KR20010060140A - Combination system for semiconductor manufacturing - Google Patents

Combination system for semiconductor manufacturing Download PDF

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Publication number
KR20010060140A
KR20010060140A KR1019990068263A KR19990068263A KR20010060140A KR 20010060140 A KR20010060140 A KR 20010060140A KR 1019990068263 A KR1019990068263 A KR 1019990068263A KR 19990068263 A KR19990068263 A KR 19990068263A KR 20010060140 A KR20010060140 A KR 20010060140A
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KR
South Korea
Prior art keywords
cassette
robot
semiconductor
chemical
deposition
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KR1019990068263A
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Korean (ko)
Inventor
이시광
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박종섭
주식회사 하이닉스반도체
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Priority to KR1019990068263A priority Critical patent/KR20010060140A/en
Publication of KR20010060140A publication Critical patent/KR20010060140A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715Changing the direction of the conveying path
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Abstract

PURPOSE: A composite system for manufacturing a semiconductor device is provided to reduce the creation of a natural oxide layer by performing a cleaning process and a deposition process in one system. CONSTITUTION: A composite system for manufacturing a semiconductor device comprises a cleaning robot(30) which is movably installed in a working chamber. A plurality of chemical bathes(31) are installed at a side of the cleaning robot(30). The plural chemical bathes(31) are vertically stacked so as to inject chemical. A plurality of cassette supplying devices(32) are installed at a side of the chemical bath(31). The cassette supplying devices(32) are formed with a plurality of gates and a rotating device for rotating a cassette and the wafer. A deposition robot(33) is positioned at a side of the chemical bath(31) and the cassette supplying device(32). A plurality of reaction furnaces(34) are formed at a side of the deposition robot(33).

Description

반도체 제조용 복합시스템{COMBINATION SYSTEM FOR SEMICONDUCTOR MANUFACTURING}Complex system for semiconductor manufacturing {COMBINATION SYSTEM FOR SEMICONDUCTOR MANUFACTURING}
본 발명은 반도체 제조용 복합시스템에 관한 것으로, 특히 반도체 제조 공정 중 세정 공정과 증착 공정을 하나의 시스템에서 이루어질 수 있도록 한 반도체 제조용 복합시스템에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a complex system for semiconductor manufacturing, and more particularly, to a complex system for semiconductor manufacturing in which a cleaning process and a deposition process can be performed in one system.
일반적으로 반도체 제조 공정 중에서 웨이퍼를 세정하는 세정 공정과 웨이퍼에 케미컬(CHEMICAL)을 증착시키는 증착 공정이 포함되어 진행된다.In general, a semiconductor manufacturing process includes a cleaning process for cleaning a wafer and a deposition process for depositing chemical (CHEMICAL) on the wafer.
도 1은 상기 세정 공정이 이루어지는 세정장비의 일례로 웹 스테이션 시스템(WET STATION SYSTEM)을 개략적으로 도시한 것으로, 이에 도시한 바와 같이, 종래 웹 스테이션 시스템은 작업 공간에 X,Y축으로 움직임이 가능하도록 암(ARM)(R)이 구비된 웨이퍼 이송용 로봇(1)이 설치되어 있고 그 암(R)이 설치된 하측으로 세정 공정에 필요한 다수개의 케미컬 베스(2)가 설치되어 있다. 그리고 그 다수개의 케미컬 베스(2)가 설치되는 일측에 카세트(CASSETTE)가 투입되는 로딩장치(3)가 설치되어 있고 그 로딩장치(3)의 반대측에 위치하는 케미컬 베스(2)의 측부에 웨이퍼를 건조시키는 드라이어(4)가 설치되며 그 측부에 웨이퍼를 카세트에 수납하는 언로딩 장치(5)가 설치되어 있다.Figure 1 schematically shows a web station system (WET STATION SYSTEM) as an example of the cleaning equipment that the cleaning process is performed, as shown, the conventional web station system can be moved in the work space in the X, Y axis A wafer transfer robot 1 equipped with an arm R is provided, and a plurality of chemical baths 2 required for the cleaning process are provided below the arm R. In addition, a loading device 3 into which a cassette is inserted is installed on one side where the plurality of chemical baths 2 are installed, and a wafer is provided on the side of the chemical bath 2 located on the opposite side of the loading device 3. A dryer 4 for drying the wafer is provided, and an unloading device 5 for accommodating the wafer in the cassette is provided on the side thereof.
