KR20010001857A - Method for connecting inkjet print head with input lines by flip-chip bonding technique - Google Patents

Method for connecting inkjet print head with input lines by flip-chip bonding technique Download PDF

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Publication number
KR20010001857A
KR20010001857A KR1019990021341A KR19990021341A KR20010001857A KR 20010001857 A KR20010001857 A KR 20010001857A KR 1019990021341 A KR1019990021341 A KR 1019990021341A KR 19990021341 A KR19990021341 A KR 19990021341A KR 20010001857 A KR20010001857 A KR 20010001857A
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KR
South Korea
Prior art keywords
bonding
power supply
metal
signal applying
applying line
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KR1019990021341A
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Korean (ko)
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KR100327247B1 (en
Inventor
김준일
정재우
유영석
Original Assignee
이형도
삼성전기 주식회사
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Priority to KR1019990021341A priority Critical patent/KR100327247B1/en
Publication of KR20010001857A publication Critical patent/KR20010001857A/en
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Publication of KR100327247B1 publication Critical patent/KR100327247B1/en

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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00Radiation therapy
    • A61N5/06Radiation therapy using light
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61HPHYSICAL THERAPY APPARATUS, e.g. DEVICES FOR LOCATING OR STIMULATING REFLEX POINTS IN THE BODY; ARTIFICIAL RESPIRATION; MASSAGE; BATHING DEVICES FOR SPECIAL THERAPEUTIC OR HYGIENIC PURPOSES OR SPECIFIC PARTS OF THE BODY
    • A61H33/00Bathing devices for special therapeutic or hygienic purposes
    • A61H33/06Artificial hot-air or cold-air baths; Steam or gas baths or douches, e.g. sauna or Finnish baths
    • A61H33/066Cabins therefor
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00Radiation therapy
    • A61N5/06Radiation therapy using light
    • A61N2005/0658Radiation therapy using light characterised by the wavelength of light used
    • A61N2005/0659Radiation therapy using light characterised by the wavelength of light used infra-red
    • A61N2005/066Radiation therapy using light characterised by the wavelength of light used infra-red far infrared

Abstract

PURPOSE: A method for connecting an input line with an ink-jet printer head using flip chip bonding method is provided to connect an input line even in case of the ink-jet printer head having a plurality of nozzles, and to minimize an actuator, thereby enabling high integration of the ink-jet printer head. CONSTITUTION: A method for connecting an input line(43) with an ink-jet printer head using flip chip bonding method includes the steps of forming a bonding pad(44) in the portion to be connected with the input line in an upper electrode(42) of an actuator of the ink-jet printer head, forming a metal for gluing(45) in the top of the bonding pad, melting the metal for gluing by heating at the temperature little higher than the melting point, and connecting the melted metal with the input line, so that the metal is rightly arranged by self-aligning characteristic due to high surface tension of the metal.

Description

Method for connecting inkjet print head with input lines by flip-chip bonding technique}

The present invention relates to a method of connecting an inkjet printhead to a power supply and a signal applying line, and more particularly, an actuator of an inkjet printhead using flip chip bonding to transfer a power supply and a signal waveform to an actuator of the inkjet printhead. And a method for connecting a power supply and a signal applying line.

In general, an inkjet printhead using an actuator is provided with an actuator including a diaphragm, a lower electrode formed on an upper portion of the diaphragm, a piezoelectric element formed on an upper portion of the lower electrode, and an upper electrode formed on an upper portion of the piezoelectric element. .

The piezoelectric body of the actuator has a property of polling when an electric field is applied. When power is applied to the upper and lower electrodes formed on the top and bottom of the polled piezoelectric material, the piezoelectric elements located between the electrodes vibrate or deform while repeating deformation and restoration.

In an inkjet print head, ink is injected onto a recording medium by vibration or mechanical deformation of the piezoelectric body of such an actuator.

In this way, since the actuator operates only when an electric field is applied, power and signal waveforms must be continuously applied to the actuator in order to operate the actuator.

In order to apply power and signal waveforms to the actuator, a power and input line, which is a line for applying power and signals, should be connected between the upper electrodes forming the actuator from a circuit for forming the power and signal waveforms.

As a method of connecting the upper electrode of the actuator to the power source and the signal applying line applying the power source and the signal waveform, conventionally, a method using wire bonding or a thermocompression method has been used.

First, FIG. 1 illustrates a method of connecting a power supply and a signal applying line to an upper electrode of an actuator of an inkjet print head using wire bonding.

In the method using wire bonding as shown in FIG. 1, an insulating layer 14 is coated on a substrate 10 up to a lead frame, and pads 16 and 17 for bonding the wires together. ) Are formed on the upper electrode 12 and the insulating layer 14, respectively.

The pads 16 and 17 separately formed on the upper electrode 16 and the insulating layer 14 of the substrate are connected by one wire 15, and the pads 17 formed on the insulating layer 14 of the wire 15 are connected to each other. ) Is coupled to the power supply and signal line (13) again. At this time, it is common to use a conductive metal such as an alloy of tin / lead (Sn / Pb) as the pad.

In this case, the power supply and signal applying line mainly use FPC (Flexible Printed Circuit), and FPC refers to a metal film formed in a predetermined pattern on an insulating substrate such as film or vinyl.

As described above, the method of connecting the actuator to the power source using wire bonding has to form a pad for the wire to be separately formed on the insulating layer of the upper electrode and the substrate, and to connect the wire to each pad, thus making the process complicated. There is a problem of this deterioration.

In addition, when the print head and the cartridge are connected, the exposed wire becomes a barrier and the wire is easily broken, which causes a problem of weak quality reliability and durability.

In addition, in the wire bonding method, the inkjet printhead must be connected to the leadframe after the connection. Therefore, even in the structure of the inkjet printhead in which the actuator and the nozzle face in the same direction, the distance between the nozzle and the paper to be printed is increased, resulting in reliability of printing. It can cause problems. In this case, the packaging by the dip (DIP) method is possible, but the technical application is difficult due to the disadvantages such as the cost of packaging and the reliability of printing generated due to the structure. In addition, in the case of an inkjet print head having a structure in which an actuator and a nozzle are directed in the same direction, there is a problem in that it is impossible to apply a flexible printed circuit board (FPCB) as a power supply and a signal applying line.

In addition, due to the impedance difference, such as the resistance of each wire, there is a problem that can not be applied to a high-speed high-definition inkjet printhead that is sensitive to minute changes in the signal waveform.

Next, a method of connecting the upper electrode of the actuator of the inkjet print head, the power supply, and the signal applying line by thermocompression method is illustrated in FIG. 2.

This method as shown in FIG. 2 is a method of directly connecting the upper electrode 22 and the power supply and the signal applying line 23 by heat or pressure without the need to form an insulating layer on the substrate 20.

This method has the advantage that the process of connecting the power supply and the actuator is simple because it directly connects the upper electrode, the power supply, and the signal applying line without forming an insulating layer.

However, since the piezoelectric body of the actuator directly receives the pressure and the amount of heat applied when connecting the power supply, the signal applying line and the upper electrode, there is a problem that the product may be damaged such as the piezoelectric body is denatured.

In addition, since a power supply and a signal applying line are directly connected to the upper electrode of the actuator, there is a problem that power may be applied to the upper electrode and the displacement of the actuator may be affected when the actuator operates according to the application of the power.

In particular, as inkjet printheads are increasingly high performance, a large number of nozzles must be included in a small area, and accordingly, the number of actuators for generating energy capable of ejecting ink from each nozzle is also increasing exponentially.

In addition, for high quality printing, small droplets must be ejected from the inkjet print head, and for this purpose, the nozzles must be small in diameter and patterned so that the actuator cells for ejecting ink are fine. Therefore, the connection pads of the power supply and the signal applying line for driving the finely patterned actuators become smaller.

Since the fine alignment between the adhesive surface of the inkjet print head and the substrate is difficult, when the number of actuators to be actuated increases, the conventional method of connecting power and signal applying lines as described above reduces the productivity. In addition, when the bonding pad becomes finer, the problem of deteriorating the reliability of the bonding and deteriorating the quality of the finished product is intensified.

In order to solve the above problems, the present invention connects a power supply and a signal applying line for driving a finely patterned actuator to an actuator of an inkjet print head, and each of them employs a self-alignment characteristic by surface tension of an adhesive metal. It is an object of the present invention to provide a method for connecting an inkjet printhead, a power supply, and a signal applying line by using a flip chip bonding method capable of bonding a fine pad while minimizing the difference in impedance generated from an actuator.

