KR20010033965A - 도금방법 및 장치 - Google Patents
도금방법 및 장치 Download PDFInfo
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- KR20010033965A KR20010033965A KR1020007007550A KR20007007550A KR20010033965A KR 20010033965 A KR20010033965 A KR 20010033965A KR 1020007007550 A KR1020007007550 A KR 1020007007550A KR 20007007550 A KR20007007550 A KR 20007007550A KR 20010033965 A KR20010033965 A KR 20010033965A
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- 238000007747 plating Methods 0.000 title claims abstract description 488
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 375
- 238000007872 degassing Methods 0.000 claims abstract description 182
- 239000012528 membrane Substances 0.000 claims description 67
- 239000007789 gas Substances 0.000 claims description 57
- 238000007772 electroless plating Methods 0.000 claims description 21
- 238000009713 electroplating Methods 0.000 claims description 15
- 238000002203 pretreatment Methods 0.000 claims description 14
- 239000011261 inert gas Substances 0.000 claims description 13
- 238000012544 monitoring process Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 abstract description 96
- 239000004094 surface-active agent Substances 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 51
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 49
- 239000001301 oxygen Substances 0.000 description 49
- 229910052760 oxygen Inorganic materials 0.000 description 49
- 238000010586 diagram Methods 0.000 description 33
- 238000001914 filtration Methods 0.000 description 19
- 238000012986 modification Methods 0.000 description 18
- 230000004048 modification Effects 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 13
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 239000001569 carbon dioxide Substances 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- 239000003570 air Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000007781 pre-processing Methods 0.000 description 4
- 238000007086 side reaction Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000012295 chemical reaction liquid Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/003—Electroplating using gases, e.g. pressure influence
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
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- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (22)
- 피도금물에 전해 또는 무전해도금을 행하는 도금방법으로서,도금액중의 용존기체를 탈기한 후, 또는 도금액중의 용존기체를 탈기하면서 도금을 행하는 그리고/또는 전처리액중의 용존기체를 탈기한 후, 또는 전처리액중의 용존기체를 탈기하면서 전처리를 행하고, 그 후 도금을 행하는 것을 특징으로 하는 도금방법.
- 제 1항에 있어서,탈기한 전처리액 또는 탈기장치로 전처리액을 탈기하면서 피도금물을 전처리액에 침지하여 상기 전처리액으로 적신 후, 상기 전해도금 또는 무전해도금을 행하는 것을 특징으로 하는 도금방법.
- 제 1항에 있어서,탈기한 도금액 또는 탈기장치로 도금액을 탈기하면서 피도금물을 도금액에 침지하여 도금을 행하는 것을 특징으로 하는 도금방법.
- 제 1항에 있어서,탈기한 전처리액 또는 탈기장치로 전처리액을 탈기하면서 피도금물의 표면에 분사하여 상기 전처리액으로 적신 후, 상기 전해도금 또는 무전해도금을 행하는 것을 특징으로 하는 도금방법.
- 제 1항에 있어서,탈기한 도금액 또는 탈기장치로 도금액을 탈기하면서 도금액을 피도금물의 표면에 분사하여 도금을 행하는 것을 특징으로 하는 도금방법.
- 제 4항 또는 제 5항에 있어서,상기 피도금물을 회전시키면서 상기 전처리액 또는 도금액을 분사하는, 또는 분사하고 나서 회전시키는 것을 특징으로 하는 도금방법.
- 제 1항 내지 제 6항중 어느 한 항에 있어서,상기 탈기는 탈기막을 가지는 탈기막모듈과 진공펌프를 사용하여 행하는 것을 특징으로 하는 도금방법.
- 제 1항 내지 제 6항중 어느 한 항에 있어서,상기 도금액 또는 전처리액의 용존기체농도를 검출하는 용존기체농도센서를 구비하고, 용존기체농도를 감시하면서 탈기처리를 행하는 것을 특징하는 도금방법.
- 제 8항에 있어서,처리가 끝난 액을 펌프에 의해 압송하여 순환하여 사용하는 것으로, 상기 순환경로중에 탈기장치를 바이패스하는 배관로를 설치하여 탈기장치에 유입하는 유량을 조정하여 탈기처리를 행하는 것을 특징으로 하는 도금방법.
- 제 1항 내지 제 9항중 어느 한 항에 있어서,상기 도금액 또는 전처리액은 용존기체농도를 4 ppm 내지 1 ppb의 사이에 유지하면서 도금 또는 전처리를 행하는 것을 특징으로 하는 도금방법.
- 도금조중에서 피도금물의 전해 또는 무전해도금을 행하는 도금장치에 있어서,상기 도금조에 공급하는 도금액 및/또는 전처리조로 도금전의 전처리를 행하는 전처리액으로부터 상기 액중에 존재하는 용존기체를 탈기처리하는 탈기장치를 구비하는 것을 특징으로 하는 도금장치.
- 도금액을 수용하는 도금조를 구비하고, 이 도금조중에서 피도금물의 전해 또는 무전해도금을 행하는 제 1항 기재의 도금장치에 있어서,상기 도금조에 도금액을 순환시키는 도금액 순환계를 구비하고, 이 도금액 순환계에 탈기장치를 설치하고, 상기 도금조로부터 배출되는 도금액중의 용존기체를 탈기하여 상기 도금조에 공급하는 것을 특징으로 하는 도금장치.