또한, 증착 공정이 이루어지는 세정장비의 일례로 퍼넌스 시스템(FURNACE SYSTEM)은 별도의 작업공간에 설비된다. 상기 퍼넌스 시스템은, 도 2에 도시한 바와 같이, 카세트가 투입되는 투입장치(10)와, 상기 투입장치(10)에 투입된 카세트를 이동시키는 카세트 핸들러(11)와, 상기 카세트 핸들러(11)에 의해 이동되어진 카세트를 보관하는 스테이지(12)와, 상기 스테이지(12)에 적재된 웨이퍼를 1회 동작에 5장씩 옮길수 있는 트랜스퍼(13)와, 상기 트랜스퍼(13)에 의해 옮겨진 웨이퍼를 반응실(14)로 이동시키는 보우트(15)와, 1회 진행시 150장의 웨이퍼를 처리하는 반응실(14)을 구비하여 이루어진다.In addition, as an example of the cleaning equipment in which the deposition process is performed, the Furnace System (FURNACE SYSTEM) is installed in a separate workspace. As shown in FIG. 2, the maintenance system includes an input device 10 into which a cassette is inserted, a cassette handler 11 for moving a cassette inserted into the input device 10, and the cassette handler 11. A stage 12 for storing a cassette moved by the transfer chamber, a transfer 13 for transferring five sheets of wafers loaded in the stage 12 in one operation, and a wafer transferred by the transfer 13 to a reaction chamber. It comprises a boat 15 for moving to 14 and a reaction chamber 14 for processing 150 wafers in a single run.
상기한 바와 같은 웹 스테이션 시스템과 퍼넌스 시스템에서 이루어지는 세정 공정 및 증착 공정과정은 다음과 같다.The cleaning process and the deposition process performed in the web station system and the maintenance system as described above are as follows.
먼저, 웹 스테이션 시스템에서 작업자가 카세트를 로딩장치(3)에 위치시켜 공정 진행을 시작하면 로봇(1)의 암(R)이 로딩장치(3)에 위치한 카세트를 픽업하여 각 케미컬 베스(2)에 담그면서 이동하게 되며 이어 드라이어(4)를 거치면서 웨이퍼를 건조시켜 세정 공정 진행이 종료되며 그 종료된 카세트가 언로딩 장치(5)에 위치하게 된다.First, in the web station system, when the operator starts the process by placing the cassette in the loading device 3, the arm R of the robot 1 picks up the cassette located in the loading device 3, and each chemical bath 2 Submerged in the movement, the wafer is dried while passing through the dryer 4 and the cleaning process is completed, and the finished cassette is positioned in the unloading apparatus 5.
상기 세정 공정이 종료된 후 작업자가 언로딩 장치(5)에 있는 카세트를 들고 퍼넌스 시스템으로 이동시켜 퍼넌스 시스템의 투입장치(10)에 위치시키면서 공정을 진행시키게 된다. 상기 투입장치(10)에 위치한 카세트는 카세트 핸들러(11)에 의해 스테이지(12)로 이동되며 되며 상기 트랜스퍼(13)에 의해 스테이지(12)로 옮겨진 카세트내에 있는 웨이퍼가 1회 구동시 5매씩 옮겨지게 되고 웨이퍼가 모두 옮겨지게 되면 공정 진행 절차에 의해 보우트(15)가 자동적으로 반응실(14)로 올라가서 외부와 차단된 상태에서 디퓨젼(DIFFUSION) 공정이 완료된다. 상기 공정이 완료된 웨이퍼는 진행 방향의 역순으로 절차를 거쳐 시스템 밖으로 이동된다.After the cleaning process is completed, the worker carries the cassette in the unloading device 5 to the maintenance system and moves the process while placing it in the input device 10 of the maintenance system. The cassette located in the feeding device 10 is moved to the stage 12 by the cassette handler 11, and the wafer in the cassette transferred to the stage 12 by the transfer 13 is moved by five sheets at a time of driving. When the wafer is moved and all the wafers are transferred, the bow 15 is automatically raised to the reaction chamber 14 by the process proceeding process, and the diffusion process is completed while being blocked from the outside. After the process is completed, the wafer is moved out of the system through the procedure in the reverse order of travel.
그러나 상기한 바와 같이 세정 공정과 증착 공정이 진행되는 시스템은 별도로 두개의 시스템, 즉 웹 스테이션 시스템과 퍼넌스 시스템으로 구성되어 있어 두개의 시스템이 설치되는 공간이 넓게 차지하게 되고 또한 웹 스테이션 시스템에서 공정이 완료된 웨이퍼를 퍼넌스 시스템으로 작업자가 이동시켜야 될 뿐만 아니라 웨이퍼를 퍼넌스 시스템에 투입하는 과정에서 퍼넌스 시스템의 상태, 즉 공정이 진행되고 있는가를 직접 확인하고 투입을 조정하여야 하므로 작업이 불편하고 비효율적이며 아울러 공정 진행 시간이 많이 소요되어 웨이퍼에 자연 산화막이 생성되어 수율을 저하시키게 되는 문제점이 있었다.However, as described above, the system in which the cleaning process and the deposition process are performed is composed of two separate systems, that is, a web station system and a maintenance system, so that the space in which the two systems are installed occupies a large space. This not only requires the operator to move the completed wafer to the maintenance system, but also inconveniently and inefficiently, as the wafer is introduced into the maintenance system, the status of the maintenance system, that is, whether the process is in progress, and the input is adjusted. In addition, there is a problem in that the process is time-consuming, the natural oxide film is generated on the wafer to lower the yield.
상기한 바와 같은 문제점을 감안하여 안출한 본 발명의 목적은 반도체 제조 공정 중 세정 공정과 증착 공정을 하나의 시스템에서 이루어질 수 있도록 한 반도체 제조용 복합시스템을 제공함에 있다.SUMMARY OF THE INVENTION An object of the present invention devised in view of the above problems is to provide a complex system for manufacturing a semiconductor, which allows a cleaning process and a deposition process to be performed in one system.
도 1는 종래 반도체 제조용 웹 스테이션 시스템을 간략화하여 도시한 정면도,1 is a front view schematically showing a conventional web station system for semiconductor manufacturing;
도 2는 종래 반도체 제조용 웹 스테이션 시스템을 간략화하여 도시한 정면도,2 is a front view schematically showing a conventional web station system for semiconductor manufacturing;
도 3은 본 발명의 반도체 제조용 복합시스템을 도시한 정면도.3 is a front view showing a composite system for manufacturing a semiconductor of the present invention.
(도면의 주요부분에 대한 부호의 설명)(Explanation of symbols on the main parts of drawing
30 ; 세정 진행용 로봇 31 ; 케이컬 베스30; Robot for cleaning progress 31; Caik Beth
32 ; 투입장치 33 ; 증착 진행용 로봇32; Input device 33; Deposition Progress Robot
34 ; 반응로34; Reactor
상기한 바와 같은 본 발명의 목적을 달성하기 위하여 소정 영역의 작업 공간내의 일측에 위치하여 전후진, 회전, 좌우, 상하운동이 가능한 세정 진행용 로봇과, 상기 세정 진행용 로봇의 측부에 수직으로 적층된 다수개의 케미컬 베스와, 상기 케미컬 베스의 측부에 설치되는 복수개의 카세트 투입장치와, 상기 케미컬 베스 및 카세트 투입장치의 측부에 위치하여 전후진, 회전, 좌우, 상하운동이 가능한 증착 진행용 로봇과, 상기 증착 진행용 로봇의 측부에 수직으로 적층되도록 설치되는 다수개의 반응로를 포함하여 구성함을 특징으로 하는 반도체 제조용 복합시스템이 제공된다.In order to achieve the object of the present invention as described above, it is located on one side of the work space in a predetermined area and can be moved forward and backward, rotated, left and right, and vertically moving. A plurality of chemical baths, a plurality of cassette feeders installed on the side of the chemical bath, a deposition progress robot positioned on the side of the chemical baths and the cassette feeder and capable of forward, backward, rotation, left and right movement, It is provided with a composite system for manufacturing a semiconductor, characterized in that it comprises a plurality of reactors are installed to be stacked vertically on the side of the robot for deposition progress.
이하, 본 발명의 반도체 제조용 복합시스템을 첨부도면에 도시한 실시례에 따라 설명하면 다음과 같다.Hereinafter, the composite system for manufacturing a semiconductor of the present invention will be described according to the embodiment shown in the accompanying drawings.
도 3은 본 발명의 반도체 제조용 복합시스템의 일실시례를 도시한 것으로, 이를 참조하여 설명하면, 먼저 소정의 공간을 갖는 작업실에 전후진, 회전, 좌우, 상하운동이 가능한 세정 진행용 로봇(30)이 설치된다. 그리고 상기 세정 진행용 로봇(30)의 측부에 다수개의 케미컬 베스(31)가 설치된다. 상기 케미컬 베스(31)는 웨이퍼가 한 장씩 처리되도록 구성될 뿐만 아니라 다수개의 케미컬 베스(31)는 수직으로 적층되며 그 케미컬 베스(31)는 케미컬을 분사하는 분사방식으로 원하는 공정을 진행하게 된다.3 is a view illustrating an embodiment of a composite system for manufacturing a semiconductor of the present invention. Referring to this description, a robot for cleaning progress 30 may be moved back and forth, rotate, left, and right in a workroom having a predetermined space. ) Is installed. In addition, a plurality of chemical baths 31 are installed on the side of the robot 30 for cleaning progress. The chemical bath 31 is configured not only to process the wafer one by one, but also a plurality of chemical baths 31 are vertically stacked, and the chemical bath 31 performs a desired process by a spraying method for injecting chemicals.
그리고 상기 케미컬 베스(31)의 측부에 복수개의 카세트 투입장치(32)가 설치되며 그 카세트 투입장치(32)는 두 개 설치됨이 바람직하다. 상기 카세트 투입장치(32)는 다수개의 게이트(G)가 설치되며 그 내부에 안착되는 카세트 및 웨이퍼를 회전시키는 회전 기능이 구비된다.In addition, a plurality of cassette input devices 32 are installed on the side of the chemical bath 31, and two cassette input devices 32 are preferably installed. The cassette input device 32 is provided with a plurality of gates (G) is provided with a rotation function for rotating the cassette and the wafer seated therein.
그리고 상기 케미컬 베스(31) 및 카세트 투입장치(32)의 측부에 전후진, 회전, 좌우, 상하운동이 가능한 증착 진행용 로봇(33)이 구비되고 그 증착 진행용 로봇(33)의 측부에 반응실이 구비된 반응로(34)가 복수개 설치된다. 상기 반응로(34)의 반응실은 웨이퍼를 한 장씩 처리할 수 있도록 구성되며 그 반응로(34)는 수직으로 적층되도록 설치된다.In addition, a deposition progress robot 33 capable of moving forward, backward, rotation, left and right, and up and down movement is provided on the side of the chemical bath 31 and the cassette inserter 32 and reacts to the side of the deposition progress robot 33. A plurality of reactors 34 with a seal are provided. The reaction chamber of the reactor 34 is configured to process wafers one by one, and the reactor 34 is installed to be stacked vertically.