1 is a cross-sectional view showing a method of connecting an actuator, a power supply, and a signal applying line of an inkjet print head by a conventional wire bonding method;

2 is a cross-sectional view showing a method of connecting an actuator, a power supply, and a signal applying line of an inkjet print head by a conventional thermal compression method;

3 is a cross-sectional view schematically showing the mechanism of flip chip bonding used in the present invention;

4A to 4D are process diagrams showing a process of a method of connecting an actuator, a power supply, and a signal applying line of an inkjet printhead using the flip chip bonding method of the present invention.

<Explanation of symbols for main parts of drawing>

10, 20, 40: substrate of inkjet print head

11, 21, 41: piezoelectric body 12, 22, 42: upper electrode

13, 23, 43: power supply and signal applying line 14: insulating film

15: wire 16, 17: pad

30, 38: substrate 32, 36: bonding pad

34: bonding metal 44: bonding pad

45: bonding metal

The present invention for achieving the above object is to connect the power supply and signal applying line for applying power and signal to the inkjet printhead and the inkjet printhead, to connect with the power supply and signal applying line of the upper electrode of the actuator of the inkjet printhead Forming a coupling pad at a portion thereof; Forming an adhesive metal on the formed bonding pads; Heating and melting the bonding metal to a temperature slightly above the melting point for bonding; Including the step of connecting the molten bonding metal and the power supply and the signal applying line, using the flip chip bonding method to be aligned with the power supply and the signal applying line by the self-alignment characteristics by the high surface tension of the bonding metal itself The inkjet printhead is characterized by a method of connecting the power supply and the signal applying line.

Hereinafter, the present invention will be described in detail.

In the present invention, a flip chip bonding method is used as a method of connecting an inkjet printhead, a power supply, and a signal applying line.

Figure 3 schematically illustrates the mechanism of flip chip bonding used in the present invention.

As shown in FIG. 3, a bonding pad 32 is formed on the substrate 30, and an adhesive metal 34 is formed on the formed bonding pad 32. Another bonding pad 36 is formed on the substrate 38. The separately formed substrate 38 and the bonding pad 36 are bonded to the upper portion of the bonding metal 34.

In the process of bonding, the bonding metal 34 is heated above the melting point to liquefy the bonding metal 34. The liquefied adhesive metal 34 is self-aligned with the bond pad of the substrate to be bonded by its high surface tension, so that the upper substrate 38 and the bond pad are on the upper side. Even when the structure of 36 and the structure of the lower substrate 30 and the bonding pad 32 are not accurately arranged, the self-aligning characteristics of the bonding metal are precisely arranged.

A method of the present invention for connecting an inkjet printhead, a power supply, and a signal applying line by the flip chip bonding mechanism as described above will be described.

In order to connect the inkjet printhead to the power supply and the signal applying line by a flip chip bonding mechanism, a coupling pad is formed at a portion to be connected to the power supply and the signal applying line of the upper electrode of the actuator of the inkjet printhead.

As the bonding pads, various metals selected according to the properties of the substrate and the adhesive metal used are laminated by a semiconductor deposition process such as vacuum deposition.

In order to prevent adhesion of gold (Au) and copper (Cu) to the substrate to prevent adhesion of tin (Sn) to the substrate or to prevent oxidation of titanium (Ti) to improve adhesion with the bonding metal, platinum (Pt) or nickel Since the adhesiveness of (Ni) is low when the substrate is ceramic, in this case, it is preferable to use titanium or chromium (Cr) in order to improve the adhesiveness with the substrate, and the above metals are appropriately stacked for use. .

Commonly used bonding pads are nickel / gold bonding pads or titanium / platinum / gold bonding pads.

The size of the coupling pad depends on the size of the actuator, but can be formed up to a fine size of 20-30㎛. In addition, the thickness of the bonding pad is preferably about 1/10 of the thickness of the bonding metal.

Since the bonding pad can be formed directly on the actuator of the inkjet print head, even if the substrate is used as a metal, there is no need to form a separate insulating layer, thereby simplifying the process.

An adhesive metal is formed on the upper portion of the coupling pad formed as described above to a predetermined thickness. As the adhesive metal, most known adhesive metals can be used, and the most commonly used adhesive metal is an alloy of lead-tin (63:37) having a relatively low melting temperature and less damage to the product due to heat. In addition, polysolder may be used depending on the application.

The adhesive metal may be formed by various methods such as vacuum deposition, screen printing, plating, and the like.

By the above method, the inkjet print head on which the bonding pad and the adhesive metal are formed is directly bonded to the power supply and the signal applying line.

In this case, as described above, it is common to use an FPC in which a metal film is formed in a predetermined pattern on an insulating substrate such as film or vinyl as described above.

For bonding, the bonding metal must be heated to a temperature slightly above the melting point, and the bonding metal melted by heating is combined with a power supply and a signal applying line. At this time, even though the bonding metal is not disposed correctly with the power supply and the signal applying line, the bonding metal is aligned with the power supply and the signal applying line due to the self-alignment characteristic by the high surface tension of the bonding metal itself.

In the conventional method, when the actuator becomes fine, the connection between the power supply and the signal applying line is difficult, but the size of the actuator has to be large. You can connect the wires correctly.

4A to 4D schematically illustrate a process of a method of connecting an inkjet print head to a power supply and a signal applying line using the flip chip bonding method of the present invention.

First, the coupling pad 44 is formed on the upper electrode 42 of the actuator formed on the substrate 40 of the inkjet print head. An adhesive metal 45 is formed on the formed coupling pad 44.

The inkjet print head on which the coupling pad 44 and the adhesive metal 45 are formed is directly coupled to the power source and the signal applying line 43.

In order to bond, the adhesive metal 45 must be melted by heating to a temperature slightly higher than the melting point, and the adhesive metal 45 melted by the heating is coupled to the power source and the signal applying line 43. At this time, even if it is not exactly arranged with the power supply and the signal applying line 43, due to the self-alignment characteristics by the high surface tension of the bonding metal (45) itself is to be aligned with the power supply and the signal applying line 43.

As described above, the present invention can be connected to the inkjet head and the power supply and the signal applying line almost independently of the number and width of the power supply and the signal applying line, so that the power supply and the signal applying line are high in the case of an inkjet print head having a high number of nozzles. Can connect

In addition, even when the power supply, the signal applying line, and the bonding metal are not disposed properly, the alignment can be performed correctly by the self-aligning characteristics of the bonding metal, so that the actuator can be miniaturized, and thus, the inkjet print head can be highly integrated.

Claims (6)

  1. In connecting a power supply and a signal applying line for applying power and a signal to the inkjet printhead and the inkjet printhead,
    Forming a coupling pad at a portion of the upper electrode of the actuator of the inkjet print head to be connected to a power supply and a signal applying line;
    Forming an adhesive metal on the formed bonding pads;
    Heating and melting the bonding metal to a temperature slightly above the melting point for bonding;
    Connecting the molten bonding metal with a power supply and a signal applying line,
    A method of connecting an inkjet printhead and a power supply and signal applying line using a flip chip bonding method in which the bonding metal itself is aligned with the power supply and signal applying line due to the self-alignment characteristic of the adhesive metal itself.
  2. 2. The method of claim 1, wherein the bonding pad is formed by a semiconductor deposition process.
  3. The method of claim 1, wherein a bonding pad of nickel / gold or a bonding pad of titanium / platinum / gold is used as a bonding pad.
  4. A method of connecting an inkjet printhead, a power supply and a signal applying line using a flip chip bonding method according to claim 1, wherein an alloy of lead-tin (63:37) is used as the bonding metal.
  5. A method of connecting an inkjet printhead, a power supply and a signal applying line using a flip chip bonding method according to claim 1, wherein a polysolder is used as the bonding metal.
  6. The method of claim 1, wherein the bonding metal is formed using a vacuum deposition method, a screen printing method, or a plating method. The inkjet printhead is connected to a power supply and a signal applying line using a flip chip bonding method.
KR1019990021341A 1999-06-09 1999-06-09 Method for connecting inkjet print head with input lines by flip-chip bonding technique KR100327247B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101141405B1 (en) * 2009-12-04 2012-05-03 삼성전기주식회사 Inkjet head package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101141405B1 (en) * 2009-12-04 2012-05-03 삼성전기주식회사 Inkjet head package

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