KR200183623Y1 - Bouble-free solder print pattern of moudle - Google Patents
Bouble-free solder print pattern of moudle Download PDFInfo
- Publication number
- KR200183623Y1 KR200183623Y1 KR2019940023633U KR19940023633U KR200183623Y1 KR 200183623 Y1 KR200183623 Y1 KR 200183623Y1 KR 2019940023633 U KR2019940023633 U KR 2019940023633U KR 19940023633 U KR19940023633 U KR 19940023633U KR 200183623 Y1 KR200183623 Y1 KR 200183623Y1
- Authority
- KR
- South Korea
- Prior art keywords
- pattern
- solder
- substrate
- print pattern
- module
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Abstract
본 고안은 모듈의 기포제거 솔더프린트 패턴에 관한 것으로, 기판의 부품 솔더링시 솔더부에 발생하는 플럭스기포의 발생을 방지하여 모듈의 동작시 발생하는 열의 방출을 원활히 하는 구조를 갖는 솔더프린트 패턴을 제공함이 목적이다.The present invention relates to a debubble solderprint pattern of the module, to provide a solderprint pattern having a structure that facilitates the release of heat generated during operation of the module by preventing the generation of flux bubbles generated in the solder portion when soldering the components of the substrate. This is the purpose.
본 고안은 기판의 상면에 솔더부의 형성시 사각형상의 본드패드에 인쇄하며, 인쇄 중앙부위에는 공간부를 형성하고, 상기 공간부를 중심으로 상하를 분리하여 패턴을 형성하며, 기포의 발생을 방지함으로서 내구성이 향상된 양질의 제품을 생산하는 효과가 있다.The present invention prints on a rectangular bond pad when the solder portion is formed on the upper surface of the substrate, and forms a space portion at the printing center portion, forms a pattern by separating the top and bottom around the space portion, and prevents the occurrence of bubbles, thereby improving durability. It is effective to produce high quality products.
Description
제1도는 기판상면에 형성한 솔더부를 나타내는 부분단면도.1 is a partial sectional view showing a solder portion formed on an upper surface of a substrate.
제2(a)도는 종래의 솔더프린트 패턴을 나타내는 평면도이고,2 (a) is a plan view showing a conventional solder print pattern,
제2(b)도는 솔더링후의 기포발생을 나타내는 단면도이다.2 (b) is a cross-sectional view showing bubble generation after soldering.
제3도는 본 고안의 솔더 프린트 패턴을 나타내는 평면도.3 is a plan view showing a solder print pattern of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 기판 12 : 도체패턴10 substrate 12 conductor pattern
14 : 솔더부 16 : 부품14 solder part 16 parts
18 : 기포 20 : 본드패드(Bond Pad)18: bubble 20: bond pad (Bond Pad)
24 : 솔더프린트 패턴24: solder print pattern
본 고안은 모듈의 기포제거 솔더프린트 패턴에 관한 것으로, 특히 모듈의 동작시 기판에 형성되어 열적 스트레스나 방열특성에 영향을 주는 플럭스기포의 발생을 방지하는 구조를 갖는 모듈의 기포제거 솔더프린트 패턴에 관한 것이다.The present invention relates to a defoaming solderprint pattern of the module, in particular to the defoaming solderprint pattern of the module having a structure that is formed on the substrate during operation of the module to prevent the generation of flux bubbles affecting thermal stress or heat dissipation characteristics. It is about.
제1도는 기판의 상면에 형성한 솔더부를 도시하는 도면이다.1 is a diagram showing a solder portion formed on an upper surface of a substrate.
동 도면에서, 기판(10)의 상면에는 도체패턴(12)이 형성되며, 상기 도체패턴(12)의 상면부에는 솔더부(14)가 형성되어 부품(16)을 실장한다.In the same figure, the conductive pattern 12 is formed on the upper surface of the substrate 10, and the solder portion 14 is formed on the upper surface of the conductive pattern 12 to mount the component 16.
상기의 솔더부(14)의 구성으로 본드패드(20)가 위치하고 납땜성이 좋고 기판(10)에 대해 강한 접착강도를 유지할 수 있도록 솔더프린트 패턴(22)을 인쇄한다.With the configuration of the solder portion 14, the bond pad 20 is positioned and the solder print pattern 22 is printed so that the solderability is good and the strong adhesive strength to the substrate 10 can be maintained.
이후, 파워 트랜지스터 같은 부품(16)을 상기 솔더부(14)위에 실장한다.Then, a component 16 such as a power transistor is mounted on the solder portion 14.
제2(a)도는 종래의 솔더프린트 패턴을 도시하는 도면으로, 본드패드(20)의 형상과 같은 사각형상으로 솔더프린트 패턴(22)이 인쇄된다.FIG. 2 (a) shows a conventional solder print pattern, in which a solder print pattern 22 is printed in a quadrangular shape like that of the bond pad 20.
그러나 상기와 같은 패턴(22)의 구조는 하기와 같은 문제점이 발생한다.However, the structure of the pattern 22 as described above causes the following problems.
본드패드(20)와 같은 형상으로 인쇄하는 솔더프린트 패턴(22)은 제1도 및 제2(b)도와 같이 솔더링후의 솔더부(14)에 플럭스기포(18)가 생기게 된다.In the solder print pattern 22 printed in the same shape as the bond pad 20, the flux bubbles 18 are formed in the solder portion 14 after soldering as shown in FIGS. 1 and 2 (b).
상기의 플럭스기퍼(18)는 솔더링중 외부로 나가지 못한 가스가 잔재하는 것으로, 모듈의 작동시 125℃의 열에 대한 방출이 상기 기포(18)에 의해 제대로 이루어지지 않으므로 제품의 특성이 저하되는 문제점이 발생한다.The flux zipper 18 is a gas that does not go to the outside during soldering remains, the emission of heat at 125 ℃ during the operation of the module is not properly made by the bubble 18 is a problem that the characteristics of the product is deteriorated Occurs.
따라서 본 고안은 상기의 문제점을 해결하기 위해 안출한 것이다.Therefore, the present invention is devised to solve the above problems.
본 고안은 기판의 부품 솔더링시 솔더부에 발생하는 플럭스기포의 발생 및 잔재를 방지하여 모듈의 동작시 발생하는 열의 방출을 원활히 하는 구조를 갖는 모듈의 기포제거 솔더프린트 패턴을 제공함이 목적이다.An object of the present invention is to provide a bubble free solder print pattern of a module having a structure that prevents the generation of flux bubbles and residual material generated during soldering of the substrate to facilitate the release of heat generated during operation of the module.
상기의 목적을 달성하기 위한 본 고안은The present invention for achieving the above object
기판의 상면에 솔더부의 형성시 사각형상의 본드패드에 인쇄하며, 인쇄 중앙부위에는 공간부를 형성하고, 상기 공간부를 중심으로 상하를 분리하여 패턴을 형성함을 특징으로 한다.When the solder portion is formed on the upper surface of the substrate is printed on a rectangular bond pad, the center portion of the printing to form a space, characterized in that to form a pattern by separating the upper and lower centering around the space.
이하, 본 고안의 기술적 구성과 이에따른 효과를 설명하면 다음과 같다.Hereinafter, the technical configuration and the effects thereof according to the present invention will be described.
제3도는 본 고안의 솔더프린트 패턴을 도시하는 도면이다.3 is a view showing a solderprint pattern of the present invention.
동 도면에서, 부품(16)을 납땜하는 솔더부(14)의 구성부분인 본드패드(20)는 사각형상을 유지하며, 인쇄되는 솔더프린트 패턴(24)은 중앙부위에 공간부를 형성하며, 상기 공간부를 중심으로 상하를 분리하여 솔더프린트 패턴(24)을 형성한다.In the figure, the bond pad 20, which is a component of the solder portion 14 for soldering the component 16, maintains a rectangular shape, and the printed solderprint pattern 24 forms a space portion in the center portion. The solder print pattern 24 is formed by separating the top and bottom centering the space part.
본드패드(20)와 인쇄된 솔더프린트 패턴(24)에 의해 부품(16)을 솔더링하여 실장하는 솔더부(14)는 솔더링시에 가스가 발생하는데, 상기의 발생한 가스는 패턴(24) 중앙부위 및 솔더링 이외의 부위로 방출되어 기포발생이 방지되며 표면장력에 의해 솔더링 부위로 당겨져서 솔더부(14)를 형성한다.The solder portion 14 which solders and mounts the component 16 by the bond pad 20 and the printed solder print pattern 24 generates gas at the time of soldering, and the generated gas is formed at the center portion of the pattern 24. And is discharged to a portion other than soldering to prevent bubble generation and is pulled to the soldering portion by surface tension to form the solder portion 14.
상기와 같은 본 고안은 솔더프린트 패턴(24)의 구조를 바꿔서 플럭스기포(18)의 발생을 방지하므로 모듈의 동작시 열방출을 용이하게 하며, 이로 인해 내구성이 향상된 양질의 제품을 생산하는 효과가 있다.The present invention as described above to prevent the generation of the flux bubble 18 by changing the structure of the solder print pattern 24, thereby facilitating heat dissipation during the operation of the module, thereby producing a quality product with improved durability have.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940023633U KR200183623Y1 (en) | 1994-09-13 | 1994-09-13 | Bouble-free solder print pattern of moudle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940023633U KR200183623Y1 (en) | 1994-09-13 | 1994-09-13 | Bouble-free solder print pattern of moudle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960012963U KR960012963U (en) | 1996-04-17 |
| KR200183623Y1 true KR200183623Y1 (en) | 2000-06-01 |
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ID=19393059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940023633U KR200183623Y1 (en) | 1994-09-13 | 1994-09-13 | Bouble-free solder print pattern of moudle |
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| Country | Link |
|---|---|
| KR (1) | KR200183623Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9099630B2 (en) | 2013-02-05 | 2015-08-04 | Samsung Electronics Co., Ltd. | Electronic apparatus |
-
1994
- 1994-09-13 KR KR2019940023633U patent/KR200183623Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9099630B2 (en) | 2013-02-05 | 2015-08-04 | Samsung Electronics Co., Ltd. | Electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR960012963U (en) | 1996-04-17 |
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