이하, 본 발명의 반도체 제조용 마스크 보관장치의 작용효과를 설명하면 다음과 같다.Hereinafter, the operational effects of the mask storage device for manufacturing a semiconductor of the present invention will be described.
먼저 공정을 진행하기 위한 웨이퍼가 적층된 카세트를 작업자가 하나의 투입장치(32)에 투입하면 작업자측의 게이트(G)가 닫히고 이어 내부의 회전 기능에 의해 케미컬 베스(31)측으로 90°회전한 다음 케미컬 베스(31)측의 게이트(G)가 열리게 된다. 상기 케미컬 베스(31)측의 게이트(G)가 열리게 되면 세정 진행용 로봇(30)이 전후진, 회전, 좌우, 상하로 움직이면서 투입장치(32)내에 놓여진 카세트내의 웨이퍼를 케미컬 베스(31)로 이동시키게 된다. 상기 케미컬 베스(31)내에서 원하는 공정이 진행된 다음 세정 진행용 로봇(30)이 케미컬 베스(31)내의 웨이퍼를 꺼내어 상기 투입장치(32)측으로 재이동시키게 된다. 이와 같은 과정이 반복되어 세정 공정이 완료된 후 케미컬 베스(31)측의 게이트(G)가 닫히고 이어 투입장치(30)내에 놓여진 카세트가 90°회전한 다음 증착측의 게이트(G)가 열리게 된다. 상기 증착 진행용 로봇(33)이 전후진, 회전, 좌우, 상하로 움직이면서 투입장치(32)내에 놓여진 카세트내의 웨이퍼를 반응로(34)의 반응실로 이동시키게 되어 그 반응실에서 원하는 공정이 진행된다.First, when a worker inserts a cassette in which wafers are stacked for processing, into one feeding device 32, the gate G of the worker is closed and then rotates 90 ° toward the chemical bath 31 by the internal rotating function. Next, the gate G on the side of the chemical bath 31 is opened. When the gate G on the side of the chemical bath 31 is opened, the cleaning process robot 30 moves forward, backward, rotation, left and right, up and down, and moves the wafer in the cassette placed in the feeding device 32 to the chemical bath 31. Will be moved. After the desired process is performed in the chemical bath 31, the cleaning process robot 30 takes out the wafer in the chemical bath 31 and moves it to the feeding device 32. This process is repeated, and after the cleaning process is completed, the gate G of the chemical bath 31 is closed, and the cassette placed in the input device 30 is rotated by 90 °, and then the gate G of the deposition side is opened. The vapor deposition robot 33 moves back and forth, rotation, left and right, and up and down to move the wafer in the cassette placed in the input device 32 to the reaction chamber of the reactor 34, and the desired process proceeds in the reaction chamber. .
또한, 다른 하나의 투입장치(32)에 별도의 카세트를 투입하면 위와 같은 동작이 연속적으로 진행된다. 이와 같은 과정에서 투입장치(32)내에 질소 분위기용 퍼지 N2를 유입시키게 되면 웨이퍼가 대기에 노출되지 않아 공정상 저해가 되는 자연 산화막의 성장을 억제하게 된다.In addition, when a separate cassette is inserted into another input device 32, the above operation proceeds continuously. In this process, when nitrogen purge N 2 is introduced into the input device 32, the wafer is not exposed to the atmosphere, thereby suppressing the growth of the natural oxide film which is inhibited in the process.
이와 같이 본 발명은 세정 공정과 증착 공정을 하나의 시스템에서 완료할 수 있게된다.As such, the present invention enables the cleaning process and the deposition process to be completed in one system.
