KR20020050116A - A method of scribing and breaking brittle sheets and an apparatus therefor - Google Patents

Abstract

PURPOSE: A cutting method and its device are provided to be capable of preventing a faulty break from occurring to a scribed bonded board. CONSTITUTION: The cutting device comprises a break bar(15) having a pressing edge shaped downwardly convex. While the break bar(15) is upset to a sheet of glass(13), the break bar is swung in the longitudinal direction of the bar(15), which travels the upsetting position against the glass(13) in the horizontal direction, resulting in a break on the glass.

Description

A method for cutting brittle substrates and apparatus therefor {A METHOD OF SCRIBING AND BREAKING BRITTLE SHEETS AND AN APPARATUS THEREFOR}

The present invention relates to a cutting method and a cutting device for a brittle substrate. The brittle substrate includes a glass plate, a semiconductor wafer, a ceramic, and the like, and also includes a brittle substrate on which two brittle substrates are bonded.

Fig. 1 schematically shows a brake device which is generally used. A brittle substrate 1 having a scribe line S formed on its rear surface is set on a table 3 with a mat 2 laid thereon. A break bar 4 is positioned above the brittle substrate 1, and the brake bar 4 is joined to a hard rubber 4b having a V-shaped cross section at the bottom of the rod-shaped metal member 4a. It is.

The lower end portion of the hard rubber 4b is pressed upward from the scribe line S so that the brittle substrate 1 is slightly bent on the mat 2 and cut along the scribe line S. FIG.

2 shows a front view of the brake bar 4, and the length L of the brake bar should be almost equal to the width of the brittle substrate 1, so that the length L becomes long when the brittle substrate 1 has a large size. In this case, the unevenness of the hard rubber 4b, the bending of the brake bar 4 and the bending of the brittle substrate 1 are generated. Therefore, in the conventional method of contacting the hard rubber 4b with the brittle substrate 1 in a straight line without any gap, the same pressure is applied. When the glass plate 1 was not subjected to a uniform brake pressure, a defect of the brake was likely to occur.

An object of the present invention is to provide a brake device that can solve the above problems by using a novel brake bar.

In addition, an object of the present invention is to provide a cutting method and a cutting device that can effectively suppress the occurrence of brake failure of a bonded brittle substrate.

1 is a view showing an outline of a conventional break device.

2 is a front view of a break bar;

Fig. 3 is a front view showing one embodiment of the brake device in the present invention.

Fig. 4 is a view of the main portion in Fig. 3 seen from the side.

FIG. 5 is a diagram illustrating a configuration of a brake bar in FIG. 3.

6 is a process chart showing a process of cutting using a method of cutting laminated glass in the present invention.

7 is a perspective view showing one embodiment of a projection cutting device.

Fig. 8 is a diagram showing one embodiment of a cutting device for laminated glass in the present invention.

9 is a process chart showing a process of cutting using a method of cutting laminated glass in the present invention.

Fig. 10 is a view showing one embodiment of the laminated glass cutting device in the present invention.

* Description of the symbols for the main parts of the drawings *

10 break device 12 table

12a: groove 13: glass plate

14: break bar support

15 brake bar 16 servo motor

18: crank 19: pressurized cylinder

21 liquid crystal panel 31 liquid crystal cell substrate

32: table of the projection cutting device

33: Protrusion cut bar 34: Support plate

35: cylinder 36: guide

SM1, SM2, SM11, SM12: scriber

BM1, BM2, BM11, BM12: Brake Unit

FM1, FM3-4, FM6-7: Carrier

FM2, FM5: reverse carrier

FM11, FM13-14, FM16-17: carrier

FM12, FM15: Reverse Carrier

RO1, RO11: Robot

BQ1, BQ11: Protrusion Cutting Device

The present invention is a brake device for cutting along a scribe line by pressing a scribed brittle substrate with a brake bar,

Breaking the brittle substrate by horizontally moving the pressing point to the glass plate by using the brake bar bent in the downward direction of the pressing portion like a bow, and in the state in which the brake bar is pressed against the brittle substrate and rotates in the bar direction. do.

(Example)

FIG. 3 is a front view of the brake device 10 showing the first embodiment of the present invention, and FIG. 4 is a side view of the device 10 seen from the side, showing an enlarged view of the main part of the present invention. The glass plate 13 scribed on the table 12 which can be moved in the Y direction (the surface and the vertical direction in Fig. 3) by the pair of guides 11 is placed on the bottom of the scribe line. Is set. Above this table 12, a flat brake bar support 14 is positioned in a vertical state, and a break bar 15 is provided below the brake bar support 14.

As shown in Fig. 5, the brake bar 15 joins the hard rubber 15b to the bottom surface of the base portion 15a, the base surface of which is bent like a bow.

Pinholes m and n are formed at both ends of the brake bar 15, and the brake bar 15 is provided so as to rotate with respect to the brake bar support 14 with the pin hole n as a point. . In addition, a disc 17 is provided at a predetermined portion of the brake bar support 14 so as to be rotated by a servo motor 16, and between the pin 17a provided on the disc 17 and the pin hole m. Crank 18 is attached. Therefore, as the disc 17 rotates, the brake bar 15 moves up and down with the pin hole n as the point. At this time, since the pressure point at which the brake bar 15 presses the glass plate 13 moves linearly in one direction, the glass plate 13 can be braked from one end to the other end. have. According to such a brake method, for example, the use of an electrostatic regulator enables control to increase the brake pressure at the start of the brake. By controlling the rotation speed of the servo motor 16, the speed of the elevating motion can also be varied.

The brake bar support 14 itself is installed to be able to move up and down by the pressurizing cylinder 19, and can set a desired brake pressure on the brake bar 15. As shown in FIG. 4, the brake bar 15 is located above the scribe line S of the glass plate 13, and the table 12 has a recessed groove 12a having a width of 5 mm and a depth of 0.5 mm just below the brake bar 15. Form in the direction of the bar. Since the groove 12a itself is small in size, an etching method is used for such groove processing.

Next, a process of cutting the laminated glass (liquid crystal panel) 21 using the brake device 10 will be described with reference to FIG. Here, finally, it is set as the process which leaves the edge part T to the one panel piece cut | disconnected as shown in G degree (K degree).

First, as shown in FIG. A, two scribe lines S are formed on the glass plate on the upper side of the liquid crystal panel 21, and then one scribe line is formed by inverting the front and back of the liquid crystal panel 21. FIG. Here, one glass plate was hatched so that the inverted state of the liquid crystal panel 21 could be recognized.

Next, as shown in FIG. C, the brake is applied to the lower glass plate using the brake device 10 as in B1. According to the conventional brake method, as shown in Fig. H, the remaining scribe lines are braked as in B2. Then, as shown in FIG. I, the front and rear sides of the liquid crystal panel are inverted, and then, as shown in FIG. J, the scribe line formed on the lower glass plate is braked as in B3, as shown in FIG. 21 is finally cut into two parts.

By the way, in the brake of B2, since the glass plate is already cut | disconnected by the brake of Bl immediately to the left of B2, the big brake pressure must be applied in the brake of B2, but if this brake pressure is too big | large, it will be cut to the upper glass plate. Because of this, the control of pressurization of the brake is not easy. In addition, in the brake of B3, when B1 comes into contact with an adjacent glass plate, cracking is likely to occur in the glass end face or the like. In the cutting process of a liquid crystal panel, the crack which generate | occur | produces in this glass cross section is also handled as a brake failure or a cutting failure.

Thus, in this embodiment, after breaking B1 as shown in Fig. C, the liquid crystal panel 21 is inverted as shown in Fig. D, and then braked B3 as shown in Fig. E. At this point, as shown in FIG. F, the liquid crystal panel 21 is already cut into two parts. As to the projection Q to be cut, as shown in Fig. G, the use of the projection cutting device can make it easy to cut a portion of the projection Q.

7 is an example of the protrusion cutting device BQ. A conveyance robot (not shown) conveys the liquid crystal cell substrate 31 separated from the liquid crystal panel 21 onto the table 32 of the projection cutting device BQ so that the projection Q projects a predetermined amount from the table. Thereafter, the liquid crystal cell substrate 31 is attracted to the table 32 and fixed. On the upper side of the side of the table 32, the projection cutting bar 33 is supported to be moved up and down by a cylinder 35 installed on the support plate 34. A long cylindrical guide 36 is attached to both ends of the upper surface of the projection cutting bar 33. have. In Fig. 7, the projection cut bar 33 is shown in an elevated state, but the projection Q portion is cut from the liquid crystal cell substrate 31 by lowering the projection cut bar 33. As shown in Figs.

When the liquid crystal panel cutting method using the protrusion cutting device shown in Figs. A to G of Fig. 6 is used, it is very effective to prevent cracking occurring in the glass cross section described above. And brake failure hardly occurs.

Fig. 8 is an example of a liquid crystal panel cutting device using the method for cutting the liquid crystal panel shown in Figs. A to G in Fig. 6 showing this embodiment.

After the liquid crystal panel 21 is supplied to the table of the scriber SM1 by the feeding material feeder FM1, and a predetermined scribe line is formed on one surface of the liquid crystal panel 21, an inverting conveyer FM2 receives the liquid crystal panel 21 on the table of the scriber SM1 and inverts the liquid crystal panel 21 (inverts the substrate). The liquid crystal panel 21 inverted by the inversion carrier FM2 is received by the carrier FM3 and conveyed onto the table of the scriber SM2. In scriber SM2, a predetermined scribe line is formed on the other side of the liquid crystal panel 21, and is conveyed on the table of the brake device BM1 of the present invention by the conveyer FM4, and the glass plate on one side of the liquid crystal panel 21 is Brakes. The inversion carrier FM5 receives the liquid crystal panel 21 from the brake device BM1 and inverts the liquid crystal panel 21 again. Carrier FM6 conveys the liquid crystal panel 21 reversed in this way on the table of brake device BM2, and brakes the glass plate of the other surface of a liquid crystal panel. Thereafter, the liquid crystal panel 21 is conveyed to the separating table BT1 by the conveying machine FM7, and the substrates of unnecessary portions other than the projection Q are removed. Thereafter, the separated liquid crystal cell substrates 31 are picked up by the robot RO1 one by one, transported onto the table of the projection cutting device BQl, and the portions of the unnecessary projection Q are cut.

The above apparatus is an example of a liquid crystal panel cutting device which completes cutting of the liquid crystal panel in the order of scribing, scribing, brake processing, brake processing, and protrusion cutting. However, one scriber, one brake device, and at least one It is good also as a laminated glass (liquid crystal panel) cutting device provided with the projection part cutting device which cuts a projection part after going through a machining process in order of a scribe process, a scribe process, a brake process, and a brake process by a conveying apparatus.

Next, a method and apparatus for cutting a liquid crystal panel for completing the cutting of the liquid crystal panel in the order of scribing, brake processing, scribing processing, brake processing, and protrusion cutting are described below.

Fig. 9 is a view showing a method of cutting laminated glass (liquid crystal panel) processed in the order of scribing, brake processing, scribing, brake processing, and projection cutting.

First, as shown in AA, two scribe lines S are formed on the glass plate on the upper side of the liquid crystal panel 21. Here, one glass plate was hatched so that the inverted state of the liquid crystal panel 21 could be recognized.

Next, as shown in the BB diagram, the liquid crystal panel 21 is inverted (inverted substrate). As shown in the diagram CC, the brake is applied to the lower glass plate using the brake device 10 as in B11. Thereafter, one scribe line is formed on the upper glass plate. Then, the liquid crystal panel 21 is inverted again as shown in the DD diagram, and B13 is then braked as shown in the EE diagram. At this point, as shown in the FF diagram, the liquid crystal panel 21 has already been cut into two pieces. As for the projection Q to be cut, as shown in the GG diagram, the use of the projection cutting device makes it possible to easily cut the portion of the projection Q.

Fig. 10 is a diagram showing an example of a laminated glass (liquid crystal panel) cutting device which is processed in the order of scribing, brake processing, scribing, brake processing, and projection cutting.

After the liquid crystal panel 21 is supplied to the table of the scriber SM11 by the feeding material feeder FM11 to form a predetermined scribe line on one surface of the liquid crystal panel 21, the inverting conveyer FM12 removes the liquid crystal panel 21 on the table of the scriber SM11. Invert the liquid crystal panel 21 (turn the substrate over). The liquid crystal panel 21 inverted by the inversion carrier FM12 is received by the carrier FM13 and conveyed onto the table of the brake device BM11. In the brake device BM11, the glass plate on one surface of the liquid crystal panel 21 is braked. The conveyer FM14 receives the liquid crystal panel 21 from the brake device BM11 and conveys it onto the table of the scriber SM12. In the scriber SM12, a predetermined scribe line is formed on the other side of the liquid crystal panel 21, the liquid crystal panel 21 is inverted again by the inversion carrier FM15, and the carrier FM16 receives the inverted liquid crystal panel 21, and the brake device BM12. It conveys to the table top of and breaks the glass plate of the other surface of a liquid crystal panel. Thereafter, the liquid crystal panel 21 is conveyed to the separation table BT11 by the conveyer FM17 to remove unnecessary substrate portions other than the projection Q. Thereafter, the separated cell substrates 31 are picked up by the robot RO11 one by one, conveyed onto the table of the projection cutting device BQ11, and the portions of the unnecessary projection Q are cut.

The apparatus shown in Fig. 10 includes two scribers, two brake devices, a plurality of conveyers and a projection cutting device, but is provided with a scriber, a brake device and at least one conveyer to scribe and brake It is good also as a cutting device of the laminated glass (liquid crystal panel) provided with the protrusion cutting device which performs a process of cutting a protrusion after passing through a machining process in order of scribing and a brake process.

In this way, by cutting off the remaining portions of the other substrate after leaving the other substrate portion facing away from the edge of one substrate, the cutting method and the cutting device of the bonded brittle substrate are completed. By this, generation | occurrence | production of the crack of the board | substrate after a cutting | disconnection, and generation | occurrence | production of glass shaving can be suppressed almost completely.

In addition, when the brake device 10 of the present invention is used for the brake devices BM1, BM2, BM11, and BM12 described above, it becomes a laminated glass (liquid crystal panel) cutting device that can further prevent the failure of the brake.

If the grooves 12a are formed in the table 12 immediately below the scribe line during each of the above brakes, the liquid crystal panel 21 is bent, and the brakes are effectively applied. In this case, the use of the mat 2 as shown in FIG. 1 can be omitted. In this case, when the table 12 can be easily replaced by a magnet or a screw on the lower mounting table, the table 12 forming the groove 12a corresponding to the scribe place can be simply used.

As described above, in the present invention, the pressing point to the glass plate is formed by using a shape in which the pressing portion of the brake bar is bent downward like a bow, and rotating the brake bar in the longitudinal direction while pressing the brake bar to the glass plate ( In this case, according to the brake method, the brake pressure can be made constant or the brake pressure can be increased at the starting point of the brake, so that the brake can be precisely applied to the processing target. have.

In addition, by using the method and apparatus for cutting the bonded substrate of the present invention, since the contact between the individual cut substrate portions can be prevented, the edge surface of the product can be cut almost without cracking.