- 전처리액을 수용하는 전처리조를 구비하고, 이 전처리조로 피도금물의 전처리를 행한 후에 도금조로 상기 피도금물의 도금을 행하는 제 1항 기재의 도금장치에 있어서,상기 전처리조에 상기 처리액을 순환시키는 전처리액 순환계를 구비하고, 이 전처리액 순환계에 탈기장치를 설치하며, 상기 전처리조로부터 배출되는 상기 처리액중의 용존기체를 탈기하여 상기 전처리조에 공급하는 것을 특징으로 하는 도금장치.
- 제 11항 내지 제 13항중 어느 한 항에 있어서,상기 탈기장치는 적어도 탈기막을 가지는 탈기막모듈과 진공펌프를 구비하는 것을 특징으로 하는 도금장치.
- 제 12항 또는 제 13항에 있어서,상기 처리액 순환계를 통과하는 액의 용존기체농도를 검출하는 용존기체농도 센서를 설치함과 함께 탈기장치의 압력을 제어하는 제어장치를 설치하고, 이 제어장치는 진공배기계의 압력을 제어하여 상기 도금액의 용존기체농도를 조정가능하게 한 것을 특징으로 하는 도금장치.
- 제 12항에 에 있어서,상기 도금액 순환계에 도금액 순환탱크를 구비하고, 이 도금액 순환탱크에 탈기장치를 설치하거나 또는 상기 도금액 순환탱크와 상기 도금조와의 사이에서 도금액을 순환시키는 제 1 도금액 순환경로와는 별도로 상기 도금액 순환탱크에 도금액을 순환시키는 제 2 도금액 순환경로를 설치하고, 이 제 2 도금액 순환경로에 탈기장치를 설치하여 상기 도금액을 탈기하면서 도금을 행하는 것을 특징으로 하는 도금장치.
- 제 13항에 있어서,상기 전처리액 순환계에 전처리액 순환탱크를 구비하고, 전처리액 순환탱크에 탈기장치를 설치하거나 또는 상기 전처리액 순환탱크와 상기 전처리조와의 사이에서 전처리액을 순환시키는 제 1 전처리액 순환경로와는 별도로 상기 전처리액 순환탱크에 전처리액을 순환시키는 제 2 전처리액 순환경로를 설치하고, 이 제 2 전처리액 순환경로에 탈기장치를 설치하여 상기 전처리액을 탈기하면서 전처리를 행하는 전처리조를 구비한 것을 특징으로 하는 도금장치.
- 제 16항 또는 제 17항에 있어서,상기 도금액 순환탱크 또는 전처리액 순환탱크의 액면에 불활성가스를 공급하는 불활성가스공급수단을 설치한 것을 특징으로 하는 도금장치.
- 제 12항에 있어서,상기 도금액 순환계에 탈기장치를 설치함과 함께, 이 탈기장치에 바이패스배관을 설치하여 상기 탈기장치에 흐르는 유량을 제어하도록 한 도금장치.
- 제 13항에 있어서,상기 전처리액 순환계에 탈기장치를 설치함과 함께, 이 탈기장치에 바이패스배관을 설치하여 상기 탈기장치에 흐르는 유량을 제어하도록 한 것을 특징으로 하는 도금장치.
- 제 19항 또는 제 20항에 있어서,상기 바이패스배관을 흐르는 유량이 많을 때에는 상기 탈기장치의 감압측의 압력을 낮은 압력으로 하고, 상기 바이패스배관을 흐르는 유량이 적을 때에는 상기 탈기장치의 감압측의 압력을 높은 압력으로 조정하도록 한 것을 특징으로 하는 도금장치.
- 제 19항 또는 제 20항에 에 있어서,상기 탈기장치를 지나는 배관과, 상기 바이패스배관과의 합류전, 또는 합류후에 용존기체농도를 검출하는 센서를 배치한 것을 특징으로 하는 도금장치.
Applications Claiming Priority (9)
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JP31780698 | 1998-11-09 | ||
JP10-317806 | 1998-11-09 | ||
JP3972399 | 1999-02-18 | ||
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JP11-171224 | 1999-06-17 | ||
JP17122499 | 1999-06-17 | ||
JP11-294859 | 1999-10-18 | ||
JP29485999 | 1999-10-18 | ||
PCT/JP1999/006204 WO2000028115A1 (fr) | 1998-11-09 | 1999-11-08 | Procede de metallisation et dispositif |
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KR20010033965A true KR20010033965A (ko) | 2001-04-25 |
KR100697875B1 KR100697875B1 (ko) | 2007-03-23 |
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KR1020007007550A KR100697875B1 (ko) | 1998-11-09 | 1999-11-08 | 도금방법 및 장치 |
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US (2) | US6716332B1 (ko) |
EP (1) | EP1048757B1 (ko) |
JP (1) | JP4043192B2 (ko) |
KR (1) | KR100697875B1 (ko) |
DE (1) | DE69941111D1 (ko) |
TW (1) | TW522455B (ko) |
WO (1) | WO2000028115A1 (ko) |
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- 1999-11-08 US US09/582,919 patent/US6716332B1/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
WO2000028115A1 (fr) | 2000-05-18 |
US6716332B1 (en) | 2004-04-06 |
EP1048757A1 (en) | 2000-11-02 |
US20040159550A1 (en) | 2004-08-19 |
DE69941111D1 (de) | 2009-08-27 |
US7118664B2 (en) | 2006-10-10 |
TW522455B (en) | 2003-03-01 |
EP1048757B1 (en) | 2009-07-15 |
KR100697875B1 (ko) | 2007-03-23 |
EP1048757A4 (en) | 2006-06-14 |
JP4043192B2 (ja) | 2008-02-06 |
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