KR20020074143A - 구리재료 표면에 무기물질로된 피복층을 형성시키는전기화학적 방법 - Google Patents

구리재료 표면에 무기물질로된 피복층을 형성시키는전기화학적 방법 Download PDF

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Publication number
KR20020074143A
KR20020074143A KR1020027004139A KR20027004139A KR20020074143A KR 20020074143 A KR20020074143 A KR 20020074143A KR 1020027004139 A KR1020027004139 A KR 1020027004139A KR 20027004139 A KR20027004139 A KR 20027004139A KR 20020074143 A KR20020074143 A KR 20020074143A
Authority
KR
South Korea
Prior art keywords
copper
layer
anodization
current density
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020027004139A
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English (en)
Korean (ko)
Inventor
빌리알베르토
호페링슈테판
프릭게마이어슈테판
Original Assignee
유로파 메탈리 에스.피.에이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유로파 메탈리 에스.피.에이. filed Critical 유로파 메탈리 에스.피.에이.
Publication of KR20020074143A publication Critical patent/KR20020074143A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Chemically Coating (AREA)
KR1020027004139A 1999-09-29 1999-09-29 구리재료 표면에 무기물질로된 피복층을 형성시키는전기화학적 방법 Withdrawn KR20020074143A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT1999/000307 WO2001023646A1 (en) 1999-09-29 1999-09-29 An electrochemical method for forming an inorganic covering layer on a surface of a copper material

Publications (1)

Publication Number Publication Date
KR20020074143A true KR20020074143A (ko) 2002-09-28

Family

ID=11333125

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027004139A Withdrawn KR20020074143A (ko) 1999-09-29 1999-09-29 구리재료 표면에 무기물질로된 피복층을 형성시키는전기화학적 방법

Country Status (16)

Country Link
US (1) US6749738B2 (https=)
EP (1) EP1226289B1 (https=)
JP (1) JP4637428B2 (https=)
KR (1) KR20020074143A (https=)
CN (1) CN1236109C (https=)
AT (1) ATE261006T1 (https=)
AU (1) AU6120999A (https=)
CA (1) CA2386129C (https=)
DE (1) DE69915395D1 (https=)
DK (1) DK1226289T3 (https=)
ES (1) ES2217812T3 (https=)
HU (1) HU224454B1 (https=)
PL (1) PL192904B1 (https=)
PT (1) PT1226289E (https=)
RU (1) RU2232212C2 (https=)
WO (1) WO2001023646A1 (https=)

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JP4870699B2 (ja) * 2008-03-10 2012-02-08 日立ビアメカニクス株式会社 銅の表面処理方法およびプリント配線板の表面処理方法
CN102157592A (zh) * 2011-01-06 2011-08-17 上海晶澳太阳能科技有限公司 一种太阳能电池组件内用导线及其加工工艺
RU2483146C1 (ru) * 2011-10-03 2013-05-27 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг РФ) Способ микродугового оксидирования присадочных прутков из титанового сплава для антифрикционной наплавки
DK2728041T3 (en) * 2012-10-30 2017-03-20 Hydro Aluminium Rolled Prod Coated aluminum strip and method of manufacture
CN103014815B (zh) * 2012-11-28 2016-05-04 常州大学 铜导线辊式快速阳极氧化处理方法
WO2015040998A1 (ja) * 2013-09-20 2015-03-26 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP5870148B2 (ja) * 2013-11-27 2016-02-24 Ｊｘ金属株式会社 キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法
WO2016022903A1 (en) * 2014-08-07 2016-02-11 Henkel Ag & Co. Kgaa Apparatus for electroceramic coating of high tension cable wire
WO2016022957A1 (en) 2014-08-07 2016-02-11 Henkel Ag & Co. Kgaa Continuous coating apparatus for electroceramic coating of cable
CN104233433B (zh) * 2014-10-03 2016-09-14 上海工程技术大学 一种制备氧化亚铜薄膜的方法
US10636924B2 (en) 2014-11-26 2020-04-28 Sunpower Corporation Solar module interconnect
CN106410227B (zh) * 2016-12-12 2019-01-15 珠海格力电器股份有限公司 一种氧化铜及其制备方法
CN106591922B (zh) * 2017-02-05 2018-05-08 桂林理工大学 一种Cu2O纳米薄膜的制备方法
CN107177876A (zh) * 2017-05-11 2017-09-19 云南民族大学 一种电沉积制备氧化亚铜锂电池薄膜材料的方法
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
EP3847921B1 (en) 2018-09-06 2025-06-04 YKK Corporation Fastener member
JP7409602B2 (ja) * 2019-05-09 2024-01-09 ナミックス株式会社 複合銅部材
CN113649042B (zh) * 2021-07-20 2023-10-10 青岛农业大学 光催化电极制备方法、光催化反应器及污染流体处理方法
JP7095193B1 (ja) 2022-03-29 2022-07-04 セイコーホールディングス株式会社 装飾部品及び装飾部品の製造方法
JP7685553B2 (ja) * 2022-05-31 2025-05-29 コリア インスティテュート オブ マテリアルズ サイエンス 殺菌性銅酸化物の形成方法及び殺菌性銅系物品

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SU658187A1 (ru) * 1975-09-23 1979-04-25 Предприятие П/Я А-7186 Способ электрохимического оксидировани меди
DD131044B1 (de) * 1977-02-21 1982-11-24 Heinz Fink Verfahren zur elektrolytischen erzeugung eines oxidischen haftbelages auf kupferfolien
JPS558487A (en) * 1978-07-05 1980-01-22 Mitsubishi Electric Corp Surface treating method of copper
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JPS607038B2 (ja) * 1980-03-19 1985-02-21 積水化学工業株式会社 銅もしくは銅合金材の着色方法
JPS607037B2 (ja) * 1980-03-19 1985-02-21 積水化学工業株式会社 銅もしくは銅合金材の着色方法
JPS5831099A (ja) * 1981-08-18 1983-02-23 Furukawa Electric Co Ltd:The 銅線、条体の黒色化法
JPS63250494A (ja) * 1987-04-03 1988-10-18 Kobe Steel Ltd 黒色被膜付き銅
JPH0750566B2 (ja) * 1987-07-27 1995-05-31 古河電気工業株式会社 コイル巻線用耐熱耐酸化性導体
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Also Published As

Publication number Publication date
RU2232212C2 (ru) 2004-07-10
CA2386129A1 (en) 2001-04-05
JP2003510466A (ja) 2003-03-18
CN1380914A (zh) 2002-11-20
HU224454B1 (hu) 2005-09-28
EP1226289B1 (en) 2004-03-03
ATE261006T1 (de) 2004-03-15
PL192904B1 (pl) 2006-12-29
CA2386129C (en) 2010-03-16
RU2002111346A (ru) 2004-02-27
DK1226289T3 (da) 2004-07-12
WO2001023646A1 (en) 2001-04-05
HUP0203533A2 (en) 2003-05-28
US20030102227A1 (en) 2003-06-05
CN1236109C (zh) 2006-01-11
EP1226289A1 (en) 2002-07-31
JP4637428B2 (ja) 2011-02-23
AU6120999A (en) 2001-04-30
US6749738B2 (en) 2004-06-15
PL354489A1 (en) 2004-01-26
PT1226289E (pt) 2004-07-30
DE69915395D1 (de) 2004-04-08
ES2217812T3 (es) 2004-11-01

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PA0105 International application

Patent event date: 20020329

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid