KR200197864Y1 - Solder pad for holding connector - Google Patents

Solder pad for holding connector Download PDF

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Publication number
KR200197864Y1
KR200197864Y1 KR2019940038465U KR19940038465U KR200197864Y1 KR 200197864 Y1 KR200197864 Y1 KR 200197864Y1 KR 2019940038465 U KR2019940038465 U KR 2019940038465U KR 19940038465 U KR19940038465 U KR 19940038465U KR 200197864 Y1 KR200197864 Y1 KR 200197864Y1
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KR
South Korea
Prior art keywords
connector
printed circuit
circuit board
solder pad
present
Prior art date
Application number
KR2019940038465U
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Korean (ko)
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KR960025602U (en
Inventor
김학서
Original Assignee
김영환
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김영환, 현대반도체주식회사 filed Critical 김영환
Priority to KR2019940038465U priority Critical patent/KR200197864Y1/en
Publication of KR960025602U publication Critical patent/KR960025602U/en
Application granted granted Critical
Publication of KR200197864Y1 publication Critical patent/KR200197864Y1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

본 고안은 컨넥터 고정용 솔더패드에 관한 것으로서, 더욱 상세하게는 컨넥터핀에 솔더패드를 삽입하여 컨넥터를 고정할 수 있도록 한것이다.The present invention relates to a solder pad for fixing a connector, and more specifically, to insert a solder pad in the connector pin to fix the connector.

이를 위해 본 고안은 DIP용 인쇄회로기판(1) 저면으로 복수개의 컨넥터핀(4)을 노출시켜 원통형의 납땜용 솔더패드(9)를 상기 컨넥터핀에 삽입하고, 표면실장용 컨넥터핀(8)에는 인쇄회로기판(5)이 접속단자(6)를 삽입함과 동시에 컨넥터핀과 인쇄회로기판에 한쌍의 평판형 납땜용 솔더패드(10)를 삽입하여 상기 각 컨넥터핀을 리플로우 솔더링 하여서 된것이다.To this end, the present invention exposes a plurality of connector pins 4 to the bottom surface of the DIP printed circuit board 1, inserts a cylindrical solder pad 9 into the connector pins, and surface-mounting connector pins 8. In the printed circuit board 5, the connection terminal 6 is inserted, and a pair of flat solder pads 10 are inserted into the connector pin and the printed circuit board to reflow solder the respective connector pins. .

Description

컨넥터 고정용 솔더패드Solder pad for connector fixing

제1도는 종래의 DIP용 인쇄회로기판에 컨넥터가 고정된 상태의 평면도.1 is a plan view of a connector fixed to a conventional DIP printed circuit board.

제2도는 제1도의 A-A선 단면도.2 is a cross-sectional view taken along the line A-A of FIG.

제3도는 종래의 표면실장용 인쇄회로기판에 컨넥터가 고정된 상태의 평면도.3 is a plan view showing a connector fixed to a conventional surface mount printed circuit board.

제4도는 제2도의 B-B선 단면도.4 is a cross-sectional view taken along the line B-B in FIG.

제5도는 본 고안에 따른 DIP용 인쇄회로기판에 컨넥터가 고정된 상태의 평면도.5 is a plan view of the connector fixed to the DIP printed circuit board according to the present invention.

제6도는 본 고안에 따른 DIP용 솔더패드의 사시도.6 is a perspective view of a solder pad for DIP according to the present invention.

제7도는 본 고안에 따른 표면실장용 인쇄회로기판에 컨넥터가 고정된 상태의 평면도.7 is a plan view of the connector fixed to the surface-mounted printed circuit board according to the present invention.