Claims (10)

A brake apparatus for cutting along a scribe line by pressurizing a scribed brittle substrate by a break bar, The brake bar has a curved pressing portion at a lower portion thereof, and the pressing portion of the curved shape is sequentially horizontally contacted with the surface of the brittle substrate along a predetermined brake line corresponding to the scribe line. Cutting device characterized in that it comprises a pressure control means for moving to. In the cutting device for scribing and braking the brittle substrate sequentially comprising at least one conveying device for conveying the brittle substrate to be processed, at least one scriber for scribing and at least one brake device for brake processing , When cutting the bonded substrate which consists of a 1st, 2nd board | substrate into at least 2 or more part along a predetermined scribe line, 1) forming at least two or more scribe lines on the first substrate by the at least one scriber, and thereafter 2) forming at least one scribe line on said second substrate by said at least one scriber, and thereafter 3) cutting the first substrate along the first scribe line of the first substrate by the at least one brake device into a first portion having the remaining scribe lines and a second portion not having the brake; 4) cutting along the scribe line of the second substrate by the at least one brake device; 5) A cutting device, further comprising cutting the first portion into two or more portions along the second scribe line in the first portion of the first substrate. A cutting device for sequentially scribing and braking a brittle substrate, comprising: at least one conveying device for conveying a brittle substrate to be processed; at least one scriber for scribing; and at least one brake device for braking; When the bonded substrate formed of the second substrate is cut into at least two portions along a predetermined scribe line, 1) forming at least two or more scribe lines on the first substrate by the at least one scriber, and thereafter 2) cutting the first substrate along the first scribe line of the first substrate by the at least one brake device into a first portion having the remaining scribe lines and a second portion not having the brake; 3) forming at least one scribe line on said second substrate by said at least one scriber, and thereafter 4) cutting along the scribe line of the second substrate by the at least one brake device; 5) A cutting device, further comprising cutting the first portion into two or more portions along the second scribe line in the first portion of the first substrate. The method according to claim 2 or 3, The at least one brake device is a cutting device for cutting along the scribe line by pressing the scribed brittle substrate by the brake bar, The brake bar includes a curved pressing portion at a lower portion thereof, and moves the curved pressing portion horizontally in the lengthwise direction of the brake bar while sequentially contacting the curved pressing portion with the surface of the brittle substrate along the predetermined brake line corresponding to the scribe line. Cutting device comprising a pressure control means. The method according to any one of claims 1 to 3, A cutting device, characterized in that a groove having a predetermined width is formed along a line on which a brake bar is pressed in a table on which a brittle substrate is set. The method according to any one of claims 1 to 5, And a supporting means for supporting a table on which the brittle substrate is set. The method according to any one of claims 1 to 6, And control means for controlling the pressing load at the position where the brake bar contacts the brittle substrate. Predetermining a bonded substrate comprising first and second substrates using a cutting device comprising at least one conveying device for conveying the brittle substrate to be processed, at least one scriber for scribing and at least one brake device for braking. In the cutting method of cutting into at least two parts along the scribe line of, 1) forming at least two scribe lines on the first substrate, 2) forming at least one scribe line on the second substrate; 3) cutting the first substrate along a first scribe line of the first substrate into a first portion having the remaining scribe lines and a second portion not having the first substrate; 4) cutting along the first scribe line of the second substrate; 5) A cutting method comprising the step of further cutting the first portion along the second scribe line in the first portion of the first substrate. Using a cutting device comprising at least one conveying device for conveying a brittle substrate to be processed, at least one scriber for scribing and at least one brake device for braking, In the cutting method of cutting the bonded substrate which consists of a 1st, 2nd board | substrate into at least 2 or more part along a predetermined scribe line, 1) forming at least two scribe lines on the first substrate, 2) cutting the first substrate along a first scribe line of the first substrate into a first portion having the remaining scribe lines and a second portion not having the first substrate; 3) forming at least one scribe line on the second substrate; 4) cutting along the first scribe line of the second substrate; 5) A cutting method comprising the step of further cutting the first portion along the second scribe line in the first portion of the first substrate. A brake device for cutting along a scribe line by pressing a scribed brittle substrate with a brake bar, Using a brake bar having a curved pressing portion at the lower portion of the brake bar, the curved pressing portion sequentially contacts the surface of the brittle substrate in a horizontal direction in the longitudinal direction of the brake bar, along with the brake predetermined line corresponding to the scribe line. Cutting method, characterized in that for moving.