)

Marking means for proceeding the marking process to recognize information about the wafer, Cooling water supply means for supplying a cooling water to cool the high heat generated from the marking means, Supplying pure water and cooling water heated from the marking means A marking apparatus comprising heat exchange means for heat-exchanging the temperature of cooling water supplied from the means, and pure water recovery means for filtering the pure water cooled by the heat exchange means and recovering the purified water back to the marking means. An automatic flow rate control valve is installed in a connection pipe interconnecting a cooling water supply pipe for supplying the cooling water to the means and a cooling water recovery pipe for recovering the cooling water from the heat exchange means to the cooling water supply means, and one side of the cooling water supply means Temperature value of coolant returned to the pipe And a temperature controller for controlling the operation of the automatic flow control valve to receive the beam to adjust the flow rate of the cooling water to cool the heated pure water from the marking means.