이상에서 설명한 바와 같이, 본 발명에 의한 반도체 제조용 복합시스템은 반도체 제조 공정 중 세정 공정과 증착 공정이 하나의 시스템에 의해 이루어짐이 가능하게 되어 시스템이 차지하는 공간을 대폭 줄일 수 있게 된다. 또한, 하나의 시스템에서 연속적인 진행이 이루어지게 됨으로써 공정이 진행되는데 소요되는 시간이 단축되어 생산성을 높일 수 있고 아울러 자연 산화막 생성을 최소화시키게 되어 수율 저하를 억제하게 되는 효과가 있다.As described above, in the semiconductor manufacturing complex system of the present invention, the cleaning process and the deposition process of the semiconductor manufacturing process may be performed by one system, thereby greatly reducing the space occupied by the system. In addition, since the continuous progress is made in one system, the time required for the process is shortened, thereby increasing productivity and minimizing the production of a natural oxide film, thereby reducing the yield.

Claims (2)

  1. 소정 영역의 작업 공간내의 일측에 구비되어 전후진, 회전, 좌우, 상하운동이 가능한 세정 진행용 로봇과, 상기 세정 진행용 로봇의 측부에 수직으로 적층된 다수개의 케미컬 베스와, 상기 케미컬 베스의 측부에 설치되는 복수개의 카세트 투입장치와, 상기 케미컬 베스 및 카세트 투입장치의 측부에 구비되어 전후진, 회전, 좌우, 상하운동이 가능한 증착 진행용 로봇과, 상기 증착 진행용 로봇의 측부에 수직으로 적층되도록 설치되는 다수개의 반응로를 포함하여 구성함을 특징으로 하는 반도체 제조용 복합시스템.A cleaning progress robot provided on one side of the work space in a predetermined area and capable of forward, backward, rotation, left and right movement, a plurality of chemical baths vertically stacked on the side of the cleaning progress robot, and the side of the chemical bath. A plurality of cassette feeding apparatuses installed in the apparatus, a deposition robot provided on the side of the chemical bath and the cassette feeding apparatus capable of moving forward, backward, rotation, left and right, and vertical movement, and stacked vertically on the side of the deposition processing robot; A composite system for manufacturing a semiconductor, comprising a plurality of reactors installed to be installed.
  2. 제1항에 있어서, 상기 케미컬 베스와 반응로는 웨이퍼가 한 장씩 처리되도록 구성된 것을 특징으로 하는 반도체 제조용 복합시스템.The complex system of claim 1, wherein the chemical bath and the reactor are configured to process wafers one by one.
KR1019990068263A 1999-12-31 1999-12-31 Combination system for semiconductor manufacturing KR20010060140A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100763168B1 (en) * 2001-05-15 2007-10-16 엘지.필립스 엘시디 주식회사 Vertical type cleaner
KR100850178B1 (en) * 2002-12-20 2008-08-04 동부일렉트로닉스 주식회사 Equipment for wet processing a semiconductor device
KR101401977B1 (en) * 2013-04-10 2014-05-30 (주)이노맥스 Wet treatment apparatus for wet treatment bath of wafer
US10186078B2 (en) 2014-11-28 2019-01-22 Polariant, Inc. System and method of recognizing indoor location of moving object
KR20210020591A (en) * 2019-08-16 2021-02-24 세메스 주식회사 Substrate treatment apparatus and Substrate treatment method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100763168B1 (en) * 2001-05-15 2007-10-16 엘지.필립스 엘시디 주식회사 Vertical type cleaner
KR100850178B1 (en) * 2002-12-20 2008-08-04 동부일렉트로닉스 주식회사 Equipment for wet processing a semiconductor device
KR101401977B1 (en) * 2013-04-10 2014-05-30 (주)이노맥스 Wet treatment apparatus for wet treatment bath of wafer
US10186078B2 (en) 2014-11-28 2019-01-22 Polariant, Inc. System and method of recognizing indoor location of moving object
KR20210020591A (en) * 2019-08-16 2021-02-24 세메스 주식회사 Substrate treatment apparatus and Substrate treatment method

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