제8도는 본 고안에 따른 표면실장용 솔더패드의 사시도.8 is a perspective view of a surface mount solder pad according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : DIP용 인쇄회로기판 4, 8 : 컨넥터핀1: DIP printed circuit board 4, 8: connector pin

5 : 표면실장용 인쇄회로기판 6 : 접속단자5: printed circuit board for surface mounting 6: connection terminal

9 : 원통형 솔더패드 10 : 평판형 솔더패드9: cylindrical solder pad 10: flat solder pad

본 고안은 컨넥터 고정용 솔더패드에 관한 것으로서, 더욱 상세하게는 컨넥터핀에 솔더패드를 삽입하여 컨넥터를 고정할 수 있도록 한것이다.The present invention relates to a solder pad for fixing a connector, and more specifically, to insert a solder pad in the connector pin to fix the connector.

종래에는 제1도 및 제2도에 도시한 바와같이 DIP용 인쇄회로기판(1)의 일측에 형성된 삽입공(2)내로 컨넥터(3)에 고정된 커넥터핀(4)을 삽입 시킨후 컨넥터핀을 인쇄회로기판(1)에 납땜인두(도시는 생략함)로 실장 하였다.Conventionally, as shown in FIGS. 1 and 2, after inserting the connector pin 4 fixed to the connector 3 into the insertion hole 2 formed on one side of the DIP printed circuit board 1, the connector pin Is mounted on a printed circuit board 1 with a soldering iron (not shown).

또한, 제3도 및 제4도에 도시한바와 같이 표면실장용 인쇄회로기판(5)의 일측에 형성된 접속단자(6)를 컨넥터(7)에 고정된 컨넥터(8)내로 삽입 시킨후 상기 컨넥터핀과 접속단자를 납땜인두(도시는 생략함)로 실장 하였다.Further, as shown in FIGS. 3 and 4, the connection terminal 6 formed on one side of the surface mount printed circuit board 5 is inserted into the connector 8 fixed to the connector 7, and then the connector is connected. The pins and connection terminals were mounted with soldering irons (not shown).

그러나, 이러한 종래의 컨넥터를 실장시는 반드시 납땜인두를 이용해야 되므로 작업시간이 많이 소요됨은 물론 고온에 의해 인쇄회로기판의 회로가 파손되는 등의 문제점이 있었다.However, since the soldering iron must be used when mounting such a conventional connector, a lot of working time is required and there is a problem such that the circuit of the printed circuit board is damaged by high temperature.

본 고안은 상기한 문제점을 해결하기 위해 안출한 것으로서, 인쇄회로기판에 컨넥터핀을 리플로우 솔더링하여 작업시간의 단축은 물론 인쇄회로기판에 구성된 회로의 파손을 방지할 수 있도록 하는데 그 목적이 있다.The present invention has been made to solve the above problems, the purpose of the reflow soldering the connector pin to the printed circuit board to shorten the working time as well as to prevent damage to the circuit configured on the printed circuit board.

상기한 목적을 달성하기 위한 본 고안의 형태에 따르면, DIP용 인쇄회로기판 저면으로 복수개의 컨넥터핀을 노출시켜 원통형의 납땜용 솔더패드를 상기 컨넥터핀에 삽입하고, 표면실장용 컨넥터핀에는 인쇄회로기판이 접속단자를 삽입함과 동시에 컨넥터핀과 인쇄회로기판에 한쌍의 평판형 납땜용 솔더패드를 삽입하여 상기 각 컨넥터핀을 리플로우 솔더링 하여서된 컨넥터 고정용 솔더패드가 제공된다.According to an aspect of the present invention for achieving the above object, by inserting a plurality of connector pins on the bottom surface of the printed circuit board for DIP to insert a cylindrical soldering solder pad to the connector pin, a printed circuit on the surface mounting connector pin A connector fixing solder pad is provided by reflow soldering each of the connector pins by inserting a pair of flat solder pads into the connector pin and the printed circuit board at the same time as the substrate is inserted into the connection terminal.

이하, 본 고안을 일실시예로 도시한 첨부도면 제5도 내지 제8도를 참조하여 상세히 설명하면 다음과 같다.Hereinafter, with reference to Figures 5 to 8 of the accompanying drawings showing the present invention as an embodiment in detail as follows.

제5도는 본 고안에 따른 DIP용 인쇄회로기판에 컨넥터가 고정된 상태의 평면도이고, 제6도는 본 고안에 DIP용 솔더패드의 사시도로서, 본 고안의 DIP용 인쇄회로기판(1)의 일측에 형성된 삽입공(2)내로 삽입되어 저면으로 컨넥터(3)의 컨넥터핀(4)에 원통형의 납땜용 솔더패드(9)를 삽입시킨후 상기 인쇄회로기판을 가열로(도시는 생략함) 내부로 삽입시켜 가열하면 상기 각 컨넥터핀은 리플로우 솔더링된다.5 is a plan view of the connector fixed to the DIP printed circuit board according to the present invention, Figure 6 is a perspective view of a solder pad for DIP in the present invention, one side of the DIP printed circuit board 1 of the present invention Inserted into the formed insertion hole (2) to insert a cylindrical soldering pad (9) to the connector pin (4) of the connector (3) to the bottom and then the printed circuit board into the heating furnace (not shown) When inserted and heated, the connector pins are reflow soldered.

또한, 제7도 및 제8도에 도시한 바와같이 표면실장용 인쇄회로기판(5)의 일측에 형성된 접속단자(6)를 컨넥터(7)의 일측에 형성된 컨넥터핀(8)내로 삽입시킨후 상기 접속단자와 컨넥터핀(8)사이에 평판형의 납땜용 솔더패드를 상.하부에 한장씩 삽입시켜 가열로 내부에서 가열하면 상기 각 컨넥터핀은 리플로우 솔더링된다.In addition, as shown in Figs. 7 and 8, after inserting the connection terminal 6 formed on one side of the surface-mounted printed circuit board 5 into the connector pin 8 formed on one side of the connector 7, When each of the connector pins is inserted into the upper and lower portions of the flat solder pad between the connection terminal and the connector pin 8 and heated inside the heating furnace, the connector pins are reflow soldered.

이상에서와 같이, 본 고안은 컨넥터핀에 솔더패드를 삽입하여 가열시키면 인쇄회로기판에 컨넥터가 고정되므로 작업이 단순화는 물론 과열에 의한 회로의 파손을 방지할 수 있게되는 매우 유용한 고안이다.As described above, the present invention is a very useful design that can simplify the operation and prevent damage to the circuit due to overheating because the connector is fixed to the printed circuit board when the solder pad is inserted into the connector pin and heated.

Claims (1)

DIP용 인쇄회로기판(1) 저면으로 복수개의 컨넥터핀(4)을 노출시켜 원통형의 납땜용 솔더패드(9)를 상기 컨넥터핀에 삽입하고, 표면실장용 컨넥터핀(8)에는 인쇄회로기판(5)이 접속단자(6)를 삽입함과 동시에 컨넥터핀과 인쇄회로기판에 한쌍의 평판형 납땜용 솔더패드(10)를 삽입하여 상기 각 컨넥터핀을 리플로우 솔더링 하여서됨을 특징으로 하는 컨넥터 고정용 솔더패드.A plurality of connector pins 4 are exposed on the bottom surface of the DIP printed circuit board 1 to insert a cylindrical solder pad 9 into the connector pins, and the surface mounting connector pins 8 have a printed circuit board ( 5) Inserting the connection terminal (6) and at the same time the connector pin and the printed circuit board by inserting a pair of flat soldering solder pads (10) by reflow soldering each connector pin, characterized in that Solder pads.
KR2019940038465U 1994-12-30 1994-12-30 Solder pad for holding connector KR200197864Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940038465U KR200197864Y1 (en) 1994-12-30 1994-12-30 Solder pad for holding connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940038465U KR200197864Y1 (en) 1994-12-30 1994-12-30 Solder pad for holding connector

Publications (2)

Publication Number Publication Date
KR960025602U KR960025602U (en) 1996-07-22
KR200197864Y1 true KR200197864Y1 (en) 2000-10-02

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Application Number Title Priority Date Filing Date
KR2019940038465U KR200197864Y1 (en) 1994-12-30 1994-12-30 Solder pad for holding connector

Country Status (1)

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Publication number Publication date
KR960025602U (en) 1996-07-22

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